DIGITAL LIGHT PROCESSING(DIP)

1. PRESENTED BY,
D.KIRUBASANKAR
S.MOHAN

2. Contents:
 Introduction
 Basic components in DLP
 Working of DLP
 Advantages
 Applications

3. Introduction
 DLP-Digital Light Processing
 Invented by DR.LARRY HORNBECK in 1987
 Made by semiconductor material
 It consist of One or Three chips methods
 It is used in video projector

4. Basic components of DLP
 DMD chip (Digital Micromirror Device)
 Light source
 They are two methods
 One chip system
 Three chip system

5. One chip system
 Passes the light to chip(color wheel)

6. Three chip system
 Light passes through prism

7. DMD chip
 It is a semiconductor material
 It is core components,miscroscopic mirror
 Matrix of micro mirrors 1024 X 768mm
 Size of the mirrors: 16 X 16 um

8. Light source
 High power LEDs or LASER source is used
 It contain high pressure xenon arc lamp
LED based
 Ordinary LEDs doesn’t produce intensity
LASER based
• The first commercially LASER based DLP was
introduced in 2008

9. Working of DLP
 3-D printing process
 Photopolymer resin.
 Compare to stereo lithography DLP have much speed
 Withstand the tensions and mechanical movement
 High intensity LED’s are used

10. contd..
 Depending on the application DLP system accept
either digital or analogue signal.

11. Advantages
 Less maintenance than LCD
 Low power consumption
 All digital display from DLP chip
 It is more reliable

12. Disadvantages
 Some device contain noise
 Viewer may have eye strain, headache and migraines.

13. Applications
 DLP projectors
 Holographic Data Storage
 Printed Circuit Board (PCB) Manufacturing
 Print Setting
 Telephone lines

14. Future uses of DLP
 High definition image creation
 3D visual display