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MWC Roundtable: Accelerating Innovation from the Intelligent Edge to Cloud
- 1. Better Faster Greener™ © 2023 Supermicro 1
- 2. The Industry’s Broadest Portfolio of Servers Better Faster Greener™ © 2023 Supermicro 2 Powered by 4th Gen Intel® Xeon® Scalable Processors Hyper Best-in-class Performance and Flexibility Rackmount Server CloudDC All-in-one Rackmount Platform for Cloud Data Centers Mainstream Versatile Entry-Level for Enterprise Applications BigTwin® Industry-leading Multi-node Architecture FatTwin® Multi-Node 4U Advanced Twin Architecture with 8 or 4 Nodes SuperBlade® Highest Density Multi-Node Architecture for HPC Applications WIO Industry’s Widest Variety of I/O Optimized Servers Universal GPU Multi-Architecture Flexibility with Future-Proof Open-Standards-Based Design High Performance and Flexibility for AI, 3D Simulation and the Metaverse PCIe GPU Highest Performance and Flexibility for Enterprise Applications Multi-Processor For High Performance Desktop Workloads SuperWorkstation Petascale All-Flash Revolutionary Petascale NVMe for Unprecedented Density and Capacity GrandTwin™ Multi-Node Architecture Optimized for Single-Processor Performance Compact Form Factors for 5G and Edge computing IoT/5G SuperEdge High-Density Computing and Flexibility at the Intelligent Edge Hyper-E Best-in-class Performance and Flexibility for Edge Data Centers
- 3. The Supermicro X13 Advantage Better Faster Greener™ © 2023 Supermicro 3 Optimized, Open Architectures • More than 15 families of systems optimized for AI, Cloud, 5G Edge and more • Featuring 4th Gen Intel® Xeon® Scalable Processors with 60% increased performance, support for PCIe 5.0, DDR5 and CXL, and built-in accelerators such as Intel vRAN Boost • Enhanced thermal capacity to support next-gen CPUs, GPUs and other components • Flexible networking with Advanced I/O Modules (AIOM) up to 400G per card • High ambient temperature operation up to 40°C with liquid cooling options • Support for open and industry standards including OCP 3.0, OAM, ORV2, OSF, OpenBMC and EDSFF
- 4. Better Faster Greener™ © 2023 Supermicro 4 SuperEdge SYS-211SE Compact 5G/Edge SYS-111E-FDWTR 2U Ultra Short-Depth SYS-211E-FRDN6T Hyper-E SYS-221HE Sys Form Factor 2RU3N; D 16.9” 1RU1N; D 16.9” 2RU1N; D 11.8” 2RU1N; D 22.6” Environmental (1) 0~35C; (2) -5~55C (1) 0~40C; (2) NEBS -5~55C (1) 0~40C; (2) -5~55C (1) 0~40C; (2) NEBS -5~55C CPU/node (@40C) SPR UP, TDP 270W, per node SPR UP, TDP 205W SPR UP, TDP 250W SPR DP, TDP 270W Memory/node 8x DDR5, per node 8x DDR5 8x DDR5 32x DDR5 PCIe slot/node •2x Gen5 x16 FHHL, per node •1x Gen5 x16 HHHL, per node •2x Gen5 x16 FHFL •1x Gen5 x16 HHHL •2x Gen5 x16 FHHL •1x Gen5 x16 HHHL (or 2x x8) •1x Gen5 x8 FHHL if CPU<165W (w/ 1U Heatsink) •6x Gen5 x8 FHFL (or 3x x16) •2x Gen5 x8 FHHL •2x Gen5 x16 Slim-AIOM Storage/node •2x internal NVMe 2280/22110 M.2 •1x internal SATA/NVMe 2280/22110 M.2 •2x internal 2.5” SATA SSD •2x internal SATA/NVMe 2280/22110 M.2 •2x internal SATA/NVMe 2280/22110 M.2 •6x 2.5” SATA/NVMe SSD High Density (2U3N) with up to 3 telco AOC slots per node 1U smallest height with 3 AOC slots, best for space flexibility 11.8” super short depth, best selection to install in 3rd party cabinet Dual CPU, highest computing power with both telco edge and core application Key Feature : X13 5G Telco & IoT Edge Servers
- 5. DU From 3rd Gen Intel Xeon Scalable To 4th Gen Intel Xeon Scalable EE Intel, the Intel logo, and other Intel marks are trademarks of Intel Corporation or its subsidiaries Silicom Mount Bryce Intel Mount Bryce SYS-210P SYS-211E CPU (EEC) FH NIC GNSS PCIe GPS N L1+2 s/w CPU FH NIC Accelerator GNSS PCIe PCIe GPS N L1 s/w L2 s/w 5 Better Faster Greener™ © 2023 Supermicro
- 6. Telco Optimized 2U Multi-Node UP Edge System 6 SYS-211TP SYS-211SE Better Faster Greener™ © 2023 Supermicro
- 7. Private 5G - enabling broader capabilities Large Areas requiring single coverage & ease of deployment Use Cases – High Throughput / Low Latency Better Faster Greener™ © 2023 Supermicro 7
- 8. Smart City Instances making cities more livable and alive! 8 Better Faster Greener™ © 2023 Supermicro Smart • Governance • Security • Healthcare • Education • Transportation • Environment • Infrastructure • Mobility • Recycling • Waste Management • Building • Industry • Entertainment • Shopping
- 9. Intelligent Retail – Virtualization Edge Solution Better Faster Greener™ © 2023 Supermicro 9 1. Providing disruptive AI-based solutions to help retailers and restaurants navigate technological and societal changes 2. Improving customer experience using AI, augmented/virtual reality, digital signage, kiosks, and analytics 3. Support for highly secure, Zero Trust, high availability systems to provide complete, optimized solutions – ensuring 100% uptime
- 10. Retail Based Use Cases Expansion of use cases including 5G Radio sites, Private 5G and managed services 10 10 Better Faster Greener™ © 2023 Supermicro
- 11. www.supermicro.com Thank You Learn More at www.supermicro.com
- 12. Which do I use? Better Faster Greener™ © 2022 Supermicro 12 Operational Decisions: What do I use? Technology Type Cellular Licensing Licensed & Unlicensed Bands Authentication 5G-AKA, EAP-AKA & EAP-TLS Simple, easy to connect Network Security Introduces Security Anchor Function, Subscription Permanent Identifier & more Use case Examples Mobile backhaul, autonomous vehicle support & fixed wireless access Technology Type Wireless LAN Licensing Unlicensed Bands Authentication Simultaneous Authentication of Equals (SAE), More difficult, requires service set ID & PW Network Security Introduces Wi-Fi Protected Access 3 (WPA3) Use case Examples Indoor coverage, IoT Support, & high-density wireless service SMCI & our Partners: Enabling Guidance to Operational Leaders for Guidance, Future-Proofing & capabilities
Editor's Notes
- Next let’s take a look at a typical DU’s architecture, the left side has 3 layers for a typical DU, the bottom is the hardware layer including CPU and add-on cards as part of the server. On top of that is the NFVi layer, where either a virtualized or containerized environment is used. Note for time saving, some PoCs might go with baremetal OS directly. At the top is the VNF or CNF where the vDU software will be running. For the popular split 7-2, the vDU software will need to cover Layer1, MAC and RLC functions, in addition, OAM, management function and F1 interface. On the right hand side is how a typical DU fits into the cellsite environment. As Kevin mentioned earlier, the O-RAN fronthaul has several LLS configuration options. For C1 for example, the DU will need to connect to the RU directly, the DU will also need to be acting as the grand master in the network. So a GPS receiver will be included as part of the DU and receive timing directly from the satellites. Other than the fronthaul, DU will also need at least couple of links connect to midhaul to CU. Another key component inside the DU is the layer 1 acceleration especially given the real-time nature of the DU. A FPGA or eASIC based add-on card will offload FEC functions from the CPU for acceleration.
- Collect data, analyze, and control the smart devices. Safer, Quicker reaction to the disaster, and improve user experience
- https://www.supermicro.com/en/products/iot-edge