Embedded IC in package technology is a young and promising advanced packaging technique: understanding the status of the patent situation is key to understanding the business environment and anticipating the related strategic evolutions!
A very young pa tent landscape dominated by a very small number of companies...
For this patent analysis 721 relevant and related patents have been selected and classified to further analyze embedded IC IP situation.
Among the 1547 patent documents constituting the 596 relevant patent families, 84% are active (pending or granted) and 16% are inactive (revoked, expired or lapsed).
In addition, even if first patents for embedded IC are quite old, this technology is very young with regard to the number of patents pending!
About 180 assignees are involved in embedded die technologies while the top 10 assignees represent 53% of patents filed in the Embedded die domain.
Main business model involved in this area is substrate & PCB makers (which have been strongly involved in the PCB and back-end industries for a while) but we found a significant number of IDMs and OSATs which are looking closer and closer to this packaging technology.
Patents in the embedded domain are mainly filed by firms or universities located in Korea (33%), Japan (21%) and USA (19%). Japanese and American players were the early adopters of the technology and they are still deeply involved in this business. Korea emerged as new key player in 2005.
We selected 10 companies among the most active players identified in this complete statistical analysis to lead an accurate description of their patent portfolios.
The report also provides a database of all the relevant patents we have analyzed in an Excel file, which allows multi-criteria searches. The criteria are basically those we used for the technological segmentation:
•Patent information: Patent publication number, link to the PDF, document, oldest priority date, title, assignee, patent potential ranking, nb of citing patent families
•Technological segmentation: chip placement / bonding, tape lamination, RDL, passivation & balling
This complete description of the patent landscape is included in the first part of the report and provides all the background material for the analysis of the embedded IC in package landscape. The report provides a complete analysis of the patent landscape including geographical origins of the patents, company or R&D organizations that have been granted the patents, historical data on when the companies have applied for patents in the last 20 years, inventors of the patents, expiration status, R&D collaborations…
More information on that report at http://www.i-micronews.com/reports/Embedded-Die-Package-Patent-Investigation/8/385/
FOWLP Patent Analysis 2012 Report by Yole DeveloppementYole Developpement
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ANALYSIS OF THE PATENT PORTFOLIO’S TECHNICAL CONTENT
After several years of specific analysis for customers, Yole Développement has decided to publish its first analysis concerning the technical contents of patents. This first study focuses on the FO-WLP area, a new packaging technology which is changing the patent landscape for semiconductor packaging across a wide range of application spaces. Yole Développement has developed a specific methodology to conduct this analysis (described below), mixing our technical and business knowledge with classical access to the patent database...
More information on that report at http://www.i-micronews.com/advanced-packaging-report/product/fowlp-patent-analysis.html
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This webinar discussed significant developments and trends in 3D packaging with a focus on embedded substrate technologies. A technology report commissioned by PSMA found that embedded substrate technology can increase power density by embedding active components and passives directly into substrate layers. The webinar covered various embedded substrate manufacturing technologies from companies like AT&S, TDK, Infineon, and Semikron. It discussed the benefits of embedded substrates including improved performance, reliability, thermal management and reduced size. Standards for embedded components and a variety of embedded passive and active components were also reviewed.
Status of Panel-Level Packaging & Manufacturing 2015 Report by Yole Developpe...Yole Developpement
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Fan-Out and Embedded Die: Technologies & Market Trends 2015 Report by Yole De...Yole Developpement
Fan-Out and Embedded Die: Two promising Wafer/Panel-Level-Packaging technologies. What are the next steps for the growth?
Fan-Out Wafer Level Packaging is already in high-volume – but it’s about to grow even more strongly
Fan-Out Wafer Level Packaging (FOWLP) started volume commercialization in 2009/2010 and started promisingly, with initial push by Intel Mobile. However, it was limited to a narrow range of applications – essentially single die packages for cell phone baseband chips – reaching its limit in 2011. In 2012 big fab-less wireless/mobile players started slowly volume production after qualifying the technology...
Implementing the latest embedded component technology from concept-to-manufac...Zuken
This document discusses implementing embedded components in printed circuit boards from concept to manufacturing. It begins with an overview of embedded component technologies and their advantages like increased density and performance. Common challenges are then addressed such as meeting tolerance requirements for formed components and impact on thermal behavior. The document emphasizes the importance of considering manufacturability early in the design process and working closely with manufacturers to define dedicated design rules. It concludes that a true 3D design approach is necessary to effectively implement embedded component technologies.
This document summarizes an advanced packaging presentation that covered topics like package-on-package (PoP), system-in-package (SiP), through silicon vias (TSV), and bottom terminated components. PoP provides benefits like less board area, better performance, and defined supply chain ownership. TSV and SiP enable further semiconductor integration challenges but require optimization for cost and reliability concerns like copper cracking.
FOWLP Patent Analysis 2012 Report by Yole DeveloppementYole Developpement
dopted for both mobile phone and consumer electronics applications, Fan-Out Wafer Level Packaging (FO-WLP) is the most innovative, advanced packaging technology today. Analysing patent status is the key to understanding the business situation.
ANALYSIS OF THE PATENT PORTFOLIO’S TECHNICAL CONTENT
After several years of specific analysis for customers, Yole Développement has decided to publish its first analysis concerning the technical contents of patents. This first study focuses on the FO-WLP area, a new packaging technology which is changing the patent landscape for semiconductor packaging across a wide range of application spaces. Yole Développement has developed a specific methodology to conduct this analysis (described below), mixing our technical and business knowledge with classical access to the patent database...
More information on that report at http://www.i-micronews.com/advanced-packaging-report/product/fowlp-patent-analysis.html
3D Embedded Substrate Technologies Increase Density and Performance of Power ...Design World
This webinar discussed significant developments and trends in 3D packaging with a focus on embedded substrate technologies. A technology report commissioned by PSMA found that embedded substrate technology can increase power density by embedding active components and passives directly into substrate layers. The webinar covered various embedded substrate manufacturing technologies from companies like AT&S, TDK, Infineon, and Semikron. It discussed the benefits of embedded substrates including improved performance, reliability, thermal management and reduced size. Standards for embedded components and a variety of embedded passive and active components were also reviewed.
Status of Panel-Level Packaging & Manufacturing 2015 Report by Yole Developpe...Yole Developpement
This report provides an overview of panel-level packaging and manufacturing. It examines key panel packaging platforms including fan-out WLP, embedded die, glass interposers, and organic interposers. The report forecasts the panel packaging market to reach $109 million by 2017. It identifies the main applications for each panel technology and assesses the players involved including OSATs, substrate makers, and IDMs. The report also reviews equipment and materials suppliers for panel manufacturing and provides a roadmap for resolution trends in panel packaging.
Status of The Advanced Packaging Industry_Yole Développement reportYole Developpement
IoT driven semiconductor industry consolidation is reflecting into a highly dynamic Advanced Packaging landscape. Demand for advanced packaging and market size is increasing. Focus is turning
to integration and wafer level packages to enable a functionality driven roadmap and revive the cost/performance curve.
Fan-Out and Embedded Die: Technologies & Market Trends 2015 Report by Yole De...Yole Developpement
Fan-Out and Embedded Die: Two promising Wafer/Panel-Level-Packaging technologies. What are the next steps for the growth?
Fan-Out Wafer Level Packaging is already in high-volume – but it’s about to grow even more strongly
Fan-Out Wafer Level Packaging (FOWLP) started volume commercialization in 2009/2010 and started promisingly, with initial push by Intel Mobile. However, it was limited to a narrow range of applications – essentially single die packages for cell phone baseband chips – reaching its limit in 2011. In 2012 big fab-less wireless/mobile players started slowly volume production after qualifying the technology...
Implementing the latest embedded component technology from concept-to-manufac...Zuken
This document discusses implementing embedded components in printed circuit boards from concept to manufacturing. It begins with an overview of embedded component technologies and their advantages like increased density and performance. Common challenges are then addressed such as meeting tolerance requirements for formed components and impact on thermal behavior. The document emphasizes the importance of considering manufacturability early in the design process and working closely with manufacturers to define dedicated design rules. It concludes that a true 3D design approach is necessary to effectively implement embedded component technologies.
This document summarizes an advanced packaging presentation that covered topics like package-on-package (PoP), system-in-package (SiP), through silicon vias (TSV), and bottom terminated components. PoP provides benefits like less board area, better performance, and defined supply chain ownership. TSV and SiP enable further semiconductor integration challenges but require optimization for cost and reliability concerns like copper cracking.
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Over-The-Top (OTT) video delivery uses third-party content delivery networks to stream video over the internet. YouTube is a popular free OTT service, and the proliferation of internet-connected devices has increased complex, multi-screen video consumption. As a result, video delivery is shifting from pay TV operators and set-top boxes to content owners and many different devices. For pay TV operators, OTT poses a threat as subscribers may opt for OTT services instead. To remain relevant, pay TV operators should acquire content, ensure high quality of service, expand beyond set-top boxes with OTT apps, and provide a unified subscription for viewing on multiple devices and screens.
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The document discusses the shift from hardware-centric to software-centric product design in electronics companies. It describes how Gstreamer helped drive this transition by providing a modular, reusable software framework for building media pipelines. Initially attempts to use Gstreamer in embedded systems failed, but it eventually saw wider adoption as processor capabilities improved and the differences between embedded and general-purpose systems decreased. Gstreamer provided benefits like stability, flexibility, and shorter development times compared to custom hardware-specific software stacks. Its use led companies to change how they work and cooperate more through open standards and tools.
Here is a summary of the document in 3 sentences or less:
[SUMMARY] The document discusses geological assistance (intrafisicology), which is defined as the effect or result of geological science activities in providing natural resources to meet human needs in the physical dimension. It covers various topics related to geology, minerals, and humanity's use of geological resources, as well as concepts in conscienciology that are relevant to understanding humanity's relationship with the physical environment.
The document summarizes topics covered in a Linux workshop from January 20th to 25th at IIT Kanpur. It includes introductions to vi text editor commands, Linux shell, finding and searching files, grep command, SSH, SCP, processes and process handling, GUI desktop environments, text editors, terminal, and installing software using package managers.
Sasikumar is a software engineer with over 3 years of experience developing embedded systems and device drivers. He has expertise in C programming, real-time operating systems, Linux driver development, and protocols like I2C, UART and SPI. Some of his projects include developing DVB-CI and CI+ stacks to enable decryption of encrypted content. He also has experience with conditional access systems from Nagravision, Cryptoguard and implementing a Simulcrypt head-end system. Sasikumar is looking for new opportunities to further his knowledge and serve a company to the best of his abilities.
This document summarizes various devices and chipsets that have been worked with, including tuners, demodulators, processors, and interfaces. It provides brief descriptions of chipsets from Conexant, Fujitsu, ST, and Xilinx that have been used. It also lists tuners, digital demodulators, firmware tools, audio/video codecs, hardware design tools, and interfaces that have been engaged with. Finally, it provides two case studies: a DVB analyzer and a DTMB analyzer that were developed using various components described in the document.
This document provides guidance on handling an IRD (Inland Revenue Department of New Zealand) audit. It discusses IRD's information gathering powers, what constitutes a document, tips for cooperating with an audit in order to be viewed favorably. It outlines industry benchmarks and notes that every dollar spent on investigations recovers an average of $5 in additional tax revenue. The document warns that interest charges can significantly increase tax owed and tips ways to mitigate interest risk such as making early voluntary payments. It also discusses shortfall penalties and the reductions available for voluntary disclosures. The disputes process is outlined if agreement cannot be reached.
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The document describes building a small embedded Linux kernel for the DaVinci DM644x Digital Evaluation Module (DVEVM).
1) The kernel is configured to select drivers for Ethernet, UART, and a TCP/IP stack while disabling unnecessary drivers.
2) The kernel is compiled to generate a uImage file stored in flash.
3) An initial RAM disk file system is built containing busybox, initscripts, and networking packages to support an HTTP server.
This document provides coding standards and conventions for Java programming. It covers topics such as program structure, file organization, indentation, comments, declarations, statements, naming conventions, and programming practices. The goal is to improve code readability, understandability, and maintainability. Projects may customize the standards as needed based on customer requirements.
The document describes an ultra-low power asynchronous logic in-situ self-adaptive VDD system for wireless sensor networks. The proposed system uses quasi-delay-insensitive asynchronous logic implemented with pre-charged static logic circuits. It features a self-adaptive VDD scaling system that dynamically adjusts the supply voltage based on processing requirements to minimize power consumption while operating robustly in the sub-threshold voltage region. The system design includes an asynchronous filter bank module powered by the adjustable VDD rail and a power management module that monitors circuit delays to determine the optimal VDD setting.
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- It has three main configurations: CLDC for low-end devices, CDC for more powerful devices, and Java SE for desktops.
- Profiles add functionality and APIs to configurations for specific device types. The main profile is MIDP for mobile phones.
- Optional packages provide additional common APIs like Bluetooth, messaging, location services, etc.
- J2ME is widely used in low-cost mobile devices but has declined on newer smartphones that use Android or iOS.
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More information : https://www.i-micronews.com/products/computing-and-ai-technologies-for-mobile-and-consumer-applications-2021/
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More information : https://www.i-micronews.com/products/application-processor-quarterly-market-monitor/
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More information : https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2021/
This document outlines an internal Barco training on embedded Linux for engineering. It covers topics like cross-compilation toolchains, the Linux boot process, bootloaders, and the Linux kernel, including building a kernel, device trees, device drivers, and a real-life Barco example. Hands-on sections provide examples for exploring U-Boot, replacing a bootloader, building a kernel, and more.
Over-The-Top (OTT) video delivery uses third-party content delivery networks to stream video over the internet. YouTube is a popular free OTT service, and the proliferation of internet-connected devices has increased complex, multi-screen video consumption. As a result, video delivery is shifting from pay TV operators and set-top boxes to content owners and many different devices. For pay TV operators, OTT poses a threat as subscribers may opt for OTT services instead. To remain relevant, pay TV operators should acquire content, ensure high quality of service, expand beyond set-top boxes with OTT apps, and provide a unified subscription for viewing on multiple devices and screens.
The move from a hardware centric design to a software centric design: GStream...Marc Leeman
The document discusses the shift from hardware-centric to software-centric product design in electronics companies. It describes how Gstreamer helped drive this transition by providing a modular, reusable software framework for building media pipelines. Initially attempts to use Gstreamer in embedded systems failed, but it eventually saw wider adoption as processor capabilities improved and the differences between embedded and general-purpose systems decreased. Gstreamer provided benefits like stability, flexibility, and shorter development times compared to custom hardware-specific software stacks. Its use led companies to change how they work and cooperate more through open standards and tools.
Here is a summary of the document in 3 sentences or less:
[SUMMARY] The document discusses geological assistance (intrafisicology), which is defined as the effect or result of geological science activities in providing natural resources to meet human needs in the physical dimension. It covers various topics related to geology, minerals, and humanity's use of geological resources, as well as concepts in conscienciology that are relevant to understanding humanity's relationship with the physical environment.
The document summarizes topics covered in a Linux workshop from January 20th to 25th at IIT Kanpur. It includes introductions to vi text editor commands, Linux shell, finding and searching files, grep command, SSH, SCP, processes and process handling, GUI desktop environments, text editors, terminal, and installing software using package managers.
Sasikumar is a software engineer with over 3 years of experience developing embedded systems and device drivers. He has expertise in C programming, real-time operating systems, Linux driver development, and protocols like I2C, UART and SPI. Some of his projects include developing DVB-CI and CI+ stacks to enable decryption of encrypted content. He also has experience with conditional access systems from Nagravision, Cryptoguard and implementing a Simulcrypt head-end system. Sasikumar is looking for new opportunities to further his knowledge and serve a company to the best of his abilities.
This document summarizes various devices and chipsets that have been worked with, including tuners, demodulators, processors, and interfaces. It provides brief descriptions of chipsets from Conexant, Fujitsu, ST, and Xilinx that have been used. It also lists tuners, digital demodulators, firmware tools, audio/video codecs, hardware design tools, and interfaces that have been engaged with. Finally, it provides two case studies: a DVB analyzer and a DTMB analyzer that were developed using various components described in the document.
This document provides guidance on handling an IRD (Inland Revenue Department of New Zealand) audit. It discusses IRD's information gathering powers, what constitutes a document, tips for cooperating with an audit in order to be viewed favorably. It outlines industry benchmarks and notes that every dollar spent on investigations recovers an average of $5 in additional tax revenue. The document warns that interest charges can significantly increase tax owed and tips ways to mitigate interest risk such as making early voluntary payments. It also discusses shortfall penalties and the reductions available for voluntary disclosures. The disputes process is outlined if agreement cannot be reached.
The document discusses LARCAN's DVB-T/H solution. It provides an overview of DVB-H as an extension of DVB-T to enable digital video broadcast services on mobile devices. It also describes how to set up DVB-T/H networks, including planning, transmitters, distribution networks, and synchronization for single frequency networks. Testing and optimization procedures are outlined as well as network monitoring and quality control. LARCAN is positioned as a leader in digital transmitter solutions that can provide a complete DVB-H portfolio.
This document summarizes research on using DVB-T signals for passive radar ship detection. DVB-T signals provide a large bandwidth and wide coverage suitable for passive radar. Preliminary experiments using a USRP software defined radio were able to detect ships up to 5 nautical miles away departing from a nearby harbor based on the Doppler frequency shifts measured. Future work aims to conduct experiments with cooperative targets and improve the system's range resolution and processing algorithms.
The document describes building a small embedded Linux kernel for the DaVinci DM644x Digital Evaluation Module (DVEVM).
1) The kernel is configured to select drivers for Ethernet, UART, and a TCP/IP stack while disabling unnecessary drivers.
2) The kernel is compiled to generate a uImage file stored in flash.
3) An initial RAM disk file system is built containing busybox, initscripts, and networking packages to support an HTTP server.
This document provides coding standards and conventions for Java programming. It covers topics such as program structure, file organization, indentation, comments, declarations, statements, naming conventions, and programming practices. The goal is to improve code readability, understandability, and maintainability. Projects may customize the standards as needed based on customer requirements.
The document describes an ultra-low power asynchronous logic in-situ self-adaptive VDD system for wireless sensor networks. The proposed system uses quasi-delay-insensitive asynchronous logic implemented with pre-charged static logic circuits. It features a self-adaptive VDD scaling system that dynamically adjusts the supply voltage based on processing requirements to minimize power consumption while operating robustly in the sub-threshold voltage region. The system design includes an asynchronous filter bank module powered by the adjustable VDD rail and a power management module that monitors circuit delays to determine the optimal VDD setting.
10 ways hardware engineers can make software integration easierChris Simmonds
Sometimes it seems that hardware engineers go out of their way to may the job of software engineers difficult. Here are my top 10 tips (plus two bonus slides) that will make integration to smoothly
- J2ME is a Java platform for embedded and mobile devices like phones, PDAs, etc.
- It has three main configurations: CLDC for low-end devices, CDC for more powerful devices, and Java SE for desktops.
- Profiles add functionality and APIs to configurations for specific device types. The main profile is MIDP for mobile phones.
- Optional packages provide additional common APIs like Bluetooth, messaging, location services, etc.
- J2ME is widely used in low-cost mobile devices but has declined on newer smartphones that use Android or iOS.
Overview of DVB-T standard to deploy Digital Terrestrial TelevisionFarhad Shahrivar
DVB-T is a technical standard for digital terrestrial television broadcasting that specifies framing, channel coding, and modulation. It is used in over 40 countries with nearly 200 million receivers sold, mostly in Europe. Benefits of DVB-T include better quality TV, improved population coverage, spectrum efficiency allowing more channels, and enabling HDTV and reception on mobile devices. Key issues in deploying DVB-T networks include establishing appropriate legal and regulatory frameworks, network planning, and content distribution infrastructure.
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Penetrating everyday products will see the market for AI technologies for the consumer market reach $5.6B in 2026.
More information : https://www.i-micronews.com/products/computing-and-ai-technologies-for-mobile-and-consumer-applications-2021/
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More information : https://www.i-micronews.com/products/application-processor-quarterly-market-monitor/
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More information : https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2021/
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Building automations in FME Flow can save time, money, and help businesses scale by eliminating data silos and providing data to stakeholders in real-time. One essential component to orchestrating complex automations is the use of attributes & automation parameters (both formerly known as “keys”). In fact, it’s unlikely you’ll ever build an Automation without using these components, but what exactly are they?
Attributes & automation parameters enable the automation author to pass data values from one automation component to the next. During this webinar, our FME Flow Specialists will cover leveraging the three types of these output attributes & parameters in FME Flow: Event, Custom, and Automation. As a bonus, they’ll also be making use of the Split-Merge Block functionality.
You’ll leave this webinar with a better understanding of how to maximize the potential of automations by making use of attributes & automation parameters, with the ultimate goal of setting your enterprise integration workflows up on autopilot.
In the realm of cybersecurity, offensive security practices act as a critical shield. By simulating real-world attacks in a controlled environment, these techniques expose vulnerabilities before malicious actors can exploit them. This proactive approach allows manufacturers to identify and fix weaknesses, significantly enhancing system security.
This presentation delves into the development of a system designed to mimic Galileo's Open Service signal using software-defined radio (SDR) technology. We'll begin with a foundational overview of both Global Navigation Satellite Systems (GNSS) and the intricacies of digital signal processing.
The presentation culminates in a live demonstration. We'll showcase the manipulation of Galileo's Open Service pilot signal, simulating an attack on various software and hardware systems. This practical demonstration serves to highlight the potential consequences of unaddressed vulnerabilities, emphasizing the importance of offensive security practices in safeguarding critical infrastructure.
"Choosing proper type of scaling", Olena SyrotaFwdays
Imagine an IoT processing system that is already quite mature and production-ready and for which client coverage is growing and scaling and performance aspects are life and death questions. The system has Redis, MongoDB, and stream processing based on ksqldb. In this talk, firstly, we will analyze scaling approaches and then select the proper ones for our system.
HCL Notes and Domino License Cost Reduction in the World of DLAUpanagenda
Webinar Recording: https://www.panagenda.com/webinars/hcl-notes-and-domino-license-cost-reduction-in-the-world-of-dlau/
The introduction of DLAU and the CCB & CCX licensing model caused quite a stir in the HCL community. As a Notes and Domino customer, you may have faced challenges with unexpected user counts and license costs. You probably have questions on how this new licensing approach works and how to benefit from it. Most importantly, you likely have budget constraints and want to save money where possible. Don’t worry, we can help with all of this!
We’ll show you how to fix common misconfigurations that cause higher-than-expected user counts, and how to identify accounts which you can deactivate to save money. There are also frequent patterns that can cause unnecessary cost, like using a person document instead of a mail-in for shared mailboxes. We’ll provide examples and solutions for those as well. And naturally we’ll explain the new licensing model.
Join HCL Ambassador Marc Thomas in this webinar with a special guest appearance from Franz Walder. It will give you the tools and know-how to stay on top of what is going on with Domino licensing. You will be able lower your cost through an optimized configuration and keep it low going forward.
These topics will be covered
- Reducing license cost by finding and fixing misconfigurations and superfluous accounts
- How do CCB and CCX licenses really work?
- Understanding the DLAU tool and how to best utilize it
- Tips for common problem areas, like team mailboxes, functional/test users, etc
- Practical examples and best practices to implement right away
Skybuffer SAM4U tool for SAP license adoptionTatiana Kojar
Manage and optimize your license adoption and consumption with SAM4U, an SAP free customer software asset management tool.
SAM4U, an SAP complimentary software asset management tool for customers, delivers a detailed and well-structured overview of license inventory and usage with a user-friendly interface. We offer a hosted, cost-effective, and performance-optimized SAM4U setup in the Skybuffer Cloud environment. You retain ownership of the system and data, while we manage the ABAP 7.58 infrastructure, ensuring fixed Total Cost of Ownership (TCO) and exceptional services through the SAP Fiori interface.
Monitoring and Managing Anomaly Detection on OpenShift.pdfTosin Akinosho
Monitoring and Managing Anomaly Detection on OpenShift
Overview
Dive into the world of anomaly detection on edge devices with our comprehensive hands-on tutorial. This SlideShare presentation will guide you through the entire process, from data collection and model training to edge deployment and real-time monitoring. Perfect for those looking to implement robust anomaly detection systems on resource-constrained IoT/edge devices.
Key Topics Covered
1. Introduction to Anomaly Detection
- Understand the fundamentals of anomaly detection and its importance in identifying unusual behavior or failures in systems.
2. Understanding Edge (IoT)
- Learn about edge computing and IoT, and how they enable real-time data processing and decision-making at the source.
3. What is ArgoCD?
- Discover ArgoCD, a declarative, GitOps continuous delivery tool for Kubernetes, and its role in deploying applications on edge devices.
4. Deployment Using ArgoCD for Edge Devices
- Step-by-step guide on deploying anomaly detection models on edge devices using ArgoCD.
5. Introduction to Apache Kafka and S3
- Explore Apache Kafka for real-time data streaming and Amazon S3 for scalable storage solutions.
6. Viewing Kafka Messages in the Data Lake
- Learn how to view and analyze Kafka messages stored in a data lake for better insights.
7. What is Prometheus?
- Get to know Prometheus, an open-source monitoring and alerting toolkit, and its application in monitoring edge devices.
8. Monitoring Application Metrics with Prometheus
- Detailed instructions on setting up Prometheus to monitor the performance and health of your anomaly detection system.
9. What is Camel K?
- Introduction to Camel K, a lightweight integration framework built on Apache Camel, designed for Kubernetes.
10. Configuring Camel K Integrations for Data Pipelines
- Learn how to configure Camel K for seamless data pipeline integrations in your anomaly detection workflow.
11. What is a Jupyter Notebook?
- Overview of Jupyter Notebooks, an open-source web application for creating and sharing documents with live code, equations, visualizations, and narrative text.
12. Jupyter Notebooks with Code Examples
- Hands-on examples and code snippets in Jupyter Notebooks to help you implement and test anomaly detection models.
Freshworks Rethinks NoSQL for Rapid Scaling & Cost-EfficiencyScyllaDB
Freshworks creates AI-boosted business software that helps employees work more efficiently and effectively. Managing data across multiple RDBMS and NoSQL databases was already a challenge at their current scale. To prepare for 10X growth, they knew it was time to rethink their database strategy. Learn how they architected a solution that would simplify scaling while keeping costs under control.
Programming Foundation Models with DSPy - Meetup SlidesZilliz
Prompting language models is hard, while programming language models is easy. In this talk, I will discuss the state-of-the-art framework DSPy for programming foundation models with its powerful optimizers and runtime constraint system.
Ivanti’s Patch Tuesday breakdown goes beyond patching your applications and brings you the intelligence and guidance needed to prioritize where to focus your attention first. Catch early analysis on our Ivanti blog, then join industry expert Chris Goettl for the Patch Tuesday Webinar Event. There we’ll do a deep dive into each of the bulletins and give guidance on the risks associated with the newly-identified vulnerabilities.
[OReilly Superstream] Occupy the Space: A grassroots guide to engineering (an...Jason Yip
The typical problem in product engineering is not bad strategy, so much as “no strategy”. This leads to confusion, lack of motivation, and incoherent action. The next time you look for a strategy and find an empty space, instead of waiting for it to be filled, I will show you how to fill it in yourself. If you’re wrong, it forces a correction. If you’re right, it helps create focus. I’ll share how I’ve approached this in the past, both what works and lessons for what didn’t work so well.
Driving Business Innovation: Latest Generative AI Advancements & Success StorySafe Software
Are you ready to revolutionize how you handle data? Join us for a webinar where we’ll bring you up to speed with the latest advancements in Generative AI technology and discover how leveraging FME with tools from giants like Google Gemini, Amazon, and Microsoft OpenAI can supercharge your workflow efficiency.
During the hour, we’ll take you through:
Guest Speaker Segment with Hannah Barrington: Dive into the world of dynamic real estate marketing with Hannah, the Marketing Manager at Workspace Group. Hear firsthand how their team generates engaging descriptions for thousands of office units by integrating diverse data sources—from PDF floorplans to web pages—using FME transformers, like OpenAIVisionConnector and AnthropicVisionConnector. This use case will show you how GenAI can streamline content creation for marketing across the board.
Ollama Use Case: Learn how Scenario Specialist Dmitri Bagh has utilized Ollama within FME to input data, create custom models, and enhance security protocols. This segment will include demos to illustrate the full capabilities of FME in AI-driven processes.
Custom AI Models: Discover how to leverage FME to build personalized AI models using your data. Whether it’s populating a model with local data for added security or integrating public AI tools, find out how FME facilitates a versatile and secure approach to AI.
We’ll wrap up with a live Q&A session where you can engage with our experts on your specific use cases, and learn more about optimizing your data workflows with AI.
This webinar is ideal for professionals seeking to harness the power of AI within their data management systems while ensuring high levels of customization and security. Whether you're a novice or an expert, gain actionable insights and strategies to elevate your data processes. Join us to see how FME and AI can revolutionize how you work with data!