AMD EPYC™ 7003 Processors with AMD 3D V-Cache™ technology are raising the bar once more for breakthrough performance on targeted technical computing workloads like Electronic Design Automation (EDA), Computational Fluid Dynamics (CFD), and Finite Element Analysis (FEA) software and solutions, helping optimize performance to accelerate the development of new products and technologies. Delivering breakthrough performance per core and helping lower TCO while accelerating product development. Socket compatible with existing 3rd Gen AMD EPYC platforms, these new processors with AMD 3D V-Cache work with existing software solutions to get up and running quickly, to help drive better, energy-efficient business outcomes with the confidence of modern security. Attend and learn about Supermicro systems with AMD EPYC™ 7003 Processors with AMD 3D V-Cache™ technology and how to be successful.

1. Better Faster Greener™ © 2022 Supermicro
Delivering Breakthrough Performance per Core
with AMD EPYC™
3rd Gen AMD EPYC™ 7003 CPUs with AMD 3D V-Cache™ Technology (Formerly Codenamed “Milan-X”) Channel
Partner Training
Eric Frazier (System)
A+ Solutions Manager
ericfrazier@supermicro.com
(408) 887-3264 (Cell)
April 7, 2022

2. DISCLAIMER
Super Micro Computer, Inc. may make changes to specifications and product descriptions at any time, without notice. The
information presented in this document is for informational purposes only and may contain technical inaccuracies, omissions
and typographical errors. Any performance tests and ratings are measured using systems that reflect the approximate
performance of Super Micro Computer, Inc. products as measured by those tests. Any differences in software or hardware
configuration may affect actual performance, and Super Micro Computer, Inc. does not control the design or implementation of
third party benchmarks or websites referenced in this document. The information contained herein is subject to change and may
be rendered inaccurate for many reasons, including but not limited to any changes in product and/or roadmap, component and
hardware revision changes, new model and/or product releases, software changes, firmware changes, or the like. Super Micro
Computer, Inc. assumes no obligation to update or otherwise correct or revise this information.
SUPER MICRO COMPUTER, INC. MAKES NO REPRESENTATIONS OR WARRANTIES WITH RESPECT TO THE
CONTENTS HEREOF AND ASSUMES NO RESPONSIBILITY FOR ANY INACCURACIES, ERRORS OR OMISSIONS THAT
MAY APPEAR IN THIS INFORMATION.
SUPER MICRO COMPUTER, INC. SPECIFICALLY DISCLAIMS ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR
FITNESS FOR ANY PARTICULAR PURPOSE. IN NO EVENT WILL SUPER MICRO COMPUTER, INC. BE LIABLE TO ANY
PERSON FOR ANY DIRECT, INDIRECT, SPECIAL OR OTHER CONSEQUENTIAL DAMAGES ARISING FROM THE USE OF
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POSSIBILITY OF SUCH DAMAGES.
ATTRIBUTION
© 2021 Super Micro Computer, Inc. All rights reserved.
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3. New 3rd Gen AMD EPYC™ with AMD 3D V-Cache™ Technology
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SP5 (LGA-6096) socket
Launched
March 21 with
768MB
L3Cache
CQ3
96-Cores
DDR5
PCIE 5
CXL
AMD EPYC™ Milan with AMD
3D V-Cache™ (Formerly
codenamed “Milan-X”)

4. More CPU Cache – Function / Comparison
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For Comparison
• Rome 128MB L3 Cache
• Milan 256MB L3 Cache
• 3D V 768MB L3 Cache
• Formerly “Milan-X”
128MB
Rome
256MB
Milan
768MB in
3rd Gen AMD EPYC™
with AMD
3D V-Cache™

5. EDA – ELECTRONIC DESIGN AUTOMATION
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Top Industries for EDA:
Semiconductor, Automotive, Circuit Manufacturing,
Medical Device
Target: 3rd Gen AMD EPYC™ 7003 with AMD 3D V-
Cache™ Technology CPUs:
7373X 16-Core – Up to 66% Faster
7374X 24-Core
7573X 32-Core

6. New 3rd Gen AMD EPYC™ with AMD 3D V-Cache™
Technology
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Up to 20 3rd-Gen EPYC™ Processors with up to
1,280 Cores with up to 15,350MB of Layer 3
Cache per Chassis! Space and Energy Efficient.
HPC, EDA, GPU Acceleration,
and Virtualization. Focus on
Semiconductor and Win!

7. New 3rd Gen AMD EPYC™ with AMD 3D V-Cache™
Technology
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Up to 8 3rd Gen AMD EYPC™ Processors, with up
to 512 Cores, and up to 6,144MB of AMD 3D V-
Cache™ per Chassis! Front and Rear I/O Options
HPC, EDA, and Virtualization.
Focus on Semiconductor and
Win!

8. New 3rd Gen AMD EPYC™ with AMD 3D V-Cache™
Technology
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Up to 4 3rd Gen AMD EPYC™ Processors, and up
to 256 Cores, with up to 3,072MB of AMD 3D V-
Cache™ per Chassis!
HPC, EDA, and Virtualization.
Focus on Semiconductor and
Win!

9. Suggested Go to Market – Top Semi
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10. CFD – Computational Fluid Dynamics
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Top Industries for CFD:
Aerospace, automotive, power generation, chemical
manufacturing, polymer processing, petroleum
exploration, medical research, meteorology,
astrophysics, and digital twin
Target AMD EPYC MILAN 3D V-Cache CPUs:
7773X 64-Core – Up to 48% Faster
7573X 32-Core
7374X 24-Core

11. New 3rd Gen AMD EPYC™ with AMD 3D V-Cache™
Technology
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Up to 128 AMD EPYC™ 3rd Gen cores per
1U or 2U Chassis and up to 1,536MB of
AMD 3D V-Cache™. Excellent for High
Performance Computing, and
Computational Fluid Dynamics.

12. New 3rd Gen AMD EPYC™ with AMD 3D V-Cache™
Technology
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UP to 64 Cores of 3rd Gen AMD
EPYC™ and up to 768MB of AMD
3D V-Cache™ per 1U or 2U
Chassis with Multiple GPUs
Support. Ideal for Omniverse,
and CFD

13. New 3rd Gen AMD EPYC™ with AMD 3D V-Cache™
Technology
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FCC Class B Certified for outside of the datacenter use.
Quiet operation ideal for remote users with server
technologies: IPMI, BMC, and TPM 2.0 for corporate
management. Up to 64-Cores of 3rd Gen AMD EPYC™, and
up to 768MB of AMD 3D V-Cache™

14. Top Computational Fluid Dynamics ISVs
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15. AMD-Supermicro Marketing Collateral
15
Marketing Resources
Category Application/Be
nchmark
Highlights
HPC SPECjbb201
5
SPEC CPU
SuperBlade w/ Milan-X Performance
Benchmarking
WIO and Ultra for SPEC CPU
Supermicro Marketing and Total Solutions
Alignment
H12 Datasheets HERE
AMD EPYC™ Tech Docs and White Papers | AMD
Better Faster Greener™ © 2022 Supermicro

16. www.supermicro.com
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