Report for Laboratory work on OMRON D6F Flow Sensor Name.docx

Report for Laboratory work on: OMRON D6F Flow Sensor
Name: Dylan Hughes
EGT-280: Introduction to Microtechnology
Cover Page
Report #1
Name of Report: MEMS Project Report
Your Name: Dylan Hughes
Submitted to:
Dr. S.M. Allameh

In partial fulfillment of the requirements for
EGT-280:
Introduction to Microtechnology
Department of Physics and Geology
Northern Kentucky University
June 2017
Name: Dylan Hughes
Name of Report: MEMS Project Report
By: Dylan Hughes
Abstract:
This project report discusses the MEMS selection process,
initial setup and wiring of the

MEMS device, problems/difficulties encountered, and internal
inspection and functionality of
an OMRON D6F-P0010A2 MEMS Mass Flow Sensor. The
internal inspection reveals the
functionality, principles, and theories that govern operation of a
thermal mass flow sensor.
Selection criteria for the MEMS device is also discussed, as
well as the importance of having the
correct connections and equipment to power and communicate
with a micro device.
Introduction:
The OMRON D6F-P series of flow sensors offers compact size,
excellent accuracy, and a
dust segregation system that allows the flow sensor to be used
in dirty, dusty environments.
Because of the micro device’s size, it can be used in very tight,
space-critical applications. Mass
flow sensors similar to the D6F-P line are being used in many
applications today. The most
common use for flow sensors is within the automotive industry.
Flow sensors are used to
monitor the amount of air flowing through the intake system and
into the combustion
chamber. The onboard computer then uses that data, along with
several other sensor’s data, to
calculate the proper air-to-fuel ratio for the current running
conditions. Flow sensors are also
used to control engine idle, monitor recirculatory exhaust
systems, and keep the interior of the
vehicle cool and comfortable.
Flow sensors have also seen an increase use within the HVAC
industry. Because of OMRON’s

dust segregation system, the D6F line of MEMS flow sensors
can be used to monitor air in nasty
environments. Micro flow sensors typically have a maximum
flow rate of 1.0 LPM. The low flow
rate allows the sensor to be placed within a bypass system. The
flow rate of the bypass air is
then proportional to the flow rate for the entire system.
Selection Process:
The OMRON D6F-P0010A2 sensor was selected for several
reasons. Firstly, because of
my experience with various flow sensors on-the-job and in
automotive repair work. I have
worked with several different flow sensors but have never had
the opportunity to open one
and discover how it works. Being so familiar with their
functionality and importance, especially
within the automotive industry, I was very excited to see the
internal workings.
The second reason for choosing the D6F flow sensor was cost
and proper documentation.
OMRON was easy to contact and provided several datasheets
with specifications for input
voltage, output voltage, operating pressure, and detailed wiring
schematics. I have never
purchased from OMRON in the past, but because of their
customer support and eagerness to
help, I will consider their products in the future.
The final reason for choosing the D6F-P flow sensor was ease
of setup and availability of an
appropriate power supply.

Name: Dylan Hughes
Initial Setup:
The initial setup of the MEMS device was challenging because
the device was not
purchased with the appropriate connector. Because of the
device’s size it was impossible to
establish a firm connection without the correct plug. After
purchasing and receiving the correct
connector, along with OMRON’s provided wiring diagram,
setup of the MEMS device was very
straight forward. An Acopian regulated power supply was used
to provide 6.0 vDC to the MEMS
device. A digital volt meter was connected to the output
terminal and ground terminal of the
MEMS device to provide voltage monitoring proportional to the
mass flow rate. Air was
supplied to the MEMS device using a small air compressor and
inline pressure regulator. The air
outlet was vented to the atmosphere.
Below is a picture of the initial setup of the MEMS device.
Problems:
As mentioned before, the OMRON sensor did not come with a
connection cable – it was
an additional accessory that I chose not to order. I have never
worked with a micro device

before and did not expect the connection terminals to be so
small. Once I was able to
successfully power the device, I then ran into problems with the
accuracy of the air pressure
regulator. At pressures below 10 PSI the pressure regulator did
not display reasonable
measurements. D6F-P flow sensors are rated to withstand
pressures of 7 PSI, so voltage-to-
Name: Dylan Hughes
pressure correlations were not possible. However, the output
voltage characteristics of the
D6F-P0010A2 were found on the D6F-P datasheet provided by
OMRON, and the results are
shown in the following chart:
Internal Inspection:
I found the internal workings of the MEMS device to be very
intriguing and “relatively”
easy to understand after watching OMRON’s MEMS Sensor
Product Technology Module. The
module discussed and explained every aspect of the MEMS
Flow Chip, the internal flow path
and dust segregation system, and the concept behind using
thermopiles and heaters to
measure the mass flow rate.
After cutting the security sticker along the top of the device, I
was able to remove the back
cover using a small flathead screwdriver. The top of the micro

device was then visible. Below is
a picture with the back cover removed.
0
0.5
1
1.5
2
2.5
3
0 0.25 0.5 0.75 1
D6F-P0010A2 Voltage
Characteristics
Flow Rate (L/min)
O
ut
pu
t V
ol
ta
ge
(V

)
Name: Dylan Hughes
I was then able to remove the circuit module, which revealed
the upper air flow path and the
MEMS Flow Chip. The upper flow path is the only path
monitored by the flow chip.
Name: Dylan Hughes
The dust segregation component in the middle of the housing
was then removed to reveal the
lower flow path. The air flow through the lower path is not
monitored by the MEMS flow chip,
but the measurement through the upper flow path is proportional
to the total mass flow rate.
Centrifugal force keeps dust and particles in the lower flow path
and out of the upper flow
path. This design ensures air through the micro flow chip is
clean and particle free.

Name: Dylan Hughes
I then used a strong magnifying glass to examine the MEMS
Flow Chip. The D6F-P flow sensor
operates under the principle of a temperature differential. Two
thermopiles are used to
monitor the air temperature of incoming and outgoing air
through the flow chip. A heating
element placed between the thermopiles creates a temperature
difference that can be seen
between the two thermopiles. This temperature differential
creates a voltage that is
proportional to the mass flow rate of the air flowing through the
flow chip. Below is a close-up
image of the MEMS Flow Chip.
Conclusion:
MEMS Mass Flow Sensors are being used in more and more
applications because of
their durability, repeatability, and affordability. Micro flow
sensors can be used to monitor a
proportional amount of air flow which allows them to be
installed in small, out-of-the-way
areas.
After purchasing, experimenting with, and inspecting the micro

device, I now have a greater
understanding of the complexities of MEMS devices, as well as
the operating principles
governing a thermal flow sensor.
Name: Dylan Hughes
Student ID and disassembled MEMS device for reference and
credibility.
YoungGonzaga, S. (2017). Cool Widgets, Inc. Business
Scenario.
Business Scenario for Cool Widgets, Inc. (CWI)
Who:
Cool Widgets, Inc (CWI), is a fictitious collection agency that
is currently experiencing
significant growth, which has greatly increased physical mail

volume. One of CWI’s long term
strategic goals is to strengthen its brand by streamlining
internal operations. To facilitate this
CWI intends to add employees and two new branch offices.
However, with the additional
business and projected growth, Cool Widgets needs a more
efficient method for handling its
rapidly expanding mail volume.
What, Where & Why:
CWI is in need of streamlining the receipt and internal delivery
of mail for accounts payable
(AP), accounts receivables (AR), and account collections (AC).
These departments have the
greatest number of manual activities in the organization because
most of the physical mail that
comes into the organization ends up in these three areas. The
AC and AR departments have the
largest portion of the incoming mail. These two departments are
responsible for managing
revenue, processing the payments sent in by customers, and
remitting the funds to the client
organizations.
CWI handles over a 1,000 pieces of mail on a daily basis. The
mail includes letters, bank
statements, checks, invoices, solicitations, UPS, Fed-Ex, and
courier deliveries. All of these must
be sorted and routed appropriately.
The task of sorting and promptly delivering the large volume of
incoming mail is complicated by
the frequent misidentification and misrouting of important mail
pieces, such as invoices,
payment advisories, wire confirmations, checks, and money

orders. Many of these items are then
delayed, misplaced, or lost in the shuffle. This results in lost
revenue, late penalties, and many
customer complaints due to lost payments and/or slow payment
processing.
CWI needs to find a way to improve the process and determine
the best method for addressing
the issues – this includes looking beyond merely solving the
immediate problem. Looking
toward the future is especially important since CWI has plans to
expand, and to shift some
operations processing functions to the new branch offices where
there will be no physical mail
delivery activities.
CWI’s current expansion plan is to have 200 employees in three
processing offices. These will
be located in three states (CA, NY, NV) and connected via a
WAN (wide area network). There
are 100 employees in the corporate office in California and
there will be 50 employees in each of
the two new branch offices. CWI is also considering hiring
remotely located collection
employees in the future as the business continues to expand.
Your Role:
In this scenario you are the Senior BSA in charge of this
analysis effort on the mail issue for
Cool Widgets, Inc.
Scenario.

Partial List of CWI Stakeholders and Related Parties
(Be aware that this is not an exhaustive list)
1. Sandra – CEO
2. Jorge – COO
3. Sydney - CIO
4. Palo – Collections Manager (AC)
5. Tyra – Mailroom Operations Manager
6. Aaron – Senior Mailroom Clerk
7. Mailroom Clerks
8. Alesha – Accounting Supervisor (AR & AP)
9. Accounting Clerks (AR & AP)
10. Hammond – Collections Supervisor
11. Collection Reps
12. Leslie – Customer Service Supervisor
13. Customer Service Reps
14. Derrick – Marketing Manager
15. Randy – Project Manager
16. McKenzie – Lead Programmer
17. Programmers and other technical staff
18. You (yes, you �� ) —Senior BSA
Example elements for analysis and consideration:
• Frequency of external mail retrievals or deliveries from post
office
• Frequency of internal mail delivery from mail room sorting to
various depts.
• Handling of Fedex/UPS/courier/special deliveries
• Outgoing mail handling
• Volume of outgoing mail
• Number of people in mail department
• The key players, stakeholders, sponsors

• Time constraints for departments that depend on mail delivery
• Other departments that rely on mail delivery
• The impact of lost/misrouted mail pieces on the CWI’s bottom
line
• Choke points in CWI’s mail handling process
• Current manual processes that could be eliminated with
technology
Scenario.
A G U I D E T O T H E B U S I N E S S A N A L Y S I S
B O D Y O F K N O W L E D G E ®
v3
BABOK
®
v3

A GUIDE TO THE BUSINESS ANALYSIS
BODY OF KNOWLEDGE®
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International Institute of Business Analysis, Toronto, Ontario,
Canada.
©2005, 2006, 2008, 2009, 2015 International Institute of
Business Analysis. All rights reserved.
Version 1.0 and 1.4 published 2005. Version 1.6 Draft
published 2006. Version 1.6 Final published 2008. Version 2.0
published 2009. Version 3.0 published 2015.
ISBN-13: 978-1-927584-03-3
Permission is granted to reproduce this document for your own
personal, professional, or educational use. If you have
purchased a license to use this document from IIBA®, you may
transfer ownership to a third party. IIBA® members may not
transfer ownership of their complimentary copy.
This document is provided to the business analysis community
for educational purposes. IIBA® does not warrant that it is
suitable for any other purpose and makes no expressed or
implied warranty of any kind and assumes no responsibility for
errors or omissions. No liability is assumed for incidental or
consequential damages in connection with or arising out of the
use of the information contained herein.
IIBA®, the IIBA® logo, BABOK® and Business Analysis Body
of Knowledge® are registered trademarks owned by
International Institute of Business Analysis. CBAP® is a
registered certification mark owned by International Institute of
Business Analysis. Certified Business Analysis Professional,
EEP and the EEP logo are trademarks owned by International
Institute of Business Analysis.
Archimate® is a registered trademark of The Open Group in the
US and other countries.

Business Model Canvas is copyrighted by
BusinessModelGeneration.com and released under Creative
Commons license.
CMMI® is a registered trademark of Carnegie Mellon
University.
COBIT® is a trademark of the Information Systems Audit and
Control Association and the IT Governance Institute.
Mind Map® is a registered trademark of the Buzan
Organization.
Scaled Agile Framework® and SAFe™ are trademarks of Scaled
Agile, Inc.
TOGAF® is a registered trademark of The Open Group in the
US and other countries.
Unified Modelling Language™ and UML® are trademarks of
the Object Management Group.
Zachman Framework for Enterprise Architecture is a trademark
of the Zachman Institute for Framework Advancement.
No challenge to the status or ownership of these or any other
trademarked terms contained herein is intended by the
International Institute of Business Analysis.
Any inquiries regarding this publication, requests for usage
rights for the material included herein, or corrections should be
sent by email to [email protected].

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Table of Contents
Chapter 1: Introduction

1.1 Purpose of the BABOK® Guide 1
1.2 What is Business Analysis? 2
1.3 Who is a Business Analyst? 2
1.4 Structure of the BABOK® Guide 3
Chapter 2: Business Analysis Key Concepts
2.1 The Business Analysis Core Concept Model™ 12
2.2 Key Terms 14
2.3 Requirements Classification Schema 16
2.4 Stakeholders 16
2.5 Requirements and Designs 19
Chapter 3: Business Analysis Planning and Monitoring
3.1 Plan Business Analysis Approach 24
3.2 Plan Stakeholder Engagement 31
3.3 Plan Business Analysis Governance 37
3.4 Plan Business Analysis Information Management 42
3.5 Identify Business Analysis Performance Improvements 47
Table of Contents
ii

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Chapter 4: Elicitation and Collaboration
4.1 Prepare for Elicitation 56
4.2 Conduct Elicitation 61
4.3 Confirm Elicitation Results 65
4.4 Communicate Business Analysis Information 67
4.5 Manage Stakeholder Collaboration 71
Chapter 5: Requirements Life Cycle Management
5.1 Trace Requirements 79
5.2 Maintain Requirements 83
5.3 Prioritize Requirements 86
5.4 Assess Requirements Changes 91
5.5 Approve Requirements 95
Chapter 6: Strategy Analysis
6.1 Analyze Current State 103
6.2 Define Future State 110
6.3 Assess Risks 120

6.4 Define Change Strategy 124
Chapter 7: Requirements Analysis and Design Definition
7.1 Specify and Model Requirements 136
7.2 Verify Requirements 141
7.3 Validate Requirements 144
7.4 Define Requirements Architecture 148
7.5 Define Design Options 152
7.6 Analyze Potential Value and Recommend
Solution
157
Chapter 8:

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