Project Report on Refrigeration Using Peltier Module

i
PROJECT REPORT
ON
REFRIGERATION USING PELTIER
MODULE
SUBMITTED BY
S6 BATCH 4
Guided by
Mr Ajmal Jamal
GOVERNMENT POLYTECHNIC COLLEGE
KOTHAMANGALAM, CHELAD - 686681
2020 - 2021

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GOVERNMENT POLYTECHNIC COLLEGE
KOTHAMANGALAM, CHELAD – 686681
2020 – 2021
DEPARTMENT OF MECHANICAL ENGINEERING
CERTIFICATE
Certificate that this is the bonafied record for the Project report entitled
“REFRIGERATION USING PELTIER MODULE” conducted by the final
year Mechanical engineering students, BATCH 4, during the year 2020-2021,
at Government Polytechnic College Kothamangalam in partial fulfilment of
the requirement for the award of Diploma in Mechanical Engineering under
the board of Technical Education Department, Kerala.
Mr AJMAL JAMAL Mr SUJIL KUMAR C S Mr AIJU THOMAS
Seminar Guide Head of Section Principal
Dept. of Mechanical Engineering
External Examiner Internal Examiner

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ACKNOLEDGEMENT
At first, let me thank the almighty for the blessing and potential to
complete this report successfully. With great pleasure I am thanking to Mr
SUJIL KUMAR Head of Mechanical engineering department for providing
me the opportunity to be a part of this Project Report 2020. Next, I would like
to thank the principal of our college Mr AIJU THOMAS.
I express my sincere gratitude to Mr AJMAL JAMAL, Lecturer in
Mechanical engineering department for the help extended to me in various
occasions to complete this report successfully and for a proper guidance.
I am also obliged to express my deep sense of gratitude to Mr
JAYAKRISHNAN G & Mr SUJIL KUMAR for their valuable advice and
guidance for the completion of my work.
Finally, I would like to thank my family as well as my friends for their
help and support.
S6 BATCH 4 MECHANICAL
Indrajith K Shivan Jibin K Jomon
Jishnu U Krishnadas S
Manu KJ Muhammed Falah
Muhammed Hisham Muhammed Ashar
Mushin Mubarak K A Niranjan R
Rahul Binu

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PAGE INDEX
ABSTRACT (1)
CHAPTER 1 (2)
1.1 INTRODUCTION (2)
CHAPTER 2 (3)
2.1 BASIC THEORY OF PELTIER DEVICE (3)
2.1 Peltier History (3)
2.2 Peltier Theory (4)
2.3 Peltier Structure (4)
2.4 Principle and characteristics of TER (5)
2.5 Specification of Peltier Module (6)
2.6 Why is TE coolers used for Cooling? (7)
2.7 Disadvantages (7)
2.8 Which Industries use TE Cooling? (8)
2.9 What are some Applications? (8)
2.10 Method of Heat Transport (9)

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2.11 An entire assembly (12)
2.12 Semiconductor doping N Type and P Type (13-14)
2.13 Thermoelectric performance (15)
2.14 Co-efficient of performance (15)
2.15 Temperature vs Time reading (17)
CHAPTER 3 (18)
3.1 MATERIAL USED (18)
3.1 Thermocol Box (18)
3.2 Battery (19)
3.3 Heatsink (20)
3.4 Digital Thermometer (21)
CHAPTER 4 (22)
4.1 CONSTRUCTION AND DESIGN (22)
4.1 Dimensions of the Refrigerator (22)
4.2 Steps in construction of Refrigerator (23)
4.3 Circuit Diagram of Refrigerator (24)

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CHAPTER 5 (25)
5.1 WORKING OF THE PROJECT AND
COEFFICIENT OF PERFORMANCE (25)
5.1 How to operate the system (25)
5.2 Nomenclature (26)
5.3 Calculations of Peltier Module (27)
5.4 Actual Performance Output (29)
CHAPTER 6 (30)
6.1 ADVANTAGE AND DISADVANTAGE (30)
6.1 Advantage (30)
6.2 Disadvantage (31)
6.3 Future Enhancement (31)
CHAPTER 7 (32)
7.1 COST ANALYSIS (32)
7.1 Cost analysis table (32)
CONCLUSION (33)
BIBLIOGRAPHY (34-35)

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LIST OF FIGURES
1. Peltier Module (3)
2. Peltier Structure (4)
3. Peltier Effect (5)
4. Heat transport in Diode view 1 (10)
9. Doping in N Type Semiconductor (13)
10. Doping in P Type Semiconductor (14)
11. Co-efficient of performance graph (16)
12. Graph between the Temperature and Time (17)
13. Image of Box indicating Length, Breadth, Height (18)
14. Image of Battery (Actual product may differ in Design) (19)
15. Image of Heatsink (Actual product may differ in Design) (20)
16. Digital Thermometer (21)
17. A typical Thermoelectric system (23)
18. Circuit diagram (24)
19. Graph On Temperature Vs Time (29)

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LIST OF TABLES
1. Specification of Peltier Module (6)
2. Temperature Vs Time Chart (29)
3. Cost Analysis (32)

1
ABSTRACT
In the recent years, we have many problems such as energy crises and
environment degradation due to the increasing CO2 emission and ozone layer
depletion has become the primarily concern to both developed and developing
countries. This paper does not need any kind of refrigerant and mechanical
device like compressor, prime mover, etc for its operation.
This paper presents the performance of refrigeration system by using Peltier
module. Thermoelectric modules are the key elements in this refrigerator for
providing the thermoelectric cooling. This projects system consists of Peltier
module, heatsink, battery, Thermocol box etc. Power consumption is one of the
major issues now. But semiconductor is a great solution of this power
consumption. Peltier module is one of the best solutions for this. In this project
Peltier module is used where one side gets cooled and other side become hot
and rejects heat to the environment with the help of fans for producing cooling
effect, this means that cooling is done without use of greenhouse gaseous. Which
would ultimately reduce the global warming which is usually caused by
conventional refrigeration system. The supply used is dc and system will be
cooled up to 9℃ and heat will be produced till 85℃. Due to the use of charge
controller, system get efficient output. Due to these advantages of our system
over conventional system are beneficial. This system having no moving parts,
due to which system became rugged and reliable. they can be extremely compact
much more than compressor. It is portable and economical system. By using
Peltier module in our daily life to save electricity or power consumption.

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CHAPTER 1
INTRODUCTION
In recent years, with the increasing awareness towards environmental
degradation caused by CFCs and HCFCs from refrigerants in conventional
refrigeration systems, it has become a subject of due concern. Besides, rural
areas won’t have to rely as much on power from the grid for their refrigeration
and cooling needs, by using the battery to power the thermoelectric refrigeration
system (TER). Also, in situations where efficiency is a less important issue than
small size, low weight and high reliability, thermoelectric refrigeration systems
would be the preferred choice. Researchers are continuously striving towards
the development of eco-friendly refrigeration technologies like thermoelectric,
adsorption, magnetic and thermoacoustic refrigeration.[1] Thermoelectric
cooling uses the Peltier effect to create a heat flux between the junctions of two
different types of materials. This effect is commonly used in camping and
portable coolers and for cooling electronic components and small instruments.
Applying a DC voltage difference across the thermoelectric module, an electric
current will pass through the module and heat will be absorbed from one side
and released at the opposite side. One module face, therefore, will be cooled
while the opposite face simultaneously is heated. On the other hand, maintaining
a temperature difference between the two junctions of the module, a voltage
difference will be generated across the module and an electrical power is
delivered.

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CHAPER 2
BASIC THEORY OF PELTER DEVICE
2.1 Peltier History:
Early 19th century scientists, Thomas Seebeck and Jean Peltier, first discovered
the phenomena that are the basis for found that if you placed a temperature
gradient across the junctions of two Dissimilar conductors, electrical current
would flow. Peltier, on the other hand, learned that passing current through two
dissimilar electrical conductors, caused heat to be either emitted or absorbed at
the junction of the materials. It was only after mid-20th Century advancements
in semiconductor technology, however, that practical applications for
thermoelectric devices became feasible. With modern techniques, we can now
produce thermos electric efficient solid-state heat-pumping for both cooling and
heating; many of these units can also be used to generate DC power at reduced
efficiency. New and often elegant uses for thermo-electrics continue to be
developed each day.[2]
Figure 1. Peltier Module

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2.2 Peltier Theory:
When DC voltage is applied to the module, the positive and negative charge
carriers in the pellet array absorb heat energy from one substrate surface and
release it to the substrate at the opposite side. The surface where heat energy is
absorbed becomes cold; the opposite surface where heat energy is released
becomes hot. Reversing the polarity will result in Reversed hot and cold
sides.[2]
2.3 Peltier Structure:
A typical thermoelectric module consists of an array of Bismuth Telluride
semiconductor pellets that have been carrier–either positive or negative–carries
the majority of current. The pairs of P/N pellets are configured so that they are
connected electrically in series, but thermally in parallel. Metalized ceramic
substrates provide the platform for the pellets and the small conductive tabs that
connect them.
Figure 2. Peltier Structure

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2.4 Principle and characteristics of Thermoelectric
Refrigeration:
Thermoelectric coolers operate by the Peltier effect. The device has two sides,
and when a DC electric current flows through the device, it brings heat from one
side to the other, so that one side gets cooler while the other gets hotter. The
"hot" side is attached to a heat sink so that it remains at ambient temperature,
while the cool side goes below room temperature. In some applications, multiple
coolers can be cascaded together for lower temperature. Thermoelectric
refrigeration work on the principle of seebeck effect in which the voltage is
applied between two different combinations of metal and due to effect of
seebeck the cooling and heating phenomena is happened which can be used
accordingly for different purpose.[5]
Figure 3. Peltier Effect

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Following are the characteristics:
• Does not produce harmful gases like CFCs.
• Noiseless operation
• No moving parts, no friction.
• Portable.
2.5 Specification of Peltier Module:
Model Number TEC1-12706
Voltage 12 V
Dimensions 40mm×40mm×3.6mm
Type Cooling cells
Usage Refrigerator or warmer
Certification RoHS
Table 1. Specification of Peltier Module[5]

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2.6 Why is TE Coolers Used for Cooling?
• No moving parts make them very reliable; approximately 105 hrs of
operation at 100 degrees Celsius, longer for lower temps
(Goldsmid,1986).
• Ideal when precise temperature control is required.
• Ability to lower temperature below ambient.
• Heat transport controlled by current input.
• Able to operate in any orientation.
• Compact size makes them useful for applications where size or weight is
a constraint.
• Ability to alternate between heating and cooling.
• Excellent cooling alternative to vapor compression coolers for systems
that are sensitive to mechanical vibration.
2.7 DISADVANTAGES:
• Able to dissipate limited amount of heat flux.
• Less efficient than VCR system
• Relegated to low heat flux applications.
• More total heat to remove than without a TEC.

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2.8 Which Industries Use TE Cooling?
• Electronic.
• Medical.
• Aerospace.
• Telecommunications.
2.9 What are Some Applications?
Cooling:
• Electronic enclosures
• Laser diodes
• Laboratory instruments
• Temperature baths
• Refrigerators
• Telecommunications equipment
• Temperature control in missiles and space systems
• Heat transport ranges vary from a few mill watts to several thousand
watts, however, since the efficiency of TE devices are low, smaller heat
transfer applications are more practical.

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2.10 Method of Heat Transport:
There are several methods which can be employed to facilitate the transfer of
heat from the surface of the thermoelectric to the surrounding.[6]
• Electrons can travel freely in the copper conductors but not so freely in
the semiconductor.
• As the electrons leave the copper and enter the hot side of the p-type, they
must fill a "hole" in order to move through the p-type. When the electrons
fill a hole, they drop down to a lower energy level and release heat in the
process.
• Then, as the electrons move from the p-type into the copper conductor on
the cold side, the electrons are bumped back to a higher energy level and
absorb heat in the process.
• Next, the electrons move freely through the copper until they reach the
cold side of the n-type semiconductor. When the electrons move into the
n type, they must bump up an energy level in order to move through the
semiconductor. Heat is absorbed when this occurs.
• Finally, when the electrons leave the hot-side of the ntype, they can move
freely in the copper. They drop down to a lower energy level and release
heat in the process.
• To increase heat transport, several p type or n type thermoelectric (TE)
components can be hooked up in parallel.[10]

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• However, the device requires low voltage and therefore, a large current
which is too great to be commercially practical.
Figure 4. Heat transport in Diode view 1
• The TE components can be put in series but the heat transport abilities are
diminished, because the interconnecting’s between the semiconductors
creates thermal shorting.
Figure 5. Heat Transport in Diode view 2
• The most efficient configuration is where a p and n TE component is put
electrically in series but thermally in parallel. The device to the right is
called a couple.[10]

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• One side is attached to a heat source and the other a heat sink that converts
the heat away.
• The side facing the heat source is considered the cold side and the side
facing the heat sink the hot side.
• Between the heat generating device and the conductor must be an
electrical insulator to prevent an electrical short circuit between the
module and the heat source.
• The electrical insulator must also have a high thermal conductivity so that
the temperature gradient between the source and the conductor is small.
• Ceramics like alumina are generally used for this purpose.[10]
• The most common devices use 254 alternating p and n type TE devices.

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• The devices can operate at 12-16 V at 4-5 amps. These values are much
more practical for real life operations.
2.11 An Entire Assembly:

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2.12.1 Semiconductor Doping N Type:
N doped semiconductors have an abundant number of extra electrons to use as
charge carriers. Normally, a group IV material (like Si) with 4 covalent bonds
(4 valence electrons) is bonded with 4 other Si. To produce an N type
semiconductor, Si material is doped with a Group V metal (P or A s) having 5
valence electrons, so that an additional electron on the Group V metal is free to
move and are the charge carriers.
Figure 9. Doping in N Type Semiconductor

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2.12.2 Semiconductor Doping P Type:
For P type semiconductors, the dopants are Group III (In, B) which have 3
valence electrons, these materials need an extra electron for bonding which
creates “holes”. P doped semiconductors are positive charge carriers. There’s an
appearance that a hole is moving when there is a current applied because an
electron moves to fill a hole, creating a new hole where the electron was
originally. Holes and electrons move in opposite directions.
Figure 10. Doping in P Type Semiconductor

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2.13 Thermoelectric Performance:
TE performance depends on the following factors:
• The temperature of the cold and hot sides.
• Thermal and electrical conductivities of the device’s materials.
• Contact resistance between the TE device and heat source/heat sink.
• Thermal resistance of the heat sink.
2.14 Co-efficient of performance:
A typical AC unit has a COP of approximately 3. TE coolers usually have COP’s
below 1; 0.4 to 0.7 is a typical range.
Below are COP values plotted versus the ratio of input current to the module’s
Imax specification. Each line corresponds with a constant DT/DT max (the ratio
of the required temperature difference to the module's max temperature
difference specification).

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Figure 11. Co-efficient of Performance Graph

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2.15 Temperature vs Time Reading:
For performance evaluation of thermoelectric Peltier module, experiments were
conducted. The temperature drops were observed every 10 minutes with respect
to 31oC ambient temperature an hour for empty container as well as 250 ml
water inside container. Readings were tabulated and represented in Temperature
vs Time plot.[3]
Figure 12. Graph between the Temperature and Time

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CHAPTER 3
MATERIALS USED
3.1 Thermocol Box:
In this we use Thermocol box as a cabin or space too be cooled. EPS features a
closed cell structure and thus supports low thermal conductivity. It is highly
preferred for thermal insulation. Other materials possess an open cell structure
and are thus incompetent when subject to moisture. Secondly, Thermocol is
tasteless, odourless and fungi-resistant. It is one of the most reliable and cost-
effective means to protect your goods from transit damage. It is extremely light.
It can be moulded into any desired shape and is yet sufficiently rigid to absorb
shocks and physical impact.[9]
• It is light in weight.
• It has low thermal conductivity.
• It is tasteless, odourless and fungi resistance.
• Reliable.
Figure 13. Image of Box Indicating Length, Breadth, Height

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3.2 Battery:
An electric battery is a device consisting of two or more electrochemical cells
that convert stored chemical energy into electrical energy. Each cell has a
positive terminal, or cathode, and a negative terminal, or anode. The terminal
marked positive is at a higher electrical potential energy than is the terminal
marked negative. The terminal marked negative is the source of electrons that
when connected to an external circuit will flow and deliver energy to an external
device. The battery specification is 12V 7.2 AH [5]
Figure 14. Image of Battery (Actual Product may differ in Design)

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3.3 Heatsink:
Heatsink is a passive heat exchanger that transfers the heat generated by an
electronic or a mechanical device into a coolant fluid in motion. Then-
transferred heat leaves the device with the fluid in motion, therefore allowing
the regulation of the device temperature at physically feasible levels. The heat
sink used in this refrigerator is of the dimension 7.5 × 8 × 4.5 cm (L × B × H).[5]
Figure 15. Image of Heatsink (Actual Product may differ in Design)

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3.4 Digital Thermometer:
Digital thermometers are temperature-sensing instruments that are easily
portable, have permanent probs, and a convenient digital display.
The way a digital thermometer works depends upon its type. They are generally
a resistance temperature detector (RTD), thermocouple digital, or thermistor
digital thermometer.[5]
Figure 16. Digital Thermometer

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CHAPTER 4
CONSTRUCTION AND DESIGN
4.1 Dimensions of the Refrigerator:
1. Outer Dimensions:
• Length 33.5 cm
• Breadth 28.5 cm
• Height 23.5 cm
2. Inner Dimensions:
• Length 30 cm
• Breadth 25 cm
• Height 19.5 cm
3. Volume of the Refrigerator:
14625 cm3
4. Dimension of the Peltier:
4 × 4 cm

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4.2 Steps in Construction of Refrigerator:
• Firstly, a box of Thermocol is made of given dimensions and then the
Thermocol box is made and fixed into it.
• The Peltier module is mounted between the heatsink using Thermal paste.
• One side of the Box is attached with cold side of the Peltier and hot side
is attached to a heat sink.
• A fan is attached parallel to the heatsink to remove the heat.
• A Digital Thermometer is connected in such a way that the sensor comes
inside and the display comes outside the box.
• A battery is placed beside Thermocol Box with proper insulation.
Figure 17. A typical thermoelectric system

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4.3 Circuit Diagram of Refrigerator:
Figure 18.1 CAD Drawing of Circuit
Figure 18.2 Drawing of Circuit

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CHAPTER 5
WORKING OF THE PROJECT AND
COEFFICIENT OF PERFORMANCE
5.1 How to operate the System:
• The Refrigerator is provided power supply from an Adaptor or Battery.
• To start the Refrigerator, the switch of the Refrigerator is turned on.
• When the switch is turned on the Peltier device start functioning.
• The heat present inside the box is absorbed by one side of the Peltier
module and is emitted through the other side using the fan and heatsink.
• Cold sides of the both Peltier transfers the chilling effect to the box.
• The Peltier thermoelectric Device will be so arranged in a box with proper
insulation system and heat sink so that efficient cooling takes place at all
the time.
• To turn off the system, switch can be turned off.

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5.2 Nomenclature:
T = Temperature (K)
Th = Hot side temperature (K)
Tc = Cold side temperature (K)
ΔT = Th – Tc (K)
Ta = Ambient temperature (K)
I = Current (A)
V = Voltage (V)
Q = Heating and cooling rate
QH = Heat rejection
QL = Heat absorption
Qc = Heat absorbed at cold surface (W)
Qp = Power input for TEC (W)
COP = Co-efficient of performance, Qc / Qp
ρ = Resistivity (Ω cm)
k = Thermal conductivity (W / (cm K))
N = Number of pair of thermoelectric elements
S = Device seebeck Co-efficient, (V / K)
R = Device electrical resistance, (Ω)

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Imax = Input current resulting in greatest ∆T,
ie., ∆Tmax , (A)
Qmax = Maximum amount of heat that can be absorbed at
cold face (occurs at I = Imax , ∆T = 0℃) (W)
∆Tmax = Maximum temperature difference a TEC can achieve,
(occurs at I = Imax , ∆T = 0℃) (K)
Vmax = Voltage at ∆T = ∆Tmax, (V)
Rheat sink = Thermal resistance of heat sink
Rhs-max = Maximum allowable heat sinks thermal resistance (K/W) [3]
5.3 Calculations of Peltier Module:
Given specification of Peltier module (TEC1-12706) from datasheet are:
Seebeck coefficient (S) = 0.01229 V/k
Module thermal conductance (K) = 0.1815 W/k
Module resistance (R) = 4Ω
Current (I) = 5A
Number of thermal couples = 127
Temperature at hot side Th = 68˚ C

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Temperature at cold side Tc = 17˚ C
∆T= (Th − Tc) = (68 − 17) = 51˚C
QL = [SITc −
1
2
I2
R − k (Th − Tc)] (−) sign for heat rejection.[4]
QH = SITh +
1
2
I2
R − k (Th-Tc) [4]
QL = [0.01229 × 5 × 17 −
1
2
× 52
× 4 – 0.1815 (68 − 17)]
= 58.21185 J
QH = [0.01229 × 5 × 17 +
1
2
× 52
× 4 – 0.1815 (68 − 17)]
= 41.788 J
From the first law of thermodynamics, the Energy supplied is:
Energy supplied,
W = QH – QL
= SI (Th − Tc) + I2
R
= 0.01229 × 5 (68 – 17) + 52
× 4
=103.13395 J
The Coefficient of Performance (COP) is obtained by the following empirical
equation.[4]
COP = QL / W
=
58.21185
103.13395
= 0.564432

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5.4 Actual Performance Output:
TEMPERATURE ˚ C TIME (MINUTES)
34 0
30 2.4
26 3.9
22 5.1
18 6.8
14 9.2
10 12.1
Table 2. Temperature Vs Time Chart
Figure 19. Graph on Temperature Vs Time

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CHAPTER 6
ADVANTAGE AND
DISADVANTAGE
6.1 Advantages:
• Light weight and compact for very small heat loads.
• No moving parts, eliminating vibration, noise, and problems of wear.
• Reversing the direction of current transforms the cooling unit into a
heater.
• Operates in any orientation. Not affected by gravity or vibration.
• Very low-cost device for cooling in small appliances.
• High reliability.
• Portable.
• Occupies less space.
• Eco-friendly C-pentane
• CFC free insulation.

31
6.2 Disadvantages:
• Limited to very small refrigeration volume.
• Compared to conventional refrigerators cooling achieved is less.
• Heat sinks required to conduct heat to and from the thermoelectric
modules become very heavy and bulky as the refrigeration capacity
increases.
• C.O.P. is less as compared to conventional refrigeration system.
6.3 Future Enhancement:
• Research in `the field of thermoelectricity and experimentation with
different materials is required to improve the COP of the TE cooler.
• We can increase the efficiency by increasing number the Peltier module.
• Increase size of module by manufacture can help to increase cooling
effect for more area.
• Effective wire with low resistance can improve Peltier effect.[4]

32
CHAPTER 7
COST ANALYSIS
The cost analysis for this project is done as follows. All the components along
with the miscellaneous cost are included in the total cost of this Refrigerator.
Sl.NO Name of Material / Equipment Cost Rs.
1 Peltier Module combo set 4212/-
2 Digital Thermometer 250/-
3 Battery 1350/-
4 Adaptor 240/-
5 Thermocol Box 150/-
6 Heat sink Compound 173/-
7 Materials 360/-
8 Welding 750/-
Total Cost 7485/-
Table 3. Cost Analysis

33
CONCLUSION
During construction of the device several minor changes were made to the
design. Each of these changes we feel was justified as they made for easier
construction while maintaining the performance of the device with respect to the
project goals. The device passed its final inspection and was deemed to have a
professional appearance by the design project coordinator
The device was discovered to have ample precision and total heat transfer
capabilities while meeting its accuracy requirement.

34
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