A presentation for your cleints who are interested in lead generation for FMCG products.
It includes case studies and pricing for each product type as well as 2 proposals, for a 10K budget and a 20K budget.
Sites database visualization in 3D developed by me using popular mapping platform: Google Earth. Using this popular platform sites database could be accessed easily & interactive by non technical departments
YouCube allows you to map YouTube videos onto an interactive 3D cube and then save it to a database so you can show your friends. As you spin around a YouCube, the sounds of the different videos fade in and out. Its fun!
A presentation for your cleints who are interested in lead generation for FMCG products.
It includes case studies and pricing for each product type as well as 2 proposals, for a 10K budget and a 20K budget.
Sites database visualization in 3D developed by me using popular mapping platform: Google Earth. Using this popular platform sites database could be accessed easily & interactive by non technical departments
YouCube allows you to map YouTube videos onto an interactive 3D cube and then save it to a database so you can show your friends. As you spin around a YouCube, the sounds of the different videos fade in and out. Its fun!
PROGRAM PHASE IN LIGAND-BASED PHARMACOPHORE MODEL GENERATION AND 3D DATABASE ...Simone Brogi
We have applied a novel approach to generate a ligand-based pharmacophore model. The pharmacophore was built from a set of 42 compounds showing activity against MCF-7 cell line derived from human mammary adenocarcinoma, using the program PHASE, implemented in the Schrödinger suite software package. PHASE is a highly flexible system for common pharmacophore identification and assessment and 3D-database creation and searching. The best pharmacophore hypothesis showed five features: two hydrogen-bond acceptors, one hydrogen-bond donor, and two aromatic rings. The structure–activity relationship (SAR) so acquired was applied within PHASE for molecular alignment in a comparative molecular field analysis (CoMFA) 3D-QSAR study. The 3D-QSAR model yielded a test set r2 equal to 0.97 and demonstrated to be highly predictive with respect to an external test set of 18 compounds (r2 =0.93). In summary, in this study we improved a previously developed Catalyst MCF-7 inhibitory pharmacophore, and established a predictive 3D-QSAR model. We have further used this model to detect novel MCF-7 cell line inhibitors through 3D database searching
Minecraft in 500 lines of Python with PygletRichard Donkin
A short walkthrough of some of the code from an impressive 500 line Python game - a simple version of Minecraft, using the Pyglet 3D library. Links to resources for Pyglet and Python gaming generally.
For the full video of this presentation, please visit:
http://www.embedded-vision.com/platinum-members/videantis/embedded-vision-training/videos/pages/may-2015-embedded-vision-summit
For more information about embedded vision, please visit:
http://www.embedded-vision.com
Marco Jacobs, Vice President of Marketing at videantis, presents the "3D from 2D: Theory, Implementation, and Applications of Structure from Motion" tutorial at the May 2015 Embedded Vision Summit.
Structure from motion uses a unique combination of algorithms that extract depth information using a single 2D moving camera. Using a calibrated camera, feature detection, and feature tracking, the algorithms calculate an accurate camera pose and a 3D point cloud representing the surrounding scene.
This 3D scene information can be used in many ways, such as for automated car parking, augmented reality, and positioning. Marco introduces the theory behind structure from motion, provides some representative applications that use it, and explores an efficient implementation for embedded applications.
3D IC Presented by Tripti Kumari, School of Engineering, CUSATthevijayps
A 3D Integrated Circuit is a chip that has active electronic components stacked on one or more layers that are integrated both vertically and horizontally forming a single circuit.
In the 3-D design architecture, an entire chip is divided into a number of blocks, and each block is placed on a separate layer of Si that are stacked on top of each other.
In a generic 3D IC structure, each die is stacked on top of another and communicated by Through-Silicon Vias (TSVs).
Architectural issues
Traditional shared buses do not scale well – bandwidth saturation
Chip IO is pad limited
Physical issues
On-chip Interconnects become increasingly slower w.r.t. logic
IOs are increasingly expensive
Consequences
Performance losses
Power/Energy cost
Design closure issues or infeasibility
Reduced wire length
Total wire length
Larger circuits produce more improvement
Lower power per transistor
Decreased interconnect delay
Higher transistor packing densities
Smaller chip areas
There are four ways to build a 3D IC:
Monolithic
Wafer-on-Wafer
Die-on-Wafer
Die On Die
At runtime, thermal variations will introduce additional time-varying clock skew, further increasing design uncertainty
2 - Thermal Issues In 3-D ICs
Due to reduction in chip size of a 3D implementation, 3D circuits exhibit a sharp increase in power density
Analysis of Thermal problems in 3D is necessary to evaluate thermal robustness of different 3D technology and design options.
3 - Reliability Issues In 3-D ICs
Electro thermal and Thermo-mechanical effects between various active layers can influence electro-migration and chip performance
Die yield issues may arise due to mismatches between die yields of different layers, which affect net yield of 3D chips.
TSV check on reset
Control use dedicated Vias in order to establish which vias are corrupted.
If 1, 2 and 3 TSVs are OK, the control set the enable signal set_to and set_from: broken path are skipped!
Pads routing shift as show in the figure
Need to define The handling protocol during the TSVs check
3D IC design is a relief to interconnect driven IC design.
Still many manufacturing and technological difficulties
Physical Design needs to consider the multiple layers of Silicon available.
Optimization of both temperature and wirelength
Placement and routing algorithms need to be modified
[1] J. Davis, et al., "Interconnect limits on gigascale integration (GSI) in the 21st century," Proceedings of the IEEE , vol.89, no.3, pp.305-324, Mar 2001.
[2] Banerjee, K.; Souri, S.J.; Kapur, P.; Saraswat, K.C.; , "3-D ICs: a novel chip design for improving deep- submicrometer interconnect performance and systems-on-chip integration," Proceedings of the IEEE , vol.89, no.5, pp.602-633, May 2001.
ASM specializes in the Design and Value Engineering, Complex Prototyping, Competitive Manufacturing in the capital process equipment for Semiconductor, Solar and Display verticals. ASM honed its team skills and capabilities to meet current and future requirements with Equipment manufacturers. ASM has robust processes in place for design, documentation control and securing customer’s IP.
Tooltech Global Engineering Pvt. Ltd, one of the first Indian Companies to set up operations in Scandinavia, is a leading Engineering Design and Simulation solutions provider serving marquee European clients.
PROGRAM PHASE IN LIGAND-BASED PHARMACOPHORE MODEL GENERATION AND 3D DATABASE ...Simone Brogi
We have applied a novel approach to generate a ligand-based pharmacophore model. The pharmacophore was built from a set of 42 compounds showing activity against MCF-7 cell line derived from human mammary adenocarcinoma, using the program PHASE, implemented in the Schrödinger suite software package. PHASE is a highly flexible system for common pharmacophore identification and assessment and 3D-database creation and searching. The best pharmacophore hypothesis showed five features: two hydrogen-bond acceptors, one hydrogen-bond donor, and two aromatic rings. The structure–activity relationship (SAR) so acquired was applied within PHASE for molecular alignment in a comparative molecular field analysis (CoMFA) 3D-QSAR study. The 3D-QSAR model yielded a test set r2 equal to 0.97 and demonstrated to be highly predictive with respect to an external test set of 18 compounds (r2 =0.93). In summary, in this study we improved a previously developed Catalyst MCF-7 inhibitory pharmacophore, and established a predictive 3D-QSAR model. We have further used this model to detect novel MCF-7 cell line inhibitors through 3D database searching
Minecraft in 500 lines of Python with PygletRichard Donkin
A short walkthrough of some of the code from an impressive 500 line Python game - a simple version of Minecraft, using the Pyglet 3D library. Links to resources for Pyglet and Python gaming generally.
For the full video of this presentation, please visit:
http://www.embedded-vision.com/platinum-members/videantis/embedded-vision-training/videos/pages/may-2015-embedded-vision-summit
For more information about embedded vision, please visit:
http://www.embedded-vision.com
Marco Jacobs, Vice President of Marketing at videantis, presents the "3D from 2D: Theory, Implementation, and Applications of Structure from Motion" tutorial at the May 2015 Embedded Vision Summit.
Structure from motion uses a unique combination of algorithms that extract depth information using a single 2D moving camera. Using a calibrated camera, feature detection, and feature tracking, the algorithms calculate an accurate camera pose and a 3D point cloud representing the surrounding scene.
This 3D scene information can be used in many ways, such as for automated car parking, augmented reality, and positioning. Marco introduces the theory behind structure from motion, provides some representative applications that use it, and explores an efficient implementation for embedded applications.
3D IC Presented by Tripti Kumari, School of Engineering, CUSATthevijayps
A 3D Integrated Circuit is a chip that has active electronic components stacked on one or more layers that are integrated both vertically and horizontally forming a single circuit.
In the 3-D design architecture, an entire chip is divided into a number of blocks, and each block is placed on a separate layer of Si that are stacked on top of each other.
In a generic 3D IC structure, each die is stacked on top of another and communicated by Through-Silicon Vias (TSVs).
Architectural issues
Traditional shared buses do not scale well – bandwidth saturation
Chip IO is pad limited
Physical issues
On-chip Interconnects become increasingly slower w.r.t. logic
IOs are increasingly expensive
Consequences
Performance losses
Power/Energy cost
Design closure issues or infeasibility
Reduced wire length
Total wire length
Larger circuits produce more improvement
Lower power per transistor
Decreased interconnect delay
Higher transistor packing densities
Smaller chip areas
There are four ways to build a 3D IC:
Monolithic
Wafer-on-Wafer
Die-on-Wafer
Die On Die
At runtime, thermal variations will introduce additional time-varying clock skew, further increasing design uncertainty
2 - Thermal Issues In 3-D ICs
Due to reduction in chip size of a 3D implementation, 3D circuits exhibit a sharp increase in power density
Analysis of Thermal problems in 3D is necessary to evaluate thermal robustness of different 3D technology and design options.
3 - Reliability Issues In 3-D ICs
Electro thermal and Thermo-mechanical effects between various active layers can influence electro-migration and chip performance
Die yield issues may arise due to mismatches between die yields of different layers, which affect net yield of 3D chips.
TSV check on reset
Control use dedicated Vias in order to establish which vias are corrupted.
If 1, 2 and 3 TSVs are OK, the control set the enable signal set_to and set_from: broken path are skipped!
Pads routing shift as show in the figure
Need to define The handling protocol during the TSVs check
3D IC design is a relief to interconnect driven IC design.
Still many manufacturing and technological difficulties
Physical Design needs to consider the multiple layers of Silicon available.
Optimization of both temperature and wirelength
Placement and routing algorithms need to be modified
[1] J. Davis, et al., "Interconnect limits on gigascale integration (GSI) in the 21st century," Proceedings of the IEEE , vol.89, no.3, pp.305-324, Mar 2001.
[2] Banerjee, K.; Souri, S.J.; Kapur, P.; Saraswat, K.C.; , "3-D ICs: a novel chip design for improving deep- submicrometer interconnect performance and systems-on-chip integration," Proceedings of the IEEE , vol.89, no.5, pp.602-633, May 2001.
ASM specializes in the Design and Value Engineering, Complex Prototyping, Competitive Manufacturing in the capital process equipment for Semiconductor, Solar and Display verticals. ASM honed its team skills and capabilities to meet current and future requirements with Equipment manufacturers. ASM has robust processes in place for design, documentation control and securing customer’s IP.
Tooltech Global Engineering Pvt. Ltd, one of the first Indian Companies to set up operations in Scandinavia, is a leading Engineering Design and Simulation solutions provider serving marquee European clients.
SIMPACK - a high-end Multi-body simulation tool, gives you complete insight of Multi-body dynamics. There are quite a few users in India, of which we had a User Meet, to take the Users inputs and to understand their difficulties. User meet will be held every year to understand the progress of our customers. Want to know more about SIMPACK MBD or the solely authorized SIMPACK distributor, feel free to contact us.
In his public lecture, Christian Timmerer provides insights into the fascinating history of video streaming, starting from its humble beginnings before YouTube to the groundbreaking technologies that now dominate platforms like Netflix and ORF ON. Timmerer also presents provocative contributions of his own that have significantly influenced the industry. He concludes by looking at future challenges and invites the audience to join in a discussion.
DevOps and Testing slides at DASA ConnectKari Kakkonen
My and Rik Marselis slides at 30.5.2024 DASA Connect conference. We discuss about what is testing, then what is agile testing and finally what is Testing in DevOps. Finally we had lovely workshop with the participants trying to find out different ways to think about quality and testing in different parts of the DevOps infinity loop.
Pushing the limits of ePRTC: 100ns holdover for 100 daysAdtran
At WSTS 2024, Alon Stern explored the topic of parametric holdover and explained how recent research findings can be implemented in real-world PNT networks to achieve 100 nanoseconds of accuracy for up to 100 days.
Dr. Sean Tan, Head of Data Science, Changi Airport Group
Discover how Changi Airport Group (CAG) leverages graph technologies and generative AI to revolutionize their search capabilities. This session delves into the unique search needs of CAG’s diverse passengers and customers, showcasing how graph data structures enhance the accuracy and relevance of AI-generated search results, mitigating the risk of “hallucinations” and improving the overall customer journey.
Communications Mining Series - Zero to Hero - Session 1DianaGray10
This session provides introduction to UiPath Communication Mining, importance and platform overview. You will acquire a good understand of the phases in Communication Mining as we go over the platform with you. Topics covered:
• Communication Mining Overview
• Why is it important?
• How can it help today’s business and the benefits
• Phases in Communication Mining
• Demo on Platform overview
• Q/A
20 Comprehensive Checklist of Designing and Developing a WebsitePixlogix Infotech
Dive into the world of Website Designing and Developing with Pixlogix! Looking to create a stunning online presence? Look no further! Our comprehensive checklist covers everything you need to know to craft a website that stands out. From user-friendly design to seamless functionality, we've got you covered. Don't miss out on this invaluable resource! Check out our checklist now at Pixlogix and start your journey towards a captivating online presence today.
Epistemic Interaction - tuning interfaces to provide information for AI supportAlan Dix
Paper presented at SYNERGY workshop at AVI 2024, Genoa, Italy. 3rd June 2024
https://alandix.com/academic/papers/synergy2024-epistemic/
As machine learning integrates deeper into human-computer interactions, the concept of epistemic interaction emerges, aiming to refine these interactions to enhance system adaptability. This approach encourages minor, intentional adjustments in user behaviour to enrich the data available for system learning. This paper introduces epistemic interaction within the context of human-system communication, illustrating how deliberate interaction design can improve system understanding and adaptation. Through concrete examples, we demonstrate the potential of epistemic interaction to significantly advance human-computer interaction by leveraging intuitive human communication strategies to inform system design and functionality, offering a novel pathway for enriching user-system engagements.
zkStudyClub - Reef: Fast Succinct Non-Interactive Zero-Knowledge Regex ProofsAlex Pruden
This paper presents Reef, a system for generating publicly verifiable succinct non-interactive zero-knowledge proofs that a committed document matches or does not match a regular expression. We describe applications such as proving the strength of passwords, the provenance of email despite redactions, the validity of oblivious DNS queries, and the existence of mutations in DNA. Reef supports the Perl Compatible Regular Expression syntax, including wildcards, alternation, ranges, capture groups, Kleene star, negations, and lookarounds. Reef introduces a new type of automata, Skipping Alternating Finite Automata (SAFA), that skips irrelevant parts of a document when producing proofs without undermining soundness, and instantiates SAFA with a lookup argument. Our experimental evaluation confirms that Reef can generate proofs for documents with 32M characters; the proofs are small and cheap to verify (under a second).
Paper: https://eprint.iacr.org/2023/1886
Maruthi Prithivirajan, Head of ASEAN & IN Solution Architecture, Neo4j
Get an inside look at the latest Neo4j innovations that enable relationship-driven intelligence at scale. Learn more about the newest cloud integrations and product enhancements that make Neo4j an essential choice for developers building apps with interconnected data and generative AI.
Goodbye Windows 11: Make Way for Nitrux Linux 3.5.0!SOFTTECHHUB
As the digital landscape continually evolves, operating systems play a critical role in shaping user experiences and productivity. The launch of Nitrux Linux 3.5.0 marks a significant milestone, offering a robust alternative to traditional systems such as Windows 11. This article delves into the essence of Nitrux Linux 3.5.0, exploring its unique features, advantages, and how it stands as a compelling choice for both casual users and tech enthusiasts.
GraphSummit Singapore | The Art of the Possible with Graph - Q2 2024Neo4j
Neha Bajwa, Vice President of Product Marketing, Neo4j
Join us as we explore breakthrough innovations enabled by interconnected data and AI. Discover firsthand how organizations use relationships in data to uncover contextual insights and solve our most pressing challenges – from optimizing supply chains, detecting fraud, and improving customer experiences to accelerating drug discoveries.
Building RAG with self-deployed Milvus vector database and Snowpark Container...Zilliz
This talk will give hands-on advice on building RAG applications with an open-source Milvus database deployed as a docker container. We will also introduce the integration of Milvus with Snowpark Container Services.
UiPath Test Automation using UiPath Test Suite series, part 6DianaGray10
Welcome to UiPath Test Automation using UiPath Test Suite series part 6. In this session, we will cover Test Automation with generative AI and Open AI.
UiPath Test Automation with generative AI and Open AI webinar offers an in-depth exploration of leveraging cutting-edge technologies for test automation within the UiPath platform. Attendees will delve into the integration of generative AI, a test automation solution, with Open AI advanced natural language processing capabilities.
Throughout the session, participants will discover how this synergy empowers testers to automate repetitive tasks, enhance testing accuracy, and expedite the software testing life cycle. Topics covered include the seamless integration process, practical use cases, and the benefits of harnessing AI-driven automation for UiPath testing initiatives. By attending this webinar, testers, and automation professionals can gain valuable insights into harnessing the power of AI to optimize their test automation workflows within the UiPath ecosystem, ultimately driving efficiency and quality in software development processes.
What will you get from this session?
1. Insights into integrating generative AI.
2. Understanding how this integration enhances test automation within the UiPath platform
3. Practical demonstrations
4. Exploration of real-world use cases illustrating the benefits of AI-driven test automation for UiPath
Topics covered:
What is generative AI
Test Automation with generative AI and Open AI.
UiPath integration with generative AI
Speaker:
Deepak Rai, Automation Practice Lead, Boundaryless Group and UiPath MVP
Full-RAG: A modern architecture for hyper-personalizationZilliz
Mike Del Balso, CEO & Co-Founder at Tecton, presents "Full RAG," a novel approach to AI recommendation systems, aiming to push beyond the limitations of traditional models through a deep integration of contextual insights and real-time data, leveraging the Retrieval-Augmented Generation architecture. This talk will outline Full RAG's potential to significantly enhance personalization, address engineering challenges such as data management and model training, and introduce data enrichment with reranking as a key solution. Attendees will gain crucial insights into the importance of hyperpersonalization in AI, the capabilities of Full RAG for advanced personalization, and strategies for managing complex data integrations for deploying cutting-edge AI solutions.
3. PROJECT MANAGEMENT
3D PRODUCT
DEVELOPMENT
COMPUTER AIDED
ENGINEERING
RAPID DATABASE
PROTOTYPING
PROJECT ASSISTED
BY COMPUTER
RAPID
TOOLING
ALUMINIUM AND
STEEL MOLDS
CONTROL
GAUGES
ROBOTIC AND
AUTOMATION
PART
PRODUCTION
PARTS
ASSEMBLY
LOGISTICS
8. COMPUTER AIDED ENGINEERING
When involved at the earliest stage of design, IBEROMOLDES can
help you to optimize product design and time-to-market :
FLOW ANALYSIS CINEMATIC ANIMATION
FUNCTIONAL CHECK
FINITE ELEMENT ANALYSIS
9. RAPID PROTOTYPING
Engineering and marketing prototypes of the highest quality.
We are able to provide all types of functional prototypes, produced by
HSC MILLING, SLS, SLA, LOM, etc.