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Built for the Edge 1
Tackling RetailTechnology Management
Challenges at the Edge
Speakers:
David Nielsen
Sr. IoT/Embedded System Product Manager - Supermicro
davidn@supermicro.com
Craig Carter
Product Line Manager – Intel®
craig.m.carter@intel.com
Richard Newman and Brett Stewart
Technology Leaders – Acumera
rnewman@reliant.io
Brett.stewart@acumera.net
Built for the Edge 2
2
Built for the Edge
The New Intel® Xeon® D Processor Family
Built for the Edge 3
By 2025, the edge silicon
opportunity will reach
$66 billion.1
By 2025, 75 percent of data
will be created and
processed outside a
traditional data center.2
The
Path to the
Edge
Cloud
Data Center
Core
Network
Network Edge
or Regional
Data Center
IoT and
Devices
On-Prem
Edge
Latency
Bandwidth
Connectivity
Security
1 DPMI, August 2021.
2 What Edge Computing Means for Infrastructure and Operations Leaders, Gartner, Oct 3, 2018.
AI
DRIVERS
FOR EDGE
Built for the Edge 4
The Most Complete Set ofTechnology Solutions
for the Industry to Build On
Connectivity Memory Processors Accelerators Software Solutions
Built for the Edge 5
The Journey to the new Intel® Xeon® D Processors
1 HCC = High Core Count SOCs for Network, Storage, and Cloud
2 LCC = Low Core Count; for Networking & mid-range storage
Timeframe indicates estimated production availability window. Dates, details and information are subject to change without notice. Refer to the individual platform gold decks for the latest POR schedule information.
2015 2017-18 2019-20 2021 2022
Intel® Xeon® Scalable Processors
Multi-socket “scalable processor” performance
platform designed for flexible space and power
environments
1st Generation
Intel® Xeon®
Scalable
Processors
2nd Generation
Intel® Xeon®
Scalable
Processors
3rd Generation
Intel® Xeon®
Scalable
Processors
Sapphire Rapids
2015 2017-18 2019-20 2021 2022
Intel® Xeon® D Processors
 Fully integrated multi-core single-socket
performance SoC designed for dense balanced
power and space constrained systems
 High-performance platforms with rich memory &
I/O connectivity
 Advanced capabilities (AI/DL, storage,
virtualization, RAS)
HCC 1
Intel® Xeon®
D-2100
Processors
Intel® Xeon®
D-2700
Processors
LCC 2
Intel® Xeon®
D-1500
Processors
Intel® Xeon®
D-1600
Processors
Intel® Xeon®
D-1700
Processors
Built for the Edge 6
Internet ofThings – Built for the Edge
Security - new features
AI capabilities with Intel® DL boost
Fast boot with Slim Bootloader
Industrial use conditions*
Integrated Ethernet
Dense, Low Power, Real-Time*, Rugged BGA SoC package for Extreme Environments
Extended Life Availability
Real time capable platform*
Extended temperature*
D-1700 D-2700
Industrial Video AI Public/Government Aerospace
Unique IoT offering
* capabilities available on select SKUs
Built for the Edge 7
The New Intel® Xeon® D Processors
Cores , Cache,
Memory Controller
Network
Accelerators
Platform
Features
Ethernet
throughput
capability
DDR4-
3200
Up to
Intel® TCC
& TSN
Up to
100
GbE
PCIe
Gen 4
Up to
32
Lanes
Intel® Xeon® D- 2700 Processor
Intel® Xeon® D- 1700 Processor
Scalable to:
• 4-20 Cores
• 100GbE
Scalable to:
• 4-10 Cores
• 100GbE
Secure,
Faster,
Flexible
Intel® Deep
Learning Boost
Intel® SST*
Intel® Platform Firmware
Resilience
Intel® Total
Memory
Encryption
Breakthrough
Performance Intel® Integrated
Ethernet
Intel
AVX-512
4
CH
Intel® Slim
Bootloader
Intel® Software
Guard Extensions
Available on select IoT SKUs
Built for the Edge 8
Flexible Performance for DemandingWorkloads
Outstanding gen-on-gen Edge performance
CPU AI
UP TO
2.97x
Increased
CPU Performance1
UP TO
7.40x
Visual Processing
Inference
Improvement 1
Intel® Xeon®
D-2700 Processor
vs.
Intel® Xeon®
D-1500 Processor 1
previous IoT processor
codename Broadwell DE
1Comparing current generation D-2796TE to the previous IOTG generation D-1577. More details of the comparison and full
performance details on www.Intel.com/PerformanceIndex Performance varies by use, configuration and other factors.
Built for the Edge 9
Intel® Xeon® D Processors
Built for the Edge
Targeting the Edge, 5G, IoT and Cloud Edge markets
BGA design with extended temperature capabilities for deployments in
indoor, outdoor, industrial and ruggedized environments
A scalable SoC with integrated compute, ethernet, AI, crypto and
compression acceleration
Intel® Xeon® D-1700
Intel® Xeon® D-2700
Built for the Edge 10
Notices and Disclaimers
Performance varies by use, configuration and other factors. Learn more at www.Intel.com/PerformanceIndex​.
Performance results are based on testing as of dates shown in configurations and may not reflect all publicly available ​updates. See
backup for configuration details. No product or component can be absolutely secure.
Intel contributes to the development of benchmarks by participating in, sponsoring, and/or contributing technical support to various
benchmarking groups, including the BenchmarkXPRT Development Community administered by Principled Technologies.
Your costs and results may vary.
Intel technologies may require enabled hardware, software or service activation.
Some results may have been estimated or simulated.
Intel does not control or audit third-party data. You should consult other sources to evaluate accuracy.
All product plans and roadmaps are subject to change without notice.
Statements in this document that refer to future plans or expectations are forward-looking statements. These statements are based on
current expectations and involve many risks and uncertainties that could cause actual results to differ materially from those expressed or
implied in such statements. For more information on the factors that could cause actual results to differ materially, see our most recent
earnings release and SEC filings at www.intc.com.
© Intel Corporation. Intel, the Intel logo, and other Intel marks are trademarks of Intel Corporation or its subsidiaries. Other names and
brands may be claimed as the property of others.
Acumera’s Reliant Platform
March 2022
The leading Edge Computing platform
for Retail and Hospitality
Convenience Store
Petroleum
Food Service
Manufacturing
Retail
Unmanned Sites
Service Providers
• Powering 26,000+ locations
• Adding 300+ locations per
month
• 80,000+ edge computing
workloads in the field
• 250k virtual machines and
containers deployed
• 65.5M data configuration
elements under management
and orchestration
Today
Technology is rapidly evolving to
enable new customer experiences
Tomorrow
Client / Server
Cloud Delivered
Applications
Rigid, fixed payment
channels
Many Standalone Systems
In the Location Kiosks
Mobile Applications
& Services
Heavy, Expensive Store
Tech Footprint
Agile Technology,
Lower Costs
Rich Digital Content
Smart IOT Sensors
Data Center
Omni Channel Payments
Machine Vision /
AI
Fuel
Pump/Controller
& Tank
Management
Virtualization,
Containers
Edge fills
the gap
Edge computing enables
retailers to take advantage
of the cloud to deploy
systems, applications and
data locally, closest to the
consumer.
Reduced Latency
Security &
Compliance
Reliable
Operations
Reduced
Capex/Opex
Systems
Interoperability
Agility &
Scalability
Edge +
Cloud
Strategy
Data
Applications
Consumers
Network
Devices
IoT
Enterpris
e
BI/Analytic
s/SIEM
DB
Workforce
management
Payment
acceptance
POS/BOH/mPOS
Local Storage /
Replication
Front-end
hardware
Multi-use/
mobile HH
Payment
devices
Kiosk
Signage
Cameras/
sensors
Consumer
devices
Routing
Switching
Security Tools
SD-WAN/connectivity
Digital content API integration
Predictable data
sets
Machine
data
Exception-based
reporting
Operational
analytics
Training
Local
Content
Digital
immersion
Engagement
Edge solutions in
Retail, Hospitality &
C-Store locations
Self
service
Fuel
operations
Edge presents many opportunities
for innovation
Location Based
Servces Consumer Self
Service
CRM/Loyalty
Why Icelake Xeon D?
Full SoC
Fewer individual components, smaller
motherboard, complete high density
embedded system
Server class performance
Fast cores and I/O, multi threaded, robust
management, non-consumer grade, long
availability cycle
Low temp / power = delivery in fanless
enclosures
Ideal for retail and restaurant locations -
fanless is a requirement for most QSR due
to the environmental
Multi core support for both high density
micro services containers and multiple VMs
4C/8T or 8C/16T means at 1.9/3.0Ghz
means plenty of compute
Full support for both VT-x and VT-d for
virtualized workloads
VT is a requirement to run our type-1
hypervisor
DL-boost support for future ML workloads
DL-Boost and AVX-512 can support both
TF and OpenVINO accelerating ML
workloads and reducing the need for a
separate GPU/TPU
Confidential
Retail Technologies at the Edge
Better Faster Greener™ © 2022 Supermicro
David Nielsen
Sr. IoT/Embedded System Product Manager
davidn@supermicro.com
April 7, 2022
Confidential
Intelligent Retail at the Edge
4/6/2022 Better Faster Greener™ © 2021 Supermicro
18
1. Providing solutions to help retailers and restaurants navigate technological
and societal changes
2. Offers processor options ranging from Intel® Atom ® to Intel® Xeon® D, plus
networking and I/O options and PCI-E expansion slots
3. Support for highly secure, Zero Trust, high availability systems to provide
complete, optimized solutions – ensuring 100% uptime
Confidential
Intel Market Ready Solution - Improved QoE,
Efficiencies & ROI
4/6/2022 Better Faster Greener™ © 2021 Supermicro
19
Next Generation Restaurants
Confidential
Retail Based Use Cases
Expansion of use cases including 5G Radio sites, Private 5G and managed services
4/6/2022 Better Faster Greener™ © 2021 Supermicro
20
Confidential
4/6/2022 Better Faster Greener™ © 2022 Supermicro
21
Processor
Intel® Ice Lake Xeon® D-1718IT, 2.6GHz, 46W, 2933MHz/D-1736NT, 2.7GHz,
67W, 2667MHz, QAT 20G
Memory Capacity
DDR4 2933Mhz 2 channels, 4 slots RDIMM/UDIMM (ECC&non ECC) up to 256GB
Expansion Slots
1 x M.2 B-Key (3042/3052/2280) & Nano SIM Slot
1 x M.2 M-Key (2280)
1x M.2 E-Key (2230)
I/O ports
1x VGA
2x USB 3.0 Slots
4x 1GbE LAN Ports
2x 25G SFP28
1x Dedicated IPMI Port
Storage
2.5“ SSD/HDD
M.2 M-Key (2280)
Mounting Options
Wall Mount
Power Supply
Lockable 150W DC Power Adapter
Operating Temperature
0°C - 40°C
1
2
3
4
5
6
7
• Intel® Ice Lake Xeon® D1718T 10MB 4c 46W 2.6GHz/ D-1736NT 15MB 8c 67W
2.7GHz QAT 20G
• Up to DDR4 2933MHz 256GB RDIMM or 128GB UDIMM
• 2x25G SFP28, 4x 1GBase-T LAN, 1x IPMI LAN, 1x VGA, 2x USB3.0
• 2x SATA 2.5” Storage, 1x M.2 B-Key (3042/3052/2280), 1x M.2 M-Key (2280)
• 0°C-40°C Operating Temperature
Key features
Applications
1x VGA
2x USB 3.0
1x M.2 B-Key & Nano
SIM Slot
1x M.2 M-Key
1xM.2 E-Key
Network Appliance, Retail, Industrial Automation,
Artificial Intelligence, Machine Learning
Intel Xeon D-1718T
4C 46W/ D-1736NT
8C 67W
4x 1GbE
2x 10GBase-T
1x IPMI
2x SFP+
2x 2.5” Storage
8
Motherboard: X12SDV-4C/8C-SP6F
Fanless Chassis: CSE-E302iL
Dimensions: W:10.5” x D:7.5” x H:3.5”
FRONT
VIEW
REAR
VIEW
SYS-E302-12D
Intel® Xeon-D Fanless Embedded System
Confidential
4/6/2022 Better Faster Greener™ © 2022 Supermicro
22
SYS-510D-4C/8C/10C-FN6P
Intel® Xeon-D Compact 1U Embedded System
Processor
Intel® Xeon® D Ice Lake LCC SoC Processor,4/8/10 Cores, 25W/50W/88W
Memory Capacity
4 DIMM slots
DDR4 2933MHz up to 256GB RDIMM/UDIMM ECC/Non-ECC
Expansion Slots
1 x PCIe 4.0 x 16
1x M.2 M-Key SATA3.0/PCI-E 3.0 x4, 2280
1x M.2 E-Key PCI-E 3.0 x1, 2230
1x M.2 B-Key SATA/PCI-E 3.0 x2/USB 3.0, 2280/3042
I/O Ports
1x IPMI dedicated LAN
4x GbE, 2x 25G SFP28
2x USB 3.0 type A
1x VGA
Drive Bays
1x Internal 3.5" or 4x Internal 2.5" drive bays
Power Supply
200W AC-DC power supply
System Cooling
3x 40x28mm 4-PIN PWM fans
Motherboard: X12SDV-4C/8C/10C-SP6F (9.0” x 7.25” Flex ATX)
Chassis: CSE-505-203B
Dimension: W17.2” x D9.8” x H1.7” (437mm x 249mm x 43mm)
Intel® Xeon ® D Ice Lake 4/8/10 Cores Processor
Up to 256GB RDIMM or 128GB UDIMM, DDR4 2933MHz in 4 Slots
1x IPMI dedicated LAN, 4x GbE,2x 25G SFP28, 2x USB 3.0 type A
1x M.2 M-Key SATA/PCI-E 3.0 x4, 2280, 1x M.2 E-Key PCI-E 3.0 x1, 2230
1x M.2 B-Key SATA3.0/PCI-E 3.0 x2/USB 3.0, 2280/3042
4x SATA drives
Key features
Applications
1x VGA
PCIe 4.0 x16
M, B, E-Key
M.2
Retail Application, Firewall, Gateway, uCPE
Xeon-D SoC
4/8/10C
4x GbE LAN,
2x 25G SFP28
1 x IPMI
1x 3.5” or
4x 2.5” drive
bays
1
2
3
4
5
6
7
Confidential
4/6/2022 Better Faster Greener™ © 2022 Supermicro
23
SYS-E300-12D-4C/8C/10CN6P
Intel® Xeon-D Mini-1U Super Server
Processor
Intel® Xeon® D Ice Lake LCC SoC Processor,4/8/10 Cores, 25W/50W/88W
Memory Capacity
4x DIMM slot
DDR4 2933MHz up to 256GB RDIMM/UDIMM ECC/Non-ECC
Expansion Slots
1 x PCIe 4.0 x 16
1x M.2 M-Key SATA3.0/PCI-E 3.0 x4, 2280
1x M.2 E-Key PCI-E 3.0 x1, 2230
1x M.2 B-Key SATA/PCI-E 3.0 x2/USB 3.0, 2280/3042
I/O ports
1x IPMI dedicated LAN
4x GbE ; 2 x 25G SFP28
2x USB 3.0 type A
1x VGA
Drive Bays
1x Internal 2.5" drive bays
Power Supply
150W AC Power Adapter
System Cooling
3x 40x28mm 4pin FAN
Motherboard: X12SDV-4C/8C/10C-SP6F (Flex-ATX 9” x 7.25”)
Chassis: CSE-E300
System W10” x D8.9” x H1.7” (254mm x 226mm x 43mm
Key features
Applications
Retail Application, Firewall, Gateway, uCPE
1x VGA
PCIe 4.0 x16
M, B, E-Key
M.2
Xeon-D SoC
4/8/10C
4x GbE LAN
2x 25G SFP28
1 x IPMI
1x 2.5” SATA
SSD
Intel® Xeon® D Ice Lake 4/8/10 Cores Processor
Up to 256GB RDIMM or 128GB UDIMM, DDR4 2933MHz in 4 Slots
1x IPMI dedicated LAN ;4x GbE ; 2x 25G SFP28; 2x USB 3.0 type A;
1x M.2 M-Key SATA/PCI-E 3.0 x4, 2280, 1x M.2 E-Key PCI-E 3.0 x1, 2230
1x M.2 B-Key SATA3.0/PCI-E 3.0 x2/USB 3.0, 2280/3042
1x SATA SSD drives
1
2
3
4
5
6
7
Confidential
4/6/2022 Better Faster Greener™ © 2022 Supermicro
24
SYS-110D-4C/8C/16C/20C-FR(A/D)N8TP
Intel® Xeon-D Compact 1U Embedded System
Processor
Intel® Xeon® D Ice Lake 4/8/16/20 Cores Processor, 65W~125W
Memory Capacity
DDR4 3200MHz 1DPC, 4 slots RDIMM/LRDIMM, up to 256GB/512GB
Expansion Slots
1x PCIe 4.0 x 16
1x M.2 M-Key SATA3.0/PCI-E 3.0 x4, 2242/2280
I/O Ports
1x IPMI dedicated LAN
4x GbE, 2x 10GbE, 2x 25G SFP28
2x USB 3.0 type A
1x VGA
Drive Bays
2x Internal 2.5" drive bays
Power Supply
Redundant 800 W, 100-240 Vac
Redundant 600 W, -48 Vdc
System Cooling
5x 40x56mm Hot-swap Counter-rotation PWM Fans (one is optional)
Motherboard: X12SDV-4/8/16/20C-SPT8F (7.5”x 8.5”)
Chassis: 515M-R804/515M-R601
Dimension: W17.2” x D15.7” x H1.7” (437mm x 399mm x 43mm)
Intel® Xeon ® D Ice Lake 4/8/16/20 Cores Processor
Up to DDR4 3200Mhz 4 channels, 4 slots RDIMM/LRDIMM up to 512GB
1x IPMI dedicated LAN; 4x GbE; 2x 10GbE; 2x 25G SFP28
2x USB 3.0 type A;
1x M.2 M-Key SATA/PCI-E 3.0 x4, 2280
2x SATA/U.2 2.5” drives
Key features
Applications
1x VGA
PCIe 4.0 x16
M-Key M.2
Networking Application, Firewall, uCPE, Telecom Application
Xeon-D SoC
4/8/16/20C
4x GbE LAN,
2x 10GbE LAN
2x 25G SFP28
1 x IPMI
2x 2.5” drive
bays
1
2
3
4
5
6
7
Confidential
Solution Strategy – Market Vertical focused
Better Faster Greener™ © 2021 Supermicro
4/6/2022 25
Retail/Restaurants
Transportation & Smart City
Energy & Power
HealthCare & Telemedicine
Oil & Gas Production
vNetwork Functions
Private 5G/LTE
Industry 4.0
Confidential
Intel Devcloud® Partnership
Intel® DevCloud for the Edge
A development sandbox to try AI and vision workloads
remotely before purchasing Intel® platforms
Intel® Distribution of
OpenVINO™ toolkit
Model Optimizer
Inference Engine
https://devcloud.intel.com/edge/
• Prototype on the latest hardware and software
to future proof your solution
• Benchmark your customized AI application
• Run AI applications from anywhere in the world
• Reduce development time and cost
Intel
®
GNA
(IP)
DevCloud on Supermicro Hardware platforms
covering key edge CPUs
Ice Lake
Whiskey / Tiger Lake Comet Lake
Cascade lake-D
Confidential
DISCLAIMER
Super Micro Computer, Inc. may make changes to specifications and product descriptions at any time, without notice. The
information presented in this document is for informational purposes only and may contain technical inaccuracies, omissions
and typographical errors. Any performance tests and ratings are measured using systems that reflect the approximate
performance of Super Micro Computer, Inc. products as measured by those tests. Any differences in software or hardware
configuration may affect actual performance, and Super Micro Computer, Inc. does not control the design or implementation of
third party benchmarks or websites referenced in this document. The information contained herein is subject to change and may
be rendered inaccurate for many reasons, including but not limited to any changes in product and/or roadmap, component and
hardware revision changes, new model and/or product releases, software changes, firmware changes, or the like. Super Micro
Computer, Inc. assumes no obligation to update or otherwise correct or revise this information.
SUPER MICRO COMPUTER, INC. MAKES NO REPRESENTATIONS OR WARRANTIES WITH RESPECT TO THE
CONTENTS HEREOF AND ASSUMES NO RESPONSIBILITY FOR ANY INACCURACIES, ERRORS OR OMISSIONS THAT
MAY APPEAR IN THIS INFORMATION.
SUPER MICRO COMPUTER, INC. SPECIFICALLY DISCLAIMS ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR
FITNESS FOR ANY PARTICULAR PURPOSE. IN NO EVENT WILL SUPER MICRO COMPUTER, INC. BE LIABLE TO ANY
PERSON FOR ANY DIRECT, INDIRECT, SPECIAL OR OTHER CONSEQUENTIAL DAMAGES ARISING FROM THE USE
OF ANY INFORMATION CONTAINED HEREIN, EVEN IF SUPER MICRO COMPUTER, Inc. IS EXPRESSLY ADVISED OF
THE POSSIBILITY OF SUCH DAMAGES.
4/6/2022 Better Faster Greener™ © 2021 Supermicro
27
Confidential
www.supermicro.com
Thank You

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Tackling Retail Technology Management Challenges at the Edge

  • 1. Built for the Edge 1 Tackling RetailTechnology Management Challenges at the Edge Speakers: David Nielsen Sr. IoT/Embedded System Product Manager - Supermicro davidn@supermicro.com Craig Carter Product Line Manager – Intel® craig.m.carter@intel.com Richard Newman and Brett Stewart Technology Leaders – Acumera rnewman@reliant.io Brett.stewart@acumera.net
  • 2. Built for the Edge 2 2 Built for the Edge The New Intel® Xeon® D Processor Family
  • 3. Built for the Edge 3 By 2025, the edge silicon opportunity will reach $66 billion.1 By 2025, 75 percent of data will be created and processed outside a traditional data center.2 The Path to the Edge Cloud Data Center Core Network Network Edge or Regional Data Center IoT and Devices On-Prem Edge Latency Bandwidth Connectivity Security 1 DPMI, August 2021. 2 What Edge Computing Means for Infrastructure and Operations Leaders, Gartner, Oct 3, 2018. AI DRIVERS FOR EDGE
  • 4. Built for the Edge 4 The Most Complete Set ofTechnology Solutions for the Industry to Build On Connectivity Memory Processors Accelerators Software Solutions
  • 5. Built for the Edge 5 The Journey to the new Intel® Xeon® D Processors 1 HCC = High Core Count SOCs for Network, Storage, and Cloud 2 LCC = Low Core Count; for Networking & mid-range storage Timeframe indicates estimated production availability window. Dates, details and information are subject to change without notice. Refer to the individual platform gold decks for the latest POR schedule information. 2015 2017-18 2019-20 2021 2022 Intel® Xeon® Scalable Processors Multi-socket “scalable processor” performance platform designed for flexible space and power environments 1st Generation Intel® Xeon® Scalable Processors 2nd Generation Intel® Xeon® Scalable Processors 3rd Generation Intel® Xeon® Scalable Processors Sapphire Rapids 2015 2017-18 2019-20 2021 2022 Intel® Xeon® D Processors  Fully integrated multi-core single-socket performance SoC designed for dense balanced power and space constrained systems  High-performance platforms with rich memory & I/O connectivity  Advanced capabilities (AI/DL, storage, virtualization, RAS) HCC 1 Intel® Xeon® D-2100 Processors Intel® Xeon® D-2700 Processors LCC 2 Intel® Xeon® D-1500 Processors Intel® Xeon® D-1600 Processors Intel® Xeon® D-1700 Processors
  • 6. Built for the Edge 6 Internet ofThings – Built for the Edge Security - new features AI capabilities with Intel® DL boost Fast boot with Slim Bootloader Industrial use conditions* Integrated Ethernet Dense, Low Power, Real-Time*, Rugged BGA SoC package for Extreme Environments Extended Life Availability Real time capable platform* Extended temperature* D-1700 D-2700 Industrial Video AI Public/Government Aerospace Unique IoT offering * capabilities available on select SKUs
  • 7. Built for the Edge 7 The New Intel® Xeon® D Processors Cores , Cache, Memory Controller Network Accelerators Platform Features Ethernet throughput capability DDR4- 3200 Up to Intel® TCC & TSN Up to 100 GbE PCIe Gen 4 Up to 32 Lanes Intel® Xeon® D- 2700 Processor Intel® Xeon® D- 1700 Processor Scalable to: • 4-20 Cores • 100GbE Scalable to: • 4-10 Cores • 100GbE Secure, Faster, Flexible Intel® Deep Learning Boost Intel® SST* Intel® Platform Firmware Resilience Intel® Total Memory Encryption Breakthrough Performance Intel® Integrated Ethernet Intel AVX-512 4 CH Intel® Slim Bootloader Intel® Software Guard Extensions Available on select IoT SKUs
  • 8. Built for the Edge 8 Flexible Performance for DemandingWorkloads Outstanding gen-on-gen Edge performance CPU AI UP TO 2.97x Increased CPU Performance1 UP TO 7.40x Visual Processing Inference Improvement 1 Intel® Xeon® D-2700 Processor vs. Intel® Xeon® D-1500 Processor 1 previous IoT processor codename Broadwell DE 1Comparing current generation D-2796TE to the previous IOTG generation D-1577. More details of the comparison and full performance details on www.Intel.com/PerformanceIndex Performance varies by use, configuration and other factors.
  • 9. Built for the Edge 9 Intel® Xeon® D Processors Built for the Edge Targeting the Edge, 5G, IoT and Cloud Edge markets BGA design with extended temperature capabilities for deployments in indoor, outdoor, industrial and ruggedized environments A scalable SoC with integrated compute, ethernet, AI, crypto and compression acceleration Intel® Xeon® D-1700 Intel® Xeon® D-2700
  • 10. Built for the Edge 10 Notices and Disclaimers Performance varies by use, configuration and other factors. Learn more at www.Intel.com/PerformanceIndex​. Performance results are based on testing as of dates shown in configurations and may not reflect all publicly available ​updates. See backup for configuration details. No product or component can be absolutely secure. Intel contributes to the development of benchmarks by participating in, sponsoring, and/or contributing technical support to various benchmarking groups, including the BenchmarkXPRT Development Community administered by Principled Technologies. Your costs and results may vary. Intel technologies may require enabled hardware, software or service activation. Some results may have been estimated or simulated. Intel does not control or audit third-party data. You should consult other sources to evaluate accuracy. All product plans and roadmaps are subject to change without notice. Statements in this document that refer to future plans or expectations are forward-looking statements. These statements are based on current expectations and involve many risks and uncertainties that could cause actual results to differ materially from those expressed or implied in such statements. For more information on the factors that could cause actual results to differ materially, see our most recent earnings release and SEC filings at www.intc.com. © Intel Corporation. Intel, the Intel logo, and other Intel marks are trademarks of Intel Corporation or its subsidiaries. Other names and brands may be claimed as the property of others.
  • 12. The leading Edge Computing platform for Retail and Hospitality Convenience Store Petroleum Food Service Manufacturing Retail Unmanned Sites Service Providers • Powering 26,000+ locations • Adding 300+ locations per month • 80,000+ edge computing workloads in the field • 250k virtual machines and containers deployed • 65.5M data configuration elements under management and orchestration
  • 13. Today Technology is rapidly evolving to enable new customer experiences Tomorrow Client / Server Cloud Delivered Applications Rigid, fixed payment channels Many Standalone Systems In the Location Kiosks Mobile Applications & Services Heavy, Expensive Store Tech Footprint Agile Technology, Lower Costs Rich Digital Content Smart IOT Sensors Data Center Omni Channel Payments Machine Vision / AI Fuel Pump/Controller & Tank Management Virtualization, Containers
  • 14. Edge fills the gap Edge computing enables retailers to take advantage of the cloud to deploy systems, applications and data locally, closest to the consumer. Reduced Latency Security & Compliance Reliable Operations Reduced Capex/Opex Systems Interoperability Agility & Scalability Edge + Cloud Strategy
  • 15. Data Applications Consumers Network Devices IoT Enterpris e BI/Analytic s/SIEM DB Workforce management Payment acceptance POS/BOH/mPOS Local Storage / Replication Front-end hardware Multi-use/ mobile HH Payment devices Kiosk Signage Cameras/ sensors Consumer devices Routing Switching Security Tools SD-WAN/connectivity Digital content API integration Predictable data sets Machine data Exception-based reporting Operational analytics Training Local Content Digital immersion Engagement Edge solutions in Retail, Hospitality & C-Store locations Self service Fuel operations Edge presents many opportunities for innovation Location Based Servces Consumer Self Service CRM/Loyalty
  • 16. Why Icelake Xeon D? Full SoC Fewer individual components, smaller motherboard, complete high density embedded system Server class performance Fast cores and I/O, multi threaded, robust management, non-consumer grade, long availability cycle Low temp / power = delivery in fanless enclosures Ideal for retail and restaurant locations - fanless is a requirement for most QSR due to the environmental Multi core support for both high density micro services containers and multiple VMs 4C/8T or 8C/16T means at 1.9/3.0Ghz means plenty of compute Full support for both VT-x and VT-d for virtualized workloads VT is a requirement to run our type-1 hypervisor DL-boost support for future ML workloads DL-Boost and AVX-512 can support both TF and OpenVINO accelerating ML workloads and reducing the need for a separate GPU/TPU
  • 17. Confidential Retail Technologies at the Edge Better Faster Greener™ © 2022 Supermicro David Nielsen Sr. IoT/Embedded System Product Manager davidn@supermicro.com April 7, 2022
  • 18. Confidential Intelligent Retail at the Edge 4/6/2022 Better Faster Greener™ © 2021 Supermicro 18 1. Providing solutions to help retailers and restaurants navigate technological and societal changes 2. Offers processor options ranging from Intel® Atom ® to Intel® Xeon® D, plus networking and I/O options and PCI-E expansion slots 3. Support for highly secure, Zero Trust, high availability systems to provide complete, optimized solutions – ensuring 100% uptime
  • 19. Confidential Intel Market Ready Solution - Improved QoE, Efficiencies & ROI 4/6/2022 Better Faster Greener™ © 2021 Supermicro 19 Next Generation Restaurants
  • 20. Confidential Retail Based Use Cases Expansion of use cases including 5G Radio sites, Private 5G and managed services 4/6/2022 Better Faster Greener™ © 2021 Supermicro 20
  • 21. Confidential 4/6/2022 Better Faster Greener™ © 2022 Supermicro 21 Processor Intel® Ice Lake Xeon® D-1718IT, 2.6GHz, 46W, 2933MHz/D-1736NT, 2.7GHz, 67W, 2667MHz, QAT 20G Memory Capacity DDR4 2933Mhz 2 channels, 4 slots RDIMM/UDIMM (ECC&non ECC) up to 256GB Expansion Slots 1 x M.2 B-Key (3042/3052/2280) & Nano SIM Slot 1 x M.2 M-Key (2280) 1x M.2 E-Key (2230) I/O ports 1x VGA 2x USB 3.0 Slots 4x 1GbE LAN Ports 2x 25G SFP28 1x Dedicated IPMI Port Storage 2.5“ SSD/HDD M.2 M-Key (2280) Mounting Options Wall Mount Power Supply Lockable 150W DC Power Adapter Operating Temperature 0°C - 40°C 1 2 3 4 5 6 7 • Intel® Ice Lake Xeon® D1718T 10MB 4c 46W 2.6GHz/ D-1736NT 15MB 8c 67W 2.7GHz QAT 20G • Up to DDR4 2933MHz 256GB RDIMM or 128GB UDIMM • 2x25G SFP28, 4x 1GBase-T LAN, 1x IPMI LAN, 1x VGA, 2x USB3.0 • 2x SATA 2.5” Storage, 1x M.2 B-Key (3042/3052/2280), 1x M.2 M-Key (2280) • 0°C-40°C Operating Temperature Key features Applications 1x VGA 2x USB 3.0 1x M.2 B-Key & Nano SIM Slot 1x M.2 M-Key 1xM.2 E-Key Network Appliance, Retail, Industrial Automation, Artificial Intelligence, Machine Learning Intel Xeon D-1718T 4C 46W/ D-1736NT 8C 67W 4x 1GbE 2x 10GBase-T 1x IPMI 2x SFP+ 2x 2.5” Storage 8 Motherboard: X12SDV-4C/8C-SP6F Fanless Chassis: CSE-E302iL Dimensions: W:10.5” x D:7.5” x H:3.5” FRONT VIEW REAR VIEW SYS-E302-12D Intel® Xeon-D Fanless Embedded System
  • 22. Confidential 4/6/2022 Better Faster Greener™ © 2022 Supermicro 22 SYS-510D-4C/8C/10C-FN6P Intel® Xeon-D Compact 1U Embedded System Processor Intel® Xeon® D Ice Lake LCC SoC Processor,4/8/10 Cores, 25W/50W/88W Memory Capacity 4 DIMM slots DDR4 2933MHz up to 256GB RDIMM/UDIMM ECC/Non-ECC Expansion Slots 1 x PCIe 4.0 x 16 1x M.2 M-Key SATA3.0/PCI-E 3.0 x4, 2280 1x M.2 E-Key PCI-E 3.0 x1, 2230 1x M.2 B-Key SATA/PCI-E 3.0 x2/USB 3.0, 2280/3042 I/O Ports 1x IPMI dedicated LAN 4x GbE, 2x 25G SFP28 2x USB 3.0 type A 1x VGA Drive Bays 1x Internal 3.5" or 4x Internal 2.5" drive bays Power Supply 200W AC-DC power supply System Cooling 3x 40x28mm 4-PIN PWM fans Motherboard: X12SDV-4C/8C/10C-SP6F (9.0” x 7.25” Flex ATX) Chassis: CSE-505-203B Dimension: W17.2” x D9.8” x H1.7” (437mm x 249mm x 43mm) Intel® Xeon ® D Ice Lake 4/8/10 Cores Processor Up to 256GB RDIMM or 128GB UDIMM, DDR4 2933MHz in 4 Slots 1x IPMI dedicated LAN, 4x GbE,2x 25G SFP28, 2x USB 3.0 type A 1x M.2 M-Key SATA/PCI-E 3.0 x4, 2280, 1x M.2 E-Key PCI-E 3.0 x1, 2230 1x M.2 B-Key SATA3.0/PCI-E 3.0 x2/USB 3.0, 2280/3042 4x SATA drives Key features Applications 1x VGA PCIe 4.0 x16 M, B, E-Key M.2 Retail Application, Firewall, Gateway, uCPE Xeon-D SoC 4/8/10C 4x GbE LAN, 2x 25G SFP28 1 x IPMI 1x 3.5” or 4x 2.5” drive bays 1 2 3 4 5 6 7
  • 23. Confidential 4/6/2022 Better Faster Greener™ © 2022 Supermicro 23 SYS-E300-12D-4C/8C/10CN6P Intel® Xeon-D Mini-1U Super Server Processor Intel® Xeon® D Ice Lake LCC SoC Processor,4/8/10 Cores, 25W/50W/88W Memory Capacity 4x DIMM slot DDR4 2933MHz up to 256GB RDIMM/UDIMM ECC/Non-ECC Expansion Slots 1 x PCIe 4.0 x 16 1x M.2 M-Key SATA3.0/PCI-E 3.0 x4, 2280 1x M.2 E-Key PCI-E 3.0 x1, 2230 1x M.2 B-Key SATA/PCI-E 3.0 x2/USB 3.0, 2280/3042 I/O ports 1x IPMI dedicated LAN 4x GbE ; 2 x 25G SFP28 2x USB 3.0 type A 1x VGA Drive Bays 1x Internal 2.5" drive bays Power Supply 150W AC Power Adapter System Cooling 3x 40x28mm 4pin FAN Motherboard: X12SDV-4C/8C/10C-SP6F (Flex-ATX 9” x 7.25”) Chassis: CSE-E300 System W10” x D8.9” x H1.7” (254mm x 226mm x 43mm Key features Applications Retail Application, Firewall, Gateway, uCPE 1x VGA PCIe 4.0 x16 M, B, E-Key M.2 Xeon-D SoC 4/8/10C 4x GbE LAN 2x 25G SFP28 1 x IPMI 1x 2.5” SATA SSD Intel® Xeon® D Ice Lake 4/8/10 Cores Processor Up to 256GB RDIMM or 128GB UDIMM, DDR4 2933MHz in 4 Slots 1x IPMI dedicated LAN ;4x GbE ; 2x 25G SFP28; 2x USB 3.0 type A; 1x M.2 M-Key SATA/PCI-E 3.0 x4, 2280, 1x M.2 E-Key PCI-E 3.0 x1, 2230 1x M.2 B-Key SATA3.0/PCI-E 3.0 x2/USB 3.0, 2280/3042 1x SATA SSD drives 1 2 3 4 5 6 7
  • 24. Confidential 4/6/2022 Better Faster Greener™ © 2022 Supermicro 24 SYS-110D-4C/8C/16C/20C-FR(A/D)N8TP Intel® Xeon-D Compact 1U Embedded System Processor Intel® Xeon® D Ice Lake 4/8/16/20 Cores Processor, 65W~125W Memory Capacity DDR4 3200MHz 1DPC, 4 slots RDIMM/LRDIMM, up to 256GB/512GB Expansion Slots 1x PCIe 4.0 x 16 1x M.2 M-Key SATA3.0/PCI-E 3.0 x4, 2242/2280 I/O Ports 1x IPMI dedicated LAN 4x GbE, 2x 10GbE, 2x 25G SFP28 2x USB 3.0 type A 1x VGA Drive Bays 2x Internal 2.5" drive bays Power Supply Redundant 800 W, 100-240 Vac Redundant 600 W, -48 Vdc System Cooling 5x 40x56mm Hot-swap Counter-rotation PWM Fans (one is optional) Motherboard: X12SDV-4/8/16/20C-SPT8F (7.5”x 8.5”) Chassis: 515M-R804/515M-R601 Dimension: W17.2” x D15.7” x H1.7” (437mm x 399mm x 43mm) Intel® Xeon ® D Ice Lake 4/8/16/20 Cores Processor Up to DDR4 3200Mhz 4 channels, 4 slots RDIMM/LRDIMM up to 512GB 1x IPMI dedicated LAN; 4x GbE; 2x 10GbE; 2x 25G SFP28 2x USB 3.0 type A; 1x M.2 M-Key SATA/PCI-E 3.0 x4, 2280 2x SATA/U.2 2.5” drives Key features Applications 1x VGA PCIe 4.0 x16 M-Key M.2 Networking Application, Firewall, uCPE, Telecom Application Xeon-D SoC 4/8/16/20C 4x GbE LAN, 2x 10GbE LAN 2x 25G SFP28 1 x IPMI 2x 2.5” drive bays 1 2 3 4 5 6 7
  • 25. Confidential Solution Strategy – Market Vertical focused Better Faster Greener™ © 2021 Supermicro 4/6/2022 25 Retail/Restaurants Transportation & Smart City Energy & Power HealthCare & Telemedicine Oil & Gas Production vNetwork Functions Private 5G/LTE Industry 4.0
  • 26. Confidential Intel Devcloud® Partnership Intel® DevCloud for the Edge A development sandbox to try AI and vision workloads remotely before purchasing Intel® platforms Intel® Distribution of OpenVINO™ toolkit Model Optimizer Inference Engine https://devcloud.intel.com/edge/ • Prototype on the latest hardware and software to future proof your solution • Benchmark your customized AI application • Run AI applications from anywhere in the world • Reduce development time and cost Intel ® GNA (IP) DevCloud on Supermicro Hardware platforms covering key edge CPUs Ice Lake Whiskey / Tiger Lake Comet Lake Cascade lake-D
  • 27. Confidential DISCLAIMER Super Micro Computer, Inc. may make changes to specifications and product descriptions at any time, without notice. The information presented in this document is for informational purposes only and may contain technical inaccuracies, omissions and typographical errors. Any performance tests and ratings are measured using systems that reflect the approximate performance of Super Micro Computer, Inc. products as measured by those tests. Any differences in software or hardware configuration may affect actual performance, and Super Micro Computer, Inc. does not control the design or implementation of third party benchmarks or websites referenced in this document. The information contained herein is subject to change and may be rendered inaccurate for many reasons, including but not limited to any changes in product and/or roadmap, component and hardware revision changes, new model and/or product releases, software changes, firmware changes, or the like. Super Micro Computer, Inc. assumes no obligation to update or otherwise correct or revise this information. SUPER MICRO COMPUTER, INC. MAKES NO REPRESENTATIONS OR WARRANTIES WITH RESPECT TO THE CONTENTS HEREOF AND ASSUMES NO RESPONSIBILITY FOR ANY INACCURACIES, ERRORS OR OMISSIONS THAT MAY APPEAR IN THIS INFORMATION. SUPER MICRO COMPUTER, INC. SPECIFICALLY DISCLAIMS ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. IN NO EVENT WILL SUPER MICRO COMPUTER, INC. BE LIABLE TO ANY PERSON FOR ANY DIRECT, INDIRECT, SPECIAL OR OTHER CONSEQUENTIAL DAMAGES ARISING FROM THE USE OF ANY INFORMATION CONTAINED HEREIN, EVEN IF SUPER MICRO COMPUTER, Inc. IS EXPRESSLY ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. 4/6/2022 Better Faster Greener™ © 2021 Supermicro 27

Editor's Notes

  1. https://www.supermicro.com/en/products/iot-edge