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IKB06N60T
TRENCHSTOP™ Series p
IFAG IPC TD VLS 1 Rev. 2.5 20.09.2013
Low Loss DuoPack : IGBT in TRENCHSTOP™ and Fieldstop technology with soft,
fast recovery anti-parallel Emitter Controlled HE diode
Features
 Very low VCE(sat) 1.5V (typ.)
 Maximum Junction Temperature 175°C
 Short circuit withstand time 5s
 Designed for frequency inverters for washing machines, fans, pumps and
vacuum cleaners
 TRENCHSTOP™ and Fieldstop technology for 600V applications offers :
- very tight parameter distribution
- high ruggedness, temperature stable behavior
- very high switching speed
 Low EMI
 Qualified according to JEDEC1
for target applications
 Pb-free lead plating; RoHS compliant
 Complete product spectrum and PSpice Models : http://www.infineon.com/igbt/
Type VCE IC;Tc=100°C VCE(sat),Tj=25°C Tj,max Marking Package
IKB06N60T 600V 6A 1.5V 175C K06T60 PG-TO263-3
Maximum Ratings
Parameter Symbol Value Unit
Collector-emitter voltage, Tj ≥ 25C VC E 600 V
DC collector current, limited by Tjmax
TC = 25C
TC = 100C
IC 12
6
A
Pulsed collector current, tp limited by Tjmax ICp ul s 18
Turn off safe operating area, VCE = 600V, Tj = 175C, tp = 1µs - 18
Diode forward current, limited by Tjmax
TC = 25C
TC = 100C
IF 12
6
Diode pulsed current, tp limited by Tjmax IFp ul s 18
Gate-emitter voltage VG E 20 V
Short circuit withstand time
2)
VGE = 15V, VCC  400V, Tj  150C
tSC 5 s
Power dissipation
TC = 25C
Pt ot 88 W
Operating junction temperature Tj -40...+175
CStorage temperature Tst g -55...+150
Soldering temperature (reflow soldering, MSL1) 260
1
J-STD-020 and JESD-022
2)
Allowed number of short circuits: <1000; time between short circuits: >1s.
G
C
E
PG-TO263-3
IKB06N60T
TRENCHSTOP™ Series p
IFAG IPC TD VLS 2 Rev. 2.5 20.09.2013
Thermal Resistance
Parameter Symbol Conditions Max. Value Unit
Characteristic
IGBT thermal resistance,
junction – case
Rt hJC 1.7 K/W
Diode thermal resistance,
junction – case
Rt hJC D 2.6
Thermal resistance,
junction – ambient
Rt hJA 62
Thermal resistance,
junction – ambient
Rt hJA Footprint
6cm² Cu
65
40
Electrical Characteristic, at Tj = 25 C, unless otherwise specified
Parameter Symbol Conditions
Value
Unit
min. typ. max.
Static Characteristic
Collector-emitter breakdown voltage V( BR )C ES VG E =0V,
IC =0.25mA
600 - - V
Collector-emitter saturation voltage VC E( sat ) VG E = 15V, IC =6A
Tj =25C
Tj =175C
-
-
1.5
1.8
2.05
Diode forward voltage VF VG E =0V, IF =6A
Tj =25C
Tj =175C
-
-
1.6
1.6
2.05
-
Gate-emitter threshold voltage VG E( t h) IC =0.18mA,
VC E =VG E
4.1 4.6 5.7
Zero gate voltage collector current ICE S VC E =600V,
VG E =0V
Tj =25C
Tj =175C
-
-
-
-
40
700
µA
Gate-emitter leakage current IGE S VC E =0V,VG E =20V - - 100 nA
Transconductance gfs VC E =20V, IC =6A - 3.6 - S
Integrated gate resistor RG int none Ω
Dynamic Characteristic
Input capacitance Ci ss VC E =25V,
VG E =0V,
f=1MHz
- 368 - pF
Output capacitance Cos s - 28 -
Reverse transfer capacitance Crs s - 11 -
Gate charge QGat e VC C =480V, IC =6A
VG E =15V
- 42 - nC
Internal emitter inductance
measured 5mm (0.197 in.) from case
LE - 7 - nH
Short circuit collector current
1)
IC( SC ) VG E =15V,tSC5s
VC C = 400V,
Tj = 25C
- 55 - A
1)
Allowed number of short circuits: <1000; time between short circuits: >1s.
IKB06N60T
TRENCHSTOP™ Series p
IFAG IPC TD VLS 3 Rev. 2.5 20.09.2013
Switching Characteristic, Inductive Load, at Tj=25 C
Parameter Symbol Conditions
Value
Unit
min. typ. max.
IGBT Characteristic
Turn-on delay time td( o n) Tj=25C,
VC C =400V,IC =6A,
VG E =0/15V,rG =23,
L=60nH,C =40pF
L, C from Fig. E
Energy losses include
“tail” and diode reverse
recovery.
- 9 - ns
Rise time tr - 6 -
Turn-off delay time td( of f) - 130 -
Fall time tf - 58 -
Turn-on energy Eo n - 0.09 - mJ
Turn-off energy Eo ff - 0.11 -
Total switching energy Et s - 0.2 -
Anti-Parallel Diode Characteristic
Diode reverse recovery time trr Tj =25C,
VR =400V, IF =6A,
diF/dt=550A/s
- 123 - ns
Diode reverse recovery charge Qrr - 190 - nC
Diode peak reverse recovery current Irr m - 5.3 - A
Diode peak rate of fall of reverse
recovery current during tb
dirr /dt - 450 - A/s
Switching Characteristic, Inductive Load, at Tj=175 C
Parameter Symbol Conditions
Value
Unit
min. typ. max.
IGBT Characteristic
Turn-on delay time td( o n) Tj=175C,
VC C =400V,IC =6A,
VG E =0/15V,rG =23,
L=60nH,C =40pF
L, C from Fig. E
Energy losses include
“tail” and diode reverse
recovery.
- 9 - ns
Rise time tr - 8 -
Turn-off delay time td( of f) - 165 -
Fall time tf - 84 -
Turn-on energy Eo n - 0.14 - mJ
Turn-off energy Eo ff - 0.18 -
Total switching energy Et s - 0.335 -
Anti-Parallel Diode Characteristic
Diode reverse recovery time trr Tj =175C
VR =400V, IF =6A,
diF/dt=550A/s
- 180 - ns
Diode reverse recovery charge Qrr - 500 - nC
Diode peak reverse recovery current Irr m - 7.6 - A
Diode peak rate of fall of reverse
recovery current during tb
dirr /dt - 285 - A/s
IKB06N60T
TRENCHSTOP™ Series p
IFAG IPC TD VLS 4 Rev. 2.5 20.09.2013
IC,COLLECTORCURRENT
100Hz 1kHz 10kHz 100kHz
0A
3A
6A
9A
12A
15A
18A
TC
=110°C
TC
=80°C
IC,COLLECTORCURRENT
1V 10V 100V 1000V
0,1A
1A
10A
5µs
DC
10µs
tp
=1µs
50µs
5ms
500µs
f, SWITCHING FREQUENCY VCE, COLLECTOR-EMITTER VOLTAGE
Figure 1. Collector current as a function of
switching frequency
(Tj  175C, D = 0.5, VCE = 400V,
VGE = 0/15V, rG = 23)
Figure 2. Safe operating area
(D = 0, TC = 25C,
Tj 175C;VGE=0/15V)
Ptot,POWERDISSIPATION
25°C 50°C 75°C 100°C 125°C 150°C
0W
20W
40W
60W
80W
IC,COLLECTORCURRENT
25°C 75°C 125°C
0A
5A
10A
15A
TC, CASE TEMPERATURE TC, CASE TEMPERATURE
Figure 3. Power dissipation as a function of
case temperature
(Tj  175C)
Figure 4. Collector current as a function of
case temperature
(VGE  15V, Tj  175C)
Ic
Ic
IKB06N60T
TRENCHSTOP™ Series p
IFAG IPC TD VLS 5 Rev. 2.5 20.09.2013
IC,COLLECTORCURRENT
0V 1V 2V 3V
0A
3A
6A
9A
12A
15A
15V
7V
9V
11V
13V
VGE
=20V
IC,COLLECTORCURRENT
0V 1V 2V 3V
0A
3A
6A
9A
12A
15A
15V
7V
9V
11V
13V
VGE
=20V
VCE, COLLECTOR-EMITTER VOLTAGE VCE, COLLECTOR-EMITTER VOLTAGE
Figure 5. Typical output characteristic
(Tj = 25°C)
Figure 6. Typical output characteristic
(Tj = 175°C)
IC,COLLECTORCURRENT
0V 2V 4V 6V 8V 10V
0A
3A
6A
9A
12A
15A
25°C
TJ
=175°C
VCE(sat),COLLECTOR-EMITTSATURATIONVOLTAGE
-50°C 0°C 50°C 100°C
0,0V
0,5V
1,0V
1,5V
2,0V
2,5V
IC
=6A
IC
=12A
IC
=3A
VGE, GATE-EMITTER VOLTAGE TJ, JUNCTION TEMPERATURE
Figure 7. Typical transfer characteristic
(VCE=20V)
Figure 8. Typical collector-emitter
saturation voltage as a function of
junction temperature
(VGE = 15V)
IKB06N60T
TRENCHSTOP™ Series p
IFAG IPC TD VLS 6 Rev. 2.5 20.09.2013
t,SWITCHINGTIMES
0A 3A 6A 9A 12A 15A
1ns
10ns
100ns
tr
td(on)
tf
td(off)
t,SWITCHINGTIMES
    
1ns
10ns
100ns
tf
tr
td(off)
td(on)
IC, COLLECTOR CURRENT RG, GATE RESISTOR
Figure 9. Typical switching times as a
function of collector current
(inductive load, TJ=175°C,
VCE = 400V, VGE = 0/15V, rG = 23Ω,
Dynamic test circuit in Figure E)
Figure 10. Typical switching times as a
function of gate resistor
(inductive load, TJ=175°C,
VCE = 400V, VGE = 0/15V, IC = 6A,
Dynamic test circuit in Figure E)
t,SWITCHINGTIMES
50°C 100°C 150°C
1ns
10ns
100ns
tr
tf
td(on)
td(off)
VGE(th),GATE-EMITTTRSHOLDVOLTAGE
-50°C 0°C 50°C 100°C 150°C
0V
1V
2V
3V
4V
5V
6V
min.
typ.
max.
TJ, JUNCTION TEMPERATURE TJ, JUNCTION TEMPERATURE
Figure 11. Typical switching times as a
function of junction temperature
(inductive load, VCE = 400V,
VGE = 0/15V, IC = 6A, rG = 23Ω,
Dynamic test circuit in Figure E)
Figure 12. Gate-emitter threshold voltage as
a function of junction temperature
(IC = 0.18mA)
IKB06N60T
TRENCHSTOP™ Series p
IFAG IPC TD VLS 7 Rev. 2.5 20.09.2013
E,SWITCHINGENERGYLOSSES
0A 2A 4A 6A 8A 10A0,0 mJ
0,1 mJ
0,2 mJ
0,3 mJ
0,4 mJ
0,5 mJ
0,6 mJ
Ets
*
Eon
*
*) Eon
and Ets
include losses
due to diode recovery
Eoff
E,SWITCHINGENERGYLOSSES
   
0,0 mJ
0,1 mJ
0,2 mJ
0,3 mJ
0,4 mJ
Ets
*
Eon
*
*) Eon
and Ets
include losses
due to diode recovery
Eoff
IC, COLLECTOR CURRENT RG, GATE RESISTOR
Figure 13. Typical switching energy losses
as a function of collector current
(inductive load, TJ=175°C,
VCE=400V, VGE=0/15V, rG=23Ω,
Dynamic test circuit in Figure E)
Figure 14. Typical switching energy losses
as a function of gate resistor
(inductive load, TJ=175°C,
VCE = 400V, VGE = 0/15V, IC = 6A,
Dynamic test circuit in Figure E)
E,SWITCHINGENERGYLOSSES
50°C 100°C 150°C
0,0mJ
0,1mJ
0,2mJ
0,3mJ
0,4mJ
Ets
*
Eon
*
*) Eon
and Ets
include losses
due to diode recovery
Eoff
E,SWITCHINGENERGYLOSSES
200V 300V 400V 500V
0,0mJ
0,1mJ
0,2mJ
0,3mJ
0,4mJ
0,5mJ
Ets
*
Eon
*
*) Eon
and Ets
include losses
due to diode recovery
Eoff
TJ, JUNCTION TEMPERATURE VCE, COLLECTOR-EMITTER VOLTAGE
Figure 15. Typical switching energy losses
as a function of junction
temperature
(inductive load, VCE=400V,
VGE = 0/15V, IC = 6A, rG = 23Ω,
Dynamic test circuit in Figure E)
Figure 16. Typical switching energy losses
as a function of collector emitter
voltage
(inductive load, TJ = 175°C,
VGE = 0/15V, IC = 6A, rG = 23Ω,
Dynamic test circuit in Figure E)
IKB06N60T
TRENCHSTOP™ Series p
IFAG IPC TD VLS 8 Rev. 2.5 20.09.2013
VGE,GATE-EMITTERVOLTAGE
0nC 10nC 20nC 30nC 40nC 50nC
0V
5V
10V
15V
480V
120V
c,CAPACITANCE
0V 10V 20V
10pF
100pF
1nF
Crss
Coss
Ciss
QGE, GATE CHARGE VCE, COLLECTOR-EMITTER VOLTAGE
Figure 17. Typical gate charge
(IC = 6 A)
Figure 18. Typical capacitance as a function
of collector-emitter voltage
(VGE=0V, f = 1 MHz)
IC(sc),shortcircuitCOLLECTORCURRENT
12V 14V 16V 18V
0A
20A
40A
60A
80A
tSC,SHORTCIRCUITWITHSTANDTIME
10V 11V 12V 13V 14V
0µs
2µs
4µs
6µs
8µs
10µs
12µs
VGE, GATE-EMITTETR VOLTAGE VGE, GATE-EMITETR VOLTAGE
Figure 19. Typical short circuit collector
current as a function of gate-
emitter voltage
(VCE  400V, Tj  150C)
Figure 20. Short circuit withstand time as a
function of gate-emitter voltage
(VCE=400V, start at TJ=25°C,
TJmax<150°C)
IKB06N60T
TRENCHSTOP™ Series p
IFAG IPC TD VLS 9 Rev. 2.5 20.09.2013
ZthJC,TRANSIENTTHERMALIMPEDANCE
1µs 10µs 100µs 1ms 10ms 100ms
10
-2
K/W
10
-1
K/W
10
0
K/W
single pulse
0.01
0.02
0.05
0.1
0.2
D=0.5
ZthJC,TRANSIENTTHERMALIMPEDANCE
1µs 10µs 100µs 1ms 10ms 100ms
10
-2
K/W
10
-1
K/W
10
0
K/W
single pulse
0.01
0.02
0.05
0.1
0.2
D=0.5
tP, PULSE WIDTH tP, PULSE WIDTH
Figure 21. IGBT transient thermal
impedance
(D = tp / T)
Figure 22. Diode transient thermal
impedance as a function of pulse
width
(D=tP/T)
trr,REVERSERECOVERYTIME
200A/µs 400A/µs 600A/µs 800A/µs
0ns
50ns
100ns
150ns
200ns
250ns
TJ
=25°C
TJ
=175°C
Qrr,REVERSERECOVERYCHARGE
200A/µs 400A/µs 600A/µs 800A/µs
0,0µC
0,1µC
0,2µC
0,3µC
0,4µC
0,5µC
TJ
=25°C
TJ
=175°C
diF/dt, DIODE CURRENT SLOPE diF/dt, DIODE CURRENT SLOPE
Figure 23. Typical reverse recovery time as
a function of diode current slope
(VR = 400V, IF = 6A,
Dynamic test circuit in Figure E)
Figure 24. Typical reverse recovery charge
as a function of diode current
slope
(VR=400V, IF=6 A,
Dynamic test circuit in Figure E)
R , ( K / W )  , ( s )  
0.3837 5.047*10-2
0.4533 4.758*10-3
0.5877 4.965*10-4
0.2483 4.717*10-5
C1 =1 /R1
R1 R2
C2 =2 /R2
R , ( K / W )  , ( s )  
0.2520 4.849*10-2
0.4578 1.014*10-2
1.054 1.309*10-3
0.7822 1.343*10-4
C1 =1 /R1
R1 R2
C2 =2 /R2
IKB06N60T
TRENCHSTOP™ Series p
IFAG IPC TD VLS 10 Rev. 2.5 20.09.2013
Irr,REVERSERECOVERYCURRENT
200A/µs 400A/µs 600A/µs 800A/µs
0A
2A
4A
6A
8A
TJ
=25°C
TJ
=175°C
dirr/dt,DIODEPEAKRATEOFFALL
OFREVERSERECOVERYCURRENT
200A/µs 400A/µs 600A/µs 800A/µs
0A/µs
-100A/µs
-200A/µs
-300A/µs
-400A/µs
-500A/µs
TJ
=25°C
TJ
=175°C
diF/dt, DIODE CURRENT SLOPE diF/dt, DIODE CURRENT SLOPE
Figure 25. Typical reverse recovery current
as a function of diode current
slope
(VR = 400V, IF = 6A,
Dynamic test circuit in Figure E)
Figure 26. Typical diode peak rate of fall of
reverse recovery current as a
function of diode current slope
(VR = 400V, IF = 6A,
Dynamic test circuit in Figure E)
IF,FORWARDCURRENT
0V 1V 2V
0A
2A
4A
6A
8A
10A
25°C
TJ
=175°C
VF,FORWARDVOLTAGE
0°C 50°C 100°C 150°C
0,0V
0,5V
1,0V
1,5V
2,0V
6A
IF
=12A
3A
VF, FORWARD VOLTAGE TJ, JUNCTION TEMPERATURE
Figure 27. Typical diode forward current as
a function of forward voltage
Figure 28. Typical diode forward voltage as a
function of junction temperature
IKB06N60T
TRENCHSTOP™ Series p
IFAG IPC TD VLS 11 Rev. 2.5 20.09.2013
PG-TO263-3
IKB06N60T
TRENCHSTOP™ Series p
IFAG IPC TD VLS 12 Rev. 2.5 20.09.2013
Ir r m
90% Ir r m
10% Ir r m
di /dtF
tr r
IF
i,v
tQS
QF
tS
tF
VR
di /dtr r
Q =Q Qr r S F
+
t =t tr r S F
+
Figure C. Definition of diodes
switching characteristics
p(t)
1 2 n
T (t)j
1
1
2
2
n
n

TC
r r
r
r
rr
Figure D. Thermal equivalent
circuit
Figure A. Definition of switching times
Figure B. Definition of switching losses
IKB06N60T
TRENCHSTOP™ Series p
IFAG IPC TD VLS 13 Rev. 2.5 20.09.2013
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2013 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or
any information regarding the application of the device, Infineon Technologies hereby disclaims any and all
warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual
property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the
types in question, please contact the nearest Infineon Technologies Office.
The Infineon Technologies component described in this Data Sheet may be used in life-support devices or
systems and/or automotive, aviation and aerospace applications or systems only with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the
failure of that life-support, automotive, aviation and aerospace device or system or to affect the safety or
effectiveness of that device or system. Life support devices or systems are intended to be implanted in the
human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable
to assume that the health of the user or other persons may be endangered.

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Original IGBT IKB06N60T K06T60 06T60 06N60 6N60 TO-263 New Infineon

  • 1. IKB06N60T TRENCHSTOP™ Series p IFAG IPC TD VLS 1 Rev. 2.5 20.09.2013 Low Loss DuoPack : IGBT in TRENCHSTOP™ and Fieldstop technology with soft, fast recovery anti-parallel Emitter Controlled HE diode Features  Very low VCE(sat) 1.5V (typ.)  Maximum Junction Temperature 175°C  Short circuit withstand time 5s  Designed for frequency inverters for washing machines, fans, pumps and vacuum cleaners  TRENCHSTOP™ and Fieldstop technology for 600V applications offers : - very tight parameter distribution - high ruggedness, temperature stable behavior - very high switching speed  Low EMI  Qualified according to JEDEC1 for target applications  Pb-free lead plating; RoHS compliant  Complete product spectrum and PSpice Models : http://www.infineon.com/igbt/ Type VCE IC;Tc=100°C VCE(sat),Tj=25°C Tj,max Marking Package IKB06N60T 600V 6A 1.5V 175C K06T60 PG-TO263-3 Maximum Ratings Parameter Symbol Value Unit Collector-emitter voltage, Tj ≥ 25C VC E 600 V DC collector current, limited by Tjmax TC = 25C TC = 100C IC 12 6 A Pulsed collector current, tp limited by Tjmax ICp ul s 18 Turn off safe operating area, VCE = 600V, Tj = 175C, tp = 1µs - 18 Diode forward current, limited by Tjmax TC = 25C TC = 100C IF 12 6 Diode pulsed current, tp limited by Tjmax IFp ul s 18 Gate-emitter voltage VG E 20 V Short circuit withstand time 2) VGE = 15V, VCC  400V, Tj  150C tSC 5 s Power dissipation TC = 25C Pt ot 88 W Operating junction temperature Tj -40...+175 CStorage temperature Tst g -55...+150 Soldering temperature (reflow soldering, MSL1) 260 1 J-STD-020 and JESD-022 2) Allowed number of short circuits: <1000; time between short circuits: >1s. G C E PG-TO263-3
  • 2. IKB06N60T TRENCHSTOP™ Series p IFAG IPC TD VLS 2 Rev. 2.5 20.09.2013 Thermal Resistance Parameter Symbol Conditions Max. Value Unit Characteristic IGBT thermal resistance, junction – case Rt hJC 1.7 K/W Diode thermal resistance, junction – case Rt hJC D 2.6 Thermal resistance, junction – ambient Rt hJA 62 Thermal resistance, junction – ambient Rt hJA Footprint 6cm² Cu 65 40 Electrical Characteristic, at Tj = 25 C, unless otherwise specified Parameter Symbol Conditions Value Unit min. typ. max. Static Characteristic Collector-emitter breakdown voltage V( BR )C ES VG E =0V, IC =0.25mA 600 - - V Collector-emitter saturation voltage VC E( sat ) VG E = 15V, IC =6A Tj =25C Tj =175C - - 1.5 1.8 2.05 Diode forward voltage VF VG E =0V, IF =6A Tj =25C Tj =175C - - 1.6 1.6 2.05 - Gate-emitter threshold voltage VG E( t h) IC =0.18mA, VC E =VG E 4.1 4.6 5.7 Zero gate voltage collector current ICE S VC E =600V, VG E =0V Tj =25C Tj =175C - - - - 40 700 µA Gate-emitter leakage current IGE S VC E =0V,VG E =20V - - 100 nA Transconductance gfs VC E =20V, IC =6A - 3.6 - S Integrated gate resistor RG int none Ω Dynamic Characteristic Input capacitance Ci ss VC E =25V, VG E =0V, f=1MHz - 368 - pF Output capacitance Cos s - 28 - Reverse transfer capacitance Crs s - 11 - Gate charge QGat e VC C =480V, IC =6A VG E =15V - 42 - nC Internal emitter inductance measured 5mm (0.197 in.) from case LE - 7 - nH Short circuit collector current 1) IC( SC ) VG E =15V,tSC5s VC C = 400V, Tj = 25C - 55 - A 1) Allowed number of short circuits: <1000; time between short circuits: >1s.
  • 3. IKB06N60T TRENCHSTOP™ Series p IFAG IPC TD VLS 3 Rev. 2.5 20.09.2013 Switching Characteristic, Inductive Load, at Tj=25 C Parameter Symbol Conditions Value Unit min. typ. max. IGBT Characteristic Turn-on delay time td( o n) Tj=25C, VC C =400V,IC =6A, VG E =0/15V,rG =23, L=60nH,C =40pF L, C from Fig. E Energy losses include “tail” and diode reverse recovery. - 9 - ns Rise time tr - 6 - Turn-off delay time td( of f) - 130 - Fall time tf - 58 - Turn-on energy Eo n - 0.09 - mJ Turn-off energy Eo ff - 0.11 - Total switching energy Et s - 0.2 - Anti-Parallel Diode Characteristic Diode reverse recovery time trr Tj =25C, VR =400V, IF =6A, diF/dt=550A/s - 123 - ns Diode reverse recovery charge Qrr - 190 - nC Diode peak reverse recovery current Irr m - 5.3 - A Diode peak rate of fall of reverse recovery current during tb dirr /dt - 450 - A/s Switching Characteristic, Inductive Load, at Tj=175 C Parameter Symbol Conditions Value Unit min. typ. max. IGBT Characteristic Turn-on delay time td( o n) Tj=175C, VC C =400V,IC =6A, VG E =0/15V,rG =23, L=60nH,C =40pF L, C from Fig. E Energy losses include “tail” and diode reverse recovery. - 9 - ns Rise time tr - 8 - Turn-off delay time td( of f) - 165 - Fall time tf - 84 - Turn-on energy Eo n - 0.14 - mJ Turn-off energy Eo ff - 0.18 - Total switching energy Et s - 0.335 - Anti-Parallel Diode Characteristic Diode reverse recovery time trr Tj =175C VR =400V, IF =6A, diF/dt=550A/s - 180 - ns Diode reverse recovery charge Qrr - 500 - nC Diode peak reverse recovery current Irr m - 7.6 - A Diode peak rate of fall of reverse recovery current during tb dirr /dt - 285 - A/s
  • 4. IKB06N60T TRENCHSTOP™ Series p IFAG IPC TD VLS 4 Rev. 2.5 20.09.2013 IC,COLLECTORCURRENT 100Hz 1kHz 10kHz 100kHz 0A 3A 6A 9A 12A 15A 18A TC =110°C TC =80°C IC,COLLECTORCURRENT 1V 10V 100V 1000V 0,1A 1A 10A 5µs DC 10µs tp =1µs 50µs 5ms 500µs f, SWITCHING FREQUENCY VCE, COLLECTOR-EMITTER VOLTAGE Figure 1. Collector current as a function of switching frequency (Tj  175C, D = 0.5, VCE = 400V, VGE = 0/15V, rG = 23) Figure 2. Safe operating area (D = 0, TC = 25C, Tj 175C;VGE=0/15V) Ptot,POWERDISSIPATION 25°C 50°C 75°C 100°C 125°C 150°C 0W 20W 40W 60W 80W IC,COLLECTORCURRENT 25°C 75°C 125°C 0A 5A 10A 15A TC, CASE TEMPERATURE TC, CASE TEMPERATURE Figure 3. Power dissipation as a function of case temperature (Tj  175C) Figure 4. Collector current as a function of case temperature (VGE  15V, Tj  175C) Ic Ic
  • 5. IKB06N60T TRENCHSTOP™ Series p IFAG IPC TD VLS 5 Rev. 2.5 20.09.2013 IC,COLLECTORCURRENT 0V 1V 2V 3V 0A 3A 6A 9A 12A 15A 15V 7V 9V 11V 13V VGE =20V IC,COLLECTORCURRENT 0V 1V 2V 3V 0A 3A 6A 9A 12A 15A 15V 7V 9V 11V 13V VGE =20V VCE, COLLECTOR-EMITTER VOLTAGE VCE, COLLECTOR-EMITTER VOLTAGE Figure 5. Typical output characteristic (Tj = 25°C) Figure 6. Typical output characteristic (Tj = 175°C) IC,COLLECTORCURRENT 0V 2V 4V 6V 8V 10V 0A 3A 6A 9A 12A 15A 25°C TJ =175°C VCE(sat),COLLECTOR-EMITTSATURATIONVOLTAGE -50°C 0°C 50°C 100°C 0,0V 0,5V 1,0V 1,5V 2,0V 2,5V IC =6A IC =12A IC =3A VGE, GATE-EMITTER VOLTAGE TJ, JUNCTION TEMPERATURE Figure 7. Typical transfer characteristic (VCE=20V) Figure 8. Typical collector-emitter saturation voltage as a function of junction temperature (VGE = 15V)
  • 6. IKB06N60T TRENCHSTOP™ Series p IFAG IPC TD VLS 6 Rev. 2.5 20.09.2013 t,SWITCHINGTIMES 0A 3A 6A 9A 12A 15A 1ns 10ns 100ns tr td(on) tf td(off) t,SWITCHINGTIMES      1ns 10ns 100ns tf tr td(off) td(on) IC, COLLECTOR CURRENT RG, GATE RESISTOR Figure 9. Typical switching times as a function of collector current (inductive load, TJ=175°C, VCE = 400V, VGE = 0/15V, rG = 23Ω, Dynamic test circuit in Figure E) Figure 10. Typical switching times as a function of gate resistor (inductive load, TJ=175°C, VCE = 400V, VGE = 0/15V, IC = 6A, Dynamic test circuit in Figure E) t,SWITCHINGTIMES 50°C 100°C 150°C 1ns 10ns 100ns tr tf td(on) td(off) VGE(th),GATE-EMITTTRSHOLDVOLTAGE -50°C 0°C 50°C 100°C 150°C 0V 1V 2V 3V 4V 5V 6V min. typ. max. TJ, JUNCTION TEMPERATURE TJ, JUNCTION TEMPERATURE Figure 11. Typical switching times as a function of junction temperature (inductive load, VCE = 400V, VGE = 0/15V, IC = 6A, rG = 23Ω, Dynamic test circuit in Figure E) Figure 12. Gate-emitter threshold voltage as a function of junction temperature (IC = 0.18mA)
  • 7. IKB06N60T TRENCHSTOP™ Series p IFAG IPC TD VLS 7 Rev. 2.5 20.09.2013 E,SWITCHINGENERGYLOSSES 0A 2A 4A 6A 8A 10A0,0 mJ 0,1 mJ 0,2 mJ 0,3 mJ 0,4 mJ 0,5 mJ 0,6 mJ Ets * Eon * *) Eon and Ets include losses due to diode recovery Eoff E,SWITCHINGENERGYLOSSES     0,0 mJ 0,1 mJ 0,2 mJ 0,3 mJ 0,4 mJ Ets * Eon * *) Eon and Ets include losses due to diode recovery Eoff IC, COLLECTOR CURRENT RG, GATE RESISTOR Figure 13. Typical switching energy losses as a function of collector current (inductive load, TJ=175°C, VCE=400V, VGE=0/15V, rG=23Ω, Dynamic test circuit in Figure E) Figure 14. Typical switching energy losses as a function of gate resistor (inductive load, TJ=175°C, VCE = 400V, VGE = 0/15V, IC = 6A, Dynamic test circuit in Figure E) E,SWITCHINGENERGYLOSSES 50°C 100°C 150°C 0,0mJ 0,1mJ 0,2mJ 0,3mJ 0,4mJ Ets * Eon * *) Eon and Ets include losses due to diode recovery Eoff E,SWITCHINGENERGYLOSSES 200V 300V 400V 500V 0,0mJ 0,1mJ 0,2mJ 0,3mJ 0,4mJ 0,5mJ Ets * Eon * *) Eon and Ets include losses due to diode recovery Eoff TJ, JUNCTION TEMPERATURE VCE, COLLECTOR-EMITTER VOLTAGE Figure 15. Typical switching energy losses as a function of junction temperature (inductive load, VCE=400V, VGE = 0/15V, IC = 6A, rG = 23Ω, Dynamic test circuit in Figure E) Figure 16. Typical switching energy losses as a function of collector emitter voltage (inductive load, TJ = 175°C, VGE = 0/15V, IC = 6A, rG = 23Ω, Dynamic test circuit in Figure E)
  • 8. IKB06N60T TRENCHSTOP™ Series p IFAG IPC TD VLS 8 Rev. 2.5 20.09.2013 VGE,GATE-EMITTERVOLTAGE 0nC 10nC 20nC 30nC 40nC 50nC 0V 5V 10V 15V 480V 120V c,CAPACITANCE 0V 10V 20V 10pF 100pF 1nF Crss Coss Ciss QGE, GATE CHARGE VCE, COLLECTOR-EMITTER VOLTAGE Figure 17. Typical gate charge (IC = 6 A) Figure 18. Typical capacitance as a function of collector-emitter voltage (VGE=0V, f = 1 MHz) IC(sc),shortcircuitCOLLECTORCURRENT 12V 14V 16V 18V 0A 20A 40A 60A 80A tSC,SHORTCIRCUITWITHSTANDTIME 10V 11V 12V 13V 14V 0µs 2µs 4µs 6µs 8µs 10µs 12µs VGE, GATE-EMITTETR VOLTAGE VGE, GATE-EMITETR VOLTAGE Figure 19. Typical short circuit collector current as a function of gate- emitter voltage (VCE  400V, Tj  150C) Figure 20. Short circuit withstand time as a function of gate-emitter voltage (VCE=400V, start at TJ=25°C, TJmax<150°C)
  • 9. IKB06N60T TRENCHSTOP™ Series p IFAG IPC TD VLS 9 Rev. 2.5 20.09.2013 ZthJC,TRANSIENTTHERMALIMPEDANCE 1µs 10µs 100µs 1ms 10ms 100ms 10 -2 K/W 10 -1 K/W 10 0 K/W single pulse 0.01 0.02 0.05 0.1 0.2 D=0.5 ZthJC,TRANSIENTTHERMALIMPEDANCE 1µs 10µs 100µs 1ms 10ms 100ms 10 -2 K/W 10 -1 K/W 10 0 K/W single pulse 0.01 0.02 0.05 0.1 0.2 D=0.5 tP, PULSE WIDTH tP, PULSE WIDTH Figure 21. IGBT transient thermal impedance (D = tp / T) Figure 22. Diode transient thermal impedance as a function of pulse width (D=tP/T) trr,REVERSERECOVERYTIME 200A/µs 400A/µs 600A/µs 800A/µs 0ns 50ns 100ns 150ns 200ns 250ns TJ =25°C TJ =175°C Qrr,REVERSERECOVERYCHARGE 200A/µs 400A/µs 600A/µs 800A/µs 0,0µC 0,1µC 0,2µC 0,3µC 0,4µC 0,5µC TJ =25°C TJ =175°C diF/dt, DIODE CURRENT SLOPE diF/dt, DIODE CURRENT SLOPE Figure 23. Typical reverse recovery time as a function of diode current slope (VR = 400V, IF = 6A, Dynamic test circuit in Figure E) Figure 24. Typical reverse recovery charge as a function of diode current slope (VR=400V, IF=6 A, Dynamic test circuit in Figure E) R , ( K / W )  , ( s )   0.3837 5.047*10-2 0.4533 4.758*10-3 0.5877 4.965*10-4 0.2483 4.717*10-5 C1 =1 /R1 R1 R2 C2 =2 /R2 R , ( K / W )  , ( s )   0.2520 4.849*10-2 0.4578 1.014*10-2 1.054 1.309*10-3 0.7822 1.343*10-4 C1 =1 /R1 R1 R2 C2 =2 /R2
  • 10. IKB06N60T TRENCHSTOP™ Series p IFAG IPC TD VLS 10 Rev. 2.5 20.09.2013 Irr,REVERSERECOVERYCURRENT 200A/µs 400A/µs 600A/µs 800A/µs 0A 2A 4A 6A 8A TJ =25°C TJ =175°C dirr/dt,DIODEPEAKRATEOFFALL OFREVERSERECOVERYCURRENT 200A/µs 400A/µs 600A/µs 800A/µs 0A/µs -100A/µs -200A/µs -300A/µs -400A/µs -500A/µs TJ =25°C TJ =175°C diF/dt, DIODE CURRENT SLOPE diF/dt, DIODE CURRENT SLOPE Figure 25. Typical reverse recovery current as a function of diode current slope (VR = 400V, IF = 6A, Dynamic test circuit in Figure E) Figure 26. Typical diode peak rate of fall of reverse recovery current as a function of diode current slope (VR = 400V, IF = 6A, Dynamic test circuit in Figure E) IF,FORWARDCURRENT 0V 1V 2V 0A 2A 4A 6A 8A 10A 25°C TJ =175°C VF,FORWARDVOLTAGE 0°C 50°C 100°C 150°C 0,0V 0,5V 1,0V 1,5V 2,0V 6A IF =12A 3A VF, FORWARD VOLTAGE TJ, JUNCTION TEMPERATURE Figure 27. Typical diode forward current as a function of forward voltage Figure 28. Typical diode forward voltage as a function of junction temperature
  • 11. IKB06N60T TRENCHSTOP™ Series p IFAG IPC TD VLS 11 Rev. 2.5 20.09.2013 PG-TO263-3
  • 12. IKB06N60T TRENCHSTOP™ Series p IFAG IPC TD VLS 12 Rev. 2.5 20.09.2013 Ir r m 90% Ir r m 10% Ir r m di /dtF tr r IF i,v tQS QF tS tF VR di /dtr r Q =Q Qr r S F + t =t tr r S F + Figure C. Definition of diodes switching characteristics p(t) 1 2 n T (t)j 1 1 2 2 n n  TC r r r r rr Figure D. Thermal equivalent circuit Figure A. Definition of switching times Figure B. Definition of switching losses
  • 13. IKB06N60T TRENCHSTOP™ Series p IFAG IPC TD VLS 13 Rev. 2.5 20.09.2013 Published by Infineon Technologies AG 81726 Munich, Germany © 2013 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. The Infineon Technologies component described in this Data Sheet may be used in life-support devices or systems and/or automotive, aviation and aerospace applications or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support, automotive, aviation and aerospace device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.