2. 1.Introduction to double gate
i. How can we follow Moore’s law
ii. Scaling
iii. Short channel effect
2.Literature Survey
3.Limitations of single gate MOSFET
4.Advantages of DG MOSFET
5.Refrences
3. The main idea of a Double Gate MOSFET is to control the Si channel
very efficiently by choosing the Si channel width to be very small and by
applying a gate contact to both sides of the channel. This concept helps
to suppress short channel effects and leads to higher currents as
compared with a MOSFET having only one gate.
4. Moore's law is the observation that the number of transistors in a dense integrated
circuit doubles approximately every two years. The observation is named after Gordon
Moore, the co-founder of Fairchild Semiconductor and Intel, whose 1965 paper described
a doubling every year in the number of components per integrated circuit,[and projected
this rate of growth would continue for at least another decade. In 1975,looking forward to
the next decade, he revised the forecast to doubling every two years, The period is often
quoted as 18 months because of Intel executive David House, who predicted that chip
performance would double every 18 months (being a combination of the effect of more
transistors and the transistors being faster).
5. As aggressive scaling of conventional MOSFETs channel
length reduces below 100 nm and gate oxide thickness
below 3nm to improved performance and packing density.
Due to this scaling short channel effects (SCEs) like
threshold voltage roll-off & gate leakage current play a
major role in determining the performance of scaled
devices. The double gate (DG) MOSFETs are electro-
statically superior to a single gate (SG) MOSFET and
allows for additional gate length scaling
6. The short-channel effects are attributed to two physical
phenomena:
A) The limitation imposed on electron drift
characteristics in
the channel.
B) The modification of the threshold voltage due to the
shortening channel length.
7. Gerold W. Neudeck discussed the double gate (DG) fully
depleted SOI MOSFET ,and its many implementations, and
is the leading device candidate for silicon nano scale
CMOS. Their main characteristics, as compared to the
single gate bulk MOSFET are less S/D capacitance ,larger
saturated current drive, smaller short channel effects(DIBL)
, scalability to L=10nm ,near ideal sub threshold slopes (S)
,and the possibility of electrically adjustable threshold
voltages.
8. Ayushi Shrivastava and Nitin Tripathi compared 25nm
Single gate Silicon on Insulator (SG-SOI) MOSFET with
Double Gate Silicon on insulator(DG-SOI) MOSFET. The
DG-SOI is similar to the proposed SOI with the exception of
back gate at body. The resulted modified DG-SOI MOSFET
reduced the short channel effects (SCE’s) . The transfer
characteristics DIBL ,threshold voltage, Ion and Ioff for 25nm
are evaluated . The back gate structure of DG-SOI is the
mirror image of front gate SOI.
The nano scale device have SCEs ,like DIBL ,hot carried
effect , due to which the device can not be further scaled.
So ,this work is further demonstrated by designing two
gates on same dimension of single gate. So that, the DG-
SOI performance enhance and will work more efficiently.
9. • Limit for supply voltage
• Limit for further scaling of tox
• Minimum channel length Lg=100nm
• Dramatic short- channel effects (SCE)
10. • Short channel effect control
i. Better scalability
ii. Lower sub-threshold current
• Higher on current
• Lower gate leakage
• Elimination of Vt variation due to random dopant
fluctuation
11. 1.Gerold W. Neudeck, “An Overview of Double-Gate
MOSFETs”, IEEE IN 47907-1285, July 2003
2.Ayushi Shrivastava , Nitin Tripathi, “Comparative study of
double gate MOSFET and single gate SOI
MOSFET”,IJEEE , Volume 07, Issue 01, Jan-June 2015
3.Xiaoping Liang ,“A 2-D Analytical Solution for SCEs in DG
MOSFETs”, VOL. 51, NO. 8, AUGUST 2004