It contains Acknowledgement, content, list of table, list of figures

1. A
PRACTICAL TRAINING
REPORT
ON
PCB
Submitted for the partial fulfillment of Degree
Bachelor of Technology
ELECTRONICS AND COMMUNICATION ENGINEERING
Submitted By: - Submitted To:-
Praveen Kumar Wadia Dr. L Solanki
12EBKEC071 Principal (Academics)
DEPARTMENT OF ELECTRONICS AND COMMUNICATION
B.K. BIRLA INSTITUTE OF ENGINEERING & TECHNOLOGY PILANI (RAJ)
(Affiliated to Rajasthan Technical University, Kota)
2014-15

2. ACKNOWLEDGEMENT
I would like to express my sincere gratitude indebtedness to Mr. A.P. Padarha for allowing
me to undergo the summer training of 45/60 days at INSTRUMENTATION LIMITED
KOTA RAJASTHAN
I am grateful to Mr. J.S. Solanki for the help provided in completion of the training, which
was assigned to me. Without his friendly help and guidance it was difficult to develop this
project.
I am also thankful to Dr P S Bhatnagar (Director BKBIET,Pilani) his true help & providing
the resources on completion of Training. Last but not least, I pay my sincere thanks and
gratitude Dr. L .Solanki (Principal Academics,BKBIET Pilani) for his valuable suggestions &
encouragement.
I would also like to thanks Mr. Santosh Jangid (Assistant Professor BKBIET Pilani) and Mr.
Rajesh Singh Shekhawat (Assistant Professor BKBIET Pilani) for timely giving the support
and suggestions during the training period.
PRAVEEN KUMAR WADIA 01.09.2015
12EBKEC071
i

3. TABLE OF CONTENTS
S No. TOPIC PAGE No.
1. Acknowledgement I
2. Table of Content Ii
3. List of Figures Iii
4. List of Tables Iv
5. Organization Profile 1
6. 1. Printed Circuit Board (PCB)
1.1 Introduction to Printed Circuit Board
1.2 History of Printed Circuit Board
2
2
3
7. 2. PCB Manufacturing
2.1 Materials
2.2 Laminates
2.3 Panelization
2.4 Etching
2.5 Chemical Etching
2.6 Lamination
2.8 Drilling
6
8
8
9
11
12
13
13
8. 3. Exposed Conductor Plating & Coating
3.1 Solder Resist
3.2 Silk Screen
3.3 Printed circuit Assembly
3.4 Protection &Packaging
14
14
15
15
17
9. 4. Design
4.1 Copper Thickness
4.2 Cordwood Construction
4.3 Multi wire Boards
18
19
20
21
10. 5. Component Mounting Technology
5.1 Through Hole Technology
5.1.1 History
5.1.2 Characteristics
5.2 Surface Mounting Technology
5.2.1 Introduction
5.2.2 History
5.2.3 Terms
5.2.4 Assembly Techniques
5.2.5 Advantages
5.2.6 Disadvantages
5.2.7 Rework
22
22
22
23
23
23
24
25
25
27
27
28
11. 6. Soldering
6.1 History
6.2 Applications
6.3 Soldering Iron
6.4 Types of Iron
29
29
29
30
30

4. 6.4.1 Simple Iron
6.4.2 Cordless Iron
6.4.3 Temperature Controlled Soldering Iron
6.5 Cleaning
30
30
31
31
12. 7. Solder
7.1 Flux
7.2 Processes
7.3 Soldering & Brazing
7.4 Silver Soldering
7.5 Induction Soldering
7.6 De-soldering
7.7 Soldering defects
33
34
35
36
37
37
38
39
13. 8. References 40
ii

5. LIST OF FIGURES
S No. NAME OF FIGURE PAGE No.
1. Fig 1.1 Printed Circuit Board
Fig 1.2 The component side of a PCB in
a computer mouse; Some examples
for common components and their
reference designation in the legend.
3
5
2. Fig 2.1 Panelization of PCBs
Fig 2.2 The two processing methods used
to produce a double-sided PWB
with plated through holes.
Fig 2.3 PCBs in process of having copper
pattern plated, notice the blue dry
film resist.
10
11
12
3. Fig 3.1 PCB with test connection pads
Fig 3.2 Antistatic bags for PCB
16
17
4. Fig 4.1 A board designed in 1967; the sweeping curves
in the traces are evidence of freehand design using self-
adhesive tape
Fig 4.2 A cordwood module
18
20
5. Fig 5.1 Through-hole devices mounted on circuit board.
Fig 5.2 Surface mount components including resistors,
transistors and an integrated circuits
Fig 5.3 Assembly line with SMT placement machines
Fig 5.4 Removal of surface mount device using soldering
tweezers
23
24
28
28
6. Fig 6.1 Soldering 29
7. Fig 7.1 An Improperly soldered joint
Fig 7.2 Solder
35
36
iii

6. LIST OF TABLE
S No. NAME OF TABLE PAGE No.
1. Tab. 2.1.1 PCB Manufacturing Process Steps
Tab. 2.1.2 Process Sequences for Single, Double and
Multi-layer PCB
Tab .2.1.3 Standard laminate thickness per
ANSI/IPC-D- 275
6
7
8
2. Tab 5.2.1 Expanded form of SMP terms 25
iv