Semefab is a custom wafer fabrication and MEMS foundry located in Scotland. It ships over 115 million semiconductor die per year, including 7.9 million MEMS die. The company provides both development and volume manufacturing services across three fabrication facilities using process technologies from 2.0μm to 0.8μm. Semefab serves over 35 customers worldwide in industries such as automotive, industrial, medical, and telecommunications.
Allwin21 Corp. has been focusing on providing solutions and enhancements to plasma Etch RIE semiconductor process equipment. These OEM Etch RIE semiconductor equipment have been used in productions and R&D since 1990′s. They have been Process-Proven. Allwin21 Corp. can customize these OEM systems with Allwin21′s comparable integrated process control system with PC, solid 3-axis robotic wafer transfer system, and new critical components to achieve the goal of giving our customers a production edge.
Please help fill in the RFQ at our website for suitable model and configuration for your applications. Appreciate your time.
Allwin21 Corp. has been focusing on providing solutions and enhancements to Tegal 901e, Tegal 903e, Tegal 901e TTW, Tegal 903e TTW,Lam AutoEtch 490 ,Lam AutoEtch 590, Lam AutoEtch 690, Lam AutoEtch 790 ,Lam Rainbow 44XX, 45XX, 46XX,47XX Series , Gasonics Aura 1000, Gasonics Aura 2000LL, Gasonics Aura 3010, Gasonics L3510 ,,Matrix 105, Matrix 105R, Matrix 205, Matrix 10 (1104, 1107, 1108), Matrix 303,Matrix 403 ,Matrix 10(1303, 1307), Branson/IPC 3000, Branson/IPC L3200 used Plasma Asher, Plasma Descum,plasma Etch, RIE semiconductor process equipment. These OEM Etch RIE semiconductor equipment have been used in productions and R&D since 1990′s. They have been proven to be a true “work horse”. Allwin21 Corp. can customize these OEM systems with Allwin21′s comparable integrated process control system with PC, solid robotic wafer transfer system (Video) and new critical components to achieve the goal of giving our customers a production edge with right cost.
Our new edition of the Newsletter "Market Insights by CORIAL" is now available!
Download your copy and read about plasma technology and applications for the Failure Analysis sector
Allwin21 Corp. has been focusing on providing solutions and enhancements to plasma Etch RIE semiconductor process equipment. These OEM Etch RIE semiconductor equipment have been used in productions and R&D since 1990′s. They have been Process-Proven. Allwin21 Corp. can customize these OEM systems with Allwin21′s comparable integrated process control system with PC, solid 3-axis robotic wafer transfer system, and new critical components to achieve the goal of giving our customers a production edge.
Please help fill in the RFQ at our website for suitable model and configuration for your applications. Appreciate your time.
Allwin21 Corp. has been focusing on providing solutions and enhancements to Tegal 901e, Tegal 903e, Tegal 901e TTW, Tegal 903e TTW,Lam AutoEtch 490 ,Lam AutoEtch 590, Lam AutoEtch 690, Lam AutoEtch 790 ,Lam Rainbow 44XX, 45XX, 46XX,47XX Series , Gasonics Aura 1000, Gasonics Aura 2000LL, Gasonics Aura 3010, Gasonics L3510 ,,Matrix 105, Matrix 105R, Matrix 205, Matrix 10 (1104, 1107, 1108), Matrix 303,Matrix 403 ,Matrix 10(1303, 1307), Branson/IPC 3000, Branson/IPC L3200 used Plasma Asher, Plasma Descum,plasma Etch, RIE semiconductor process equipment. These OEM Etch RIE semiconductor equipment have been used in productions and R&D since 1990′s. They have been proven to be a true “work horse”. Allwin21 Corp. can customize these OEM systems with Allwin21′s comparable integrated process control system with PC, solid robotic wafer transfer system (Video) and new critical components to achieve the goal of giving our customers a production edge with right cost.
Our new edition of the Newsletter "Market Insights by CORIAL" is now available!
Download your copy and read about plasma technology and applications for the Failure Analysis sector
Atomic Layer Deposition solutions for SiC Power ElectronicsBeneq
Power Electronics International
Brussels, Belgium
19.04.2023
Atomic Layer Deposition solutions for SiC Power Electronics
Integrated ALD passivation/gate dielectric stack for SiC MOSFET
Presented by Mikko Söderlund from Beneq Oy
Allwin21 Corp. is the exclusive licensed manufacturer of AG Associates Heatpulse 610 Rapid Thermal Processing equipment. Allwin21 is manufacturing the new AccuThermo AW Series Atmospheric Rapid Thermal Processors and Vacuum Rapid Thermal Processors. Compared with traditional RTP systems, Allwin21’s AccuThermo AW RTPs have innovative software and more advanced temperature control technologies to achieve the BEST rapid thermal processing performance (repeatability, uniformity, and stability) with decades of research directly applicable to ours.
You can use MFC2 for wet N2 process with using bubbler on our RTP equipment during steady time. The chamber would be purged with dry N2 using MFC1 at the beginning and end of the process.
Please help fill in the RFQ at our website for suitable production proven Rapid Thermal Processor model and configuration for your applications. Please go through the Q and A if necessary before you fill in the RFQ below. Appreciate your time. Thank you very much.
For many years AG Associates was the dominant manufacturer of RTP systems. It was founded in 1981 and produced the first single wafer RTP system in 1982, the Heatpulse 210. In 1987, it produced the Heatpulse 610. These RTP systems run at atmospheric pressure and rely on a pre-process nitrogen or argon purge prior to wafer processing. They are still being used around the world in manufacturing, R&D and Universities. These RTP systems have a proven track record for reliability and simplicity.
Qualcomm 60GHz WiGig/WiFi 802.11ad Chipset World’s First Smartphone Editionsystem_plus
Early glimpse of very compact form millimeter-wave chipset commercially available for handset applications.
More information on that report at: http://www.systemplus.fr/reverse-costing-reports/qualcomm-60ghz-wigigwifi-802-11ad-chipset-worlds-first-smartphone-edition/
Allwin21 Brochures for Rapid Thermal Processing equipment, Plasma Asher ,Plasma Descum Equipment, Plasma Etcher, RIE, Sputtering Deposition Equipment, Thin Film Metrology ,semiconductor equipment. Made in USA. All are production proven, the most popular semiconductor process equipment.
Allwin21 Corp. was formed in 2000 with a focus on professionally providing Rapid Thermal Process, Plasma Asher Strip / Descum, Plasma Etch/RIE, Sputter Deposition, and Metal Film Metrology semiconductor equipment, services and technical support in Semiconductor III-V, MEMS, Biomedical, Nanotechnology, Solar, & LED industries. We endeavor to be a leader in our product lines. To achieve this, we have been providing unique innovative and cost-effective technical solutions, high quality equipment, and on time spare parts delivery worldwide. We have maintained a global presence that has grown and expanded into the major high-tech manufacturing areas of the world. We pride ourselves on developing and continuing lasting customer relationships.
We understand that a timely responsive support and service are critical elements in semiconductor industries. Allwin21’s experienced engineer team is the best guarantee for high quality service and support. We provide on-site installation, training, maintenance, system optimization, retrofits, and/or customized upgrades.
For many years AG Associates was the dominant manufacturer of RTP systems. It was founded in 1981 and produced the first single wafer RTP system in 1982, the Heatpulse 210. In 1987, it produced the Heatpulse 610. These RTP systems run at atmospheric pressure and rely on a pre-process nitrogen or argon purge prior to wafer processing. They are still being used around the world in manufacturing, R&D and Universities. These RTP systems have a proven track record for reliability and simplicity.
Allwin21 Corp. is the exclusive licensed manufacturer of AG Associates Heatpulse 610 Rapid Thermal Processing equipment. Allwin21 is manufacturing the new AccuThermo AW Series Atmospheric Rapid Thermal Processors and Vacuum Rapid Thermo Processors.Compared with traditional RTP systems, Allwin21″s AccuThermo AW RTPs have innovative software and more advanced temperature control technologies to achieve the best rapid thermal processing performance ( repeatability , uniformity and Stability etc.).
Developing robust, 5V tolerant analog I/O libraries for CMOS processes & FinF...Sofics
Presentation by Vera on the Mentor Graphics technology day in Cambridge (2018-09-11). In the presentation Vera covered different topics including techniques used at Sofics to speed up design. She also presented solutions for 5V tolerant interfaces and protection of high speed interfaces against ESD stress
GaN-on-Si Substrate Technology and Market for LED and Power ElectronicsYole Developpement
GaN-on-Si enables GaN power electronics, will LED transition as well?
GaN-ON-Si LED IS ALREADY ADOPTED BY SOME LED MANUFACTURERS, BUT COULD IT BECOME THE INDUSTRY STANDARD?
Today, GaN on Sapphire is the main stream technology for LED manufacturing. GaN-on-Si technology appeared naturally as an alternative to sapphire to reduce cost. Our cost simulation indicates that the differential in silicon substrate cost is not enough to justify the transition to GaN-on-Si technology. The main driver is the ability to manufacture in existing, depreciated CMOS fabs in 6” or 8”.
Despite potential cost benefits for LEDs, the mass adoption of GaN-on-Si technology for LED applications remains unclear. Opinions regarding the chance of success for LED-on-Si vary widely in the LED industry from unconditional enthusiasm to unjustified skepticism. Virtually all major LED makers are researching GaN-on-Si LED, but few have made it the core of their strategy and technology roadmap. Among the proponents, only Lattice Power, Plessey and Toshiba have moved to production and are offering commercial LED-on-Si.
At Yole Développement, we believe that although significant improvements have been achieved, there are still some technology hurdles (performance, yields, CMOS compatibility). We consider that if the technology hurdles are cleared, GaN-on-Si LEDs will be adopted by some LED manufacturers, but will not become the industry standard. We expect that Silicon will capture less than 5% of LED manufacturing by 2020.
GaN-ON-Si TECHNOLOGY WILL BE WIDELY ADOPTED BY POWER ELECTRONICS APPLICATIONS
The power electronics market addresses applications such as AC to DC or DC to AC conversion, which is always associated with substantial energy losses that increase with higher power and operating frequencies. Incumbent silicon based technology is reaching its limit and it is difficult to meet higher requirements. GaN based power electronics have the potential to significantly improve efficiency at both high power and frequencies while reducing device complexity and weight. Power GaN are therefore emerging as a substitution to the silicon based technology. Today, Power GaN remains at its early stage and presents only a tiny part of power electronics market.
We are quite optimistic about the adoption of GaN-on-Si technology for Power GaN devices. GaN-on-Si technology have brought to market the first GaN devices. Contrary to the LED industry, where GaN-on-Sapphire technology is main stream and presents a challenging target, GaN-on-Si will dominate the GaN based power electronics market because of its lower cost and CMOS compatibility. Although GaN based devices remain more expensive than Si based devices today, the overall cost of GaN devices for some applications are expected to be lower than Si devices three years from now, according to some manufacturers.
http://www.i-micronews.com/reports/GaN-on-Si-Substrate-Market-LED-Power-Electronics/3/424/
Corporate brochure for Saturn Electronics Corporation featuring PCB Manufacturing Equipment, advanced technologies, IPC standards and industry certifications. PCB Buyer's Guide included for industry comparisons.
Atomic Layer Deposition solutions for SiC Power ElectronicsBeneq
Power Electronics International
Brussels, Belgium
19.04.2023
Atomic Layer Deposition solutions for SiC Power Electronics
Integrated ALD passivation/gate dielectric stack for SiC MOSFET
Presented by Mikko Söderlund from Beneq Oy
Allwin21 Corp. is the exclusive licensed manufacturer of AG Associates Heatpulse 610 Rapid Thermal Processing equipment. Allwin21 is manufacturing the new AccuThermo AW Series Atmospheric Rapid Thermal Processors and Vacuum Rapid Thermal Processors. Compared with traditional RTP systems, Allwin21’s AccuThermo AW RTPs have innovative software and more advanced temperature control technologies to achieve the BEST rapid thermal processing performance (repeatability, uniformity, and stability) with decades of research directly applicable to ours.
You can use MFC2 for wet N2 process with using bubbler on our RTP equipment during steady time. The chamber would be purged with dry N2 using MFC1 at the beginning and end of the process.
Please help fill in the RFQ at our website for suitable production proven Rapid Thermal Processor model and configuration for your applications. Please go through the Q and A if necessary before you fill in the RFQ below. Appreciate your time. Thank you very much.
For many years AG Associates was the dominant manufacturer of RTP systems. It was founded in 1981 and produced the first single wafer RTP system in 1982, the Heatpulse 210. In 1987, it produced the Heatpulse 610. These RTP systems run at atmospheric pressure and rely on a pre-process nitrogen or argon purge prior to wafer processing. They are still being used around the world in manufacturing, R&D and Universities. These RTP systems have a proven track record for reliability and simplicity.
Qualcomm 60GHz WiGig/WiFi 802.11ad Chipset World’s First Smartphone Editionsystem_plus
Early glimpse of very compact form millimeter-wave chipset commercially available for handset applications.
More information on that report at: http://www.systemplus.fr/reverse-costing-reports/qualcomm-60ghz-wigigwifi-802-11ad-chipset-worlds-first-smartphone-edition/
Allwin21 Brochures for Rapid Thermal Processing equipment, Plasma Asher ,Plasma Descum Equipment, Plasma Etcher, RIE, Sputtering Deposition Equipment, Thin Film Metrology ,semiconductor equipment. Made in USA. All are production proven, the most popular semiconductor process equipment.
Allwin21 Corp. was formed in 2000 with a focus on professionally providing Rapid Thermal Process, Plasma Asher Strip / Descum, Plasma Etch/RIE, Sputter Deposition, and Metal Film Metrology semiconductor equipment, services and technical support in Semiconductor III-V, MEMS, Biomedical, Nanotechnology, Solar, & LED industries. We endeavor to be a leader in our product lines. To achieve this, we have been providing unique innovative and cost-effective technical solutions, high quality equipment, and on time spare parts delivery worldwide. We have maintained a global presence that has grown and expanded into the major high-tech manufacturing areas of the world. We pride ourselves on developing and continuing lasting customer relationships.
We understand that a timely responsive support and service are critical elements in semiconductor industries. Allwin21’s experienced engineer team is the best guarantee for high quality service and support. We provide on-site installation, training, maintenance, system optimization, retrofits, and/or customized upgrades.
For many years AG Associates was the dominant manufacturer of RTP systems. It was founded in 1981 and produced the first single wafer RTP system in 1982, the Heatpulse 210. In 1987, it produced the Heatpulse 610. These RTP systems run at atmospheric pressure and rely on a pre-process nitrogen or argon purge prior to wafer processing. They are still being used around the world in manufacturing, R&D and Universities. These RTP systems have a proven track record for reliability and simplicity.
Allwin21 Corp. is the exclusive licensed manufacturer of AG Associates Heatpulse 610 Rapid Thermal Processing equipment. Allwin21 is manufacturing the new AccuThermo AW Series Atmospheric Rapid Thermal Processors and Vacuum Rapid Thermo Processors.Compared with traditional RTP systems, Allwin21″s AccuThermo AW RTPs have innovative software and more advanced temperature control technologies to achieve the best rapid thermal processing performance ( repeatability , uniformity and Stability etc.).
Developing robust, 5V tolerant analog I/O libraries for CMOS processes & FinF...Sofics
Presentation by Vera on the Mentor Graphics technology day in Cambridge (2018-09-11). In the presentation Vera covered different topics including techniques used at Sofics to speed up design. She also presented solutions for 5V tolerant interfaces and protection of high speed interfaces against ESD stress
GaN-on-Si Substrate Technology and Market for LED and Power ElectronicsYole Developpement
GaN-on-Si enables GaN power electronics, will LED transition as well?
GaN-ON-Si LED IS ALREADY ADOPTED BY SOME LED MANUFACTURERS, BUT COULD IT BECOME THE INDUSTRY STANDARD?
Today, GaN on Sapphire is the main stream technology for LED manufacturing. GaN-on-Si technology appeared naturally as an alternative to sapphire to reduce cost. Our cost simulation indicates that the differential in silicon substrate cost is not enough to justify the transition to GaN-on-Si technology. The main driver is the ability to manufacture in existing, depreciated CMOS fabs in 6” or 8”.
Despite potential cost benefits for LEDs, the mass adoption of GaN-on-Si technology for LED applications remains unclear. Opinions regarding the chance of success for LED-on-Si vary widely in the LED industry from unconditional enthusiasm to unjustified skepticism. Virtually all major LED makers are researching GaN-on-Si LED, but few have made it the core of their strategy and technology roadmap. Among the proponents, only Lattice Power, Plessey and Toshiba have moved to production and are offering commercial LED-on-Si.
At Yole Développement, we believe that although significant improvements have been achieved, there are still some technology hurdles (performance, yields, CMOS compatibility). We consider that if the technology hurdles are cleared, GaN-on-Si LEDs will be adopted by some LED manufacturers, but will not become the industry standard. We expect that Silicon will capture less than 5% of LED manufacturing by 2020.
GaN-ON-Si TECHNOLOGY WILL BE WIDELY ADOPTED BY POWER ELECTRONICS APPLICATIONS
The power electronics market addresses applications such as AC to DC or DC to AC conversion, which is always associated with substantial energy losses that increase with higher power and operating frequencies. Incumbent silicon based technology is reaching its limit and it is difficult to meet higher requirements. GaN based power electronics have the potential to significantly improve efficiency at both high power and frequencies while reducing device complexity and weight. Power GaN are therefore emerging as a substitution to the silicon based technology. Today, Power GaN remains at its early stage and presents only a tiny part of power electronics market.
We are quite optimistic about the adoption of GaN-on-Si technology for Power GaN devices. GaN-on-Si technology have brought to market the first GaN devices. Contrary to the LED industry, where GaN-on-Sapphire technology is main stream and presents a challenging target, GaN-on-Si will dominate the GaN based power electronics market because of its lower cost and CMOS compatibility. Although GaN based devices remain more expensive than Si based devices today, the overall cost of GaN devices for some applications are expected to be lower than Si devices three years from now, according to some manufacturers.
http://www.i-micronews.com/reports/GaN-on-Si-Substrate-Market-LED-Power-Electronics/3/424/
Corporate brochure for Saturn Electronics Corporation featuring PCB Manufacturing Equipment, advanced technologies, IPC standards and industry certifications. PCB Buyer's Guide included for industry comparisons.
