http://www.solidodesign.com/files/variation-aware-custom-design-survey-2011.pdfThe survey was executed in late 2010, with 486 IC design professionals participating.A blind, anonymous survey was emailed to several thousand participants worldwide by an independentconsultancy over the time period from Sept 22, 2010 to November 7, 2010. 486 IC design professionalscompleted the survey online. Survey respondents were comprised of a broad spectrum of designers andengineering management, with a majority (53%) in an engineering management role.
Results: all defects folded on one Die
Plenary Applied-Magma collaboration- Ehud Tzuri
A Bridge Over Troubled Wafer…<br />Use of design layout for systematic defect identification for New Product Introduction cycle time reduction<br />Ehud Tzuri<br />Chief Marketing Officer<br />Applied Materials<br />4 May 2011<br />
Applied/Magma Announcement 28 Feb 2011<br />3<br />
It’s all about Yield<br />Defectivity and process control are directly linked to yield<br />productivity<br />Maintain and improve yield at volume production<br />Shorten ramp time<br />Modeled Yield Curve<br />time<br />4<br />
Variation-Aware Design – Why?<br />5<br />Design variation: the variation in parametric and die yield results caused by process, random variation, and layout dependent effects (proximity)<br />Source: VARIATION-AWARE CUSTOM IC DESIGN REPORT 2011, Amit Gupta President and CEO, Solido Design Automation<br />
Complex Die Layout – A Sensitivity Issue<br />9<br />Different densities and patterns have different optical characteristics in the eyes of the inspection tool<br />Inspection Tool Scan Image<br />
Challenges Summary<br />Difficulty to reach yield entitlements fast with minimal re-spins<br />Increasing number of “hot spots” <br />Inefficient separation of random / systematic defects<br />Products complexity growing different sensitivity areas required for inspection<br />10<br />
DBI: Design Based Inspection<br />Using CAD data to set up complex die layouts for inspection<br />50% faster time to recipe due to increased automation<br />Improved sensitivity by assigning different thresholds to different areas<br />13<br />
Defect die stack<br />Manual layout<br />DBI layout<br />Sensitivity improved by DBI recipe<br />DBI Case Study: Sensitivity<br />14<br />
DBB: Design Based Binning - Concept<br />15<br />Binning of all defects per layout /structure<br />
DBB Case Study<br />DBB Pareto and clips of largest bins<br />SEM Images of Critical Structures<br />Faster identification of Process-Window-Limiting-Structures<br />Complementing Hot Spot simulation data<br />16<br />
DBB Case Study<br />17<br />Clear visual identification of process window<br />
Benefits of Approach: Voice of Customer<br /> “The introduction of CAD-based inspection technology for defect analysis and monitoring at GLOBALFOUNDRIES Fab 1 has helped improve defect management efficiency and reduce cycle time for process optimization. <br /> Both our production and development lines now rely on this technology to help guarantee process quality and yield stability."<br />Remo Kirsch, Manager of Contamination Free Manufacturing at GLOBALFOUNDRIES Fab 1 in Dresden, Germany<br />Press announcement, 28 February 2011<br />18<br />
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