This document provides information on ULQ200xA-Q1 high-voltage, high-current Darlington transistor arrays. The devices consist of seven Darlington pairs with common-cathode clamp diodes. They can be used for applications such as relay drivers, motor drivers, and lamp drivers. The document describes features, applications, pinouts, specifications and electrical characteristics of the ULQ2003A-Q1 and ULQ2004A-Q1 models.
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FirmLeak: A framework for efficient and accurate runtime estimation of leakage power by firmware
Arun Joseph, Anand Haridass, Charles Lefurgy, Spandana Rachamalla, Sreekanth Pai, Diyanesh Chinnakkonda, Vidushi Goyal
2015 28th International Conference on VLSI Design (VLSID),
3-7 Jan. 2015
Abstract:Separating the dynamic power and leakage power components from total microprocessor power can enable new optimizations for cloud computing. To this end, we introduce FirmLeak, a new framework that enables accurate, real-time estimation of microprocessor leakage power by system software. FirmLeak accounts for power-gating regions, per-core voltage domains, and manufacturing variation. We present an experimental evaluation of FirmLeak on a POWER7+ microprocessor for a range of hardware parts, voltages and temperatures. We discuss how this can be used in two applications to manage power by 1) improving billing of energy for cloud computing and 2) optimizing fan power consumption.
Separating the dynamic power and leakage power
components from total microprocessor power can enable new
optimizations for cloud computing. To this end, we introduce
FirmLeak, a new framework that enables accurate, real-time
estimation of microprocessor leakage power by system software.
FirmLeak accounts for power-gating regions, per-core voltage
domains, and manufacturing variation. We present an
experimental evaluation of FirmLeak on a POWER7+
microprocessor for a range of hardware parts, voltages and
temperatures. We discuss how this can be used in two
applications to manage power by 1) improving billing of energy
for cloud computing and 2) optimizing fan power consumption.
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FirmLeak: A framework for efficient and accurate runtime estimation of leakage power by firmware
Arun Joseph, Anand Haridass, Charles Lefurgy, Spandana Rachamalla, Sreekanth Pai, Diyanesh Chinnakkonda, Vidushi Goyal
2015 28th International Conference on VLSI Design (VLSID),
3-7 Jan. 2015
Abstract:Separating the dynamic power and leakage power components from total microprocessor power can enable new optimizations for cloud computing. To this end, we introduce FirmLeak, a new framework that enables accurate, real-time estimation of microprocessor leakage power by system software. FirmLeak accounts for power-gating regions, per-core voltage domains, and manufacturing variation. We present an experimental evaluation of FirmLeak on a POWER7+ microprocessor for a range of hardware parts, voltages and temperatures. We discuss how this can be used in two applications to manage power by 1) improving billing of energy for cloud computing and 2) optimizing fan power consumption.
Separating the dynamic power and leakage power
components from total microprocessor power can enable new
optimizations for cloud computing. To this end, we introduce
FirmLeak, a new framework that enables accurate, real-time
estimation of microprocessor leakage power by system software.
FirmLeak accounts for power-gating regions, per-core voltage
domains, and manufacturing variation. We present an
experimental evaluation of FirmLeak on a POWER7+
microprocessor for a range of hardware parts, voltages and
temperatures. We discuss how this can be used in two
applications to manage power by 1) improving billing of energy
for cloud computing and 2) optimizing fan power consumption.
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Đang phục vụ cho hơn 30% nhu cầu của Việt nam với mức chất lượng cao nhất của thế giới ( high-end và Standard range). Sản phẩm này cũng đang được bán tại Mỹ, Nhật, Eu, và Trung đông,… Tại Việt nam, từ năm 1998 đến nay, LS đã và đang cung cấp cho hàng ngàn công trình lớn nhỏ tại Việt nam bao gồm các nhà đầu tư Nhật bản, Hàn Quốc, và các nhà đầu tư Việt nam.
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About
Indigenized remote control interface card suitable for MAFI system CCR equipment. Compatible for IDM8000 CCR. Backplane mounted serial and TCP/Ethernet communication module for CCR remote access. IDM 8000 CCR remote control on serial and TCP protocol.
• Remote control: Parallel or serial interface.
• Compatible with MAFI CCR system.
• Compatible with IDM8000 CCR.
• Compatible with Backplane mount serial communication.
• Compatible with commercial and Defence aviation CCR system.
• Remote control system for accessing CCR and allied system over serial or TCP.
• Indigenized local Support/presence in India.
• Easy in configuration using DIP switches.
Technical Specifications
Indigenized remote control interface card suitable for MAFI system CCR equipment. Compatible for IDM8000 CCR. Backplane mounted serial and TCP/Ethernet communication module for CCR remote access. IDM 8000 CCR remote control on serial and TCP protocol.
Key Features
Indigenized remote control interface card suitable for MAFI system CCR equipment. Compatible for IDM8000 CCR. Backplane mounted serial and TCP/Ethernet communication module for CCR remote access. IDM 8000 CCR remote control on serial and TCP protocol.
• Remote control: Parallel or serial interface
• Compatible with MAFI CCR system
• Copatiable with IDM8000 CCR
• Compatible with Backplane mount serial communication.
• Compatible with commercial and Defence aviation CCR system.
• Remote control system for accessing CCR and allied system over serial or TCP.
• Indigenized local Support/presence in India.
Application
• Remote control: Parallel or serial interface.
• Compatible with MAFI CCR system.
• Compatible with IDM8000 CCR.
• Compatible with Backplane mount serial communication.
• Compatible with commercial and Defence aviation CCR system.
• Remote control system for accessing CCR and allied system over serial or TCP.
• Indigenized local Support/presence in India.
• Easy in configuration using DIP switches.
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Original DARLING TRANSISTOR ARRAY IC ULQ2003A 2003A 2003 SOP-16 New Texas Instrusments
1. 7C
6C
5C
4C
3C
2C
1C
COM
7
6
5
4
3
2
1
7B
6B
5B
4B
3B
2B
1B
10
11
12
13
14
15
16
9
Product
Folder
Sample &
Buy
Technical
Documents
Tools &
Software
Support &
Community
ULQ2003A-Q1, ULQ2004A-Q1
SGLS148E –DECEMBER 2002–REVISED DECEMBER 2015
ULQ200xA-Q1 High-Voltage High-Current Darlington Transistor Arrays
1 Features 3 Description
The ULQ200xA-Q1 devices are high-voltage high-1• Qualified for Automotive Applications
current Darlington transistor arrays. Each consists of
• ESD Protection Exceeds 200 V Using Machine seven npn Darlington pairs that feature high-voltage
Model (C = 200 pF, R = 0) outputs with common-cathode clamp diodes for
• 500-mA-Rated Collector Current (Single Output) switching inductive loads. The collector-current rating
of a single Darlington pair is 500 mA. The Darlington• High-Voltage Outputs: 50 V
pairs can be paralleled for higher current capability.
• Output Clamp Diodes
The ULQ2003A-Q1 has a 2.7-kΩ series base resistor• Inputs Compatible With Various Types of Logic
for each Darlington pair, for operation directly with
• Relay-Driver Applications TTL or 5-V CMOS devices. The ULQ2004A-Q1 has a
10.5-kΩ series base resistor to allow operation
2 Applications directly from CMOS devices that use supply voltages
of 6 V to 15 V. The required input current of the• Relay Drivers
ULQ2004A-Q1 is below that of the ULQ2003A-Q1.
• Stepper and DC Brushed Motor Drivers
• Lamp Drivers Device Information(1)
• Display Drivers (LED and Gas Discharge) PART NUMBER PACKAGE BODY SIZE (NOM)
• Line Drivers SOIC (16) 9.90 mm x 3.90 mm
ULQ2003A-Q1
TSSOP (16) 5.00 mm x 4.40 mm• Logic Buffers
ULQ2004A-Q1 SOIC (16) 9.90 mm x 3.90 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Simplified Block Diagram
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
17. PACKAGE OPTION ADDENDUM
www.ti.com 6-Feb-2020
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
ULQ2003AQDRQ1 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br)
NIPDAU Level-1-260C-UNLIM -40 to 125 ULQ2003AQ
ULQ2003ATDG4Q1 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br)
NIPDAU Level-1-260C-UNLIM -40 to 105 ULQ2003AT
ULQ2003ATDQ1 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br)
NIPDAU Level-1-260C-UNLIM -40 to 105 ULQ2003AT
ULQ2003ATDRG4Q1 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br)
NIPDAU Level-1-260C-UNLIM -40 to 105 ULQ2003AT
ULQ2003ATDRQ1 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br)
NIPDAU Level-1-260C-UNLIM -40 to 105 ULQ2003AT
ULQ2003ATPWRQ1 ACTIVE TSSOP PW 16 2500 Green (RoHS
& no Sb/Br)
NIPDAU Level-1-260C-UNLIM -40 to 105 U2003AT
ULQ2004ATDRG4Q1 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br)
NIPDAU Level-1-260C-UNLIM -40 to 105 ULQ2004AT
ULQ2004ATDRQ1 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br)
NIPDAU Level-1-260C-UNLIM -40 to 105 ULQ2004AT
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
18. PACKAGE OPTION ADDENDUM
www.ti.com 6-Feb-2020
Addendum-Page 2
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF ULQ2003A-Q1, ULQ2004A-Q1 :
•Catalog: ULQ2003A, ULQ2004A
NOTE: Qualified Version Definitions:
•Catalog - TI's standard catalog product
19. TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
ULQ2003ATPWRQ1 TSSOP PW 16 2500 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 3-Aug-2017
Pack Materials-Page 1
23. www.ti.com
PACKAGE OUTLINE
C
14X 0.65
2X
4.55
16X
0.30
0.19
TYP
6.6
6.2
1.2 MAX
0.15
0.05
0.25
GAGE PLANE
-80
B
NOTE 4
4.5
4.3
A
NOTE 3
5.1
4.9
0.75
0.50
(0.15) TYP
TSSOP - 1.2 mm max heightPW0016A
SMALL OUTLINE PACKAGE
4220204/A 02/2017
1
8
9
16
0.1 C A B
PIN 1 INDEX AREA
SEE DETAIL A
0.1 C
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153.
SEATING
PLANE
A 20
DETAIL A
TYPICAL
SCALE 2.500
24. www.ti.com
EXAMPLE BOARD LAYOUT
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
16X (1.5)
16X (0.45)
14X (0.65)
(5.8)
(R0.05) TYP
TSSOP - 1.2 mm max heightPW0016A
SMALL OUTLINE PACKAGE
4220204/A 02/2017
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 10X
SYMM
SYMM
1
8 9
16
15.000
METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
EXPOSED METALEXPOSED METAL
SOLDER MASK DETAILS
NON-SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
25. www.ti.com
EXAMPLE STENCIL DESIGN
16X (1.5)
16X (0.45)
14X (0.65)
(5.8)
(R0.05) TYP
TSSOP - 1.2 mm max heightPW0016A
SMALL OUTLINE PACKAGE
4220204/A 02/2017
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE: 10X
SYMM
SYMM
1
8 9
16