I have collected all the necessary information about various hardware blocks of Nvidia Tegra K1 processor and put them together. It would be helpful for those who are/going to work on it by giving the details in a very concise fashion.
Nvidia’s tegra line of processors for mobile devices2 2Sukul Yarraguntla
Nvidia's Tegra line of system on chips (SoCs) uses a heterogeneous multi-processor architecture with purpose-optimized processors to provide high performance for mobile devices while maintaining low power consumption and long battery life. The Tegra architecture includes dual CPU cores, a GPU, and dedicated cores for video/image processing, audio, and more. By selectively powering processors for specific tasks like music, video, or games, Tegra can deliver all-day battery life while supporting high-definition multimedia experiences.
The document is a presentation about the NVIDIA Tegra K1 microprocessor. It begins with an outline that will discuss the Tegra K1, its specifications, chip version, architecture, and features. It provides background on NVIDIA as a company and introduces the Tegra line of system on a chip units. It describes the Kepler GPU microarchitecture that powers the Tegra K1. The presentation notes that the Tegra K1 is built on NVIDIA's Kepler architecture and can provide powerful, immersive mobile experiences for gaming, augmented reality, and automotive applications.
The MYC-CZU3EG CPU Module is a powerful MPSoC System-on-Module (SoM) based on Xilinx Zynq UltraScale+ ZU3EG which features a 1.2 GHz quad-core ARM Cortex-A53 64-bit application processor
Q2.12: Idling ARMs in a busy world: Linux Power Management for ARM Multiclust...Linaro
This document discusses power management for ARM multi-cluster systems in Linux. It describes the need for common power management code in the kernel to handle saving and restoring CPU and cluster state. It outlines the ARM common power management code components, including CPU PM notifiers, local timer handling, and CPU suspend/resume functionality. It also discusses challenges such as cache-to-cache migration during the suspend process.
The document discusses Qualcomm Snapdragon, a family of mobile system on chips (SoCs) designed by Qualcomm. It describes the evolution of Snapdragon CPUs from Scorpion to Krait and their features. It also discusses the Adreno GPU, Hexagon DSP, and other components integrated into Snapdragon SoCs. The document then provides details about specific Snapdragon families like S4, 800 series, and 810. It also includes information about ARM architecture and its instruction set.
Kernel Features for Reducing Power Consumption on Embedded DevicesRyo Jin
This document discusses various techniques for reducing energy consumption on mobile devices using the Linux kernel. It focuses on ARM architecture and Samsung's Exynos System-on-Chip. Key techniques discussed include CPU frequency scaling (CPUfreq), putting components into low power states via runtime power management, utilizing deeper CPU idle states, and dynamic voltage and frequency scaling for other devices (Devfreq). Measurements demonstrate energy savings from each technique, with the largest savings coming from combined use of CPU idle states, powering off idle CPU cores, and Devfreq.
This document discusses Qualcomm's Snapdragon system on chip (SoC) processors. It provides a brief history of Snapdragon, noting the release of the first chips in 2008. It outlines the key features of Snapdragon SoCs including the CPU, GPU, DSP and capabilities for graphics, camera, display and more. The document also describes Qualcomm's Snapdragon series of processors that are tiered based on their capabilities and includes a table comparing the different tiers.
The document discusses Qualcomm's Snapdragon mobile processors. It describes the key features and technology innovations of the Snapdragon S4 processor, including its CPU, GPU, modem, and DSP components. The S4 introduced Qualcomm's Krait CPU architecture and integrated 3G/4G modem. It provided improved performance over previous generations while enhancing power efficiency. The document outlines the different versions of Snapdragon processors like the S4 Play, S4 Plus, S4 Pro, and S4 Prime that were designed for various mobile device tiers.
Nvidia’s tegra line of processors for mobile devices2 2Sukul Yarraguntla
Nvidia's Tegra line of system on chips (SoCs) uses a heterogeneous multi-processor architecture with purpose-optimized processors to provide high performance for mobile devices while maintaining low power consumption and long battery life. The Tegra architecture includes dual CPU cores, a GPU, and dedicated cores for video/image processing, audio, and more. By selectively powering processors for specific tasks like music, video, or games, Tegra can deliver all-day battery life while supporting high-definition multimedia experiences.
The document is a presentation about the NVIDIA Tegra K1 microprocessor. It begins with an outline that will discuss the Tegra K1, its specifications, chip version, architecture, and features. It provides background on NVIDIA as a company and introduces the Tegra line of system on a chip units. It describes the Kepler GPU microarchitecture that powers the Tegra K1. The presentation notes that the Tegra K1 is built on NVIDIA's Kepler architecture and can provide powerful, immersive mobile experiences for gaming, augmented reality, and automotive applications.
The MYC-CZU3EG CPU Module is a powerful MPSoC System-on-Module (SoM) based on Xilinx Zynq UltraScale+ ZU3EG which features a 1.2 GHz quad-core ARM Cortex-A53 64-bit application processor
Q2.12: Idling ARMs in a busy world: Linux Power Management for ARM Multiclust...Linaro
This document discusses power management for ARM multi-cluster systems in Linux. It describes the need for common power management code in the kernel to handle saving and restoring CPU and cluster state. It outlines the ARM common power management code components, including CPU PM notifiers, local timer handling, and CPU suspend/resume functionality. It also discusses challenges such as cache-to-cache migration during the suspend process.
The document discusses Qualcomm Snapdragon, a family of mobile system on chips (SoCs) designed by Qualcomm. It describes the evolution of Snapdragon CPUs from Scorpion to Krait and their features. It also discusses the Adreno GPU, Hexagon DSP, and other components integrated into Snapdragon SoCs. The document then provides details about specific Snapdragon families like S4, 800 series, and 810. It also includes information about ARM architecture and its instruction set.
Kernel Features for Reducing Power Consumption on Embedded DevicesRyo Jin
This document discusses various techniques for reducing energy consumption on mobile devices using the Linux kernel. It focuses on ARM architecture and Samsung's Exynos System-on-Chip. Key techniques discussed include CPU frequency scaling (CPUfreq), putting components into low power states via runtime power management, utilizing deeper CPU idle states, and dynamic voltage and frequency scaling for other devices (Devfreq). Measurements demonstrate energy savings from each technique, with the largest savings coming from combined use of CPU idle states, powering off idle CPU cores, and Devfreq.
This document discusses Qualcomm's Snapdragon system on chip (SoC) processors. It provides a brief history of Snapdragon, noting the release of the first chips in 2008. It outlines the key features of Snapdragon SoCs including the CPU, GPU, DSP and capabilities for graphics, camera, display and more. The document also describes Qualcomm's Snapdragon series of processors that are tiered based on their capabilities and includes a table comparing the different tiers.
The document discusses Qualcomm's Snapdragon mobile processors. It describes the key features and technology innovations of the Snapdragon S4 processor, including its CPU, GPU, modem, and DSP components. The S4 introduced Qualcomm's Krait CPU architecture and integrated 3G/4G modem. It provided improved performance over previous generations while enhancing power efficiency. The document outlines the different versions of Snapdragon processors like the S4 Play, S4 Plus, S4 Pro, and S4 Prime that were designed for various mobile device tiers.
JT1_Universal_Flight_Control_Station 2 (2)Matt Thomas
The JT1 Universal Flight Control Station is a fully customizable command and control system for unmanned aerial vehicles (UAVs) and other aircraft. It uses modular components from top manufacturers to provide high-quality video, comfortable ergonomic seating, and flexible hardware and software interfaces. The system is designed to meet military standards for reliability, durability, and compatibility across missions and platforms.
The Snapdragon 400 is a mobile processor that offers popular features like HD video and audio playback at affordable price points. It includes both dual and quad core CPU options based on Qualcomm's Krait and ARM Cortex-A7 technologies. It supports HD displays, graphics-intensive gaming, 4G LTE, and other demanding mobile experiences.
The document describes Qualcomm's Snapdragon 800 processor and its specifications. The Snapdragon 800 uses a 28nm HPm process and includes a quad-core Krait 400 CPU up to 2.3GHz, Adreno 330 GPU, LTE and 3G/2G modem support, support for 4K video playback and 55MP cameras. It has advanced features for power management, audio, graphics, and connectivity.
This document provides an overview of overclocking innovations for 2016, including:
- A live demonstration of overclocking Intel's first 10-core desktop processor using the Intel X99 chipset.
- A discussion of new overclocking capabilities for Intel Core processors like per-core overclocking and AVX ratio offset.
- Details on motherboard technologies from ASUS that enhance overclocking, like the ROG OC Panel and microcontrollers.
- An explanation of overclocking options for Intel 6th generation Core processors using the Intel Z170 chipset, including unlocked ratios and memory overclocking.
The document discusses tools and technologies for overclocking, like the Intel
Mobile processors have become very powerful, with processing speeds up to 3.5 GHz and multiple cores that enable better graphics and multitasking. The document discusses different types of mobile processors like Qualcomm Snapdragon, MediaTek, Exynos, Kirin, Intel Atom, and Apple's mobile processors. It also covers topics like how processors work, the benefits of multiple cores, nanometer sizes, and ARM architecture.
- Ryzen Threadripper processors provide HEDT leadership with more cores, threads, cache and memory bandwidth than Intel's competing Core i9 processors.
- The new lineup includes the 16-core/32-thread 1950X, 12-core/24-thread 1920X, and 8-core/16-thread 1900X models.
- Benchmark results show the Threadripper 1950X outperforming the Core i9-7900X in multi-threaded workloads by up to 38% while providing equivalent performance at a lower price point.
Intel Atom X Mobile Processors Announcement Slides MWC 2015Ronen Mendezitsky
Intel announced new Atom x3 and x5 processors and XMM 7360 modem at Mobile World Congress. The Atom x3 comes in 3G and LTE versions for affordable smartphones and tablets. It provides responsive performance and strong battery life. The Atom x5 and x7 will be Intel's first 14nm mobile SoCs, featuring 64-bit CPUs, Intel Gen 8 graphics and the XMM 7360 modem supporting LTE Category 6 speeds. Intel also announced new connectivity solutions like wireless GNSS, Wi-Fi 8x70 and NFC to benefit Intel platforms.
This document provides an overview and details of ASUS notebook motherboard power circuits and components. It includes diagrams of the power systems used in Sonoma, Napa, Santa Rosa and Montevina platforms. Sample diagrams are shown for the M9V and V6J motherboards. Key integrated circuits used in the power systems like the LTC3728, TPS5130, MAX1987, TPS51020 and ISL6227 switching regulators are described in detail including specifications, pinouts and functions. Troubleshooting tips are provided in a Q&A section.
Altera is now shipping our Cyclone® IV FPGAs, the market's lowest cost, lowest power FPGAs, with an integrated 3.125-Gbps transceiver variant. Learn how to meet increasing bandwidth requirements while lowering costs in high-volume applications in this presentation. http://www.altera.com/b/cyclone-iv-fpga-shipping.html
Intel 8th Core G Series with Radeon Vega M Low Hong Chuan
The document discusses 8th generation Intel Core processors with Radeon RX Vega M graphics. It provides an overview of the new processors and their positioning for gaming, content creation, and VR/MR. It highlights key features like Intel EMIB technology, HBM2 memory, and dynamic power sharing. Performance benchmarks show improvements over 3-year-old systems for gaming, productivity and content creation workloads. Innovative thin and light desktop designs are also discussed.
The document provides an overview of the HPE ProLiant DL380 Generation9 (Gen9) server. It describes the front, rear, and internal views of the server chassis, highlighting the server's components and features. These include processor, memory, expansion slot, and storage controller options. The server delivers performance and expandability for 2P rack deployments with high reliability.
The document discusses the MSI Z77 MPOWER motherboard. It was designed based on feedback from overclockers and features enhanced components, power delivery, and cooling for extreme overclocking. It includes tools like the OC Genie II for easy one-button overclocking and Multi-BIOS II for recovery from failed overclocking attempts. The board is optimized for high performance multi-GPU configurations and long-term heavy overclocking use.
This document summarizes the evolution of computer motherboards from early processors like the 8086 to later Pentium models. It provides specifications for each board including the processor, manufacturer, memory capacity, and BIOS. It also describes user configurable settings like memory and I/O configurations through jumpers and switches.
The document provides information on the HPE ProLiant DL20 Gen10 Server, including:
- It is a 1U rack server powered by Intel Xeon E, Pentium, and Core i3 processors, offering flexibility and value.
- Standard features include Intel C242 chipset, up to 64GB memory, 1Gb Ethernet ports, and various storage options.
- It comes in various pre-configured models for entry, performance, and solution workloads.
The document provides specifications for Qualcomm's Snapdragon series of mobile processors, including the Snapdragon 800, 600, 400, and 200. It lists the key components and specifications for each model, such as the CPU, GPU, memory support, camera capabilities, and modem/wireless features. The Snapdragon 800 is the highest-end model supporting up to 2.3GHz CPUs and 4K video capture, while the Snapdragon 200 is the lowest-end model supporting up to 1.4GHz CPUs and 720p video.
The Rico Board is an excellent high-performance Single Board Computer using the newest TI’s AM437x Sitara ARM Cortex-A9 based solution. It has 512MB DDR3, 4GB eMMC Flash, 16MB QSPI Flash and 32KB EEPROM on board, featuring various peripherals like Debug Serial, USB, Gigabit Ethernet, Dual-Camera, TF, HDMI, LCD and etc. It is preloaded with Linux and supplied with optional 7-inch LCD Module including capacitive touch screen. More information can be found at MYIR's website: http://www.myirtech.com/list.asp?id=510
NSA, GCHQ, Five, Nine and Fourteen Eyes White Paper on Cybersecurity Exploit ...Michael Holt
The document lists and describes various tools and exploits developed by the NSA/CIA to infiltrate and gain persistent access to computer systems and networks. These include BIOS exploits to implant spying software that survives operating system reinstalls (DEITYBOUNCE, IRONCHEF), exploits that modify firewall firmware to persistently implant spyware (FEEDTHROUGH, GOURMETTROUGH, HALLUXWATER, JETPLOW, SOUFFLETROUGH), and exploits that modify hard drive firmware to survive operating system changes (IRATEMONK, SWAP). It also describes tools for intercepting wireless communications, hacking phones, and simulating cell towers to track targets.
This document provides specifications for a smartwatch, including:
- It has a 1.65" IPS LCD screen and is powered by a Qualcomm Snapdragon 400 processor with 512MB of RAM and 4GB of storage.
- Sensors include a 9-axis accelerometer, compass and gyroscope for tracking motion and orientation.
- Connectivity options include Bluetooth 4.0 and it charges via a micro USB port on a charging cradle.
- The battery has a capacity of 400mAh.
AMD technology powers 4 of the top 5 fastest supercomputers in the world. AMD was also the first to release a quad-core CPU over 6.5GHz and the fastest graphics card. More recently, AMD launched new processors and chipsets, improved graphics drivers, and partnered to bring 500,000 Android apps to PCs. AMD has advantages over competitors like larger L1 CPU caches, easier overclocking tools, power efficiency technologies, and upgradeability across motherboards.
PIC Introduction and explained in detailedAnkita Tiwari
The document provides an introduction to the PIC microcontroller. It discusses what a microcontroller is, compares microcontrollers to general purpose microprocessors, and briefly outlines the history of the PIC microcontroller. It then describes features of the PIC16F84 microcontroller including its clock generator, reset function, ports, central processing unit, and memory organization including flash memory, RAM, and ROM. It also covers the timer and prescalar functions.
The document provides an overview of the key features and architecture of NXP Semiconductors' LPC213x microcontroller family. The LPC213x MCUs are based on an ARM7TDMI-S CPU with on-chip flash memory and RAM. They include features such as GPIO ports, UARTs, I2C interfaces, SPI, PWM, ADC, DAC, RTC, and watchdog timer. The MCUs also support in-system programming, debugging via EmbeddedICE, and instruction tracing with an embedded trace macrocell.
JT1_Universal_Flight_Control_Station 2 (2)Matt Thomas
The JT1 Universal Flight Control Station is a fully customizable command and control system for unmanned aerial vehicles (UAVs) and other aircraft. It uses modular components from top manufacturers to provide high-quality video, comfortable ergonomic seating, and flexible hardware and software interfaces. The system is designed to meet military standards for reliability, durability, and compatibility across missions and platforms.
The Snapdragon 400 is a mobile processor that offers popular features like HD video and audio playback at affordable price points. It includes both dual and quad core CPU options based on Qualcomm's Krait and ARM Cortex-A7 technologies. It supports HD displays, graphics-intensive gaming, 4G LTE, and other demanding mobile experiences.
The document describes Qualcomm's Snapdragon 800 processor and its specifications. The Snapdragon 800 uses a 28nm HPm process and includes a quad-core Krait 400 CPU up to 2.3GHz, Adreno 330 GPU, LTE and 3G/2G modem support, support for 4K video playback and 55MP cameras. It has advanced features for power management, audio, graphics, and connectivity.
This document provides an overview of overclocking innovations for 2016, including:
- A live demonstration of overclocking Intel's first 10-core desktop processor using the Intel X99 chipset.
- A discussion of new overclocking capabilities for Intel Core processors like per-core overclocking and AVX ratio offset.
- Details on motherboard technologies from ASUS that enhance overclocking, like the ROG OC Panel and microcontrollers.
- An explanation of overclocking options for Intel 6th generation Core processors using the Intel Z170 chipset, including unlocked ratios and memory overclocking.
The document discusses tools and technologies for overclocking, like the Intel
Mobile processors have become very powerful, with processing speeds up to 3.5 GHz and multiple cores that enable better graphics and multitasking. The document discusses different types of mobile processors like Qualcomm Snapdragon, MediaTek, Exynos, Kirin, Intel Atom, and Apple's mobile processors. It also covers topics like how processors work, the benefits of multiple cores, nanometer sizes, and ARM architecture.
- Ryzen Threadripper processors provide HEDT leadership with more cores, threads, cache and memory bandwidth than Intel's competing Core i9 processors.
- The new lineup includes the 16-core/32-thread 1950X, 12-core/24-thread 1920X, and 8-core/16-thread 1900X models.
- Benchmark results show the Threadripper 1950X outperforming the Core i9-7900X in multi-threaded workloads by up to 38% while providing equivalent performance at a lower price point.
Intel Atom X Mobile Processors Announcement Slides MWC 2015Ronen Mendezitsky
Intel announced new Atom x3 and x5 processors and XMM 7360 modem at Mobile World Congress. The Atom x3 comes in 3G and LTE versions for affordable smartphones and tablets. It provides responsive performance and strong battery life. The Atom x5 and x7 will be Intel's first 14nm mobile SoCs, featuring 64-bit CPUs, Intel Gen 8 graphics and the XMM 7360 modem supporting LTE Category 6 speeds. Intel also announced new connectivity solutions like wireless GNSS, Wi-Fi 8x70 and NFC to benefit Intel platforms.
This document provides an overview and details of ASUS notebook motherboard power circuits and components. It includes diagrams of the power systems used in Sonoma, Napa, Santa Rosa and Montevina platforms. Sample diagrams are shown for the M9V and V6J motherboards. Key integrated circuits used in the power systems like the LTC3728, TPS5130, MAX1987, TPS51020 and ISL6227 switching regulators are described in detail including specifications, pinouts and functions. Troubleshooting tips are provided in a Q&A section.
Altera is now shipping our Cyclone® IV FPGAs, the market's lowest cost, lowest power FPGAs, with an integrated 3.125-Gbps transceiver variant. Learn how to meet increasing bandwidth requirements while lowering costs in high-volume applications in this presentation. http://www.altera.com/b/cyclone-iv-fpga-shipping.html
Intel 8th Core G Series with Radeon Vega M Low Hong Chuan
The document discusses 8th generation Intel Core processors with Radeon RX Vega M graphics. It provides an overview of the new processors and their positioning for gaming, content creation, and VR/MR. It highlights key features like Intel EMIB technology, HBM2 memory, and dynamic power sharing. Performance benchmarks show improvements over 3-year-old systems for gaming, productivity and content creation workloads. Innovative thin and light desktop designs are also discussed.
The document provides an overview of the HPE ProLiant DL380 Generation9 (Gen9) server. It describes the front, rear, and internal views of the server chassis, highlighting the server's components and features. These include processor, memory, expansion slot, and storage controller options. The server delivers performance and expandability for 2P rack deployments with high reliability.
The document discusses the MSI Z77 MPOWER motherboard. It was designed based on feedback from overclockers and features enhanced components, power delivery, and cooling for extreme overclocking. It includes tools like the OC Genie II for easy one-button overclocking and Multi-BIOS II for recovery from failed overclocking attempts. The board is optimized for high performance multi-GPU configurations and long-term heavy overclocking use.
This document summarizes the evolution of computer motherboards from early processors like the 8086 to later Pentium models. It provides specifications for each board including the processor, manufacturer, memory capacity, and BIOS. It also describes user configurable settings like memory and I/O configurations through jumpers and switches.
The document provides information on the HPE ProLiant DL20 Gen10 Server, including:
- It is a 1U rack server powered by Intel Xeon E, Pentium, and Core i3 processors, offering flexibility and value.
- Standard features include Intel C242 chipset, up to 64GB memory, 1Gb Ethernet ports, and various storage options.
- It comes in various pre-configured models for entry, performance, and solution workloads.
The document provides specifications for Qualcomm's Snapdragon series of mobile processors, including the Snapdragon 800, 600, 400, and 200. It lists the key components and specifications for each model, such as the CPU, GPU, memory support, camera capabilities, and modem/wireless features. The Snapdragon 800 is the highest-end model supporting up to 2.3GHz CPUs and 4K video capture, while the Snapdragon 200 is the lowest-end model supporting up to 1.4GHz CPUs and 720p video.
The Rico Board is an excellent high-performance Single Board Computer using the newest TI’s AM437x Sitara ARM Cortex-A9 based solution. It has 512MB DDR3, 4GB eMMC Flash, 16MB QSPI Flash and 32KB EEPROM on board, featuring various peripherals like Debug Serial, USB, Gigabit Ethernet, Dual-Camera, TF, HDMI, LCD and etc. It is preloaded with Linux and supplied with optional 7-inch LCD Module including capacitive touch screen. More information can be found at MYIR's website: http://www.myirtech.com/list.asp?id=510
NSA, GCHQ, Five, Nine and Fourteen Eyes White Paper on Cybersecurity Exploit ...Michael Holt
The document lists and describes various tools and exploits developed by the NSA/CIA to infiltrate and gain persistent access to computer systems and networks. These include BIOS exploits to implant spying software that survives operating system reinstalls (DEITYBOUNCE, IRONCHEF), exploits that modify firewall firmware to persistently implant spyware (FEEDTHROUGH, GOURMETTROUGH, HALLUXWATER, JETPLOW, SOUFFLETROUGH), and exploits that modify hard drive firmware to survive operating system changes (IRATEMONK, SWAP). It also describes tools for intercepting wireless communications, hacking phones, and simulating cell towers to track targets.
This document provides specifications for a smartwatch, including:
- It has a 1.65" IPS LCD screen and is powered by a Qualcomm Snapdragon 400 processor with 512MB of RAM and 4GB of storage.
- Sensors include a 9-axis accelerometer, compass and gyroscope for tracking motion and orientation.
- Connectivity options include Bluetooth 4.0 and it charges via a micro USB port on a charging cradle.
- The battery has a capacity of 400mAh.
AMD technology powers 4 of the top 5 fastest supercomputers in the world. AMD was also the first to release a quad-core CPU over 6.5GHz and the fastest graphics card. More recently, AMD launched new processors and chipsets, improved graphics drivers, and partnered to bring 500,000 Android apps to PCs. AMD has advantages over competitors like larger L1 CPU caches, easier overclocking tools, power efficiency technologies, and upgradeability across motherboards.
PIC Introduction and explained in detailedAnkita Tiwari
The document provides an introduction to the PIC microcontroller. It discusses what a microcontroller is, compares microcontrollers to general purpose microprocessors, and briefly outlines the history of the PIC microcontroller. It then describes features of the PIC16F84 microcontroller including its clock generator, reset function, ports, central processing unit, and memory organization including flash memory, RAM, and ROM. It also covers the timer and prescalar functions.
The document provides an overview of the key features and architecture of NXP Semiconductors' LPC213x microcontroller family. The LPC213x MCUs are based on an ARM7TDMI-S CPU with on-chip flash memory and RAM. They include features such as GPIO ports, UARTs, I2C interfaces, SPI, PWM, ADC, DAC, RTC, and watchdog timer. The MCUs also support in-system programming, debugging via EmbeddedICE, and instruction tracing with an embedded trace macrocell.
The document describes the features of an AVR 8-bit microcontroller, including its RISC architecture, memory capabilities, I/O ports, timers, USB and peripheral features. It has 8/16/32KB of flash memory, 512/512/1024 bytes of EEPROM and SRAM, and 22 programmable I/O lines. It includes analog and digital features such as timers, USART, SPI and a USB controller.
Chp4 introduction to the pic microcontroller copymkazree
The document provides an introduction to the PIC microcontroller, including:
1) It describes the basic components and architecture of microcontrollers compared to microprocessors.
2) It outlines the history and features of the popular PIC microcontroller family from Microchip Technology, including the PIC16F84 model.
3) It explains the core components of the PIC16F84 including ports, memory organization, clock generator, and the central processing unit.
This document provides details about the MSP430x5xx microcontroller including its block diagram, CPU architecture, memory map, I/O ports, interrupts, clock system, low power modes, watchdog timer and more. Key aspects include its 16-bit RISC CPU, various clock signals, flash memory up to 512KB, RAM up to 66KB, 8 I/O ports, analog to digital converter, timers, real-time clock, and low power modes down to 0.1uA. Example code is provided to configure ports for output and LED interfacing.
This document describes the architectural features and peripheral functions of the PIC16F873 microcontroller. It discusses the microcontroller core, which uses a Harvard architecture with separate program and data memory. It then describes the peripheral features including timers, I/O ports, serial communication interfaces, and analog-to-digital converter. Diagrams are included showing the memory map, pin configuration, and block diagrams of timers and serial communication modules. The document provides a detailed overview of the capabilities and operation of the PIC16F873 microcontroller.
This document provides information about microprocessors, microcontrollers, and the Intel 8085 and 8051 chips. It discusses how a microprocessor incorporates a computer's central processing unit on a single integrated circuit, and how microcontrollers are designed for embedded applications. Key aspects of microcontrollers covered include on-chip RAM, timers, serial ports, interrupt controllers, analog-to-digital converters, and pulse width modulation controllers. An example block diagram and features are given for the Intel 8051 microcontroller. Example Arduino/Freeduino programs are also summarized.
This document provides an overview of an embedded systems course that focuses on the LPC 2148 ARM processor. The objectives are to study the architecture and design aspects of the LPC 2148, including I/O and memory interfacing. The outcomes include designing and implementing programs on the LPC 2148 as well as studying communication interfaces and scheduling algorithms. The course is divided into 5 modules that cover the ARM instruction set, LPC 2148 architecture, peripherals, operating system overview, and the μC/OS-II real-time kernel. Learning resources include textbooks on embedded systems, ARM architecture, and real-time concepts.
AN INTEGRATED FOUR-PORT DC-DC CONVERTER-CEI0080Vivek Venugopal
This document proposes a novel four-port DC/DC converter topology for renewable energy applications. The proposed topology adds two switches and two diodes to a traditional half-bridge topology to interface two power sources, one bidirectional storage port, and one isolated load port. Zero-voltage switching is achieved for all four main switches. Three ports can be tightly regulated through independent duty cycles while the fourth is unregulated to maintain power balance. Experimental results confirm independent control over three processing paths with low component count and losses.
The document provides an overview of the LPC214x microcontroller family from NXP Semiconductors, which features an ARM7 processor, on-chip flash memory, RAM, analog and digital peripherals like USB, SPI, I2C, and GPIO. It describes the memory architecture and maps as well as the system control block and various peripherals included in the MCU, such as timers, serial interfaces, and an ADC. The document also outlines programming and debugging tools available for the LPC214x family like in-system programming, an embeddedICE logic for debugging, and a trace macrocell for instruction tracing.
The TMS320C5x DSP architecture is based on the C25 with some enhancements. It uses a Harvard architecture with separate program and data memory buses. The CPU contains a CALU for arithmetic, PLU for logic, and ARAU for address calculations. On-chip memory includes ROM, DARAM, and SARAM. Peripherals include serial ports, timers, interrupts, and I/O. The architecture provides high performance with low power consumption and compatibility with prior C series DSPs.
This document provides information about the LPC2148 microcontroller socket board. It includes specifications like the LPC2148 microcontroller with 512K memory, 12MHz and 32.768KHz crystals, and a power on reset circuit. Key features of the LPC2148 microcontroller are also summarized, such as 40kB RAM, 512kB flash, USB and serial interfaces, analog and digital I/O, and low power modes. The socket board is used to mount and develop projects with the LPC2148 microcontroller.
The document describes the AT89S51 microcontroller. It has 4K bytes of in-system programmable flash memory, 128 bytes of RAM, 32 I/O lines, and features like timers, serial communication, and low power modes. The microcontroller is compatible with the 80C51 instruction set and provides a flexible and cost-effective solution for embedded applications.
The document discusses the PIC microcontroller architecture. It begins by explaining what PIC stands for and how PIC microcontrollers have become important in industrial automation and embedded applications. It then provides a brief history of PIC development. The document goes on to describe the different categories of PIC microcontrollers based on internal architecture, including baseline, mid-range, enhanced mid-range, and PIC18. It also discusses the core features of PIC microcontrollers like instruction set, register file architecture, and interrupt logic. Finally, it explains some key architectural features like Harvard architecture and reduced instruction set that enable fast execution speeds.
The document discusses various mechanisms for CPU input and output (I/O), including registers that interface between devices and the CPU, UARTs for serial communication, and programming techniques like memory-mapped I/O and busy-wait I/O. It also covers interrupts, describing how devices signal the CPU to execute interrupt handlers, and advantages of interrupts over busy-wait I/O. The document discusses interrupt prioritization, vectors, overhead, and implementations in ARM. Finally, it briefly mentions exceptions, traps, co-processors, and caches.
1. Calibrate the line sensor readings by taking multiple samples while turning left and right to determine the minimum and maximum values.
2. Continuously read the line sensor position and calculate the proportional, integral, and derivative terms based on the error from the center.
3. Determine the difference in motor powers needed to turn toward the center based on the PID values, without allowing negative powers.
4. Set the motor speeds based on the power difference to steer toward the center line.
The document provides an overview of ST7 8-bit microcontrollers from STMicroelectronics. It describes the ST7 portfolio, features, and peripherals. The ST7 is an 8-bit CISC core with up to 60KB program memory and 5KB RAM. It has flash memory options, a rich peripheral set including timers, serial interfaces, and USB/CAN connectivity. The document outlines the ST7 architecture and interrupt system, memory types, programming tools, and applications.
INDUSTRIAL TRAINING REPORT EMBEDDED SYSTEM.pptxMeghdeepSingh
This document provides an overview of embedded systems and microcontrollers. It defines a microcontroller as a single-chip computer containing memory, input/output circuitry, and other components to function without additional support. The document describes the features and components of a typical microcontroller, including registers, instruction sets, addressing modes, and peripherals. It compares microcontrollers to microprocessors and provides examples of using LEDs and 7-segment displays with microcontrollers.
3. Two Versions - Logan and Denver
Logan - 32 bit quad-core 4-PLUS-1 ARM Cortex
A15 CPU; upto 2.3GHz; 28 nm process
Logan - Two part nos. available CD575M and
CD575MI
Denver - 64 bit dual core based on ARMv8
architecture; upto 2.5GHz
64kB L1;32kB of I-cache and 32kB D-cache
2MB L2 cache
OUR FOCUS → LOGAN
5. Vector graphics is the
use of geometrical
primitives such as
points, lines, curves,
and shapes or
polygons—all of
which are based on
mathematical
expressions—to
represent images in
computer graphics
6. Rasterisation (or
rasterization) is the
task of taking an
image described in a
vector graphics
format (shapes) and
converting it into a
raster image (pixels
or dots) for output on
a video display or
printer, or for storage
in a bitmap file
format.
7. Reason- mobile devices are in standby state for
almost 80% time → power saving
4-PLUS-1 CPU → 4 HIGH performance more
power intensive cores and 1 LOW power, low
performance core
S/W b/w cores done on basis of processing reqd.;
intelligent s/w hysteresis
Total Power = Leakage + Dynamic
Dynamic Power α Frequency x (Voltage)2
8. Fast Process = Optimized for high frequency
operation, but higher leakage
Low Power Process = Operates at lower
frequency with lower leakage
High to low performance crossover at 600MHz
Low power core has peak freq. of 1GHz
Both cores are OS transparent
Not all 4 high performance cores active; dynamic
enable/disable
Note: all the 5 cores cannot be active
simultaneously
9.
10.
11.
12. Motive is to free the CPU
Handle varied workload and use GPU efficiently
Run complex, less structured tasks
Any kernel can launch another kernel and can
create the necessary streams,events and
dependencies needed to process additional work
without the need for host CPU interaction.
13. GPU core can be used by multiple CPUs
Enables multiple CPU cores to launch work on a
single GPU simultaneously
Increases GPU utilization and slashing CPU idle
times
32 simultaneous, hardware managed
connections(?)
17. About the SCU
The SCU connects one to four Cortex-A9
processors to the memory system through the
AXI interfaces.
The SCU functions are to:
maintain data cache coherency between the
Cortex-A9 processors
initiate L2 AXI memory accesses
arbitrate between Cortex-A9 processors
requesting L2 accesses
manage ACP accesses.
Snoop Control Unit(SCU)Snoop Control Unit(SCU)
18. AGENDA
AVP
MPIO
Interrupt Controllers
Clock
Boot
Power States
PMC
Flow Controller
Power Architecture
Memory Controller
Peripherals
19. AVP- Audio Video Processor
Functions
- Manage initial boot stages
- Control and assist hardware audio decoding
blocks, BSEA and VCP2
- Control and assist hardware video decoder,VDE
256 kB local RAM(IRAM)
8kB cache
20. Muti- purpose I/O : MPIOMuti- purpose I/O : MPIO
Each MPIO consists of:
Output driver with:
-Tri state capability
- Drive strength controls
-Push pull mode, open drain mode or both
Input receiver with Schmitt mode, CMOS mode or
both
Weak pull up or pull down
They stay in their POR state until changed by
software(bootloader or OS)
Default pad drive impedance is 50 ohms
21. 5 types of MPIO pads:
ST(Standard)
DD(dual driver)- 3.3V tolarant(pull up resistor)
regardless of i/p V....must be set to open drain
mode...special pwr seq considerations for this
OD(open drain)-5V tolerant..no push pull driver
CZ(controlled Z)-tigntly controlled Z
LV- 1.8V tolerant
MPIO....contd.MPIO....contd.
22. MPIO....contd.MPIO....contd.
Each MPIO can have upto 5 functions- upto 4
SFIO( special funtion wherein they are for
peripherals) and 1 as GPIO
Pinmux controller handles MPIO functionality and
has one register per MPIO
24. GPIO Controller
GPIO controller is divided into 8 banks
Each bank handles upto 32 MPIOs
Within each bank, GPIOs are arranged as 4 ports
of 8 bits each
162 GPIOs in all
Individually config. as Input, output, interrupt
source with edge/level triggering
Lock bit functionality(optional) ensures GPIO
config. is not modified during runtime, system
reset can clear this bit
25. Unused Pin- PWR Saving
Assert tri state and disable input buffer
If all pins in a pad control group are unused, set
the drive strengths and slew rates to a minimum
If all pins on a power rail are unused, assert
E_NO_IOPOWER for that rail in the PMC registers
26. Two- vGIC(Virtual generic Interrupt controller) and
LIC(Legacy Interrupt controller)
vGIC- For the ARM15 CPUs and LIC for the
ARM7 AVP
160 hardware interrupts grouped into slices of 32
where each slice can be configured independently
27. There is one vGIC per CPU cluster and runs at
half the clk freq. of that cluster
vGIC supports 256 interrupts each with a unique
ID
Interrupt sources for vGIC
Software Generated Interrupts(SGI)
Private Peripheral Interrupts(PPI)
Shared Peripheral Interrupts(SPI)
28. SGIs(also called IPIs ie Inter Processor Interrupts)
generated by writing to vGIC registers, max. of 16
in no., ID 0 to 15
PPIs are generated by a peripheral that is specific
to a CPU. 7 PPIs per CPU. nFIQ and nIRQ
provided as pins.(?)
SPIs are external hardware interrupts given via
IRQ pins and also by internal SoC units. Level
triggered
InterruptInterrupt
Controllers.....contd.Controllers.....contd.
29. Two external Clks- 32.768kHz(for PMC and RTC) and
12MHz
16 PLLs
For saving power by clock gating refer page 78 of TRM
Each peripheral has its own CLOCK_SOURCE register- 2
bits to select from 4 clk sources and 8 bits for clk divider, 7
for integer and 1 for fraction
CL-DVFS(Closed Loop Dynamic Voltage and Frequency
Scaling) register help controlling clock and power supply to
FCPU(fast CPU) complex
30. RTC
Maintains sec and ms counters
5 alarm registers
Always ON pwr domain
Can issue interrupts in LP states
Hardware adjusts drifts in clock due to PPM
variations of osc
All registers(except BUSY) use 32KHz clk domain
31. TIMERS
RTC
Nvidia Generic Timers (10 nos)
WDT- 5 nos: 1 per FCPU and 1 for COP(AVP)[LP
CPU doesn't have WDT?]
GIT- ARM CPU Generic Timers(4 timers per CPU:
Secure & Non Secure Physical Timers; Hypervisor
Timer and Virtual timer)
TSC-Generic Time System Counter- reference for
GIT. Its a part of PMC
Note: any timer can be used as WDT
32. Power On Reset(POR)- deasserted externally
(SYS_RESET_N pin)
Reset by thermal Sensor
Watchdog Timer-Two types:
Deadman Timer(legacy) WDT-1st expiry interrupt issued
and on 2nd reset but only some subunits
WDT2- 1st expiry interrupt issued, on 2nd FIQ, on 3rd
CPU reset, on 4th full system reset
Software reset- Config bit in PMC; resets whole chip
LP0 wakeup reset- PMC logic controlled
33. During POR or system reset, reset controller
deasserts boot blocks first and then the CPU and
COP after 511 osc. clock periods to prevent
COP/CPU from talking to these boot devices while
itself still being in reset state
Non boot devices are brought into operation from
reset by software
At POR bits of registers
RST_DEVICES_L/H/U/V/W/X and
CLK_OUT_ENB_L/H/U/V/W/X are set by
hardware(pg 90 of TRM)
PORPOR
34. Blocks necessary for the boot are:
AVP with its L1
All systems buses like AHB, APB etc
Timer
RTC
NOR flash controller
eFUSE
GPIO
CoreSight- debug controller; one per cluster
38. Power States..contd.
LP2
Cluster switch (a variant of LP2)
- Cluster1 to 0 switch
-Cluster0 to 1 switch :CPU3 ie last of cluster0
initiates this switch
39. Power States..contd.
LP3(per CPU)
If CPU is idle for a short time its clock is ungated
ie CPU is halted( we have not pwr gated this CPU
only clk is stopped)
Only small wake up logic clk is enabled, others
ungated
LP3 exited on detection of IRQ or FIQ
Flow controller not needed, clk gating/ungating
internal to FCPUs and LPCPU
40. AVP Low Power States
No specific instruction to halt the AVP
However, its memory bus can be put into WAIT
state by flow controller (HALT State)
IRQ/FIQ and other wake events can bring AVP
out of halt state
During halt, AVP clk is automatically ungated by
hardware
AVP is NOT power gated
42. PMC....contd.
Provides interface to external PMIC
Controls votage switching/transitions as processor
changes power states(eg LP0, LP1)
Processes power/clock requests( acts as slave)
from various peripherals
To speed up operation, the PMC register file
operates in local peripheral interface bus domain
(APB) rather than in the 32KHz clock domain used
for PMC processing
43. Flow Controller-
IMPORTANT*
Provides sequencing of hardware controlled CPU
power states
Handles switching between CPU clusters 0 & 1
and also switching them OFF
Receives CPU pwr state requests from CPUs,
sends pwr ON/OFF requests to PMC which power
gates/ungates corresponding CPUs
Monitors per CPU interrupts and events to
determine CPU wake events
Initiates CPU wake
WFI(wait for interrupt) command used to trigger
low power states
45. Flow Controller....contd.
Note:
Flow controller has 3 different state machines-
* Main CPU flow controller state machines shown in
fig. above
* CPU rail power UP state machine
* State machine for COP
Flow controller uses CPU-ID (in MPID register) to
identify the cores
46. Power Architecture
There are sense pins for various system voltage
domains which access then continuously
47. Power Gating and Ungating
For CCPLEX PG partitions, sequencing ensured
by hardware when power gating is done via flow
controller
For SoC(non CCPLEX) PG partitions, sequencing
is done by software
Power gating controller- two in number
1. SoC PG controller
2. GPU PG controller
48. SoC PG Controller
Controls 8 zones and uses a fixed power ON/OFF
sequence using a fixed set of delays
Power OFF seq. is opposite of power ON
Same programming register for all zones
49. GPU PG Controller
GPU PG controlled by GPMU unit inside Kepler
GPU
Independent of SoC/CPU PG
If CPU and GPU share the same voltage rail (for
cost reduction), then software settings should
ensure that simultaneous PG of CPU and GPU
should not occur to avoid di/dt issues
50. Fast CPU PG COntroller
Used to power gate fast CPU partitions
Funtioning similar to SoC PG controller
51. Power Gating
Flow controller uses seperate state machine for
PG each CPU
PG done based on CPU-ID
Only one request handled at a time to avoid pwr
noise issues
Flow controller - PMC inerface has core ID and
not Cluster ID
As shown in figure, CPU and non CPU
components can be PG seperately
53. Power Gating....contd.
At boot,CPU rail is OFF by default. It can be
enabled by AVP using register write to PMC
registers
CPU rail can also be switched ON by PMIC (I2C
write)
COP can switch OFF the FCPUs
CPU and non CPU blocks cannot be switched
simultaneously
60. Peripherals- MIPI CSI 2.0
2 CSI interfaces, each supports upto 4 lanes
2 image sensors can be used simultaneously (eg
stereo apps.)
CSI B can support one additional single lane input