Syrma sgs pvt ltd.

1. YEAR-2024
SYRMA SGS
TECHNOLOGYPVT.LTD. BAWAL(REWARI)
SUBMITTED BY:-
NAME:- SAHIL
ROLL NO. :- (20EC12) 201401018002
BRANCH:- ELECTRONICS and COMMUNICATION ENGINEERING
[ TRAINING REPORT]

3. PRESENTED BY:- SAHIL SUBMITTED TO:-SANDEEP YADAV
ACKNOWLEDGEMENT
I acknowledge my gratitude to my mentor, Mr. Ritesh Sharma
(Assistant Manager.) SYRMA SGS TECHNOLOGY PVT.LTD.
BAWAL (DEPT: Quility).
The supervision and support that he gave truly help the p[progression
and smoothness of the training program. The cooperation is much
indeed appreciated.
My grateful thanks also go to Mr. RITESH SHARMA(Senior Assitent
Manager) and MR.Raghav Saini (Junior Engineer) in QUILITY
department. A big contribution andduring six month is very great indeed.
Besides this training period makes me realize the value of working
together as a team and a new experience in working environment, which
challenges us every minute. Not forget appreciation go to the rest of
SYRMA SGS staff that help me from time to time during my training .

4. CERTIFICATE

5. PRESENTED BY:- SAHIL SUBMITTED TO:-SANDEEP YADAV
CERTIFICATE OF
COMPLETION
This is to certify that training report is titled by LEARNING ABOUT
ASSEMBLING OF PCB’s MAINTENECE and PCB Quility Check
(Components Value Check and then assemble at proper location) .
This report is submitted by SAHIL.
Institute Name:- RAO PAHLAD SINGH COLLEGE OF ENGINEERING
and TECHNOLOGY, BALANA, MOHINDERGARH. This Training Report
is done under supervision and guidance of Mr. RAGHAV SAINI (Quility
Engineer) and MR. RITESH SHARMA (Quility Assistant Manager) in
Quility Department .

6. SMT
Surface Mount Technology

7. SMT
Surface Mount Technology

8. SMT
Surface Mount Technology

9. PCB LoaderYJ-LINK
• Auto width adjustment High speed magazine
change Jam detection
• Width synchronization Line control ESD
powder coating (RAL 7035)
• Located at the first stage of SMT line, this unit
transfers PCBs stacked in a magazine rack to
the downstream machine using a pneumatic
pusher one by one.
SMT
Surface Mount Technology

10. PCB CleanerYJ-LINK
• Removes dust and particle on a PCB by sticky
roller and ionizer while being transferred to
next process.
• Options
1. Analog speed controller (1~200mm/sec)
2. Auto width adjustment
3. Width synchronization
4. Line control
5. ESD powder coating (RAL 7035)
SMT
Surface Mount Technology
• Features
1. Touch screen (Operating panel)
2. Tower lamp
3. Manual width adjustment
4. Ionizer
5. SMEMA interface
6. Controlled by PLC

11. Screen Printer GPX-C FUJI
• Solder paste is used to mount the
component which is applied in the screen
printer with the help of stencil
• Solder supply and cleaning can be
automated and the machine was designed
considering work efficiency.
• Reduces the load on operators and
minimizes the work time for changeover
and maintenance.
• It has a sheet of stainless steel with laser cut
opening used to place solder paste on a
PCBA board for SMT components
SMT
Surface Mount Technology

12. SMT
Surface Mount Technology
• SAC= Stanus + Silver +copper are used as soldering paste it have 2
type SAC 305 & SAC 307 which are most commonly used.
• The life of Paste is very low once it opened and have to store it in
low
• temp 2degree to 10 degree C for 4 months.
• Size of stencil varies from
- 3 mil thick
- 4 mil thick
- 5 mil thick( Most commonly used)
- 6 mil thick
• Type of soldering paste
- Type 3 25-45 un
- Type 4 20-35 un
- Type 5 15-35 un
- Type 6 10-30 un

13. Screen Printer Inspection
Konyoung
• It defects error during the solder paste
printing process. We check presence &
alignment /placement
- Height
- Area
- Volume
• In SPI machine we upload data manually ,
while programing, component ID ,PAD ID
X,Y,Z . In order to ensure the desired
amount of solder paste has been deposited
without defects and that the process is
repeatable
SMT
Surface Mount Technology
• There are 2 major solder paste defects
1. Missing pad
2. Excess paste

14. Pick & Place FUJI - NXT 3
In pick and place machine , the nozzle will pick the
component , In each module there are 24 nozzle,
check the component the right component is
mounted on the PCB and the defective component is
placed in drop box
The NEW NXT III Following feature
• Highly productive
• Multi-functional modular placing machine
• Built for speed, a faster XY robot and tape
feeders, as well as a new H24 head that achieves
35,000 chips per hour.
SMT
Surface Mount Technology

15. • It have high-speed head achieves 37,500 cph
(chips per hour) (Productivity priority mode)
per module, a 44% improvement from the
fastest speed of the NXT II.
• By improving machine rigidity and further
refining its independent servo control and
vision recognition technology, Fuji has
achieved a placing accuracy for small chip
parts of +/- 0.025 mm* (3sigma, Cpk≥1.00).
SMT
Surface Mount Technology

16. Reflow oven
1. A reflow oven is a machine used primarily for reflow
soldering of surface mount electronic components to
printed circuit boards .
2. In commercial high-volume use, reflow ovens take
the form of a long tunnel containing a conveyor belt
along which PCBs travel. For prototyping or
hobbyist use PCBs can be placed in a small oven
with a door.
3. Typical reflow profile comprise four distinct
Session
- Pre heat
- Soak
- Reflow
- Cooling
SMT
Surface Mount Technology

17. Reflow oven
SMT
Surface Mount Technology
• Preheat zone – it heat up the board temp
depending on the paste requirement
evaporates off the flux volatiles.(124°C -
179°C)
• Soak zone – acts as flux activation zone
,stabilizes the temp across entire
board(179°C-230°C).
• Reflow zone – temp zone that spent above
liquids(230°C -250°C ).
• Cooling zone - PCBA is cooled from peak temp. to
solidifies , rapid cooling is required to min the
intermetallic and obtain fine grain solder joints(250°C -
47°C ).

18. Automatic Optical Inspection
(Zenitn Lite)
• AOI is an automated visual inspection which
use to defects on PCBA
• It scans PCBAwith cameras and detects 2
type of Failures
1. Catastrophic failures(Missing components )
2. Quality failures
Benefits of using AOI
• Non – contact test method
• Accurately detects a specific category of
programmed defects on
SMT
Surface Mount Technology

19. Automatic Optical Inspection
(Zenitn Lite)
Type of Defects
• Soldering Defects
1. Open circuits
2. Solder bridges
3. Solder Void
4. Solder quality
• Component Defects
1. Lifted lead
2. Missing Component
3. Faulty component
SMT
Surface Mount Technology