The document discusses the status and next steps for Nexteer's grey box request for information. It provides an updated technical concept for an open ECU with integrated connectors and discusses direct PCB access for motor position sensor calibration. Thermal simulations show the design can maintain junction temperatures below qualification limits. The document identifies some remaining uncertainties and provides alternatives for potential optimization.
This document provides a roadmap for changes to the BVH1 system from 2018-2019. It outlines 12 planned changes for introduction in October 2018 including decontenting capacitors, changing suppliers for various components, and localizing production of some parts in Europe. It also describes 10 changes planned for introduction in October 2019 such as localizing motor production in Europe, removing white gap filler, simplifying the worm shaft damping system, and moving to a solid motor coupling. The document discusses timing, risks, and milestones for development and launch of the changes.
Discover Infineon‘s first double sided cooling power module for automotive.
More information on that report at https://www.i-micronews.com/category-listing/product/infineon-ff400r07a01e3-double-side-cooled-igbt-module.html
Tesla Model 3 Inverter with SiC Power Module from STMicroelectronicssystem_plus
The first SiC power module in commercialized electric vehicles.
More information on that report at: http://www.systemplus.fr/reverse-costing-reports/tesla-model-3-inverter-with-sic-power-module-from-stmicroelectronics/
Broadcom AFEM-8072 – Mid and High Band LTE RF Front-End Module (FEM) - teardo...system_plus
The first mid/high band Long Term Evolution (LTE) Radio Frequency (RF) FEM in the Apple iPhone X integrates the latest generation of Film Bulk Acoustic Resonator (FBAR) technology with advanced and innovative packaging.
More information on that report at http://www.systemplus.fr/reverse-costing-reports/broadcom-afem-8072-mid-and-high-band-lte-rf-front-end-module-fem/
SPR21610 - Vitesco Technologies Power Module in Jaguar I-PACE Invertersystem_plus
Multiple optimized packaging innovations for this automotive power module from Vitesco Technologies.
More : https://www.systemplus.fr/reverse-costing-reports/vitesco-technologies-power-module-in-jaguar-i-pace-inverter/
The document discusses the status and next steps for Nexteer's grey box request for information. It provides an updated technical concept for an open ECU with integrated connectors and discusses direct PCB access for motor position sensor calibration. Thermal simulations show the design can maintain junction temperatures below qualification limits. The document identifies some remaining uncertainties and provides alternatives for potential optimization.
This document provides a roadmap for changes to the BVH1 system from 2018-2019. It outlines 12 planned changes for introduction in October 2018 including decontenting capacitors, changing suppliers for various components, and localizing production of some parts in Europe. It also describes 10 changes planned for introduction in October 2019 such as localizing motor production in Europe, removing white gap filler, simplifying the worm shaft damping system, and moving to a solid motor coupling. The document discusses timing, risks, and milestones for development and launch of the changes.
Discover Infineon‘s first double sided cooling power module for automotive.
More information on that report at https://www.i-micronews.com/category-listing/product/infineon-ff400r07a01e3-double-side-cooled-igbt-module.html
Tesla Model 3 Inverter with SiC Power Module from STMicroelectronicssystem_plus
The first SiC power module in commercialized electric vehicles.
More information on that report at: http://www.systemplus.fr/reverse-costing-reports/tesla-model-3-inverter-with-sic-power-module-from-stmicroelectronics/
Broadcom AFEM-8072 – Mid and High Band LTE RF Front-End Module (FEM) - teardo...system_plus
The first mid/high band Long Term Evolution (LTE) Radio Frequency (RF) FEM in the Apple iPhone X integrates the latest generation of Film Bulk Acoustic Resonator (FBAR) technology with advanced and innovative packaging.
More information on that report at http://www.systemplus.fr/reverse-costing-reports/broadcom-afem-8072-mid-and-high-band-lte-rf-front-end-module-fem/
SPR21610 - Vitesco Technologies Power Module in Jaguar I-PACE Invertersystem_plus
Multiple optimized packaging innovations for this automotive power module from Vitesco Technologies.
More : https://www.systemplus.fr/reverse-costing-reports/vitesco-technologies-power-module-in-jaguar-i-pace-inverter/
Texas Instruments’ LMG5200 GaN Power Stage - 2018 teardown reverse costing re...system_plus
The first 80V half-bridge GaN power stage from TI, with innovative packaging.
More information on that report at http://www.systemplus.fr/reverse-costing-reports/texas-instruments-lmg5200-gan-power-stage/
01 Introduction 8 series toyota presentation.pdfjcardy1985
This document provides information about Toyota's new 8 Series forklift models, including:
- The 8 Series model range which includes internal combustion and LPG powered forklifts in various lift capacities.
- Key design improvements over the 7 Series such as increased seat adjustment, better visibility, smaller steering wheel, and improved cooling system.
- Reliability improvement activities for the 8 Series including improved waterproofing of electrical components, optimized cooling fan and radiator positioning, and exhaust system modifications.
Design and Analysis Of Hybrid Car Using Tubular Frame Chasis and Helium GasIRJET Journal
This document describes the design and analysis of a hybrid car using a tubular frame chassis and helium gas. It discusses the components of the car including the electric DC motor, frame, battery, and drive. Chromoly steel 4130 is selected for the tubular frame chassis due to its high strength and stiffness properties. Helium gas is selected to fill the chassis due to its low density, lifting properties, and compliance with regulations. Structural analysis using ANSYS software shows the maximum deformation of the chassis design is within permissible limits. The car is powered by a battery and electric DC motor, with the goal of reducing weight through the use of helium gas in the frame.
Mitsubishi J1- Series 650V High-Power Modules for Automotivesystem_plus
The first power module with 7th-gen CSTBT IGBT and an innovative integrated substrate.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/mitsubishi-j1-series-650v-high-power-modules-for-automotive/
The document discusses the increasing use of plastics in automobiles as an alternative to metals. It provides examples of common plastic applications like instrument panels, engine components, and tires. Plastics compete with metals based on weight savings, design flexibility, and ease of fabrication. Specific plastic materials used in different car parts are listed. The document also discusses how plastics are processed and compares properties of plastics to metals. It highlights benefits plastics provide like weight reduction and lower tooling costs compared to metals for certain applications.
Introduction to Buses & Engine Systems.pptxMeghanNagvekar
The document provides an introduction to Tata Motors buses and engine systems. It discusses the objectives of the training program which are to understand Tata bus models, CNG fuel systems, and maintenance of CNG engines. The agenda covers an introduction to rear-engine and front-engine buses, an overview of compressed natural gas (CNG) and gas engine terminology, and details on the Cummins 6B5.9G and 3.8/5.7 SGI CNG engine systems including specifications and maintenance.
The 1st generation 1200V SiC MOSFET device from STMicroelectronics has good current density at a very competitive cost
The STC30N120 is the first generation 1200V SiC MOSFET device from STMicroelectronics. The device has a planar structure and a design that allows good electrical performance, such as high current density. Moreover, the supply chain and manufacturing choices lead to a very competitive cost.
The device is suitable for high power applications like motor drives, inverters, DC-DC converters and power supplies.
The STC30N120 integrates first generation high-voltage SiC power MOSFET dies in a dedicated discrete package.
The device is assumed to operate at very high temperature, up to 200°C, and to have an on-resistance of 90mΩ, with generally standard SiC manufacturing technology.
The report goes into depth in its analysis of the packaging and the components, with images of the complex planar SiC structure.
It also includes production cost analysis and detailed comparison with Rohm and Wolfspeed’s SiC MOSFETs and with 1200V silicon IGBTs. The comparison highlights differences in the electrical parameters, supply chain and production cost.
For more information, please visit our website: http://www.i-micronews.com/reports.html
Take a look at the fifth generation of EPC’s low voltage transistor
The low voltage GaN device market is increasingly important, and Efficient Power Conversion Corporation (EPC) is a major player in low voltage GaN-on-silicon high-electron-mobility transistor (HEMT) devices. 100V GaN HEMTs are a very new technology but they already compete with silicon transistors, especially in the field of megahertz high frequency applications.
System Plus Consulting has investigated the company’s EPC2045 device, its latest driving 100V for applications such as single-stage 48V converters, USB-C data and power connectors, LiDAR sensors, point-of-load converters and loads in open rack server architectures.
With its new transistor and GaN epitaxy design, the EPC2045 achieves a breakdown voltage of 100V for a current of 16A at 25°C, and a very low RdsOn on-resistance of 7mΩ compared to the previous generation.
The chip-scale packaging of EPC products reduces the final device cost and decreases its inductance, bringing advantages not only with respect to competitors in GaN, but also silicon.
Compared to silicon transistors, GaN process developments have significantly lowered capacitance. This translates into lower gate drive losses and lower device switching losses at higher frequencies for the same on-resistance and voltage rating.
More information on that report at http://www.i-micronews.com/reports.html
The document discusses plans for developing a next generation electric vehicle (EV) project. It includes sections on project background, product and technology concepts, performance goals, a project schedule and budget, collaboration plans, and applications of EV technology. Design concepts include a composite plastic body, battery rental programs, and regional assembly systems. Performance goals include a range of 80-120 km per charge and acceleration of 0-96 km/h in under 10 seconds.
UnitedSiC UJN1205K 1200V SiC JFET report published by System Plus Consultingsystem_plus
Discover the technological choices made by United Silicon Carbide Inc. (UnitedSiC) for its most advanced SiC JFET and its associated features
More information on that report at: http://www.systemplus.fr/reverse-costing-reports/unitedsic-ujn1205k-1200v-sic-jfet/
The first 600V system-in-package half-bridge driver from STMicroelectronics integrating two GaN-based HEMTs.
More information: https://www.systemplus.fr/reverse-costing-reports/stmicroelectronics-mastergan1-half-bridge-driver/
Advanced Materials International Forum, Bari 18-19 settembre, conferenza internazionale dedicata ai materiali avanzati e alle loro possibili applicazioni nei settori industriali, con un focus particolare sui trasporti (aerospazio, automotive, navale e cantieristico).
Littelfuse and Monolith Semiconductors, in collaboration with X-Fab, have released a 1st-generation, high-reliability MOSFET with the hope of making this silicon carbide product mainstream.
The market outlook for SiC devices is promising, with a compound annual growth rate (CAGR) of 28% from 2016 – 2020. This will increase to 40% from 2020 – 2022 due to growth among automotive and industrial applications. In total, the SiC market will exceed $1B in 2022. In the energy conversion sector, SiC devices have an actual value of $250M, which will increase by around 28% in 2022. The reason for this relates to market forces pushing for loss reduction, not only for the sake of improved efficiency but also for smaller packages.
More information on that report a http://www.systemplus.fr/reverse-costing-reports/littelfuse-silicon-carbide-mosfet-lcis1mo120e0080-1200v-25a-80mohms/
Design and Fabrication of Inbuilt Hydraulic Jack for Four WheelersIRJET Journal
This document describes the design and fabrication of an inbuilt hydraulic jack system for four-wheel vehicles. The system is designed to lift vehicles from inside the cabin using switches on the dashboard, eliminating the need for manual jacking. It consists of hydraulic cylinders installed on both sides of the vehicle frame powered by a hydraulic pump. The cylinders can lift either side of the vehicle independently. The document provides details on the components, design calculations, methodology, cost analysis and conclusions on the potential benefits of the system for improving vehicle maintenance efficiency.
Broadcom AFEM-8100 System-in-Package in the Apple iPhone 11 Seriessystem_plus
This document provides a reverse costing analysis of the Broadcom AFEM-8100 SiP used in the Apple iPhone 11 series. It includes a physical analysis of the module and its dies, as well as a manufacturing process flow and cost analysis. Broadcom remains the sole supplier of the multi-die module, which features power amplifier, switch, filter and other dies. The analysis finds innovations that reduce the package size and cost, including a new EMI shielding integration method.
Texas Instruments’ LMG5200 GaN Power Stage - 2018 teardown reverse costing re...system_plus
The first 80V half-bridge GaN power stage from TI, with innovative packaging.
More information on that report at http://www.systemplus.fr/reverse-costing-reports/texas-instruments-lmg5200-gan-power-stage/
01 Introduction 8 series toyota presentation.pdfjcardy1985
This document provides information about Toyota's new 8 Series forklift models, including:
- The 8 Series model range which includes internal combustion and LPG powered forklifts in various lift capacities.
- Key design improvements over the 7 Series such as increased seat adjustment, better visibility, smaller steering wheel, and improved cooling system.
- Reliability improvement activities for the 8 Series including improved waterproofing of electrical components, optimized cooling fan and radiator positioning, and exhaust system modifications.
Design and Analysis Of Hybrid Car Using Tubular Frame Chasis and Helium GasIRJET Journal
This document describes the design and analysis of a hybrid car using a tubular frame chassis and helium gas. It discusses the components of the car including the electric DC motor, frame, battery, and drive. Chromoly steel 4130 is selected for the tubular frame chassis due to its high strength and stiffness properties. Helium gas is selected to fill the chassis due to its low density, lifting properties, and compliance with regulations. Structural analysis using ANSYS software shows the maximum deformation of the chassis design is within permissible limits. The car is powered by a battery and electric DC motor, with the goal of reducing weight through the use of helium gas in the frame.
Mitsubishi J1- Series 650V High-Power Modules for Automotivesystem_plus
The first power module with 7th-gen CSTBT IGBT and an innovative integrated substrate.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/mitsubishi-j1-series-650v-high-power-modules-for-automotive/
The document discusses the increasing use of plastics in automobiles as an alternative to metals. It provides examples of common plastic applications like instrument panels, engine components, and tires. Plastics compete with metals based on weight savings, design flexibility, and ease of fabrication. Specific plastic materials used in different car parts are listed. The document also discusses how plastics are processed and compares properties of plastics to metals. It highlights benefits plastics provide like weight reduction and lower tooling costs compared to metals for certain applications.
Introduction to Buses & Engine Systems.pptxMeghanNagvekar
The document provides an introduction to Tata Motors buses and engine systems. It discusses the objectives of the training program which are to understand Tata bus models, CNG fuel systems, and maintenance of CNG engines. The agenda covers an introduction to rear-engine and front-engine buses, an overview of compressed natural gas (CNG) and gas engine terminology, and details on the Cummins 6B5.9G and 3.8/5.7 SGI CNG engine systems including specifications and maintenance.
The 1st generation 1200V SiC MOSFET device from STMicroelectronics has good current density at a very competitive cost
The STC30N120 is the first generation 1200V SiC MOSFET device from STMicroelectronics. The device has a planar structure and a design that allows good electrical performance, such as high current density. Moreover, the supply chain and manufacturing choices lead to a very competitive cost.
The device is suitable for high power applications like motor drives, inverters, DC-DC converters and power supplies.
The STC30N120 integrates first generation high-voltage SiC power MOSFET dies in a dedicated discrete package.
The device is assumed to operate at very high temperature, up to 200°C, and to have an on-resistance of 90mΩ, with generally standard SiC manufacturing technology.
The report goes into depth in its analysis of the packaging and the components, with images of the complex planar SiC structure.
It also includes production cost analysis and detailed comparison with Rohm and Wolfspeed’s SiC MOSFETs and with 1200V silicon IGBTs. The comparison highlights differences in the electrical parameters, supply chain and production cost.
For more information, please visit our website: http://www.i-micronews.com/reports.html
Take a look at the fifth generation of EPC’s low voltage transistor
The low voltage GaN device market is increasingly important, and Efficient Power Conversion Corporation (EPC) is a major player in low voltage GaN-on-silicon high-electron-mobility transistor (HEMT) devices. 100V GaN HEMTs are a very new technology but they already compete with silicon transistors, especially in the field of megahertz high frequency applications.
System Plus Consulting has investigated the company’s EPC2045 device, its latest driving 100V for applications such as single-stage 48V converters, USB-C data and power connectors, LiDAR sensors, point-of-load converters and loads in open rack server architectures.
With its new transistor and GaN epitaxy design, the EPC2045 achieves a breakdown voltage of 100V for a current of 16A at 25°C, and a very low RdsOn on-resistance of 7mΩ compared to the previous generation.
The chip-scale packaging of EPC products reduces the final device cost and decreases its inductance, bringing advantages not only with respect to competitors in GaN, but also silicon.
Compared to silicon transistors, GaN process developments have significantly lowered capacitance. This translates into lower gate drive losses and lower device switching losses at higher frequencies for the same on-resistance and voltage rating.
More information on that report at http://www.i-micronews.com/reports.html
The document discusses plans for developing a next generation electric vehicle (EV) project. It includes sections on project background, product and technology concepts, performance goals, a project schedule and budget, collaboration plans, and applications of EV technology. Design concepts include a composite plastic body, battery rental programs, and regional assembly systems. Performance goals include a range of 80-120 km per charge and acceleration of 0-96 km/h in under 10 seconds.
UnitedSiC UJN1205K 1200V SiC JFET report published by System Plus Consultingsystem_plus
Discover the technological choices made by United Silicon Carbide Inc. (UnitedSiC) for its most advanced SiC JFET and its associated features
More information on that report at: http://www.systemplus.fr/reverse-costing-reports/unitedsic-ujn1205k-1200v-sic-jfet/
The first 600V system-in-package half-bridge driver from STMicroelectronics integrating two GaN-based HEMTs.
More information: https://www.systemplus.fr/reverse-costing-reports/stmicroelectronics-mastergan1-half-bridge-driver/
Advanced Materials International Forum, Bari 18-19 settembre, conferenza internazionale dedicata ai materiali avanzati e alle loro possibili applicazioni nei settori industriali, con un focus particolare sui trasporti (aerospazio, automotive, navale e cantieristico).
Littelfuse and Monolith Semiconductors, in collaboration with X-Fab, have released a 1st-generation, high-reliability MOSFET with the hope of making this silicon carbide product mainstream.
The market outlook for SiC devices is promising, with a compound annual growth rate (CAGR) of 28% from 2016 – 2020. This will increase to 40% from 2020 – 2022 due to growth among automotive and industrial applications. In total, the SiC market will exceed $1B in 2022. In the energy conversion sector, SiC devices have an actual value of $250M, which will increase by around 28% in 2022. The reason for this relates to market forces pushing for loss reduction, not only for the sake of improved efficiency but also for smaller packages.
More information on that report a http://www.systemplus.fr/reverse-costing-reports/littelfuse-silicon-carbide-mosfet-lcis1mo120e0080-1200v-25a-80mohms/
Design and Fabrication of Inbuilt Hydraulic Jack for Four WheelersIRJET Journal
This document describes the design and fabrication of an inbuilt hydraulic jack system for four-wheel vehicles. The system is designed to lift vehicles from inside the cabin using switches on the dashboard, eliminating the need for manual jacking. It consists of hydraulic cylinders installed on both sides of the vehicle frame powered by a hydraulic pump. The cylinders can lift either side of the vehicle independently. The document provides details on the components, design calculations, methodology, cost analysis and conclusions on the potential benefits of the system for improving vehicle maintenance efficiency.
Broadcom AFEM-8100 System-in-Package in the Apple iPhone 11 Seriessystem_plus
This document provides a reverse costing analysis of the Broadcom AFEM-8100 SiP used in the Apple iPhone 11 series. It includes a physical analysis of the module and its dies, as well as a manufacturing process flow and cost analysis. Broadcom remains the sole supplier of the multi-die module, which features power amplifier, switch, filter and other dies. The analysis finds innovations that reduce the package size and cost, including a new EMI shielding integration method.
Similar to NEXTEER_-_Concept_optimization_2015-08-11_V2.pdf (16)
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Website: www.dashrentacarbah.com
2. NEXTEER - HELLA Meeting - CCA Grey Box Price Indication
Concept Overview
2 Confidential ISO 16016 NEXTEER - HELLA Meeting | E-SC | E.Rigaud| Aug 11, 2015
Saginaw May 18, 2015 Lippstadt June 17, 2015
Aug 11, 2015
3. 3 Confidential ISO 16016
NEXTEER - HELLA Meeting - CCA Grey Box Price Indication
Concept Overview – Updates summary
Concept May 18, 2015 Concept June 17, 2015 Concept Aug 11, 2015
General MD
concept
Motor / Plastic housing / Heatsink
inside / PCB / plastic cover
Motor / Plastic housing / Heatsink
inside / PCB / plastic cover
PCB / Heatsink cover
Battery
connector
Yazaki connector RFQ Connector,
integrated into plastic housing
Existing stand alone
RFQ connector
CAN connector Specific connector Same as above Same as above
TOS connector Specific connector Connector (Molex) integrated into
housing, cable inside powerpack
Connector (Molex Mini 50)
integrated into housing,
cable inside powerpack
Cover / venting
element
Venting element integrated
into housing
Plastic cap inserted into cover
Venting element plugged into cover
Access for calibration given by
venting element opening
Open ECU
Customer motor
leadframe
Change requested by Hella Only a cut of blades is needed. Only a cut of blades is needed
Sealing ECU /
motor
O-ring placed on motor Gasket placed on ECU (housing) Gasket placed on motor
Electronic
components
9 MOSFETs
1 reverse polarity protection MOSFET
6 MOSFETs (no phase cut off)
1 reverse polarity protection MOSFET
6 MOSFETs (no phase cut off)
1 reverse polarity protection MOSFET
NEXTEER - HELLA Meeting | E-SC | E.Rigaud| Aug 11, 2015
4. NEXTEER - HELLA Meeting - CCA Grey Box Price Indication
Concept Overview – Manufacturing Flow Chart
PCB
PCB double
side population
Boot loader
flashing
Panel
separation
Battery
connector
CM choke Motor
phases
Soldering on
PCB
Glue dispensing
for EMC fixation
soldering on
PCB
Equipped PCB
screwing
Thermal paste
dispensing
Marking
and
packing
End of line tests
ICT
PCB partial
coating
Capacitors Heatsink
Torque
connector
Insulator
Assembly
(glueing)
Motor
housing
ECU
Assembly
(screwing)
(@
Nexteer)
4 Confidential ISO 16016
5. NEXTEER - HELLA Meeting - CCA Grey Box Price Indication
Concept Overview – ECU Structure
Heatsink – aluminium die casting + machining
surfaces + thermal paste dispensed
Gasket for tightness between ECU & motor
placed on motor
Insulator – to prevent any contact between
motor phases & heatsink
Common mode choke placed on PCB before
soldering
5 Screws with self threading for PCB pressing
and fixation into heatsink
Equipped PCB (power MOSFETs + reverse +
filtering components + logic PCB components)
Motor housing
Thermal paste can be dispensed for better
thermal transfer between ECU and motor
housing
4 Screws for ECU / Motor group assembling
2 capacitors, battery connector, torque
connector & motor phases are placed on PCB
before selective soldering process
Hella delivery
Nexteer
5 Confidential ISO 16016 NEXTEER - HELLA Meeting | E-SC | E.Rigaud| Aug 11, 2015
6. 6 Confidential ISO 16016
NEXTEER - HELLA Meeting - CCA Grey Box Price Indication
Concept Overview – ECU Assembly Details
Saginaw May 18, 2015 Lippstadt June 17, 2015
Thermal paste
Screw M5
Heatsink
Bushing
ECU housing
Gasket
Motor housing
Thermal paste
Screw M5
Heatsink
Bushing
ECU housing
Gasket (O-ring)
Motor housing
Hella delivery
Nexteer
Toulouse August 11, 2015
Thermal paste
Screw M5
Heatsink (ECU housing)
Gasket
Motor housing
NEXTEER - HELLA Meeting | E-SC | E.Rigaud| Aug 11, 2015
7. 7 Confidential ISO 16016
NEXTEER - HELLA Meeting - CCA Grey Box Price Indication
New mechanical concept advantage – Gap closure plan
Advantages:
- Reduction of mechanical components number:
plastic housing and plastic cover removed.
- Better thermal performance
larger contact surface between ECU and Gearbox / Motor housing
- Simplified ECU/Motor interface
aluminum machined surface on both side
- Lower potential disturbances of the Motor Position Sensor
motor current lines distant from the MPS
NEXTEER - HELLA Meeting | E-SC | E.Rigaud| Aug 11, 2015
8. NEXTEER - HELLA Meeting - CCA Grey Box Price Indication
Products architecture comparison – Delivery stand
Heatsink
Common
mode choke
PCB
Battery
Connector*
Screws
TOS
connector
Capacitors
Motor phases
Concept August 2015 Concept May/June 2015
Cover
Venting element
Screws
PCB
Heatsink
Filtering
Plastic
housing
Sealing
Motor phases
Thermal surface between heatsink & motor : 1950 mm² Thermal surface between heatsink & motor : 1050 mm²
* Re-use of existing part(s) in production
8 Confidential ISO 16016 NEXTEER - HELLA Meeting | E-SC | E.Rigaud| Aug 11, 2015
9. 9 Confidential ISO 16016
NEXTEER - HELLA Meeting - CCA Grey Box Price Indication
Commercial offer comparison
Price indication Aug 11, 2015 Price indication May 19, 2015
Mechanical
parts
PCB / Heatsink cover Plastic housing / Heatsink inside / PCB / plastic cover
MOSFET IPLU300N04S4-1R1 (1.15 mOhm) IPLU300N04S4-R7 (0.76 mOhm)
Production Removal of process steps linked to plastic cover and
plastic housing
Process steps for plastic cover and plastic housing
Venting element No venting element Venting element quoted
Battery
connector
No battery connector/harness in the commercial offer
(directed part to be considered ?)
Battery connector in the plastic housing
=> Current price reduction estimation round about 7 Euro
NEXTEER - HELLA Meeting | E-SC | E.Rigaud| Aug 11, 2015