Sysinfo3D
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Sites database visualization in 3D developed by me using popular mapping platform: Google Earth. Using this popular platform sites database could be accessed easily & interactive by non technical departments
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Analyze database system using a 3 d method
OTNYathra, Mumbai (19th Feb 2015) & Bangalore (25th Feb 2015), India,
PROGRAM PHASE IN LIGAND-BASED PHARMACOPHORE MODEL GENERATION AND 3D DATABASE ...
We have applied a novel approach to generate a ligand-based pharmacophore model. The pharmacophore was built from a set of 42 compounds showing activity against MCF-7 cell line derived from human mammary adenocarcinoma, using the program PHASE, implemented in the Schrödinger suite software package. PHASE is a highly flexible system for common pharmacophore identification and assessment and 3D-database creation and searching. The best pharmacophore hypothesis showed five features: two hydrogen-bond acceptors, one hydrogen-bond donor, and two aromatic rings. The structure–activity relationship (SAR) so acquired was applied within PHASE for molecular alignment in a comparative molecular field analysis (CoMFA) 3D-QSAR study. The 3D-QSAR model yielded a test set r2 equal to 0.97 and demonstrated to be highly predictive with respect to an external test set of 18 compounds (r2 =0.93). In summary, in this study we improved a previously developed Catalyst MCF-7 inhibitory pharmacophore, and established a predictive 3D-QSAR model. We have further used this model to detect novel MCF-7 cell line inhibitors through 3D database searching
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"3D from 2D: Theory, Implementation, and Applications of Structure from Motio...
"3D from 2D: Theory, Implementation, and Applications of Structure from Motio...Edge AI and Vision Alliance
For the full video of this presentation, please visit:
http://www.embedded-vision.com/platinum-members/videantis/embedded-vision-training/videos/pages/may-2015-embedded-vision-summit
For more information about embedded vision, please visit:
http://www.embedded-vision.com
Marco Jacobs, Vice President of Marketing at videantis, presents the "3D from 2D: Theory, Implementation, and Applications of Structure from Motion" tutorial at the May 2015 Embedded Vision Summit.
Structure from motion uses a unique combination of algorithms that extract depth information using a single 2D moving camera. Using a calibrated camera, feature detection, and feature tracking, the algorithms calculate an accurate camera pose and a 3D point cloud representing the surrounding scene.
This 3D scene information can be used in many ways, such as for automated car parking, augmented reality, and positioning. Marco introduces the theory behind structure from motion, provides some representative applications that use it, and explores an efficient implementation for embedded applications.3D IC Presented by Tripti Kumari, School of Engineering, CUSAT
A 3D Integrated Circuit is a chip that has active electronic components stacked on one or more layers that are integrated both vertically and horizontally forming a single circuit.
In the 3-D design architecture, an entire chip is divided into a number of blocks, and each block is placed on a separate layer of Si that are stacked on top of each other.
In a generic 3D IC structure, each die is stacked on top of another and communicated by Through-Silicon Vias (TSVs).
Architectural issues
Traditional shared buses do not scale well – bandwidth saturation
Chip IO is pad limited
Physical issues
On-chip Interconnects become increasingly slower w.r.t. logic
IOs are increasingly expensive
Consequences
Performance losses
Power/Energy cost
Design closure issues or infeasibility
Reduced wire length
Total wire length
Larger circuits produce more improvement
Lower power per transistor
Decreased interconnect delay
Higher transistor packing densities
Smaller chip areas
There are four ways to build a 3D IC:
Monolithic
Wafer-on-Wafer
Die-on-Wafer
Die On Die
At runtime, thermal variations will introduce additional time-varying clock skew, further increasing design uncertainty
2 - Thermal Issues In 3-D ICs
Due to reduction in chip size of a 3D implementation, 3D circuits exhibit a sharp increase in power density
Analysis of Thermal problems in 3D is necessary to evaluate thermal robustness of different 3D technology and design options.
3 - Reliability Issues In 3-D ICs
Electro thermal and Thermo-mechanical effects between various active layers can influence electro-migration and chip performance
Die yield issues may arise due to mismatches between die yields of different layers, which affect net yield of 3D chips.
TSV check on reset
Control use dedicated Vias in order to establish which vias are corrupted.
If 1, 2 and 3 TSVs are OK, the control set the enable signal set_to and set_from: broken path are skipped!
Pads routing shift as show in the figure
Need to define The handling protocol during the TSVs check
3D IC design is a relief to interconnect driven IC design.
Still many manufacturing and technological difficulties
Physical Design needs to consider the multiple layers of Silicon available.
Optimization of both temperature and wirelength
Placement and routing algorithms need to be modified
[1] J. Davis, et al., "Interconnect limits on gigascale integration (GSI) in the 21st century," Proceedings of the IEEE , vol.89, no.3, pp.305-324, Mar 2001.
[2] Banerjee, K.; Souri, S.J.; Kapur, P.; Saraswat, K.C.; , "3-D ICs: a novel chip design for improving deep- submicrometer interconnect performance and systems-on-chip integration," Proceedings of the IEEE , vol.89, no.5, pp.602-633, May 2001.
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OTNYathra, Mumbai (19th Feb 2015) & Bangalore (25th Feb 2015), India,
PROGRAM PHASE IN LIGAND-BASED PHARMACOPHORE MODEL GENERATION AND 3D DATABASE ...
We have applied a novel approach to generate a ligand-based pharmacophore model. The pharmacophore was built from a set of 42 compounds showing activity against MCF-7 cell line derived from human mammary adenocarcinoma, using the program PHASE, implemented in the Schrödinger suite software package. PHASE is a highly flexible system for common pharmacophore identification and assessment and 3D-database creation and searching. The best pharmacophore hypothesis showed five features: two hydrogen-bond acceptors, one hydrogen-bond donor, and two aromatic rings. The structure–activity relationship (SAR) so acquired was applied within PHASE for molecular alignment in a comparative molecular field analysis (CoMFA) 3D-QSAR study. The 3D-QSAR model yielded a test set r2 equal to 0.97 and demonstrated to be highly predictive with respect to an external test set of 18 compounds (r2 =0.93). In summary, in this study we improved a previously developed Catalyst MCF-7 inhibitory pharmacophore, and established a predictive 3D-QSAR model. We have further used this model to detect novel MCF-7 cell line inhibitors through 3D database searching
Minecraft in 500 lines of Python with Pyglet
A short walkthrough of some of the code from an impressive 500 line Python game - a simple version of Minecraft, using the Pyglet 3D library. Links to resources for Pyglet and Python gaming generally.
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Application of 3D printing in analytical chemistry (by Fariborz Amoozgar)Iranian Spase Research Center (ISRC)
"3D from 2D: Theory, Implementation, and Applications of Structure from Motio...
"3D from 2D: Theory, Implementation, and Applications of Structure from Motio...Edge AI and Vision Alliance
For the full video of this presentation, please visit:
http://www.embedded-vision.com/platinum-members/videantis/embedded-vision-training/videos/pages/may-2015-embedded-vision-summit
For more information about embedded vision, please visit:
http://www.embedded-vision.com
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Structure from motion uses a unique combination of algorithms that extract depth information using a single 2D moving camera. Using a calibrated camera, feature detection, and feature tracking, the algorithms calculate an accurate camera pose and a 3D point cloud representing the surrounding scene.
This 3D scene information can be used in many ways, such as for automated car parking, augmented reality, and positioning. Marco introduces the theory behind structure from motion, provides some representative applications that use it, and explores an efficient implementation for embedded applications.3D IC Presented by Tripti Kumari, School of Engineering, CUSAT
A 3D Integrated Circuit is a chip that has active electronic components stacked on one or more layers that are integrated both vertically and horizontally forming a single circuit.
In the 3-D design architecture, an entire chip is divided into a number of blocks, and each block is placed on a separate layer of Si that are stacked on top of each other.
In a generic 3D IC structure, each die is stacked on top of another and communicated by Through-Silicon Vias (TSVs).
Architectural issues
Traditional shared buses do not scale well – bandwidth saturation
Chip IO is pad limited
Physical issues
On-chip Interconnects become increasingly slower w.r.t. logic
IOs are increasingly expensive
Consequences
Performance losses
Power/Energy cost
Design closure issues or infeasibility
Reduced wire length
Total wire length
Larger circuits produce more improvement
Lower power per transistor
Decreased interconnect delay
Higher transistor packing densities
Smaller chip areas
There are four ways to build a 3D IC:
Monolithic
Wafer-on-Wafer
Die-on-Wafer
Die On Die
At runtime, thermal variations will introduce additional time-varying clock skew, further increasing design uncertainty
2 - Thermal Issues In 3-D ICs
Due to reduction in chip size of a 3D implementation, 3D circuits exhibit a sharp increase in power density
Analysis of Thermal problems in 3D is necessary to evaluate thermal robustness of different 3D technology and design options.
3 - Reliability Issues In 3-D ICs
Electro thermal and Thermo-mechanical effects between various active layers can influence electro-migration and chip performance
Die yield issues may arise due to mismatches between die yields of different layers, which affect net yield of 3D chips.
TSV check on reset
Control use dedicated Vias in order to establish which vias are corrupted.
If 1, 2 and 3 TSVs are OK, the control set the enable signal set_to and set_from: broken path are skipped!
Pads routing shift as show in the figure
Need to define The handling protocol during the TSVs check
3D IC design is a relief to interconnect driven IC design.
Still many manufacturing and technological difficulties
Physical Design needs to consider the multiple layers of Silicon available.
Optimization of both temperature and wirelength
Placement and routing algorithms need to be modified
[1] J. Davis, et al., "Interconnect limits on gigascale integration (GSI) in the 21st century," Proceedings of the IEEE , vol.89, no.3, pp.305-324, Mar 2001.
[2] Banerjee, K.; Souri, S.J.; Kapur, P.; Saraswat, K.C.; , "3-D ICs: a novel chip design for improving deep- submicrometer interconnect performance and systems-on-chip integration," Proceedings of the IEEE , vol.89, no.5, pp.602-633, May 2001.
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Sysinfo3D
- 1. Sysinfo3D®: Sites Database in 3D
- 2. RealHeight: each sector represented in actual height
- 3. RealTilt: each sector displayed according its total tilt
- 4. VerticalBeamwidth: view touch down point of antenna main lobe
- 5. ViewSite: site detailed model with its actual condition