The Universal GPU system architecture combines the latest technologies that support multiple GPU form factors, CPU choices, storage, and networking options.Together, these components are optimized to deliver high performance in a balanced architecture in a highly scalable system. Systems can be optimized for each customer’s specific Artificial Intelligence (AI), Machine Learning (ML), or High Performance Computing (HPC) applications. Organizations worldwide are demanding new options for their future computing environments, which have the thermal headroom for the next generation of CPUs and GPUs. Join this webinar to learn how to leverage Supermicro's Universal GPU system to simplify customer deployments, deliver ultimate modularity and customization options for AI to Omniverse environments.

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Better Faster Greener™ © 2022 Supermicro

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Supermicro’s Universal GPU: Modular, Standards
Based and Built for the Future
Josh Grossman,
Principal Product Manager
April, 2022
Better Faster Greener™ © 2022 Supermicro

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Agenda
• Introduction to AI Market
• Universal GPU Systems with MI250
• Martin Huarte on AMD GPU Software Stack
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AI Market Projection
• 13 trillion dollar overall market Size According to Mckinsey
• AI market size (USA) will expand at a Compound Annual Growth
Rate (CAGR) of 40.2% from 2021 to 2028.
• 83% of companies share that having access to AI is a top priority
in their business plans.
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AI augmentation” will create $2.9trn of “business value” and save 6.2bn
man-hours globally. A survey by McKinsey last year estimated that AI
analytics could add around $13trn, or 16%, to annual global GDP by 2030.
Retail and logistics stand to gain most (see chart 2). (Economist, 2022)

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Rack Scale AI Solutions
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Summary Universal GPU Server
• The Most Optimized and Flexible GPU Server Platform available today
o CPU MB Support
• AMD H12 Milan
• Intel X12 Ice Lake
o GPU Support
• NVIDIA Redstone with GPU to GPU NVLink
• AMD MI-250 with Infinity Fabric xGMI
• Traditional PCIe Form Factor GPU
• Modular Design for Flexibility
• Improved Thermal Capability
o Support up to 500W/700W GPU, 280W AMD CPU and 350W/400W Intel CPU
• 1U Expansion Module available for all 4U Servers
UBB/OAM
Intel PVC
Redstone
AMD MI-
250
PCIe
Supermicro Confidential

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4U/5U Rackmount
Dual X12, X13 and H12
Processors 32 DIMM Slots
Up to 10 PCIe Low Profile 5.0
Slots
Up to 10 PCIe with up to 2
AIOM/OCP 3.0 NIC Slots
Up to 10 Drives of 2.5”
NVMe/SAS/SATA
4x 3000W
Redundant Titanium (2+2) /
Platinum Level Power Supplies
Universal GPU Product Series
4U uGPU
Universal GPU Server
Performance
Modular, Standards Based
Modular design supports a variety of GPU
technologies and configurations
Supports industry leading high performance GPUs
from NVIDIA, AMD and Intel.
Standardize on one GPU Platform for all your
data center needs
Next Generation Supermicro Universal GPU Servers
Subject to change without notice
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5U uGPU
Universal GPU with 1 U Expansion Module
One GPU Platform

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Universal Design and AMD Instinct MI250 OAM
Supermicro Confidential/Internal Only
• Significant HPC performance increase
over competition
• Also good for AI/ML workloads
• 128GB HBM2e ECC Memory per OAM
• GPU to GPU xGMI Infinity Fabric 2.5TB/s

12. CONFIDENTIAL
AMD Tools & Solutions for AI/ML and HPC
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RTM
Reverse Time Migration
Datacenter Tools: Profilers & Debuggers, Comm & Math Libraries, Compiler
Code Reuse: ONNX Run-time, existing deep learning, HPC code
Cross Platform: Open source, supports AMD CPUs, CPU, non-AMD GPUs
3RD GEN AMD INFINITY
ARCHITECTURE
FIRST MULTI-CHIP GPU
• Highest performance
• Bigger GPU memory
• Higher Flops (FP64, FP32, FP16)

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Specifications
CPU – Dual Socket
Dual AMD EPYC 7003 CPUs (Socket SP3)
up to 280W, 128 Cores/256 Threads
Memory – 32 DIMM Slots
32 DIMM, 8TB Reg. ECC DDR4 up to
3200MHz
Drives – 10 2.5” Drive-bay
Up to 10x HS NVMe U.2 connect to PCIe
Switch or 10x HS 2.5” SATA
Expansion – 8 PCIe Slots
8x PCIe 4.0 x16 LP (via PLX switch)
I/O ports
1x VGA, 1x COM Header, 2x USB 3.0, and
1x Dedicated IPMI
Power Supply
4x 3000W (2+2) Titanium Level efficiency
power supplies
4U AMD EPYC 7003 Dual CPUs and Four AMD MI250 GPUs
Universal GPU System AMD AS -4124GQ-TNMI
Subject to change without notice
Key Features
Universal GPU Server Standards Based Design
Modular by Design for Flexibility/Future Proofed
Improved Thermal Capability
Key Applications
Perfect Platform for HPC applications
Data Center Infrastructure
System Rear View
System Front View
Supermicro Confidential/Internal Only

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Specifications
CPU – Dual Socket
Dual AMD EPYC 7003 CPUs (Socket SP3)
up to 280W, 128 Cores/256 Threads
Memory – 32 DIMM Slots
32 DIMM, 8TB Reg. ECC DDR4 up to
3200MHz
Drives – 10 2.5” Drive-bay
Up to 10x HS NVMe U.2 connect to PCIe
Switch or 10x HS 2.5” SATA
Expansion – 10 PCIe Slots
8x PCIe 4.0 x16 LP (via PLX switch)
2x PCIe 4.0 x16 LP or AIOM (via CPU w/
1U add-on)
I/O ports
1x VGA, 1x COM Header, 2x USB 3.0, and
1x Dedicated IPMI
Power Supply
4x 3000W (2+2) Titanium Level efficiency
power supplies
5U AMD EPYC 7003 Dual CPUs and Four AMD MI250 GPUs
Universal GPU System AMD AS -4124GQ-TNMI
Subject to change without notice
Key Features
Universal GPU Server Standards Based Design
Modular by Design for Flexibility/Future Proofed
Improved Thermal Capability
Key Applications
Perfect Platform for HPC applications
Data Center Infrastructure
System Rear View
System Front View
Supermicro Confidential/Internal Only

15. Driving Innovation and
Discovery with AMD Instinct™
accelerators on ROCm™ Stack
Martin Huarte, Ph.D.
Developer Relations Manager, martin.huarte@amd.com

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[AMD Official Use Only]
Open APIs
Open
Libraries
Compilers
Developer
Tools
Kernel /
Runtime
HPC
Frameworks
ISV Apps
Open-
Source
Codes
Operating
Systems
Deployment
Tools
Mgmt Tools
ML
Frameworks

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[AMD Official Use Only]
Drivers/Runtimes
Programming
models
Libraries
Compilers & Tools
Deployment Tools
Compiler
OpenMP API HIP API OpenCL™
RedHat, CentOS, SLES & Ubuntu Device Drivers and Run-Time
BLAS FFT
RAND
SPARSE
Debugger
Profiler
ROCm Validation Suite ROCm Data Center Tool
SOLVER
TENSILE
ALUTION THRUST MIOpen
MIVisionX
Tracer
RCCL
MIGraphX PRIM
hipify
ROCm SMI

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[AMD Official Use Only]
AMD Infinity Hub
Containerized HPC Apps and ML Frameworks
Purpose-built accelerators for HPC and AI workloads
Full range of leading OEMs/ODMs supplying AMD
Accelerated systems to HPC and AI market segments
Open software platform for developers to build
HPC applications on AMD Accelerators
Single location for researchers and data scientists to
download containerized HPC apps and ML
frameworks
Compilers, Libraries, Dev
Tools, APIs, Kernels/Runtimes
Validated, Optimized Systems & Platforms

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[AMD Official Use Only]
DRIVING MAINSTREAM ADOPTION & ECOSYSTEM ENABLEMENT
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EXPANDED
OPTIMIZED
ENABLING
SUPPORT FOR AMD INSTINCT™
MI200 & AMD RADEON™ PRO
W6800 GPUS
COMPILER & LIBRARY
OPTIMIZATIONS FOR HPC &
AI/ML
NEW ROCm DOCUMENTATION
PORTAL & IMPROVED DEBUG
TOOLS

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[AMD Official Use Only]
Re-architected ROCm Documentation
 Support Guides
 Installation & Deployment Guides
 API / SDK Documentation
Access to ROCm Learning Center
 GPU programming tutorials, videos and labs
https://docs.amd.com/

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[AMD Official Use Only]
Molecular Dynamics Academic / Research Oil & Gas / Geoscience
NAMD
LAMMPS
GROMACS
Computer Aided
Engineering (CAE)
Weather Machine Learning
Reverse Time Migration (RTM) –
miniMOD sample
SPECFEM3D (Cartesian)
SPECFEM3D (Globe)
CP2K
Quantum Espresso
NWChem
VASP
MPAS
TempoQuest AceCAST
ICON
NEMO
Chroma
MILC
GRID
TensorFlow
PyTorch
ONNX-Runtime
MLPerf
AMBER
OpenMM
Relion
Quantum Chemistry Quantum Physics
OpenFOAM® (CFD)
PYFR (CFD)
Cascade CharLES (CFD)
Ansys Mechanical (FEA)
Target availability 1H22

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[AMD Official Use Only]
AMD INFINITY HUB ROCm™ APP CATALOG
COMMERCIAL ISVs
[LINK]
[LINK]
•
•
•
•
•
*Ansys Mechanical 2022 R2, Cascade CharLES, TempoQuest AceCAST

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[AMD Official Use Only]
• HPC Apps: CHROMA*, CP2K*, GRID*, GROMACS*,
HACC, LAMMPS, MILC, NAMD*, OpenMM*, Relion,
SPECFEM3D (Cartesian)*, SPECFEM3D (Globe)*
• HPC Apps: AMBER*, ICON, MPAS, NWCHEM,
OpenFOAM, PYFR, QuantumEspresso, WRF, NEMO
• AI/ML: PyTorch*, TensorFlow*
• Benchmarks: HPL, NBODY
• Benchmarks: MLPerf (SSD, Resnet50, Transformer),
HPCG
Additional MI200 Support Planned for 1H22
MI200 Support Planned for 2H21
* Available on InfinityHub with MI100 support today
Performance Results for Select Apps / Benchmarks

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[AMD Official Use Only]
 AMD Instinct GPUs:
 AMD Instinct™ MI210 GPU page: https://www.amd.com/en/products/server-accelerators/instinct-mi210
 AMD Instinct™ MI Series Product Page: https://www.amd.com/en/graphics/instinct-server-accelerators
 AMD Instinct™ HPC Solutions Page: https://www.amd.com/en/graphics/servers-instinct-mi-powered-servers
 AMD Instinct™ Machine Learning Solutions Page: https://www.amd.com/en/graphics/servers-instinct-deep-learning
 AMD CDNA2 Architecture: https://www.amd.com/en/technologies/cdna2
 CDNA2 WP: https://www.amd.com/system/files/documents/amd-cdna2-white-paper.pdf
 AMD ROCm™ open software platform:
 AMD ROCm™ pages: https://www.amd.com/en/graphics/servers-solutions-rocm
 AMD Infinity Hub: https://www.amd.com/en/technologies/infinity-hub
 AMD Accelerator Cloud: https://www.amd.com/en/solutions/accelerated-computing
 ROCm Information Portal (DOCs & Learning Ctr.): https://docs.amd.com/
 HPC & AMD page: www.AMD.com/HPC
For AMD Instinct™ GPU and ROCm™ marketing assets, contact: Guy.Ludden@AMD.com or
Sydney.Freeman@AMD.com

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Thank You
25 Better Faster Greener™ © 2022 Supermicro
Please Contact us for Details:
Josh Grossman,
Principal Product Manager, Supermicro
joshg@supermicro.com
Martin Huarte, Ph.D.,
Developer Relations Manager, AMD
martin.huarte@amd.com

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DISCLAIMER
Super Micro Computer, Inc. may make changes to specifications and product descriptions at any time, without notice. The
information presented in this document is for informational purposes only and may contain technical inaccuracies, omissions
and typographical errors. Any performance tests and ratings are measured using systems that reflect the approximate
performance of Super Micro Computer, Inc. products as measured by those tests. Any differences in software or hardware
configuration may affect actual performance, and Super Micro Computer, Inc. does not control the design or implementation of
third party benchmarks or websites referenced in this document. The information contained herein is subject to change and may
be rendered inaccurate for many reasons, including but not limited to any changes in product and/or roadmap, component and
hardware revision changes, new model and/or product releases, software changes, firmware changes, or the like. Super Micro
Computer, Inc. assumes no obligation to update or otherwise correct or revise this information.
SUPER MICRO COMPUTER, INC. MAKES NO REPRESENTATIONS OR WARRANTIES WITH RESPECT TO THE
CONTENTS HEREOF AND ASSUMES NO RESPONSIBILITY FOR ANY INACCURACIES, ERRORS OR OMISSIONS THAT
MAY APPEAR IN THIS INFORMATION.
SUPER MICRO COMPUTER, INC. SPECIFICALLY DISCLAIMS ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR
FITNESS FOR ANY PARTICULAR PURPOSE. IN NO EVENT WILL SUPER MICRO COMPUTER, INC. BE LIABLE TO ANY
PERSON FOR ANY DIRECT, INDIRECT, SPECIAL OR OTHER CONSEQUENTIAL DAMAGES ARISING FROM THE USE OF
ANY INFORMATION CONTAINED HEREIN, EVEN IF SUPER MICRO COMPUTER, Inc. IS EXPRESSLY ADVISED OF THE
POSSIBILITY OF SUCH DAMAGES.
ATTRIBUTION
© 2022 Super Micro Computer, Inc. All rights reserved.
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