Miniscule Digital
Camera Hardware
Design (1.18” x 1.18”
1.96”)

Case Study
November, 2013
AGENDA

•
•
•
•
•
•
•
•
•
•
•

Project Specification & Challenges
Scope of Work
Pre-requisites
Required Tools
Project Life...
Top Level Specifications
Specification

Reference
Product

Teq Diligent Project
Specification

Challenges

Size of Camera
...
Scope of Work

Small Size 5MP Camera Hardware Design
•
•
•
•
•
•
•
•
•

Feasibility Study
Architecture Definition
Schemati...
Pre-requisites
High Speed
Board Design

Digital Media
SoC Based
Architecture
Design

Multiple Board
System Design

Blind-B...
Tools
Activity

Required Tools

Placement Feasibility Study

MS Visio

Power Calculations

MS Excel

Documentation

MS Wor...
1

Life Cycle – Hardware Design

Note: All dark colour shaded phases/documents were part of Scope of this project.
2

Life Cycle – Hardware Design

Note: All dark colour shaded phases/documents were part of Scope of this project.
3

Life Cycle – Hardware Design

Note: All dark colour shaded phases/documents were part of Scope of this project.
Documents

Feasibility
Study

Documents
•
•
•

Top level Placement
Diagram
HW partitioning
Top level System Block
Diagram
Documents

Specification Finalization

Documents
•

Hardware Requirement Document
Documents

Top level Design

Documents
•

Power Budget Sheet, Detailed block diagram
Documents

Schematic

Documents
•

Schematic diagram, Bill of material, Netlist
Documents

MCAD Modeling
Documents

Layout

Documents
•
•
•

Layout Source File
Various Gerber
Files
SI reports
Outcomes

Layout
BLIND-BURIED
BOARD

FINE PITCH
COMPONENTS

1-3, 3-8, 8-10

0.65mm BGA –
DMSoC

MULTI-LAYERS
10 layers, 6 ...
Outcomes

Proto Manufacturing
Documents

Bring-up Testing

Documents
•

Test case document, Bring-up Test report, Status report
Configuration Management

• Change Management – Change impact analysis shall be done for
each and every change occurred an...
Tracking & Monitoring

Mutual NDA
Feasibility Study ( 1wk)
Purchase Order
Spec
Schematic
Finalization
Design
(0.5 wk)
(3Wk...
Deliverables - Database
Customer Benefits

We successfully completed Extremely
complex, Small form factor Embedded
Hardware prototype design proje...
Customer Benefits
Customer Benefits
Customer Benefits
Testimonial

Teq Diligent team has made seemingly
impossible hardware design possible. I feel
that they created a differen...
THANK YOU

C-725, Siddhi Vinayak Tower,
Makarba, Off S.G. Highway,
Ahmedabad – 380051
Gujarat, India
www.teqdiligent.com
s...
Upcoming SlideShare
Loading in …5
×

Miniscule Digital Camera Hardware Design (1.18” x 1.18” 1.96”) - Teq Diligent Case Study

908 views

Published on

World is now moving towards the miniaturization of electronic devices. People around the world are now working day and night to make things more and more smaller. Chip density is increasing by many fold in all the new generation of chips of any Semiconductor manufacturers. The pitch of these new generation chips are also reducing in this race. PCB manufacturing technologies are also improved to accommodate more and more components in the same real estate of PCB, component sizes are now reduced to 0201 size. In this era of miniaturization, Teq Diligent took a challenge to design a miniscule digital camera hardware design. The challenge was to design and develop three different boards and accommodate in a size of 1.18” x 1.18” x 1.96” (which is slightly bigger than the match box size).

This presentation provides some details about this case study of Teq Diligent.

Published in: Technology, Business
0 Comments
2 Likes
Statistics
Notes
  • Be the first to comment

No Downloads
Views
Total views
908
On SlideShare
0
From Embeds
0
Number of Embeds
5
Actions
Shares
0
Downloads
0
Comments
0
Likes
2
Embeds 0
No embeds

No notes for slide

Miniscule Digital Camera Hardware Design (1.18” x 1.18” 1.96”) - Teq Diligent Case Study

  1. 1. Miniscule Digital Camera Hardware Design (1.18” x 1.18” 1.96”) Case Study November, 2013
  2. 2. AGENDA • • • • • • • • • • • Project Specification & Challenges Scope of Work Pre-requisites Required Tools Project Lifecycle Project Documents / Outcomes Project Configuration Mgmt. Project Tracking & Monitoring Deliverables - Database Customer Benefits Testimonial
  3. 3. Top Level Specifications Specification Reference Product Teq Diligent Project Specification Challenges Size of Camera 50mm x 30mm x 30mm √ √ Smallest Form Factor Resolution: 2588 x 1940 √ √ Sensor Type: 1/2.5 CMOS Sensor √ √ FPGA Based Design TI DMSoC (TMS320DM368) X MicroSD X X X USB2.0 OTG √ √ 5 Processor Removable memory support, USB interface, SD Video Output, Mode Selection Switch, LED indications 2 Addition of high speed interfaces like DDR2 memory More components compared ref. product in same size. Bulky Power supply design
  4. 4. Scope of Work Small Size 5MP Camera Hardware Design • • • • • • • • • Feasibility Study Architecture Definition Schematic Design Enclosure Design Support Layout Design Liaison with PCB Manufacturer Liaison with Contract Manufacturer Bring-up Testing Functional Testing Complete Prototype Hardware Design Ownership
  5. 5. Pre-requisites High Speed Board Design Digital Media SoC Based Architecture Design Multiple Board System Design Blind-Buried Board Design Hardware Partitioning Skills Power Supply Design Awareness to SMD Component Technologies Synchronization With SW & Mech Team
  6. 6. Tools Activity Required Tools Placement Feasibility Study MS Visio Power Calculations MS Excel Documentation MS Word Project Planning MS Project / MS Excel Schematic Entry Cadence ORCAD Capture Layout Design Allegro Signal Integrity (SI) Analysis Allegro Board Testing Digital Multimeter Oscilloscope Soldering Station Texas Instruments’ Emulator Mechanical 3D model Solid Works
  7. 7. 1 Life Cycle – Hardware Design Note: All dark colour shaded phases/documents were part of Scope of this project.
  8. 8. 2 Life Cycle – Hardware Design Note: All dark colour shaded phases/documents were part of Scope of this project.
  9. 9. 3 Life Cycle – Hardware Design Note: All dark colour shaded phases/documents were part of Scope of this project.
  10. 10. Documents Feasibility Study Documents • • • Top level Placement Diagram HW partitioning Top level System Block Diagram
  11. 11. Documents Specification Finalization Documents • Hardware Requirement Document
  12. 12. Documents Top level Design Documents • Power Budget Sheet, Detailed block diagram
  13. 13. Documents Schematic Documents • Schematic diagram, Bill of material, Netlist
  14. 14. Documents MCAD Modeling
  15. 15. Documents Layout Documents • • • Layout Source File Various Gerber Files SI reports
  16. 16. Outcomes Layout BLIND-BURIED BOARD FINE PITCH COMPONENTS 1-3, 3-8, 8-10 0.65mm BGA – DMSoC MULTI-LAYERS 10 layers, 6 layers, 6 layers IMPEDANCE CONTROLLED 90E & 100E Differential, 50E & 75E single ended FINE TRACES 3.5 mils X 3.5mils trace width, spacing HIGHLY DENSE PCBs 215 pins/sq inch REFERENCE PLANES Layer stack-ups with proper arrangements
  17. 17. Outcomes Proto Manufacturing
  18. 18. Documents Bring-up Testing Documents • Test case document, Bring-up Test report, Status report
  19. 19. Configuration Management • Change Management – Change impact analysis shall be done for each and every change occurred and discussed and agreed upon with customer before implementing the change. • Version Control • Bug Tracking
  20. 20. Tracking & Monitoring Mutual NDA Feasibility Study ( 1wk) Purchase Order Spec Schematic Finalization Design (0.5 wk) (3Wks) • • • • • Layout Design (6 wks) Component Procurement, PCB Fab, PCB assembly (4 wks) Weekly Status Meetings with Customers Additional Email & Telephonic communications need basis Resources: 1.5 HW Design Engineers Note-1: Major phases are only showed in above schedule Note-2: The project dates are hypothetical dates used for better illustration only, removing hold time and normalized to 1 resource Bring-up Testing – First Unit (1 wk) Bring-up Testing – 4 Units (2 wks)
  21. 21. Deliverables - Database
  22. 22. Customer Benefits We successfully completed Extremely complex, Small form factor Embedded Hardware prototype design project with the best quality (zero functional defects) and within budget.
  23. 23. Customer Benefits
  24. 24. Customer Benefits
  25. 25. Customer Benefits
  26. 26. Testimonial Teq Diligent team has made seemingly impossible hardware design possible. I feel that they created a differentiation by their approach towards making customer win in their market place. Design review and handling technical queries were the most effective areas during development. Director - Products & Solutions
  27. 27. THANK YOU C-725, Siddhi Vinayak Tower, Makarba, Off S.G. Highway, Ahmedabad – 380051 Gujarat, India www.teqdiligent.com sales@teqdiligent.com Tel: +91 – 79 – 6617 0070 M: +91 – 99251 08145 Your partner for product engineering services

×