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Accelerating Innovation from Edge to Cloud

The number of internet-connected devices is growing exponentially, enabling an increasing number of edge applications in environments such as smart cities, retail, and industry 4.0. These intelligent solutions often require processing large amounts of data, running models to enable image recognition, predictive analytics, autonomous systems, and more. Increasing system workloads and data processing capacity at the edge is essential to minimize latency, improve responsiveness, and reduce network traffic back to data centers. Purpose-built systems such as Supermicro’s short-depth, multi-node SuperEdge, powered by 3rd Gen Intel® Xeon® Scalable processors, increase compute and I/O density at the edge and enable businesses to further accelerate innovation. Join this webinar to discover new insights in edge-to-cloud infrastructures and learn how Supermicro SuperEdge multi-node solutions leverage data center scale, performance, and efficiency for 5G, IoT, and Edge applications.

Accelerating Innovation from Edge to Cloud

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Supermicro’s Edge-to-Cloud
AI/ML/DL Overview
David Nielsen
Sr. IoT/Embedded System Product Manager
davidn@supermicro.com
March 15, 2022
Agenda
• Supermicro at the Edge
• Edge-to-Cloud Digital Transformation
• AI/ML/DL & Benchmarking
• Management Tools
• New Products to Meet the Challenge
Better Faster Greener™ © 2022 Supermicro
2
2/1/2022
Old “Embedded” world IT World
Intelligent Edge
Standalone servers
Bare metal operating
systems
Lots of COTS product choices
Lightweight
DevOps
Low-cost architecture
and components are
supported
Evolved from IT world
Evolved from OT world
Cloud native
Hyperscale
Virtual Machines
Containers
No scale-out
Limited application
choices - niche products
Support for Realtime
workloads
Enterprise-grade hardware
expected
Autonomic management
Redundant distributed storage
Automatic failover
Scale-out architecture
Zero touch deployment
Programmatic management (APIs)
IT meets OT at the Intelligent Edge
Adapting the best technologies from datacenter and the cloud to the OT environment
Market Vertical Focused Solutions
Better Faster Greener™ © 2021 Supermicro
3/15/2022 4
Retail/Restaurants
Transportation & Smart City
Energy & Power
HealthCare & Telemedicine
Oil & Gas Production
vNetwork Functions
Private 5G/LTE
Industry 4.0
2/1/2022 Better Faster Greener™ © 2022 Supermicro
5
Remote DC
Regional DC
Central Office /
Edge Cloud
Network Edge
Network-
Optimized
2-5ms
<1ms/Realtime <10ms <20ms >50ms
Customer
Premises
Edge-Optimized ML/Analytics/Archive
Resource Management
Edge DC
CPE
Edge
Platforms
Enabling Edge to Cloud
Edge Appliance Prerequisites
Self Healing and Resiliency at the Edge
Edge Systems are remotely managed and unmanned.
Provides low latency and high throughput delivery for
VM’s & Containers – some of which are expected to be
up 99.9999% of the time
Automation / AI / ML
The use of GPU technology to enhance the
responsiveness of issues, policy and real-time analytics.
Built in AI for container and vNF management is
becoming a critical requirement
Cloud native approach and DevOps enablement
Service Providers & NFV vendors are driving a cloud
native approach. Service providers acknowledge the
evolvement of software in every part of the network
allowing cloud-based automation for infrastructure
deployment, operations and VM/Container
management.
Role of Open Software and Hardware Architectures
Open Architectures for software and hardware
infrastructure to develop, deploy and manage vNFs,
containers and APIs for services – enablement of
multiple, integrated partners
providing guidance and standards for delivery.
2/1/2022 Better Faster Greener™ © 2022 Supermicro
6
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Accelerating Innovation from Edge to Cloud

  • 1. Supermicro’s Edge-to-Cloud AI/ML/DL Overview David Nielsen Sr. IoT/Embedded System Product Manager davidn@supermicro.com March 15, 2022
  • 2. Agenda • Supermicro at the Edge • Edge-to-Cloud Digital Transformation • AI/ML/DL & Benchmarking • Management Tools • New Products to Meet the Challenge Better Faster Greener™ © 2022 Supermicro 2 2/1/2022
  • 3. Old “Embedded” world IT World Intelligent Edge Standalone servers Bare metal operating systems Lots of COTS product choices Lightweight DevOps Low-cost architecture and components are supported Evolved from IT world Evolved from OT world Cloud native Hyperscale Virtual Machines Containers No scale-out Limited application choices - niche products Support for Realtime workloads Enterprise-grade hardware expected Autonomic management Redundant distributed storage Automatic failover Scale-out architecture Zero touch deployment Programmatic management (APIs) IT meets OT at the Intelligent Edge Adapting the best technologies from datacenter and the cloud to the OT environment
  • 4. Market Vertical Focused Solutions Better Faster Greener™ © 2021 Supermicro 3/15/2022 4 Retail/Restaurants Transportation & Smart City Energy & Power HealthCare & Telemedicine Oil & Gas Production vNetwork Functions Private 5G/LTE Industry 4.0
  • 5. 2/1/2022 Better Faster Greener™ © 2022 Supermicro 5 Remote DC Regional DC Central Office / Edge Cloud Network Edge Network- Optimized 2-5ms <1ms/Realtime <10ms <20ms >50ms Customer Premises Edge-Optimized ML/Analytics/Archive Resource Management Edge DC CPE Edge Platforms Enabling Edge to Cloud
  • 6. Edge Appliance Prerequisites Self Healing and Resiliency at the Edge Edge Systems are remotely managed and unmanned. Provides low latency and high throughput delivery for VM’s & Containers – some of which are expected to be up 99.9999% of the time Automation / AI / ML The use of GPU technology to enhance the responsiveness of issues, policy and real-time analytics. Built in AI for container and vNF management is becoming a critical requirement Cloud native approach and DevOps enablement Service Providers & NFV vendors are driving a cloud native approach. Service providers acknowledge the evolvement of software in every part of the network allowing cloud-based automation for infrastructure deployment, operations and VM/Container management. Role of Open Software and Hardware Architectures Open Architectures for software and hardware infrastructure to develop, deploy and manage vNFs, containers and APIs for services – enablement of multiple, integrated partners providing guidance and standards for delivery. 2/1/2022 Better Faster Greener™ © 2022 Supermicro 6
  • 7. SCMI Edge Portfolio Small (Atom/Core) Large (Single Socket Core / Xeon-SP 1 - 3 GPU/VPU & I/O options) X-Large (Dual Socket Xeon-SP 3 or more GPU/VPU) vNF Workloads Throughput SYS-220HE SYS-E403P SYS-110P SYS-5019A ✔ Built for Net/Comms ✔ 2x workloads ✔ Power Needs ✔ Increased internal connections ✔ Redundancy/HA ✔ Expandability ✔ Flexible ✔ Rackmount or standalone ✔ NEBS and harsher certifications ✔ Cost Effective ✔ Enterprise driven ✔ Normalized Workloads ✔ uCPE & Intel Select solutions ✔ SMB capable ✔ Lower power consumption Minimal Port / Throughput Maximum Port / Throughput SYS-E50/100/302 Medium (Single Socket Core / Xeon-D 1 GPU/VPU & I/O options) SYS-510D SYS-210SE 2/1/2022 Better Faster Greener™ © 2022 Supermicro 7
  • 8. Micro-Datacenters w/ Liquid Immersive cooling Better Faster Greener™ © 2021 Supermicro 3/15/2022 8 Low Latency AI Driven Micro-Datacenter
  • 9. • Momentum into Wireless & High Throughput • Merging of common elements for heavy workloads • Whitebox H/W & Open SW Architectures • Increased use of AI • Network Architecture for Edge-to-Cloud platforms • Distributed Automated, Self Healing/Managing Intelligent platforms • “Killer-Apps” driving the need for increased AI/ML/DL based systems Market Evolution Snapshot Key Market Opportunities System integration, consolidation of hardware, exponential application deployment, higher-need agile partners 2/1/2022 Better Faster Greener™ © 2022 Supermicro 9
  • 10. Edge Service Delivery (GPU/CPU/FPGA) HCI Edge Compute Resolution Media Transformation Private Networking Edge Broadcasting Compute Transcoding User Requests Content Proactive Caching Transparent Caching Big Data Sensor Data WebTv/Video Video Communication Flickr Text2Speech Speech2Text Video2Text Translation SASE Dedicated Routing Enterprise Networks Social Events Local Aides Alerts GPS Cryptography Cloudlets VoIP Video Audio Proximity Proof Geolocation Bandwidth Indication Augmented Reality Face Recognition Site Recognition Edge Based CDN Geo Information Preloading Distributed Database Proximity Caching Car2Car RAN Data Monitoring IoT Local Connectivity Edge Content Delivery 2/1/2022 Better Faster Greener™ © 2022 Supermicro 10 Offloading Aggregation Content Scaling Augmentation
  • 11. High Level View of AI / ML / DL 2/1/2022 Better Faster Greener™ © 2022 Supermicro 11
  • 12. Edge Inferencing – What is it? • Enabling the edge data gathering device to provide actionable intelligence using Artificial Intelligence (AI) techniques. • Using multiple combined sensor input of large volumes of data is extracted and analyzed using AI with a trained neural network. • Platform requires sufficient computing capacity to run an optimized AI model at the point of data capture and this is referred to as ‘Inference at the Edge’. • Accelerates the OODA loop so that actions can be taken much more quickly. • How it is Achieved: Inference requires a pre-trained deep neural network model which is trained by feeding as many data points as possible into a framework to provide the best possible accuracy. • Typical frameworks that are used as the basis of these deep neural network models include: Tensorflow, MxNet and Caffe. 2/1/2022 Better Faster Greener™ © 2022 Supermicro 12
  • 13. Seven Patterns of AI 2/1/2022 Better Faster Greener™ © 2022 Supermicro 13 Goal driven output & analytics
  • 14. https://devcloud.intel.com/edge/ • Prototype on the latest hardware and software to future proof your solution • Benchmark your customized AI application • Run AI applications from anywhere in the world • Reduce development time and cost Using X86 based AI OpenVINO SDK 2/1/2022 Better Faster Greener™ © 2022 Supermicro 14 • OpenVINO - SDK From Intel • Runs on key X86 CPUs • HW Acceleration from Movidius • Continued enhancements of AI on each release of CPU Intel® DevCloud for the Edge A development sandbox to try AI and vision workloads remotely before purchasing Intel® platforms
  • 15. SMCI AI Ready Solutions 2/1/2022 Better Faster Greener™ © 2022 Supermicro 15 HPC/AI/Edge Testing, Certification & Benchmarking
  • 16. ML Perf Benchmarking 2/1/2022 Better Faster Greener™ © 2022 Supermicro 16 GPU certified systems URLs on NVIDIA website https://docs.nvidia.com/ngc/ngc-ready-systems/index.html https://www.nvidia.com/en-us/data-center/resources/vgpu-certified- servers/ https://www.nvidia.com/en-us/data-center/data-center-gpus/qualified- system-catalog/ https://docs.nvidia.com/ngc/ngc-deploy-on-premises/nvidia-certified- systems/index.html
  • 17. AI in Action – Partner Solutions 2/1/2022 Better Faster Greener™ © 2022 Supermicro 17 Personalization Vision AI AI Voice Interaction Lidar Smart Transportation Lidar Traffic Analysis SmartEdge MEC Augmented Reality Multi-Purpose CDN
  • 18. SuperCloud Composer • SW Defined Data Center Redfish API & Web Mngt Interface • Intelligent Data Center Management for day-to-day operations • Composable Disaggregated infrastructure • Multi-Rack Architecture and Orchestration of dynamic resources • Brick and mortar Server Health, Monitoring and Alerting Mngt • Pooled PCI-E NVMe (GPU/FPGA) • Pooled NVMe (GPU/FPGA) over Fabric • OS Provisioning / Fast Deploy • Advanced Out of Band Telemetry and Analytics • Application & Service-Level High Availability Better Faster Greener™ © 2021 Supermicro 3/15/2022 18 www.supermicro.com/en/solutions
  • 19. New Supermicro Edge Products 2/1/2022 Better Faster Greener™ © 2022 Supermicro 19
  • 20. 3/15/2022 20 3/15/2022 Better Faster Greener™ © 2021 Supermicro 20 SYS-210SE-31D/SYS-210SE-31A SuperEdge Series, 2U 3-Node, Intel® Ice Lake-SP Front Access Short Depth Server Processor Intel® Xeon® Ice Lake Scalable Processors up to 205W TDP, single socket Memory Capacity 8x DIMM slot, DDR4 3200MHz 3DS ECC RDIMM or LRDIMM Support Intel® Optane™ Persistent Memory 200 Series Expansion Slots 2x PCIe 4.0 x16 FHHL 1x PCIe 4.0 x16 HHHL I/O Ports 1x GbE Mgmt RJ45, NCSI support (share NIC) 1x KVM dongle (output 1x VGA, 1x COM, 2x USB 2.0 through KVM cable) Storage 2x PCIe 4.0 x4 M.2 M-key 2280/22110, with RAID (by Intel® VROC) Security 1x on board TPM and 1x TPM header, HW Root of Trust 1 2 C D 4 5 Motherboard: X12SPED-F Chassis: CSE-SE201 Dimension: W17.7” x D16.9” x H3.5” (449mm x 430mm x 88mm) 6 16.9” (430mm) chassis depth, fits in 600mm deep cabinet Front hot-swappable Nodes with single CPU socket and 8 DIMM design Front access IO design, and tool-less serviceability Redundant power supply units with DC and AC options Carrier Grade (NEBS Level 3) compliance 3rd Gen Intel® Xeon® Ice Lake Scalable Processors, up to 205W, single socket 2x PCIe 4.0 x16 FHHL slots and 1x PCIe 4.0 x16 HHHL slot per Node 2x M.2 M-Key 2280/22110 per node Key features Applications Telecom, C-RAN(vRAN), 5G Open-RAN, 4G vBBU, Edge Datacenter, Enterprise Edge Computing, Flex-RAN, Multi-Access Edge Computing (MEC) System Form Factor 2RU Rackmount, 3 hot-swappable CPU Nodes System Cooling 4x 4056mm Counter Rotation Fans per Node Power Supply 2000W DC or 2000W AC Redundant PSU System Operating Environment General application: 0°C to 40°C (up to 205W TDP) NEBS criteria: -5°C to 55°C (up to 185W TDP) CPU Node Specification 3 B A Better Faster Greener™ © 2022 Supermicro
  • 21. Product Specifications Form Factor 2U Rackmount Chassis: CSE-217HQ+-000NBP4 Dimension (Wx H x D) 438 x 88 x 730mm (W x H x D) Node/Sled 4 x Hot-swappable 1U CPU Node Storage 24x 2.5” Hot-swap SATA Drive Bays (6 bays per Node) System Cooling 4 Heavy duty 8cm PWM fans with optimal fan speed control Power Supply 2000W 1+1 Redundant Power Supplies DC PSU: PWS-2K03D-1R AC PSU: PWS-2K04A-1R Operating & Non- operating Temperature Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F) Non-operating Temperature: -40°C to 60°C (-40°F to 140°F) Certification EMC: CE/FCC/VCCI/RCM/NEBS Safety: CB/UL/CUL 3/15/2022 21 Design features • 2U4N server DC 2000W redundant and rear access PSU • Single Intel ICX socket P support up to 270W • Front hot-swappable 2.5” HDD tray, rear hot-swappable nodes • Rear access l/O design, and tool less serviceability • AC/DC Redundant power supply units Better Faster Greener™ © 2022 Supermicro SYS-210TP-HPTR / SYS-210TP-HPTRD 2U 4-Node, Intel® Ice Lake-SP Rear Access DU Server
  • 22. 3/15/2022 Better Faster Greener™ © 2022 Supermicro 22 Processor Intel Ice Lake Xeon D-1718IT, 2.6GHz, 46W, 2933MHz/D-1736NT, 2.7GHz, 67W, 2667MHz, QAT 20G Memory Capacity DDR4 2933Mhz 2 channels, 4 slots RDIMM/UDIMM (ECC&non ECC) up to 256GB Expansion Slots 1 x M.2 B-Key (3042/3052/2280) & Nano SIM Slot 1 x M.2 M-Key (2280) 1x M.2 E-Key (2230) I/O ports 1x VGA 2x USB 3.0 Slots 4x 1GbE LAN Ports 2x 25G SFP28 1x Dedicated IPMI Port Storage 2.5“ SSD/HDD M.2 M-Key (2280) Mounting Options Wall Mount Power Supply Lockable 150W DC Power Adapter Operating Temperature 0°C - 40°C 1 2 3 4 5 6 7 • Intel Ice Lake Xeon D-1718T 10MB 4c 46W 2.6GHz/ D-1736NT 15MB 8c 67W 2.7GHz QAT 20G • Up to DDR4 2933MHz 256GB RDIMM or 128GB UDIMM • 2x25G SFP28, 4x 1GBase-T LAN, 1x IPMI LAN, 1x VGA, 2x USB3.0 • 2x SATA 2.5” Storage, 1x M.2 B-Key (3042/3052/2280), 1x M.2 M-Key (2280) • 0°C-40°C Operating Temperature Key features Applications 1x VGA 2x USB 3.0 1x M.2 B-Key & Nano SIM Slot 1x M.2 M-Key 1xM.2 E-Key Network Appliance, Retail, Industrial Automation, Artificial Intelligence, Machine Learning Intel Xeon D- 1718T 4C 46W/ D- 1736NT 8C 67W 4x 1GbE 2x 10GBase-T 1x IPMI 2x SFP+ 2x 2.5” Storage 8 Motherboard: X12SDV-4C/8C-SP6F Fanless Chassis: CSE-E302iL Dimensions: W:10.5” x D:7.5” x H:3.5” FRONT VIEW REAR VIEW SYS-E302-12D Intel® Xeon D Fanless Embedded System
  • 23. 3/15/2022 Better Faster Greener™ © 2022 Supermicro 23 SYS-E300-12D-4C/8C/10CN6P Intel® Ice Lake-D Mini-1U Super Server Processor Intel® Xeon D Ice Lake LCC SoC Processor,4/8/10 Cores, 25W/50W/88W Memory Capacity 4 DIMM slot, DDR4 2933MHz up to 256GB RDIMM/UDIMM ECC/Non-ECC Expansion Slots 1 x PCIe 4.0 x 16 1 M.2 M-Key SATA3.0/PCI-E 3.0 x4, 2280 1 M.2 E-Key PCI-E 3.0 x1, 2230 1 M.2 B-Key SATA/PCI-E 3.0 x2/USB 3.0, 2280/3042 I/O ports 1 x IPMI dedicated LAN 4 x GbE ; 2 x 25G SFP28 2 x USB 3.0 type A 1 x VGA Drive Bays 1 Internal 2.5" drive bays Power Supply 150W AC Power Adapter System Cooling 3x 40x28mm 4pin FAN 1 2 3 4 5 6 Motherboard: X12SDV-4C/8C/10C-SP6F (Flex-ATX 9” x 7.25”) Embedded Server Box Chassis: CSE-E300 System WxDxH : 10”x8.9”x1.7” or 254x226x43 mm. 7 Key features Applications Retail Application, Firewall, Gateway, uCPE 1 VGA PCIe 4.0 x16 M, B, E-Key M.2 Xeon-D SoC 4/8/10C 4x GbE LAN, 2x 25G SFP28 1 x IPMI Dedicated LAN 1 x 2.5” SATA SSD Intel® Xeon D Ice Lake 4/8/10 Cores Processor Up to 256GB RDIMM or 128GB UDIMM, DDR4 2933MHz in 4 Slots 1 x IPMI dedicated LAN ;4 x GbE ; 2 x 25G SFP28; 2x USB 3.0 type A; 1 M.2 M-Key SATA/PCI-E 3.0 x4, 2280 1 M.2 E-Key PCI-E 3.0 x1, 2230 1 M.2 B-Key SATA3.0/PCI-E 3.0 x2/USB 3.0, 2280/3042 1 SATA SSD drives
  • 24. 3/15/2022 Better Faster Greener™ © 2022 Supermicro 24 SYS-110D-4C/8C/16C/20C-FR(A/D)N8TP Intel® Ice Lake D Compact 1U Embedded System Processor Intel® Xeon D Ice Lake 4/8/xx/xx Cores Processor, 65W~125W Memory Capacity DDR4 3200MHz 1DPC, 4 slots RDIMM/LRDIMM, up to 256GB/512GB Expansion Slots 1 x PCIe 4.0 x 16 1 M.2 M-Key SATA3.0/PCI-E 3.0 x4, 2242/2280 I/O ports 1 x IPMI dedicated LAN 4 x GbE ; 2 x 10GbE ; 2 x 25G SFP28 2 x USB 3.0 type A 1 x VGA Drive Bays 2 Internal 2.5" drive bays Power Supply Redundant 800 W, 100-240 Vac Redundant 600 W, -48 Vdc System Cooling 5x 40x56mm Hot-swap Counter-rotation PWM Fans (one is optional) 1 2 3 4 5 6 Motherboard: X12SDV-4C/8C/16C/20C-SPT8F(7.5”x 8.5”) 1U Chassis: 515M-R804/515M-R601 W17.2” x D15.7” x H1.7” (437x399x43mm) 7 Intel® Xeon D Ice Lake 4/8/16/20 Cores Processor Up to DDR4 3200Mhz 4 channels, 4 slots RDIMM/LRDIMM up to 512GB 1 x IPMI dedicated LAN ;4 x GbE ; 2x 10GbE; 2 x 25G SFP28 2x USB 3.0 type A; 1 M.2 M-Key SATA/PCI-E 3.0 x4, 2280 2 SATA/U.2 2.5” drives Key features Applications 1 VGA PCIe 4.0 x16 M-Key M.2 Networking Application, Firewall, uCPE, Telecom Application Xeon Ice Lake D SoC 4/8/16/20C 4x GbE LAN, 2x 10GbE LAN 2x 25G SFP28 1 x IPMI dedicated LAN 2x 2.5” drive bays
  • 25. 3/15/2022 Better Faster Greener™ © 2022 Supermicro 25 SYS-510D-4C/8C/10C-FN6P Intel® Xeon D Compact 1U Embedded System Processor Intel® Xeon D Ice Lake LCC SoC Processor,4/8/10 Cores, 25W/50W/88W Memory Capacity 4 DIMM slot, DDR4 2933MHz up to 256GB RDIMM/UDIMM ECC/Non-ECC Expansion Slots 1 x PCIe 4.0 x 16 1 M.2 M-Key SATA3.0/PCI-E 3.0 x4, 2280 1 M.2 E-Key PCI-E 3.0 x1, 2230 1 M.2 B-Key SATA/PCI-E 3.0 x2/USB 3.0, 2280/3042 I/O ports 1 x IPMI dedicated LAN 4 x GbE ; 2 x 25G SFP28 2 x USB 3.0 type A 1 x VGA Drive Bays 1 Internal 3.5" or 4 Internal 2.5" drive bays Power Supply 200W AC-DC power supply System Cooling 3x 40x28mm 4-PIN PWM fans 1 2 3 4 5 6 Motherboard: X12SDV-4C/8C/10C-SP6F (9.0” x 7.25” Flex ATX) 1U Chassis: CSE-505-203B W17.2” x D9.8” x H1.7” (437x249x43mm) 7 Intel® Xeon D Ice Lake 4/8/10 Cores Processor Up to 256GB RDIMM or 128GB UDIMM, DDR4 2933MHz in 4 Slots 1 x IPMI dedicated LAN ;4 x GbE ; 2 x 25G SFP28; 2x USB 3.0 type A; 1 M.2 M-Key SATA/PCI-E 3.0 x4, 2280 1 M.2 E-Key PCI-E 3.0 x1, 2230 1 M.2 B-Key SATA3.0/PCI-E 3.0 x2/USB 3.0, 2280/3042 4 SATA drives Key features Applications 1 VGA PCIe 4.0 x16 M, B, E-Key M.2 Retail Application, Firewall, Gateway, uCPE Xeon Ice Lake D SoC 4/8/10C 4x GbE LAN, 2x 25G SFP28 1 x IPMI dedicated LAN 1x 3.5” or 4 x 2.5” drive bays
  • 26. 3/15/2022 Better Faster Greener™ © 2022 Supermicro 26 SYS-E403-9D-14CN/16C-IPD2 Pole-Mounted IP65 Server Platform for 5G and the Intelligent Edge Processor Intel® Xeon® Skylake D-2183IT Processor, 16C/32T, 2.2GHz, 100W Intel® Xeon® Skylake D-2177NT Processor, 14C/28T, 1.9 GHz, 105W Memory Capacity 4x DIMM slots, (2400 MHz: D-2183IT, 2667 MHz: D-2177NT) DDR4, up to 512GB ECC LRDIMM, or 256GB ECC RDIMM Expansion Slots 2x PCIe 3.0 x16 (FHFL) or 2x PCIe 3.0 x8 & 1x PCIe 3.0 x16 (FHFL) 1x M.2 M-Key 2280/22110 (PCIe 3.0 x4/SATA3) 1x M.2 B-Key 3042 (PCIe 3.0 x2/SATA3/USB3.0) 1x M.2 E-Key 2230 (PCIe 3.0 x1/USB2.0) I/O Ports 4x SATA3 (6Gbps) ports; RAID 0, 1, 5, 10 4x 10GbE SFP+ ports, 9x GbE ports, 1x Dedicated IPMI port 1x VGA, 1x COM via RJ45 Drive Bays 4x Internal 2.5" drive bays Main Power 900W –44 Vdc to -59 Vdc, support dual power input, redundant power System Cooling 3 x 8080mm PWM redundant fans, 6x 8038mm waterproof fans Compact server in IP65 enclosure for extreme environments Intel® Skylake D-2177NT(14C/28T) / D- 2183IT(16C/32T) 3x PCIe slots (FHFL, 300mm) for GPU/FPGA 4x 10GbE SFP+, 9x GbE (1 for MGMT), 1x dedicated IPMI port Redundant power supply, fans and sensors -40℃ to 46℃ ambient (14CN), -40℃ to 50℃ ambient (16C) Weight: 101.5lbs (46.04kg) Key features Applications 5G Radio Access Network (RAN) Multi-Access Edge Computing (MEC) Vehicle to Everything (C-V2X/V2X), Smart City Motherboard: MBD-X11SDW-14CN/16C-TP13F+ (8” x 10”) Chassis: CSE-E403iF-000NDBP2 Dimension: W12.56” x D10.16” x H32.31” (319mm x 258mm x 821mm) 3x PCIe slot B-Key M.2 M-Key M.2 E-Key M.2 Extreme Outdoor Environment D-2183IT/ D-2177NT IPMI LAN 9x GbE 4x 10GbE SFP+ 4x SATA3 2x USB 3.0 2x USB 2.0 -48 VDC 1 2 3 4 5 6 7
  • 27. 3/15/2022 Better Faster Greener™ © 2022 Supermicro 27 SYS-E403-9D-16C-IP Pole-Mounted IP65 Server Platform for 5G and the Intelligent Edge Processor Intel® Xeon® Skylake D-2183IT Processor, CPU TDP support 100W Memory Capacity 4x DIMM slots, DDR4 2400 MHz, up to 512GB ECC LRDIMM, or 256GB ECC RDIMM Expansion Slots 2x PCIe 3.0 x16 (FHFL) or 2x PCIe 3.0 x8 & 1x PCIe 3.0 x16 (FHFL) 1x M.2 M-Key 2280/22110, 1x M.2 B-Key 3042, 1x M.2 E-Key 2230 I/O Ports 4x SATA3 (6Gbps) ports; RAID 0, 1, 5, 10 2x 10GbE SFP+ ports, 2x 10GbE Base-T ports 9x GbE ports, 1x Dedicated IPMI port, 1x COM via RJ45, 1x VGA Drive Bays 4x Internal 2.5" drive bays Main Power 100-240 VAC, Est. Max Power consumption: 1200W (instantaneous) / 900W (stable) Server Power 600W 100-240 VAC, Multi-output power supply, 80Plus Gold System Cooling 3x 8080mm PWM redundant fans, 4x 172x25.4mm enclosure fans Compact server in IP65 enclosure for extreme environments Intel® Skylake D-2183IT(16C/32T) DDR4 2400MHz up to 512GB, 256GB non ECC 3x PCIe slots (FHFL, 300mm) for GPU/FPGA 2x 10GbE SFP+, 2x 10GbE Base-T, 9x GbE 2x USB 3.0, 2x USB 2.0, 4x 2.5” SATA3 drive bays 3x M.2 M-Key, B-Key, E-Key 2x PCIe 3.0 x16 or 2x PCIe 3.0 x8 & 1x PCIe 3.0 x16 -40℃ to 46℃ ambient Key features Applications 5G Radio Access Network (RAN) Multi-Access Edge Computing (MEC) Vehicle to Everything (C-V2X/V2X), Smart City 3x PCIe slot B-Key M.2 M-Key M.2 E-Key M.2 Extreme Outdoor Environment D-2183IT IPMI LAN 9x GbE 2x 10GbE 2x 10GbE SFP+ 4x SATA3 2x USB 3.0 2x USB 2.0 Motherboard: MBD-X11SDW-16C-TP13F (8” x 10”) Chassis: CSE-E403iF-000NBP Dimension: W20.3” x D25.6” x H32.31” (516mm x 450mm x 650mm) 100-240 VAC 1 2 3 4 5 6 7
  • 28. Better Faster Greener™ © 2022 Supermicro 28 SYS-E403-12P-IPA2-C Pole-Mounted IP65 Server Platform for Smart City and the Intelligent Edge Processor Intel® Xeon® Ice Lake Scalable Processor up to 165W Memory Capacity 8x DIMM slots, (up to 2TGB, 3DS ECC DDR4-3200MHz RDIMM/LRDIMM) Expansion Slots 3x PCIe 4.0 x16 (FHFL) 1x M.2 M-Key 2280/22110 (PCIe 3.0 x4/SATA3) I/O Ports 2x 10GbE LANs, 1x Dedicated IPMI port 1x VGA, 1x COM Drive Bays 4x SATA 2.5 SSD Main Power 900W 110V – 240 Vac System Cooling Modular 3 x 8038mm PWM System fans, 6x 8038mm HEX Fans Compact server in IP65 enclosure for extreme environments Intel® Xeon® Ice Lake Scalable Processor, Up to 165W 8x DIMM slots, (up to 2TB, 3DS ECC DDR4-3200MHz RDIMM/LRDIMM) 2x 10GbE, 1x dedicated IPMI port 2x USB 3.0, 2x USB 2.0 1x M.2 M-Key 2280/110 3x PCIe 4.0 x16 (FHFL, 300mm) 4x SATA 2.5 SSD -40℃ to 46℃ ambient plus solar load Weight: 97lb (44kg) Key features Applications Smart City Multi-Access Edge Computing (MEC) Intelligent Edge Motherboard: X12SPW-TF (8” x 13”) Chassis: CSE-B403L1-A600DIP65 Dimension: W12.6” x D9.6” x H32.6” (319mm x 244mm x 828mm) 3x PCIe Slots M-Key M.2 Extreme Outdoor Environment Intel® Ice Lake Processor IPMI LAN 2x 10GbE 4x SATA 2.5 SSD/U.2 2x USB 3.0 2x USB 2.0 1 2 3 4 5 6 7 3/15/2022
  • 29. 2/1/2022 Better Faster Greener™ © 2021 Supermicro 29 3rd Gen Intel® Xeon® Ice Lake Scalable Processors, up to 250W DDR4 3200MHz up to 2TB Total Memory 2x PCIe 4.0 x16 FHHL, 1x PCIe 4.0 x16 low profile slot (or 2 x8) 1x PCIe 4.0 x8 FHHL *(if CPU <= 165W, 1U heatsink) 2x 10G BASE-T & 4x GbE Processor Intel® Xeon® Ice Lake Scalable Processors up to 250W TDP Memory Capacity 8x DIMM slot, DDR4 3200MHz, up to 2TB total memory Expansion Slots 2x PCIe 4.0 x16 FHHL 1x PCIe 4.0 x16 low profile slot (or 2 x8) 1x PCIe 4.0 x8 FHHL *(if CPU <= 165W, 1U heatsink) I/O Ports 2x 10G BASE-T, 4x GbE, 2x USB 3.0, 2x USB 2.0, 1x VGA, 1x dedicated IPMI, 1x COM port Drive Bays 2x SATA3 (2x internal), 1x M.2 M Key 2280/22110 2 x NVMe with Optional NVMe Backplane – I/O Slot 2 is lost Power Supply 600W DC redundant power supply System Cooling 4x 8038 chassis fan 4-PIN PWM FAN 1 2 3 4 6 Motherboard: X12SPM-LN6TF Chassis: CSE-211M Dimension: W17.2” x D11.8” x H3.5” (437mm x 299mm x 89mm) 7 Key features Applications GPU/FPGA Supported 2x PCIe 4.0 x16 1x PCIe 4.0 x16 LP 1x PCIe 4.0 x8* M.2 – M Key Multi-Access Edge Computing(MEC), C-RAN(vRAN), uCPE, AI on Edge, Deep Learning, Advance Network Security 3rd Gen. Xeon Scalable Processors up to 225W TDP IPMI LAN 4x GbE 2x 10GbE 2x SATA3 2x USB 2.0 1x COM via RJ45 1x IPMI 5 SYS-210P-FRDN6T Intel® Ice Lake-SP 300mm Short Depth 2U UP Edge System
  • 30. DISCLAIMER Super Micro Computer, Inc. may make changes to specifications and product descriptions at any time, without notice. The information presented in this document is for informational purposes only and may contain technical inaccuracies, omissions and typographical errors. Any performance tests and ratings are measured using systems that reflect the approximate performance of Super Micro Computer, Inc. products as measured by those tests. Any differences in software or hardware configuration may affect actual performance, and Super Micro Computer, Inc. does not control the design or implementation of third party benchmarks or websites referenced in this document. The information contained herein is subject to change and may be rendered inaccurate for many reasons, including but not limited to any changes in product and/or roadmap, component and hardware revision changes, new model and/or product releases, software changes, firmware changes, or the like. Super Micro Computer, Inc. assumes no obligation to update or otherwise correct or revise this information. SUPER MICRO COMPUTER, INC. MAKES NO REPRESENTATIONS OR WARRANTIES WITH RESPECT TO THE CONTENTS HEREOF AND ASSUMES NO RESPONSIBILITY FOR ANY INACCURACIES, ERRORS OR OMISSIONS THAT MAY APPEAR IN THIS INFORMATION. SUPER MICRO COMPUTER, INC. SPECIFICALLY DISCLAIMS ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. IN NO EVENT WILL SUPER MICRO COMPUTER, INC. BE LIABLE TO ANY PERSON FOR ANY DIRECT, INDIRECT, SPECIAL OR OTHER CONSEQUENTIAL DAMAGES ARISING FROM THE USE OF ANY INFORMATION CONTAINED HEREIN, EVEN IF SUPER MICRO COMPUTER, Inc. IS EXPRESSLY ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. ATTRIBUTION © 2022 Super Micro Computer, Inc. All rights reserved. 2/1/2022 Better Faster Greener™ © 2021 Supermicro 30