1.
Confidential

2.
Confidential
Supermicro X13 Comprehensive Portfolio
Hyper and Hyper-E
Best-in-Class Performance and
Flexibility Rackmount Servers
for Enterprise Applications
Cloud DC
All-in-one Rackmount Platforms
for Cloud Data Centers
Mainstream
Versatile Entry Level and Volume
Servers for Enterprise Applications
BigTwin®
Highly Modular Multi-Node
Systems with Tool-less Design
FatTwin®
Advanced Multi-node 4U Twin
Architecture with 8 or 4 Nodes
Cost-effective 2U Multi-node
Platforms
TwinPro® SuperBlade®
High Density x86 Multi-node
Server for Enterprise Cloud, HPC
SuperStorage®
WIO (UP)
Industry’s Widest Variety of
I/O Optimized Servers
High Density Systems for Double-
width, Full Length PCIe GPUs
PCIe GPU Servers Universal GPU Servers
High Performance and Flexibility
with Advanced Architecture and
Thermal Design
Highest Performance and Flexibility
for Enterprise Applications
MP 4-Way Server
High-efficiency, High-performance Compact
Form Factor for 5G and Edge computing
IOT/Embedded
Top-loading Server Optimized for Field
Serviceability and Field Replacement
Workstations for High
Performance Workloads
SuperWorkstations
2 Better Faster Greener™ © 2022 Supermicro
GrandTwin®
Highly Modular Front Access
Multi-Node Systems with Tool-
less Design

3.
Confidential
Supermicro Has the Most Genoa Options
2/8/2023 Better Faster Greener™ © 2022 Supermicro
3
AS –2115GT-HNTR (Rear IO)
GrandTwin
2U4Node
Hyper
DP Systems
CloudDC
UP Systems
GPU Systems
AS -1015CS-TNR
AS -1115CS-TNR
AS -2015CS-TNR
AS -1125HS-TNR
AS -2025HS-TNR
AS -2125HS-TNR
AS -4125GS-TNRT
8 PCIe 5.0 x16 GPUs
AS –2115GT-HNTF (Front IO)
Supermicro A+ Product Page
https://www.supermicro.com/en/products/aplus

4.
Confidential
4th Generation Platform Overview (Max per socket)
• 3rd Generation Intel Xeon Scalable
• Core count: 40
• PCIe lane count: 64
• PCIe Generation: 4th
• Memory : DDR4/3200
• 8 channel
• 3rd Generation AMD EPYC
• Core count: 64
• PCIe lane count: 128
• PCIe Generation: 4th
• Memory : DDR4/3200
• 8 channel
• 4th Generation Intel Xeon Scalable
• Core count : 60
• PCIe lane count: 80
• PCIe Generation: 5th
• Memory : DDR5/4800
• 8 channel
• 4th Generation AMD EPYC (Genoa)
• Core count: 96
• PCIe lane count: 128
• PCIe Generation: 5th
• Memory : DDR5/4800
• 12 channel

5.
Confidential
Memory and PCIe Bandwidth
24 x DIMM slots,
DDR5 -4800 memory
Supports up to 6 TB
32 DIMM slots
DDR5 -4800 memory
supports up to 8TB
Hyper
Hyper
CloudDC CloudDC
12 DIMM slots,
DDR5-4800
Supports up to 3TB
16 DIMM slots
DDR5-4800
Supports up to 4TB
Up to 160 Lanes of
Gen5 PCIe with DP
Up to 128 Lanes of
Gen5 PCIe with UP
H13
X13

6.
• Micron Confidential
• Micron Confidential
The CPU/memory challenge
6
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
2012 2013 2014 2015 2016 2017 2018 2019 2020
Normalized growth rate
CPU core count Memory Channel BW per core
 Increasing core counts
drives memory demand
 Demanding more
bandwidth and capacity
 Memory is unable to
keep up, leading to
more DDR channels
 Year-over-year memory
cost per GB reductions
flatten
 Memory capacity scaling
challenges are expected
to persist

7.
• Micron Confidential
• Micron Confidential
Memory
bandwidth
per
core
(GB/s)
CPU Core Count
24 32 48 64 96
DDR4 has reached its limit!
DDR5 increases memory bandwidth per CPU core
for next-generation, multi-core CPUs
128
Source: Micron estimates. System bandwidth simulated for x8 modules in 1DPC and dual-channel configuration.
DDR5 6400
DDR5 4800
DDR4 3200
DDR5 8800
0
2
4
6
8
10
12
14
40
16
18

8.
• Micron Confidential
• Micron Confidential
DDR4 vs DDR5
Up to 3x
performance increase
Rank(s) left side A Rank(s) left side B
40 bits
independent channel A
40 bits
independent channel B
 Data rates (up to 8800 MT/s)
 2x burst length (BL16)
 2x bank groups (8)
 2x banks (32)
 Improved refresh granularity (same bank refresh)
 2 independent 40-bit channels per RDIMM
(64 bytes per channel)
Micron Simulation, Subject to change
Simulated Conditions

9.
• Micron Confidential
• Micron Confidential
DDR4 vs DDR5
Simulated effective bandwidth
9
Simulated conditions
- BW normalized to x64 interface
- 64B random accesses
- 66% reads
- One dual rank x4 RDIMM
DDR4-3200 DDR5-3200
DDR4 3200 vs DDR5 3200
DDR4-3200 DDR5-4800
DDR4 3200 vs DDR5 4800
16.8 GB/s
34.2 GB/s
16.8 GB/s
23.4 GB/s
1.39x
2.03x
- 16Gb component addressing
- Same bank refresh enabled
- Auto-precharge enabled

10.
• Micron Confidential
• Micron Confidential
DDR5 data bus efficiency improved
Micron Confidential
10
66%
efficiency
91%
efficiency
89%
efficiency
DDR4 3200
DDR5 3200
DDR5 4800
DDR4 3200 DDR5 3200 DDR5 4800
16.8 GB/s
25.6 GB/s
23.4 GB/s
25.6 GB/s
34.2 GB/s
38.4 GB/s
Simulation
Theoretical Theoretical
Theoretical
Simulated conditions

11.
• Micron Confidential
• Micron Confidential
Application workload proof points
Micro-
benchmark
Stream
MLC
Data center
IMDB - REDIS
Cloud
provider
SPEC-jbb
SAP-SD
SAP-HANA
VMmark
HPC
OpenFoam
Cloverleaf
CP2K
POT3D
WRF
AI
ResNet
DLRM
BERT

12.
• Micron Confidential
• Micron Confidential
Sensitivity of workloads to memory latency, bandwidth and capacity
12

13.
Confidential
The User Perspective - Product Selection
• Single Node Systems
• Multi-Node Systems
• Blade Systems (Networking)
• Application Specific Systems

14.
Confidential
Supermicro Solutions

15.
• Micron Confidential
• Micron Confidential
Application workload demands in a data-centric world
Data center
Business applications
and real-time services
that include large in-
memory dB and OLTP
Cloud provider
Expanded number of
users and micro-
services that include
high-availability,
scaling and low
latency, virtualized and
containerized
environments
High-performance
computing
AI/ML and deep
learning algorithms
with real-time
processing and
analytics

16.
• Micron Confidential
• Micron Confidential
Increased performance for in-memory execution of
database and analytics applications
23% 45%
9,756 Query
Executions
per Hour
DDR4-3200
3rd Gen Xeon platorm1
DDR5-4800
4th Gen Xeon platorm2
14,118 Query
Executions
per Hour
SAP HANA 2.0
3
Phase 1
Data Load Time (s)
Faster
1.3 billion records loaded
More efficient business intelligence for
online analytical systems
More concurrent
operations
SAP HANA 2.0
3
Phase 3
0 1 2 3 4 5 6 7
DDR5-4th Gen Xeon
platform2
DDR4-3rd Gen Xeon
platform1
8 9 10 11
10.49
8.05
Lower is better
1. 3rd Gen Intel Xeon Platinum 8380 processor with Micron DDR4 3200 MHz system
2. 4th Gen Intel Xeon Platinum 8490H processor with Micron DDR5 4800 MHz system
3. SAP Standard Application Benchmark testing the hardware and database performance of SAP applications and components.

17.
• Micron Confidential
• Micron Confidential
Speed up your business application workloads
Meet Service Level Agreements (SLAs)
Improve business agility, scaling and efficiency
SPECjbb max-jOPS
3
1.40x
224,892
jOPS
DDR4-32001 DDR5-4800 2
315,663
jOPS
1.48x
135,269
jOPS
DDR4-32001
DDR5-48002
200,288
jOPS
SPECjbb critical-jOPS
3
1. 3rd Gen Intel Xeon Platinum 8380 processor with Micron DDR4 3200 MHz system
2. 4th Gen Intel Xeon Platinum 8480 processor with Micron DDR5 4800 MHz system
3. SPECjbb is registered trademark of Standard Performance Evaluation Corporation. Performance results are derived from detailed benchmark procedures available at http://www.spec.org
Increased transactional
throughput
Reduced latency and
response times
Better Quality of Service (QoS)

18.
• Micron Confidential
• Micron Confidential
Improve HPC efficiency
Reduce overall runtime of HPC simulations
Increase design iterations to improve accuracy
Faster time-to-market
20
The memory bandwidth required for next-generation HPC servers
>3x HPC workload performance boost
2.96 3.16
2.56
3.24
2.60
Speed factor for HPC workloads
1. AMD DDR4 system is an AMD EPYC 7763 64 core with DDR4-3200 MHz fully populated with 64GB RDIMMs
2. AMD DDR5 system is an AMD EPYC 9654 96 core with DDR5-4800 MHz fully populated with 64GB RDIMMs

19.
• Micron Confidential
• Micron Confidential
DDR5 for data-
intensive workloads
2xcapability
2x burst length
2x bank groups
2x banks
2x or higher bandwidth1
Increased bandwidth
More than 2x1
Higher bus efficiency
Greater than 80%1
Faster transfer speed
Up to 8800 MT/s2
Improving overall
workload performance3
Cloud
Data center
High-performance computing
22
34.2 GB/s
16.8 GB/s
23.4 GB/s
2.03x
1.39x
DDR4-3200 DDR5-4800
DDR5-3200
DDR4 3200 DDR5 4800
Virtualization
40%
HPC modeling
>200%
Business apps
45%
1. Benchmark simulation comparison of DDR5-4800 vs DDR4 -3200
2. Based on defined JEDEC specification
3. Results based on internal testing, 3rd party testing and/or industry workload benchmark
testing

20.
• Micron Confidential
• Micron Confidential

21.
© 2023 Micron Technology, Inc. All rights reserved. Information, products, and/or specifications are
subject to change without notice. Micron, the Micron logo, and all other Micron trademarks are the
property of Micron Technology, Inc. All other trademarks are the property of their respective owners.
24
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