The VI Chip VTM® is an advanced voltage transformation module designed for high efficiency and power density, operating at a frequency greater than 1 MHz with efficiencies up to 96%. It supports a wide range of input and output voltages and currents, making it suitable for various applications, including point-of-load voltage conversion and safety isolation. Additionally, VI Chip technology offers flexibility and minimal power loss improvements, positioning it for future advancements in power conversion systems.

1. VI Chip VTM® Voltage Transformation Module
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2. VI Chip Voltage Transformation Module (VTM)
› Isolated Sine Amplitude Converter (SAC) topology
› Fixed, high frequency (>1MHz)
› Efficiency up to 96%
› Fixed ratio converter (VOUT=VIN x K)
– Commercial:
› Input voltage: 26 – 55 V
Full-chip: 1.28” x 0.87” x 0.265” › Output voltage: 0.2 – 55 V
Half-chip: 0.65” x 0.87” x 0.625” › Output current: 6 – 130 A
– MIL-COTS:
› Input voltage: 26 – 50 V
› Output voltage: 0.8 – 50 V
› Output current: 3 – 100 A
› Usage
– Use with upstream PRM(s)
– Point-of-Load voltage divider / current multiplier
– Safety isolation (2,250 V) input-output
– Input capacitor multiplier
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3. Value Proposition: Power Density
› High power density enables:
– More functions (Gbps, ports, flops, capacity) in the same space
– A more powerful system without a larger power supply
– A more powerful system without a heavier power supply
› VI Chip power density enables:
– Systems that would be impossible with conventional approaches
– Systems that would be too large, too heavy or not cost effective with
a conventional approach
› VI Chips decrease power footprint by 40% today
› Power density increase of 25% every 2.5 years
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4. Value Proposition: Efficiency
› High efficiency enables:
– Smaller, cooler, quieter systems
– Energy cost savings for end user
– High performance systems with minimal total cost of ownership
› VI Chip architectures reduce hidden power losses
– A “whole system approach”, not just a focus on one conversion stage
› VI Chip technology continues to raise the efficiency standard
– IBC has half the power loss compared to industry IBC average
– Alternative solutions are at the technological limit with
respect to efficiency improvements
– New Vicor products cut losses by 20% every 2.5 years
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5. Value Proposition: Flexibility
› Flexibility enables:
– Re-use of power components
in multiple products
– Fewer SKUs, higher volume,
lower cost
– Fast time to market
– Reduced development effort
› VI Chip technology reduces the need
for custom power systems
– Power component paradigm
› Expanding portfolio of products
increases flexibility over time
– More options, more
configurability, less
complexity, shorter design time
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6. VI Chip Technology
› Advanced Engines
– Enable high efficiency and superior power density
– Maximize efficiency of power silicon
› HV Adaptive Cell topologies cut VI requirements
› LV Current Multipliers cut Vds requirements:
– Buck regulators operating from 12 V bus require 20 V rated MOSFET to supply 0.8 V
– VTM require 3 V rated MOSFET to supply 0.8 V
› Advanced architecture (FPA) minimizes power distribution loss
– Dense, efficient energy storage at 48 V
– No Bulk Caps at the PoL
– Highest current density at the PoL frees up precious real estate
› Superior modular product line
– Substantial IP portfolio covers architectures, topologies, internal components, control, etc…
› From the AC Wall Plug (or HV Bus) to the PoL (LV, high current)
› AC-DC and DC-DC
› “Young” technology continues to raise the efficiency and density bars
– Power loss cut by 25% every 2 years
– Power density increased by 25% every 2 years
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