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November 2006 Rev 2 1/8
8
TIP32C
Power transistor
Applications
■ Linear and swithing industrial equipment
Description
The TIP32C is a silicon Epitaxial-base PNP power
transistor in Jedec TO-220 plastic package. It is
intented for use in medium power linear and
switching applications.
The complementary NPN type is TIP31C.
.
Internal schematic diagram
1
2
3
TO-220
www.st.com
Order codes
Part number Marking Package Packing
TIP32C TIP32C TO-220 Tube
Absolute maximum ratings TIP32C
2/8
1 Absolute maximum ratings
Table 1. Absolute maximum ratings
Symbol Parameter Value Unit
VCBO Collector-base voltage (IE = 0) -100 V
VCEO Collector-emitter voltage (IB = 0) -100 V
VEBO Emitte-base voltage (IC = 0) -5 V
IC Collector current -3 A
ICM Collector peak current (tP < 5ms) -5 A
IB Base current -1 A
PTOT
Total dissipation at Tcase = 25°C
Tamb = 25°C
40
2
W
W
Tstg Storage temperature -65 to 150 °C
TJ Max. operating junction temperature 150 °C
TIP32C Electrical characteristics
3/8
2 Electrical characteristics
(Tcase = 25°C; unless otherwise specified)
Table 2. Electrical characteristics
Symbol Parameter Test Conditions Min. Typ. Max. Unit
ICEO
Collector cut-off current
(IB = 0)
VCB =-60V -0.3 mA
ICES
Collector cut-off current
(VBE = 0)
VCB =-100V -0.2 mA
IEBO
Emitter cut-off current
(IC = 0)
VEB =-5V -1 mA
VCEO(sus
(1)
1. Pulsed duration = 300 ms, duty cycle ≥1.5%.
Collector-emitter
sustaining voltage
(IB = 0)
IC = -30mA -100 V
VCE(sat)
(1) Collector-emitter
saturation voltage
IC = -3A _ IB = 375mA -1.2 V
VBE(on)
(1) Base-emitter voltage IC = -3A_ VCE =-4V -1.8 V
hFE
(1) DC current gain
IC = -1A VCE =-4V
IC = -3A _ VCE =-4V
25
10 50
Electrical characteristics TIP32C
4/8
2.1 Typical characteristic
Figure 1. Safe operating area Figure 2. Derating Curves
Figure 3. DC current gain Figure 4. Collector-emitter saturation
voltage
Figure 5. Base-emitter saturation
voltage
TIP32C Package Mechanical Data
5/8
3 Package Mechanical Data
In order to meet environmental requirements, ST offers these devices in
ECOPACK® packages. These packages have a Lead-free second level
interconnect . The category of second level interconnect is marked on the
package and on the inner box label, in compliance with JEDEC Standard JESD97.
The maximum ratings related to soldering conditions are also marked on the inner
box label. ECOPACK is an ST trademark. ECOPACK specifications are available
at: www.st.com
Package Mechanical Data TIP32C
6/8
DIM.
mm. inch
MIN. TYP MAX. MIN. TYP. MAX.
A 4.40 4.60 0.173 0.181
b 0.61 0.88 0.024 0.034
b1 1.15 1.70 0.045 0.066
c 0.49 0.70 0.019 0.027
D 15.25 15.75 0.60 0.620
E 10 10.40 0.393 0.409
e 2.40 2.70 0.094 0.106
e1 4.95 5.15 0.194 0.202
F 1.23 1.32 0.048 0.052
H1 6.20 6.60 0.244 0.256
J1 2.40 2.72 0.094 0.107
L 13 14 0.511 0.551
L1 3.50 3.93 0.137 0.154
L20 16.40 0.645
L30 28.90 1.137
øP 3.75 3.85 0.147 0.151
Q 2.65 2.95 0.104 0.116
TO-220 MECHANICAL DATA
TIP32C Revision History
7/8
4 Revision History
Table 3. Revision history
Date Revision Changes
10-Oct-1999 1 Initial Release
15-Nov-2006 2 The document has been reformatted
TIP32C
8/8
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2006 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -
Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com

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Original COMPLEMENTARY SILICON POWER TRANSISTORS TIP32 TIP32C TO-220F New STMicroelectronics

  • 1. November 2006 Rev 2 1/8 8 TIP32C Power transistor Applications ■ Linear and swithing industrial equipment Description The TIP32C is a silicon Epitaxial-base PNP power transistor in Jedec TO-220 plastic package. It is intented for use in medium power linear and switching applications. The complementary NPN type is TIP31C. . Internal schematic diagram 1 2 3 TO-220 www.st.com Order codes Part number Marking Package Packing TIP32C TIP32C TO-220 Tube
  • 2. Absolute maximum ratings TIP32C 2/8 1 Absolute maximum ratings Table 1. Absolute maximum ratings Symbol Parameter Value Unit VCBO Collector-base voltage (IE = 0) -100 V VCEO Collector-emitter voltage (IB = 0) -100 V VEBO Emitte-base voltage (IC = 0) -5 V IC Collector current -3 A ICM Collector peak current (tP < 5ms) -5 A IB Base current -1 A PTOT Total dissipation at Tcase = 25°C Tamb = 25°C 40 2 W W Tstg Storage temperature -65 to 150 °C TJ Max. operating junction temperature 150 °C
  • 3. TIP32C Electrical characteristics 3/8 2 Electrical characteristics (Tcase = 25°C; unless otherwise specified) Table 2. Electrical characteristics Symbol Parameter Test Conditions Min. Typ. Max. Unit ICEO Collector cut-off current (IB = 0) VCB =-60V -0.3 mA ICES Collector cut-off current (VBE = 0) VCB =-100V -0.2 mA IEBO Emitter cut-off current (IC = 0) VEB =-5V -1 mA VCEO(sus (1) 1. Pulsed duration = 300 ms, duty cycle ≥1.5%. Collector-emitter sustaining voltage (IB = 0) IC = -30mA -100 V VCE(sat) (1) Collector-emitter saturation voltage IC = -3A _ IB = 375mA -1.2 V VBE(on) (1) Base-emitter voltage IC = -3A_ VCE =-4V -1.8 V hFE (1) DC current gain IC = -1A VCE =-4V IC = -3A _ VCE =-4V 25 10 50
  • 4. Electrical characteristics TIP32C 4/8 2.1 Typical characteristic Figure 1. Safe operating area Figure 2. Derating Curves Figure 3. DC current gain Figure 4. Collector-emitter saturation voltage Figure 5. Base-emitter saturation voltage
  • 5. TIP32C Package Mechanical Data 5/8 3 Package Mechanical Data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com
  • 6. Package Mechanical Data TIP32C 6/8 DIM. mm. inch MIN. TYP MAX. MIN. TYP. MAX. A 4.40 4.60 0.173 0.181 b 0.61 0.88 0.024 0.034 b1 1.15 1.70 0.045 0.066 c 0.49 0.70 0.019 0.027 D 15.25 15.75 0.60 0.620 E 10 10.40 0.393 0.409 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.194 0.202 F 1.23 1.32 0.048 0.052 H1 6.20 6.60 0.244 0.256 J1 2.40 2.72 0.094 0.107 L 13 14 0.511 0.551 L1 3.50 3.93 0.137 0.154 L20 16.40 0.645 L30 28.90 1.137 øP 3.75 3.85 0.147 0.151 Q 2.65 2.95 0.104 0.116 TO-220 MECHANICAL DATA
  • 7. TIP32C Revision History 7/8 4 Revision History Table 3. Revision history Date Revision Changes 10-Oct-1999 1 Initial Release 15-Nov-2006 2 The document has been reformatted
  • 8. TIP32C 8/8 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2006 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com