The document outlines the roles and responsibilities of a process team in developing and optimizing a surface mount technology (SMT) process to enhance quality, reduce scrap, and improve productivity. Key activities include defining process flow charts, establishing product feasibility requirements, documenting process parameters, and conducting analyses of test failures and reflow profiles. The document emphasizes the importance of controlled templates for work instructions and process specifications to ensure compliance and continuous improvement.

1. P R O C E S S T E A M
R O L E S &
R E S P O N S I B I L I T I E S

2. P U R P O S E
To create, configure and develop a robust
SMT process to improve the quality rate,
reduce the scrap, and to improve the
productivity.

3. R O L E S A N D R E S P O N S I B I L I T I E S
Define process
flow chart
Review product
feasibility
/requirements
Defining process
parameters
Reflow profiling
Ensure the AOI
/SPI inspection
library
Analysis in line
rejection
Analysis Testing
failure PCBA
Process
specification
chart for MASS
PRODUCTION
Work instruction
preparation
PFMEA
One point lesson
/any special
requirement
preparation

4. D E F I N E P R O C E S S F L O W C H A R T
Process flow chart should
be prepared to develop
understanding of how a
process is to be done.
A quality-controlled
process flow chart template
TP074 to be filled
indicating all the process
sequences, an essential
part to study the process
for improvement.

5. P R O D U C T
F E A S I B I L I T Y
/ R E Q U I R E M E N T S
• A document to be created and
controlled by QMS that will consist
all the requirement
• like jigs and fixtures for PCB.
• Component feasibility with PCB
design and process.
• Stencil design analysis.

6. D E F I N I N G
P R O C E S S
PA R A M E T E R S
 It will include Solder paste screen printer
parameters that will be documented and
controlled in TP386 template.
• Solder Paste inspection parameters
containing UCL and LCL documented in
TP384.

7. R E F L O W
P R O F I L I N G
P R O C E S S
In the NPI phase reflow profile to be taken by an
assembled panel depending upon the availability
of the PCB and the component.
All the reflow profile for every product are saved
in a computer system and a print copy to be given
to all the production line to display at reflow oven.
Reflow profile to be validated every time when
that particular product to be run.
ECD Super mole profiler having six channel is
being used for taking reflow profile and apart from
we’re having a reflow oven checker to check the
reflow oven once in a week for all the lines.

8. A N A LY S I S
O F T E S T
F A I L U R E
O F P C B A
• It will be done by finding out all the potential causes of the
failure
• Reflow profile will be optimized to control the defects.
• Thermal consideration to be studied, stencil aperture
opening to be taken under considerations, to evaluate the
solder paste transfer efficiency of the stencil (Area and
aspect ratio), PCB land area to be analyzed,
• Analysis of the components whether they are having
oxidation or corrosion on their surface or not and treat them
accordingly.

9. W O R K I N S T R U C T I O N A N D O P L
P R E PA R AT I O N
Work instruction for every machine and every
process will be created reviewed and modified
as per the requirement in TP074 template.
OPL for special requirements will also be
prepared and displayed in TP318 template.

10. P R O C E S S
S P E C I F I C A T I O N
R E C O R D
• Process specification record to be created and controlled
by QMS in TP410 template.
• It will have all the information in a single sheet like solder
paste, screen printer parameters, spi parameters, reflow
profile etc.
• It can be changed if required, only process team will be
authorized to change this PS.