World is now moving towards the miniaturization of electronic devices. People around the world are now working day and night to make things more and more smaller. Chip density is increasing by many fold in all the new generation of chips of any Semiconductor manufacturers. The pitch of these new generation chips are also reducing in this race. PCB manufacturing technologies are also improved to accommodate more and more components in the same real estate of PCB, component sizes are now reduced to 0201 size. In this era of miniaturization, Teq Diligent took a challenge to design a miniscule digital camera hardware design. The challenge was to design and develop three different boards and accommodate in a size of 1.18” x 1.18” x 1.96” (which is slightly bigger than the match box size).
This presentation provides some details about this case study of Teq Diligent.