150615_Nexteer_Visit_(1).pdf June 2015 visit

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Property of Valeo. Duplication prohibited
Confidential
Confidential
Nexteer Visit
June, 2015

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Confidential
Agenda Day 1
Introduction to Valeo and PEL 13h30-14h
EPS ECU development 14-14h30
Markets
Our technical solutions to address the different market segments
Business models & our main customers
Project development: The critical steps of the design of an EPS ECU 14h30-15h30
Product architecture
Use of simulation
HW/SW integration (critical for EPS)
Autosar
Deep dive in the disciplines: HW, Mechatronics, SW, Validation 15h30-16h15
R&D tour 16h15 -17h

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Agenda (Day 2)
Introduction
Sablé plant presentation
Mother plan / daughter plant
Plant tour
SMD
Power Module
Assembly line
Debriefing

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List of attendees : Nexteer
Names Functions
Steve Spicer Global EPS Product Line Executive
Marc Ellis Global Supplier Development Engineer
Pierre Longuemare Customer Engineering manager
Neal Roller EPS Engineering Manager
Sastry Chimalakonda Enterprise Commodity Manager

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List of attendees : VALEO
Names Functions
Pierre Lebrun PEL R&D Director
Laurent Mainguet PEL Project Director
Benjamin Morlière Steering platform manager
François Pellier PEL HW metier manager
Marc Sylvestre PEL SW metier manager
Laurent Lapassade PEL Mecatronic metier manager
Mohamed Ait-Elhalj PEL validation metier manager
Erwan Nicot Medium Power R&D Manager
Stephane Charpentier Key account manager
Anthony Lucy Mecatronic Architect
Mimoun Askeur HW Architect
Raj Puttaiah Business development manager

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Agenda Day 1
Introduction to Valeo and PEL
EPS ECU development:
Markets
Business models
Project development:
Use of simulation tools
Building blocks
Deep dive in the disciplines

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A well-balanced customer base
*Excluding Nissan
** Including Nissan
85%
15%
Aftermarket
(incl miscellaneous
sales & tooling)
OEM
German
Asian**
Others
American
French*
30%
26%
16%
22%
6%
(1) At end 2014
Original equipment
12.7 Bn € sales (1)

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China
24%
A record order intake in 2014
17.5 Bn €
7,1
8,9 9,4 9,6
8,8
11,9
14,0
15,1 14,8
17,5
2005 2006 2007 2008 2009 2010 2011 2012 2013 2014
x 2
Europe
Asia
North
America
South
America
44%
34%
4%
18%

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Key figures 2014
78,500
Employees
50
Research &
Development
centers
133
Production
sites
29
Countries
15
Distribution
platforms

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Worldwide presence
2,900 Employees
8 Production sites
3%of sales*
11,779 Employees
16 Production sites
20%of sales*
39,071 Employees
59 Production sites
49%of sales*
(including Africa)
24,750 Employees
50 Production sites
28%of sales*
end 2014
* In % of OE sales

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Valeo worldwide ranking
Transmission
Systems
Electrical
Systems
Climate
Control
Driving
Assistance
Interior
Controls
Wiper
Systems
Lighting
Systems
#1
#1
#1
#2
#1
#2
end 2014
#2
Thermal
Powertrain #2

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Powertrain system business group
4 product groups
Medium power electronics
High Power Electronics for HEVs &
EVs
Electronics
Product Group “PEL”
- CO2 Emission
Reduction
Transmission Systems Product
Group “PTR”
Automatic Transmissions
Powershift Transmissions
Manual Transmissions
Friction Materials
Hydraulic Clutch Actuation
Combustion Engine Product Group
“PCE”
EMS ECUs
Actuators & Sensors
Boost & Coolant Control
Exhaust & Air Control
Air Charging Systems
System Engineering & Transversal Innovation
- Hybrid and Electric
- Pollutants Emission
Reduction
Electrical Systems Product Group
“PES”
Alternators
Electric Motors
Belt Starter Generator
Reinforced Starters
Starters
Energy conversion

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Powertrain Electronics: from 500W to 300 kW
Inverter: 320 kW in 10.8 L
Design and assembly of our own power modules:
cost and flexibility
More than 10 million power modules per year in 2019
Steering: more than 3 million parts per year

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Rio Bravo
(Mexico)
Troy
(USA)
Shenzhen
(China)
Shanghai
(China)
Cergy, Créteil
(France)
Sablé
(France)
Veszprem
(Hungary)
Front office
Development center
Plant
Mother plant = Sablé (France)
Drammen
(Norway)
Shinjuku
(Japan)
Footprint
Electronics Product Group “PEL” PEL plants are closed to Nexteer plants
- Vezsprem / Tichy
- Shenzen / Suzhou

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Agenda Day 1
Markets
Project development: The critical steps of the design of an EPS ECU
Use of simulation
Autosar
Deep dive in the disciplines: HW, Mechatronics, SW, Validation

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EPS Market penetration
0
10 000 000
20 000 000
30 000 000
40 000 000
50 000 000
60 000 000
70 000 000
80 000 000
90 000 000
2012 2013 2014 2015 2016 2017 2018
Units
Years
GLOBAL* LIGHT VEHICLE POWER STEERING TYPE USAGE: 2012 - 2018
EHPS
EPS
HPS
MANUAL
Source: IHS data
A fast growing market
Win market share now!

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0,5
1
KW
1,5
Tons
1 2 3 4 5
Pinion
Dual Pinion
HEPS
A/B C D/E SMALL TRUCK
Rack
EPS
Rack
24V – 48V
12V system area
Column
EPS HPS : Hydraulic Power Steering
HEPS : Hydro-Electric Power Steering
EPS : Electric Power Steering
SHP : Steering High Power
HEPS
EPS road Map
Power Steering Market Segmentation

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Our technical solutions to address the market segments
Below 130-140A:
discrete solutions
Above 130-140A: power module
Mercedes (C, E and S
classes) / BMW : power
module from Fairchild
VW – Audi:
Power module designed
and manufactured by
Valeo  better control of
quality and form factor
HEPS (PSA,
Renault): several
million units per
year since more
than 10 years

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PCB
IMS
DBC
Thermal
Dissipation
Power density
Compactness
WIRE BONDING
SMT
OVEN REFLOW
DBC : Direct Bonded Copper
IMS : Insulated Metal Substrate
PCB : Printed Circuit Board
SMT : Surface Mounted Technology
Power Module
CEPS
HEPS
EPS Rack concentric
Our technical solutions to address the market segments
EPS Rack parallel

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BOM improvements project after project
EPS1 (160 A peak) EPS 3 (130 A peak) EPS 4 (130 A peak)
- Discrete control board on FR4
- DBC power module
- Electronic on chassis
- ECU assembly at Valeo
- IMS power board
- Electronic on chassis
- ECU assembly at Valeo
- FR4 power board
- Chassis removal
- ECU assembly at customer
103mm
125.3mm
Ø93mm
96.3mm
101.5mm
124mm
Ø93mm
54mm
117mm
117mm
Long
Short
BOM: -20% vs. Ref.
BOM: -40% vs. Ref.
BOM: -32% vs. Ref.
EPS 2 (140 A peak)
Reference BOM
Discrete technologies are used until their maximum operating area
Mechanical parts are optimized thanks to a better process integration with the motor

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EPS Business Model
Hardware
design
Bios
Spec & Dvpt
(base SW)
Application
SW
Coding
Motor
tuning
External
SW
Integration
OEM 2
OEM 3
OEM 5
OEM 6
OEM 4
Mechatronic
(Hardware BTP)
OEM 1
Flexible approach to meet customer needs
Ability to integrate building blocks (HW, SW) from customers in a secured way

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EPS & HEPS
Valeo customers:
Thyssen Krupp Presta: Mercedes S-class, BMW
Volkswagen / Audi: MLB-evo platform
JTEKT: HEPS since more than 10 years (PSA, RSA)
VALEO already manufactures more than 3 million units per year

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Agenda Day 1
Markets
Use of simulation
Autosar

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Product architecture : Grey Box
The critical steps of the design of an EPS ECU
Product Specifications
Product Architecture
-Building blocks from Nexteer
-Building blocks from Valeo
Integration into the car, incl. Autosar
Validation of the
architecture:
simulations
Detailed
design
HW-SW integration:
a critical step

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Valeo EPS adaptation to Nexteer
interface (April 2015)
Objectives
Very simple integration with functions embedded on board
BOM & development cost reduction
Integration description
Power and command stage on one board
6 layers FR4 board: 70µm outer layers (Thermal management to confirm)
Embedded CM filter & DM filter on board
Embedded Motor connections on board
Dissipation on aluminium heat sink
Packaging proposal
EPS Nexteer Only one package for base and premium design
Design to Cost on Valeo EPS generic design
(December 2014)
Valeo EPS generic design
(June 2014)
Package compliant with customer 3D model “COMBINED PRIME
GREY BOX”

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Product architecture: use of building blocks
Use of building blocks @ Valeo:
Better quality from a better maturity
Better cost: both R&D cost and BOM cost
Possibility to introduce building blocks from a customer in a flexible and secured way
Example: design of an EPS ECU
15 building blocks
6 fully re-used from a previous development
6 adapted from previous developments
3 brand new building blocks

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Validation of the architecture through simulations
Usually, we need to freeze the architecture before DV tests
 significant risks on product definition
 high risks on EMC, thermal behavior …
To secure the design, we perform simulations:
Mechanics: vibrations
Thermal
EMC

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Simulation examples: power electronics components
Thermal behavior of the power electronics components,
Current in the chemical capacitors,
Curent and voltage in MOSFET
Mean_T_VA
IN OUT
sqrt( V(rms)**2 - V(mean)**2 )
OUT
mean
rms
Irms_capa
Ibatt
RMS_T_VA
IN OUT
H1
1
{VHT}
VHT
FS800_pinf in_8Lpm_Zth_model
Zth
Tamb
Tj_D
Tj_IGBT
Tsolder
V(theta_e) + acos( V(cos_phi) )
theta_e
cos_phi
OUT
f sw_prof ile
cosphi_prof ile
Imax
V(in) * sqrt(2)
in OUT
Theta_e
Imax
N
Theta_e
60
Tamb
Tj_UH
Tj_DUH
Iu
Iv
Iw
Puh
PDuh
Theta_e
sdt ( V(in) ) + Theta_e_init
in OUT
V(in) * 2*pi
in OUT
I_3ph_sin_v ar
Load
Imax
Theta
U
V
W
N
Irms_prof ile
Vph-n_prof ile
f e_prof ile
V(Vph-n) / (VHT/2)
v ph-n OUT
DPWM_max_min_3ph_f v ar_VA
U1
f sw WL_m
WL_p
WH_m
WH_p
VL_m
VL_p
VH_m
VH_p
UL_m
UL_p
UH_m
UH_p
theta
m
pi/12 initial angle to have maximum current on U phase
Erec.txt
Eof f .txt
Eon.txt
CARTO 2D (E v s I & Tj)
[0,1]
[0,1]
[0,1]
[0,1]
[0,1]
[0,1]
inv erter_IGBT_d_ideal_th1_VA
FS800_inv erter
PH_W
PH_V
PH_U
LS_W
LS_V
LS_U
HS_W
HS_V
HS_U
GND
BAT
Tj_DUH
Tj_UH
A
-0
40
80
120
Iph
/
A
-400
-200
0
200
400
Power
/
kW
-0
1
2
3
4
Time/Secs 1Secs/div
0 1 2 3 4 5 6 7 8
Tj
/
deg_C
60
70
80
90
100
110
120
Tj_UH
Tj_DUH
Puh
PDuh
Iw
Iv
Iu
Irms_capa
Ibatt

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Simulation examples: temperature profiles on the MOS during
parking cycles
Arms
-60
-40
-20
0
20
40
60
80
100
120
P_capa
/
W
0
0.5
1
1.5
2
2.5
Time/Secs 2Secs/div
0 2 4 6 8 10 12 14 16 18 20
P_mos
/
W
-0
4
8
12
16
20
P_ph
Mean=5.4375953A
P_ls
Mean=7.6665811A
P_hs
Mean=8.0759921A
P_capa
Mean=760.81665mA
Irms_W
Irms_V
Irms_U
the 3 Irms inputs must be signed
in case of locked rotor,
Erec.txt
Eof f .txt
Eon.txt
CARTO 2D (energy v s Iph & Temp)
centered intersectiv e PWM
inv erter_MOS_mean_model_th9_VA
U2
Activ e
Locked_rotor
Irms_U
BAT
Tj_UH
Tj_UREL
Tj_WL
Tj_WH
Tj_VL
Tj_VH
Tj_UL
Tj_VREL
Tj_WREL
Irms_V
Irms_W
Vbatt
activ e
locked_rotor
Capacitor power calculation
25
Tamb4
Mean=760.81665mA P_capa
Irms_V
Irms_U
Stimuli
locked_rotor
Irms_W
Irms_U
Iw_prof ile
pwls f ile Irms_W.txt
Iv _prof ile
pwls f ile Irms_V.txt
LR_prof ile
pwls f ile locked_rotor.txt
Iu_prof ile
pwls f ile Irms_U.txt
25
Tamb3
Vbatt
locked_rotor activ e
activ e
1
V_activ e
Vbatt
14
Vbatt
Irms_W
Irms_V
Irms_U
Mean=5.4375953A P_ph 25
Tamb1
Mean=8.0759921A P_hs
25
Tamb
25
Tamb2
Mean=7.6665811A P_ls
Irms_V
MOS power calculation
Irms_W
m cos_phi
1
V_cos_phi
m_prof ile
pwls f ile m.txt
cos_phi
m
Irms_W
Irms_V
Irms_U
inv erter_capa_mean_model_th_VA
the 3 Irms inputs must be signed
in case of locked rotor,
CARTO 1D (esr v s Temp)
centered intersectiv e PWM
esr.txt
U1
Irms_U
Irms_V
Irms_W
Thotspot
Locked_rotor Activ e
m
cos_phi
BAT
Inverter thermal simulations w ith mean models
Sébastien Lecointre, Laurent Caves
Company:
EPS_RP
A_4V_02
Project:
B1
Version:
Author:
24/06/2013
Date:
Objectives:
Valeo Pow ertrain Systems

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Simulation examples: busbars modeling  EMC, parasitic
inductance …
Based on mechanical drawings, optimization of the design of the busbars

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EMC simulation
EMC simulation for conducted emission regarding power filter. Including
parasitic bus bar…
Benefit: much faster convergence for EMC

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Control board: FR4
Thermal decoupling:
keep the control board
“cool” (< 150°C)
Capacitors. Challenge =
vibrations
Power stage. Thermal
challenge
Heatsink
* For 300ku/year
Illustration: electronics for a belt starter generator
A lot of challenges with vibrations and heat

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Optimization of the concept through simulation
Unit iStars_13 iStars_14 iStars_15 iStars_16
MOS [°C] 165 164 164 158
Capacitors [°C] 144 144 145 140
Rear bracket flow rate [L/s] 8.45 8.86 8.87 8.89
Between module fins [L/s] 4.70 5.39 5.39 5.41
Between module fins [°C] 145 142 142 136
Heat flux Phases / Air [W] -23.3 23.2 12.4 12.7
Heat flux Bracket /
Heat sink
[W] -4.4 -4.4 -3.8 +11.2
Rear bracket [°C] 161 161 161 143
Optimized
solution

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Reliability study
Based on vehicule lifetime profile, extraction of capacitor and Power MOS
parameter for reliability study
Electrical stress
Calculation tool
Evaluation in real part
Thermal stress

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Detailed design
See the deep dive into the disciplines in the next section

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Integration HW / SW
Presented before, Valeo proposes different scenario of development with its customer.
These scenario suppose experience and methodology to ensure developments according to performences, quality & delay.
As an example for scenario where Valeo is responsible for hardware & customer for software we have dedicated
methodology (HSI, common review of justification & characterization files, test in plant specification review, …) & also we
use the simulation to assess the hardware behaviour each time the command law are changing :
To validate a mosfet driver on EPS, pattern shapes are required but it is not enough :
Testing the different pattern used by the software is required but we need also to justify the driver for each
transistion between patterns. These transitions depend on the different use conditions, which is customer
concern but we request all input commands to justify the mosfet driver.
It is done with simulation to make sure to perform the comprehensive list of cases.
On the picture we can see an important glitch
on the phases due to a change of the pattern.
Without the simulation of this complete
scenario, we are not able to justify the driver
design against this event.

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Integration HW / SW
Work with correlated models :
In this specific case with the following customer setup :
PWM_simulation_Ubatt_16V_OpenRotVector_0_34_OpenrotSpeed_10radpsec
Negative spike on GDU (SL pin / GND) Real measurement on customer
means
Simulation results :
FACTORS
CONTROL
POINT
STANDARD OK PARTS BAD PARTS
JUDGMENT
(Only write Y/N/D)
COMMENTS [13]
Std
OK
Meet
std
Direct
link
sw input data,
mosfet
commands
Negative
spike on
GDU
source HS
& LS
GDU datasheet
-7V
-5,40V -11,20V Y N Y
Based on input data from cust. :
PWM_simulation_Ubatt_16V_Ope
nRotVector_0_34_OpenrotSpeed
_10radpsec (SWx3_20140429 for
bad part) &
(SWx3.1_EOL_20140605 for
good part)
sw input data,
mosfet
commands
mosfet di/dt
mosfet
datasheet :
2500A/µs
806A/µs 2800A/µs Y N Y
Based on input data from cust. :
PWM_simulation_Ubatt_16V_Ope
nRotVector_0_34_OpenrotSpeed
_10radpsec (SWx3_20140429 for
bad part) &
(SWx3.1_EOL_20140605 for
good part)
With this example, we can see, depending on software with the
same hardware, characteristic results either compliant or not
compliant with the hardware.
The software difference is only 400ns between the simultaneous
switching of 2 phases.

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Integration into the car incl. Autosar
Several OEMs start requiring that suppliers use the Autosar standard also for
EPS ECUs (e.g. BMW)
Valeo has been developing according to the Autosar standard since several
years (especially for engine ECUs)
Customer verbatim:
PSA: “Valeo is showing a very good maturity with Autosar, significantly better than Bosch
or Continental”
BMW: “BMW appreciated the centralized approach presented by Valeo as it allows and
shows a good mastering of AUTOSAR”

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Agenda Day 1
Markets
Use of simulation
Autosar

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Role of disciplines
Disciplines: Hardware, Mechatronics, Software, Validation
Define and maintain the standards
Develop expertise
Support projects
Solve critical issues

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Confidential
HARDWARE
François PELLIER, Hardware Manager PEL

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HARDWARE
Competencies in Hardware
Development of Standards
Development process
Building Blocks Startegy
1
2
4
3

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High Expertise in
electronics domains to
cover power electronics
products
Architectures
Integration
Control Board
Power electronics 33%
28%
39%
Designers for High
Voltage Power
Designers for control
board
Designers for 12/48 V
power electronic

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Model extracts: for thermal and electrical modeling
EMC Design and Tests
PCB Layout design
HW Design Review
Valeo Electronics Standards
Valeo Technical Institute
*GEEDS: Group Electronics Expertise and Development Services

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Capitalization of the knowledge
 Standards
For Design Rules
For Design Guides
For Building Blocks
For Simulation data-base
For development methodology
Management of the Standards
Done by the HW standardization committee
Managers
Experts
Identification of the need
Update of existing
Update of checklists
Design Rules
Guides
Checklists

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 Standards
For Design Rules
For Design Guides
For Building Blocks
Managers
Experts
Update of existing
Update of the matrix
Building
Blocks
Building Block
Matrix

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Simulation
data-base
 Standards
For Design Rules
For Design Guides
For Building Blocks
Managers
Experts
Update of existing
Tool evaluation
Building
Blocks
Slow_decay _3ph_VA
U3
DC
Theta
UH_p
UH_m
UL_p
UL_m
VH_p
VH_m
VL_p
VL_m
WH_p
WH_m
WL_p
WL_m
theta_e
rad/s >>> rpm
rpm
U2
0 Pulse(0 1 1m 1m 1m)
I1
{Vbatt}
Vbatt1
ARB4
V(theta) + acos(cos_phi)
thetaOUT
inv erter_mos_ideal
[0,1]
[0,1]
[0,1]
[0,1]
[0,1]
[0,1]
U4
BAT
GND
HS_U
HS_V
HS_W
LS_U
LS_V
LS_W
PH_U
PH_V
PH_W
Model @ 27°C
theta_e
BLDCM_tri_
U1
Omega
Theta_e
Theta_m
U
V W
rpm
rpm
ARB1
75
OUT
Product
plattform

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 Standards
For Design Rules
For Design Guides
For Building Blocks
Managers
Experts
Update of existing
Update of checklists
Description of the hardware
development methodology
Checklists

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Example: architecture checklist
Systematic reviews done at
the right time according
customer millstones
checked during
architecture review
with the architecture
document
Architecture document

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customer millstones
Milstones:
CAAV: Contract Approval Application Validation
REQF: Requirement Freeze
DESF: Design Freeze
TOGO: Tool Go
ISVA: Initial Sample Validation
Example: design
rules for a diode
Check during design
review of Building
Blocks
Standards
Guides
Link between a rule
and the Standard

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Reviews:
HWD1 to 5: Hardware Design Review
managed by the GEEDS
Architecture Review: Review on the detailed
Hardware architectures
BOM review: validation of Built of Material list
HSI: Hardware/Software Interface
HMI: Hardware/Mechanical Interface
Development process
customer millstones
Milstones:
CAAV: Contract Approval Application Validation
REQF: Requirement Freeze
DESF: Design Freeze
TOGO: Tool Go
ISVA: Initial Sample Validation

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Development process
Checklists
Project
Development
based on
hardware
Expertize
Building
Blocks
Building Block
Matrix
Simulation
data-base
Rules
Guides
PROJECT DEVELOPMENT
Development methodology
Hardware
Dashboard

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Building Blocks Strategy
Saved effort
From the needs to the
selection of existing
Definition: it’s a part of electronic that
can be potentially re-used in other
products
EXAMPLE OF APPLICATIVE HARDWARE ARCHITECTURE

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How to re-use a Building Block
A Building Block is defined by a description, a
schematic block, an interface description and a
performance table
Three cases
The Building Block is adapted to the application, it
will be use as it is, check will limited to non
regression during integration
Some limited change are needed, the effort will be
limited to the change
No Building Block match with the application, a new
one will be created. It includes also if the Building
Block is too expensive
In all of these case, project, purchaser are involved
in the decision
Description
The Building Block « FLYBACK_PSU [12V]
(MAX15004) » provides an multi-output power supply
from the 12 V battery voltave source with a galvanic
insulation.
The component used is the MAX15004, which is an
integrated buck controller.

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A classification
per family
EPS example

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Confidential
Mecatronic

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Mechatronic in PEL
Electronics for e-Machines
High Power Electronics for HEVs &
EVs
Control & Electric Network
Electronics
“PEL”
Example of Mechatronic

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Mecatronic Ressources & Competencies
30 CAD designers
3 Experts in mechanical design
9 Technologues
1 Expert for PCB
1 Expert for Welding, Brazing, Finishing
1 Expert for Potting, Gluing
6 Standards/Building Blocks Owner
More than 120 Standards available
4 Trainers
Mechanical Design & Process, DFMEA, Protection of embeded electronics and waterproof
systems, PCB organic & substrats, Electronic Technologies and process

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Mechatronic Tools: CAD
Catia V5 R22
Skeleton methodology
Q-Checker
internal Auto-Collision Checker DMU space analysis
SheetMetal
Valeo Stack-up Tool
Customer & Supplier exchanges
Security based on OPENDXM
MPLM
Global Database

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Confidential
Mechatronic Tools: Simulations
Why simulations
Improve design quality
Reduce development time
Design optimisation
Use int ressources and competencies
Better results confidences
Benefit of worldwild experiences
More ressources availabilities
Domains: Vibrations, Stress, Thermal, Flow

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Confidential
Mechatronic Tools: DFMEA
FUNCTION
FAILURE
MODE
EFFECT CAUSE
S O D
S/O/D
(or
RPN) DEADLINE
FAILURE
RESPONSIBLE
DETECTION
ACTION
PREVENTIVE
ACTION
PREVENTIVE
ACTION
DETECTION
ACTION
CORRECTIVE ACTION
S O’ D’
S/O’/D’
(or
RPN’)
CL
INITIAL ACTIONS
CRITERIA
*CUSTOMER
1
4
6
7
8
9
10
1
3
6
8
10
1
3
6
8
10
S
/
O
/
D
(or
S
X
O
X
D)
Perform D-FMEA
Phase 1 / DESF
R&D PTM
Date: XXX
1
4
6
7
8
9
10
1
3
6
8
10
1
3
6
8
10
S
/
O’
/
D’
(or
S
X
O’
X
D’)
Initiate D-FMEA
Phase 0 / REQF
N°
INPUT
FMEA
OUTPUT

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Mechatronic Tools: Lab Facilities
Metrology Lab including Zeiss 3D unit
Cross cut analysis
Screwing & torque control
Push/Pull unit
Microscopy
3D Printer

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Confidential
Mechatronic Tools: DOE Process optimisation
Ex: increased mechanical strenght of copper busbar electrical welding
Targets:
-Mechanical strenght increase
-No visual degradation
-No re-design
-Standard assembly process
Assembly Process Multi-criteria
Optimization through Design of
Experiments Method
(GSI-RD-H01-0000-424)
Valeo Method
Tool

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Confidential
Process optimisation: DOE method global view
Mechanical strengh optimization
Parameters to study (Pressure, Current, Time)
Build up appropriate tests : only 13 experiments necessary to study 3
parameters (3 values per parameters) instead of 27 (3 parameters x
3 values)
Process modelisation: predictive model

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Confidential
Process optimisation: DOE results on EPS project
246.00 257.00 268.00 279.00 290.00 301.00 312.00
6300.00
7100.00
7900.00
8700.00
9500.00
Desirability
A: Pressure [N]
C
:
C
u
r
r
e
n
t
[
A
]
0.000
0.000 0.000 0.000
0.000 0.000 0.000
0.000
0.100
0.100
0.200
0.200
0.300
0.300
0.400
0.500
Time: 35 ms
Initial parameters
Design-Expert® Software
Factor Coding: Actual
Desirability
0.600
0.000
X1 = A: Pressure [N]
X2 = C: Current [A]
Actual Factors
B: Weld time [ms] = 25.09
D: Polarity = P2
246.00 257.00 268.00 279.00 290.00 301.00 312.00
6300.00
7100.00
7900.00
8700.00
9500.00
Desirability
A: Pressure [N]
C
:
C
u
r
r
e
n
t
[
A
]
0.000
0.000 0.000
0.000 0.000
0.000 0.000
0.000
0.000
0.100
0.100 0.200
0.300
0.300
0.400
0.400
0.500
0.500
0.600
0.600
Optimized parameters:
-Pressure 
-Current
-Time 
Mechanical strength= 330N (+73%)
Mechanical strength= 190N
Assembly Process Multi-criteria
Optimization through Design of
Experiments Method
-Time and cost saving
- Process improvement
- Efficiency

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Confidential Update
Mechatronic Methodology: V Cycle
RFQ answer
Preliminary analysis
and
architecture definition
Preliminary Design
Customer delivery
DV follow up
Design Integration
• 3D and 2D (on Catia V5)
•Stack up
• Design checklist (plastic molding, high pressure molding, RAISE…)
• Simulations:
• Vibratory
•Mechanical constraints
• Thermal
• Fluidic
• Technical specification
• Metroly specification
• Supplier metrology report analysis
• Counter metrology
• Process flow chart drawing
• Risks mitigation
• Prototype analysis after each test
• Correlation of the numerical simulation
• Analysis of LLC
• Analysis of the stickers
• Product RETEX
• AMDEC
• Checking of the standards
• Checking of the technologies qualified
• Preliminary simulations:
• Vibratory
• Mechanical constraints
• Thermal
• Fluidic
• Bill of material
• Customer interface drawing
• Vehicule integration follow up
• Analysis of customer requirements
•Functional analysis
•Compliance matrix
RAISE review
Architecture review Proto tool launch review Off tool launch review DV review
Detailed design
Continuous Design review
Prototyping
follow up

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Confidential
Mechatronic Methodology:MK/HW exchange
1. PCB Definition
Define the constraint area and the outline on the PCB
Use the CBD licence on Catia V5
Creation of the IDF file
Exchange file with Cadence
2. Checking of the components routing
Cadence creates the new idf file and the component bookstore
Upload this file on Catia to create the PCB with the component
3. Checking of the result by a PCB superposition

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Standards/Building Blocks

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Mechatronic Methodology: Standards
Creation by experts
After validated solution acheivement
Output from a Red Box item
Application Check during design review
Improve quality
Reduce development time
Reduce development cost

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Confidential
Mechatronic Methodology: Standards example
RAISE code
PLM reference
Origin of the rule
CONFIDENTIAL, duplication prohibited Generic Part:
Training Module
P2
P1
Justification of the
rule
Phases
V29015355A
Yes
1,2
PEV_MK_DR_141
Preform (Alloy) and leads dimensions
Design rule
2
Leadframe Size(mm)
Preform Size(mm HxL)
0.8x4 0.8x5 0.8x6 1.2x6
2 x 2 X
2 x 3 X X
3 x 2 X
3 x 3 X
• Preform with leadframes size qualified :
• Materials validated :
-Leadframe  CuOF or Cu ETP
- Preform thickness  150µm
PREFORM STANDARD
DIN EN ISO 17672 CuP 284
DIN EN 1044 CP 102
• Preform location on the lead:
OLD
Preform
The Preform design = or > to the lead section
VDOC_017798
L
H
RAISE code
PLM reference
Origin of the rule
Training Module
P2
P1
rule
Phases
V29015355A
Yes
1,2
PEV_MK_DR_141
Design rule
2
Pull test:
- The samples for the trials must be done in the same or representative configuration than
the mass production (leadframes and alloys orientations, materials and dimensions).
- Pull test should be done according to the standard  ADOC_010240
VDOC_017798
Preform (Alloy) and leads dimensions
OK
OK

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Confidential
Mechatronic Methodology: Standards example
RAISE code
DESIGN RULE
PLM reference
Origin of the rule
P2
P1
rule
Phases
V29015355A
VDOC_009113
0, 1, 2
2
Dimensionning of heat dissipation rib
PEL_MK_DR_110
These rules are defined to provide guidelines to design heat dissipation ribs taking into
account heat sink behaviour and die casting parts feasibility.
- Part material: Die casting aluminium alloys
- Design rules (minimum dimensions to apply):
- Heat sink thickness = part constant thickness t (2mm mini)
- Rib thickness at bottom = t
- Pitch between two ribs at bottom = 2 t
- Rib thickness on top = 0.6 t
- Radius at rib bottom = 0.8 t
- Radius at rib top = 0.3 t
- Rib draft angle = 2°
- Design validation:
- Efficiency of ribs design needs to be validated by thermal simulation and optimized if
necessary.
- Part compatibility with aluminium injection needs to be validated by mold flow
analysis and optimized if necessary.
1
2
3
4
Training Module Yes
1
2
3
4
5
6
7
5
6
7
When used: during design phase 2
When checked: during DR RAISE Proto tool launch review

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Confidential
Confidential
Software
Marc Sylvestre

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Confidential
0
256
500
1000
2000
4000
CPU [MHz]
Flash
size
[kbytes]
PEL Generic Platform
Freescale family
AUTOSAR Architecture
IFX AURIX family
µcontroller Road Map
EPS
eSC48
DCDC
TCU Europe
EDC
Family 1
inverters
50
100
150
200
300
Safety
Not Safety
GMG
iBSG
EDVM
TCU
China
eClutch
OBC GW
China
OBC GW
Europe
MPI Engine
ECU
GDI Engine
ECU
Family 2
inverters
Multi-core
Mono-core
eBKV
HCU
Inv/DCDC
eSC12
Specific micro
(cust. Request)
6000
250
EPS products are expected to move to AUTOSAR

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Confidential
Confidential
SW Architecture
Marc Sylvestre, SW Metier in PTS/PEL

I 76
Confidential
BSW Architecture Generic
Platform
µC specific
Generic
Platform
Projet
Specific
HAL
MCU / OS Mem Com
MCAL / IO
Dio
Adc Port ePwm
LinS
Can
DIOHAL
ADCHAL
Fls
Fee
OS / SCHED
COM
Startup
Mcu Spi
NvrM
MemIf
Wdg
CCP/
XCP
Applicative SW
COM
Specific
Projet
Electrical
Motor
Control
RTMCLD
BSW
Specific
Projet
Sent
FlexRay
CRC
RTMCKS
SAL
• AUTOSAR stacks from ElektroBit
• VALEO Service Line in charge of configuration and compliance tests
• VALEO is involved in AUTOSAR Consortium since 2004
AUTOSAR is well mastered at VALEO !

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Confidential
EPS ASW ARCHITECTURE
Basic Software
INTERFACE LAYER - INTERFACE LAYER - INTERFACE LAYER - INTERFACE LAYER - INTERFACE LAYER
End Of Line
Applicative
SW-C
High-Level
Applicative
SW-C
Functional
Safety
(Level 2)
SW-C
TORQUE Control
Functional
Applicative SW-C
Designed by customer
coSpecified with customer / Designed by Valeo
Specified by Valeo/ Designed by Valeo
Control Red Path
• Tests in Production
algorithms for Steering
production plant
• Driver request
analysis, to compute
a torque reference to
be applied by e-motor
• Torque control
algorithms (see details
here after)
• Functional safety
algorithms, to check
that produced torque
follows driver request
Vehicle
(CAN)
messaging
Driver
request
PWM
Torque Request
CI : Control Inverter
CM : Control Machine
STC (10ms)
Speed Target
Consolidation
SCS (10ms)
Speed Control Strategy

Ext
* *
DrtSpeedMaxAvailable


Ext
Meas
TSat_Actv
 TTC (1ms)
Torque Target
Consolidation
TCS (1ms)
Torque Control Strategy
* *

Cons
Idq0

Ext
Meas
UbatHV
Meas UCVSI
Speed Stage Torque Stage
AS : Adaptive Strategies
ITP (10ms)
Inverter temperature
protection
TVSI
TMotor
OSP (10ms)
Over Speed Protection
Meca
DPM (10ms)
Derating Protection
Management
Idq0

CTC (100µs)
Current Target
Consolidation
DrtI0dqMax
Idq0

CONS
* CCS (100µs)
Current Control
Strategy
*
USat_Actv
Udq0

Idq0MEAS
Udq0

EXT
elec_adv
Elec_adv
Udq0Norm

Current Stage
Tmax
Tmin/maxCons
Ubatt_cor
Tmax
Tmax
Tmax
BDS(10ms)
Battery Derating
strategy
MTP (10ms)
Motor Temperature
Protection
VDC (100µs)
xxxxxx
SVM (100µs)
xxxxxx
UCVSI
UCVSI
Idq0

Idq0

SM : System Management
ACS (10ms)
xxxxxx
MAM (10ms)
xxxxxx
McuState
max
SpeedMin/Max
I0dq min/max
Elec
Elec
RPC (100µs)
Reverse Park Currents
Elec
I0dqMeas3
I0AlphaBeta
ACL (Applicative Control Layer)
• Architecture and Key functions are
Building Blocks from the Generic Platform
• Those Building Blocks are common to all
our inverter products
• Project is in charge of configuration only
Standardization and Reuse to
achieve QCD objectives !

I 78
Confidential
Confidential
Software Development Process
and Tools

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Confidential
Software V-Cycle
Overall
Architecture
Design
Sw Product
Integration
& Tests
S
W
I
n
c
r
e
m
e
n
t
l
e
v
e
l
S
W
P
r
o
d
u
c
t
l
e
v
e
l
Sw Req. Analysis
Overall / Features
Sw Product
Functional
Validation
Increment Req.
Analysis
Increment
Architecture
Design
Increment Integration
& Integration Tests
Increment
Functional Validation
Increment Unit
Design
Increment Unit
Tests
Sw Release
Delivery
Sw Increment
Delivery
Sw Input
Req.
Subset of Sw
Input Req.
Increment Implementation
SRS
Elicitation
GDD
CL / BSW
Interface
CL_SyRS
Internal Inputs
(HSI, TSC, …)
External Inputs
(Customer specs,
ECRs, SIQ, Norms, …)
Functional
Validation Report
IT Report
CL Team
development
Increment Req.
Analysis
Increment
Architecture
Design
& Integration Tests
Increment
Increment Unit
Design
Increment Unit
Tests
Sw Increment
Delivery
Subset of Sw
Input Req.
Increment Implementation
BSW Team
development
Sw Integration Tests plan
Sw Functional Validation plan
Sw Increments development
…
CMMi Level 2 achieved in 2009
CMMi Level 3 improvements on going
SPICE / HIS Level 3 can be deployed at
project level if required
Software process is supported by tools to
make it robust and efficient
Software Lifecycle, Version management,
Change management and Defect tracking
are managed in an integrated solution
based on Serena Dimensions & SBM

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Confidential
Software Incremental V-Cycle / CL
Code Integration
& Integration Tests
Unit Test :
SIL/PIL coverage
Back
To Back
Increment
Implementation
MBD
Unit
Design
Control Law
Req. Analysis
Autocoding
MIL
functional
MIL
coverage
MIL Unit Tests
MIL Integration
& Integration Tests
Increment
Req. Analysis
Increment
Architecture
Design
Increment
Unit
Design
& Integration Tests
Increment
Unit Tests
Increment
MBD
activities
Code
activities
Sw Increment
Delivery
Subset of Sw
Input Req.
Increment
Implementation
MIL Functional
Validation
HIL Functional
Validation
MBD
iterative
design
loop
Back
To Back
MBD
Architecture
Design
MBD Modules
External needs
Functional simulation is first done at unit design level
Once done, all unit design models are integrated in a global simulation model which includes models of Basic Software, Electronics,
Loads and Sensors
This global simulation allows to “validate” global behavior at Product level and to prepare tunings parameters without the need of the real
Hardware or Sensors/Actuators

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Confidential
Code Integration
& Integration Tests
Unit Test :
SIL/PIL coverage
Back
To Back
Increment
Implementation
MBD
Unit
Design
Control Law
Req. Analysis
Autocoding
MIL
functional
MIL
coverage
MIL Unit Tests
MIL Integration
& Integration Tests
Increment
Req. Analysis
Increment
Architecture
Design
Increment
Unit
Design
& Integration Tests
Increment
Unit Tests
Increment
MBD
activities
Code
activities
Sw Increment
Delivery
Subset of Sw
Input Req.
Increment
Implementation
MIL Functional
Validation
HIL Functional
Validation
MBD
iterative
design
loop
Back
To Back
MBD
Architecture
Design
MBD Modules
External needs
Save time on the implementation phase
Mainly due to automatic generation and increased quality
Increase reactivity face to the customer requests
“1 hour” between verified model availability and mockup download
Be more flexible regarding development team organization
Allows system engineers to build prototypes without SW support
Millions of vehicle in the street (Gasoline Engine Control Units)
Several projects close to SOP (eSC 48V, DCDC converter, ..)

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Confidential
Code Integration
& Integration Tests
Unit Test :
SIL/PIL coverage
Back
To Back
Increment
Implementation
MBD
Unit
Design
Control Law
Req. Analysis
Autocoding
MIL
functional
MIL
coverage
MIL Unit Tests
MIL Integration
& Integration Tests
Increment
Req. Analysis
Increment
Architecture
Design
Increment
Unit
Design
& Integration Tests
Increment
Unit Tests
Increment
MBD
activities
Code
activities
Sw Increment
Delivery
Subset of Sw
Input Req.
Increment
Implementation
MIL Functional
Validation
HIL Functional
Validation
MBD
iterative
design
loop
Back
To Back
MBD
Architecture
Design
MBD Modules
External needs
Back to Back tests are done to ensure that generated code give the same results as simulation
It also provide code coverage
Process is completely automated
Automated Simulation,
Generation and Verification
to achieve QCD objectives !

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Confidential
Confidential
Validation

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Confidential
Shenzhen: 4p
Laboratories Footprint
84
Cergy: 30 p
Elec Test
EMC Test
Therm & Humidity Test
Endurance test
Vib Test
Elec Test
Clim Test
Endurance
test
Vib Test
Elec Test
Frankfurt: 1p
EMC Test lab
EMC Test
Troy
Elec Test

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Confidential
Laboratory Skills
Validation & Benches Lab skills
 DVP&R & test plans
 Validation tests performing in accordance with automotive standards
 Developpement of tools and specifical test benches
Test benches: 10 contributors
 Development of EV , DV & PV benches: National Instrument facilities & Labview
 EV & DV Benches calibration
Valeo Labs : 20 contributors
 Hot,Cold & Humidity thermal chambers
 Thermal shock chambers
 Electrical test equipments
 Endurance & test benches

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Confidential
Valeo Electrical test facilities
VDS 200
used to simulate Various Battery supply waveforms
International standards & Manufacturer norms
PFS 200
used to perform fast micro interruptions voltage
DXS 506
used to test dielectric strength & insulation resistance
UCS 200 used to test DUT
immunity to Automotive Transients
(µs to ns):
International standards &
Manufacturer norms:
Pulses 1, 1bis
Pulse 2a
Pulse 3a
Pulse 3b
NSG 438 used to test DUT immunity to ESD
discharge
+/- 200 V to +/- 30 KV
Air discharge
Contact discharge
Powered & Unpowered DUT

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 Semi anechoic chamber
 Radiated emissions / Radiated immunity
Valeo EMC Facilities
Shielded room
 BCI
Cells
 TEM Cell – DC to 400 MHz
GTEM Cell – DC to 3GHz

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Confidential
Valeo Climate and Endurance facilities
Thermal Shock Chambers( 600L / 230L)
From -65°C to 200°C
Humidity Thermal Chambers
from 10% to 98% of humidity
-40°c / + 140°C
Hot and Cold Thermal Chamber
Warm and Cold Storages : from -50°C to 180°C

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External Lab facilities
Vibration shakers
Vibration and Mechanical Shock
Combined with thermal chamber
Salt Spray Chamber High pressure cleaning test Immertsion test

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Valeo-PEL Partner- labs ISO17025
Emitech Lab
L2EC lab
CETIM Lab LCIE Lab
E2M Lab
Sercovam Lab
In case of equipment not available, we work with selected lab partners

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Validation Tests Management

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Confidential
Workbook-Scorecard tool: Overview
The workbook is a tool developed using google facilities & shared with all project team members.
DV or PV global overview: Test Legs definition / performer / Dates/ Test status / Test report status etc…
Tests
Legs
Performer
Plan date
Effective date
Test status
Progress
status
Test report
status
ISO/IEC 17025 § 4.7

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Confidential
Workbook- Test leg view: detail view
Test parameters:
Parts quantity,
test duration etc..
Test status
Test to perform
Parts under
test Réf
Test progress rate
ISO/IEC 17025 § 4.7

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Confidential
Workbook – Redbox interconnection
In case of Failure it
automatically opens a
QRAP RedSheet
ISO/IEC 17025 § 4.9

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Confidential
Continuous Improvement: RAISE

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Confidential
Validation tests performing
RedBox Review
VAL-Design Review:
V@lead
qqoqcp QR
FTA 5W
Correction Std
qqoqcp QR
FTA 5W
Correction Std
Validation tests performing
Test issues
5W2H QR
FTA 5W
Correction Std
FD- ID Issue descrip Facteur: 4M Action
VAL RedBox Management
QR FTA 5W Cor Std ID
FD12-XX --------------------- Machine X X X VAL-DR-XXX
--------
FD12-XX --------------------- Machine X X X
--------
FD12-XX --------------------- Machine X X VAL-DR-XXX
--------
VAL- ID STD descrip Type SC date
VAL Standard Management
VAL-DR-XX --------------------- DR --------
VAL-MET-XX --------------------- MET --------
VAL-DR-XX --------------------- DR --------
SC date
--------
--------
--------
…
qqoqcp QR
FTA 5W
Correction Std
FD12-XXX
PEL-VAL-DR-XXX
Continual Improve process: VAL RAISE
FD12-XXX
Test issues
Laboratory
standardization
committee
Lab standard
Rules
ISO/IEC 17025 § 4.10/4.11/4.12

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Provide benches for validation tests
Benches specification Benches Commissioning
Electrical ,
Mechanical Design
Integration ( HW/SW of
benches)
Benches Realization ( HW & SW)
Benches development :
Benches
specification
Layout &
Mech plans
Integration
Test report
R&R report

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Example of benches for EPS
Benches:
Automated testing
Test report with PASS/FAILED criteria
Measurements with external sensors (
current - Voltage probes, Torque sensors,
Temp etc..)
Labview software
N.I. Facilities
CAN Monitoring
COM: CAN/ Flexray / LIN
Loadbox ( Gear / Resistor/ Inductance /
Motor etc..)
Multi channel ( 6 parts in same time)
Benches for : Characterization test, Elec
test, EnvironmentalTest, Endurance tests)

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Agenda (Day 2)
Introduction
Plant tour
SMD
Power Module
Assembly line
Debriefing

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Confidential
List of attendees : VALEO
Names Functions
Christophe Dechamps Sablé site Director
Benjamin Berlioz Project site manager
Benjamin Morlière Steering platform manager
Alain Umenhover PEL industrial director
Stephane Charpentier Key account manager
Raj Puttaiah Business development manager

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List of attendees : Nexteer
Names Functions
Steve Spicer Global EPS Product Line Executive
Marc Ellis Global Supplier Development Engineer
Pierre Longuemare Customer Engineering manager
Neal Roller EPS Engineering Manager
Sastry Chimalakonda Enterprise Commodity Manager

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Agenda (Day 2)
Introduction
Plant tour
SMD
Power Module
Assembly line
Debriefing

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Confidential
PowerTrain Systems Business Group
ELectronic Product Group
Sablé sur Sarthe Plant
Christophe DECHAMPS– Site General Manager
WELCOME
SABLE PLANT

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Confidential
Sablé sur Sarthe Plant
Covered area : 10 000 m²
Production : 5400 m²
Assembly Area : 3000 m²
‘’Clean’’ Room ISO 8 : 2475 m²
Hygroscopy : 50% + / - 10%
Temperature : 22°C + / - 2°C
Particles / dust
< 100 000 particles (< 0.5 µm / foot3)
Logistic : 3000 m²
Headcount : 520 people
Daily Production
SMD (8 smd lines) – 30000 parts/day (7 millions of
components per day)
Power Modules (3 assembly lines) – 7000 parts/day
Assembly (14 lines) - 25 000 parts / day

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Layout

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PEL Manufacturing process overview
Assembly process
SMT process
Power module process

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Laboratory
Product Audit & Failure Analysis

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Mecatronic Lab : Clean room ISO 7 80 m².
Wire bonding equipement, laser soldering and die placement
for power modules prototypes and process validation

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Quality Management System
VALEO 5000
Strategy Method Measure Progress Continuous
Improvement
P D C A
5 AXES
BASED ON SAN GEN SHUGI
V5000
Physical Indicators (20)
PAQ
QRQC Step 1-2-3
OPERATIONAL
EXCELLENCE
QRQC
0 ppb

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For the visit
In order to protect your feet, you’ll need :
To wear shell on your shoes
To protect our products against ESD, you’ll need :
To wear an ESD garment
To wear heel strap on each shoe
If you need to touch a product you’ll need to wear gloves
Even a scrap is respected (for analysis purpose) and wear of gloves is
mandatory

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Agenda (Day 2)
Introduction
Plant tour
SMD
Power Module
Assembly line
Debriefing

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Objectives
Make sure that all plants receive the appropriate support when starting a new
product or technology
Map processes (screwing, electrical welding, selective soldering, silicon dispensing …)
Check the maturity of each plant
Define and apply standards
Bring support
Benchmark KPIs
Sometimes the daughter plant can have better KPIs than the mother plant
Get the best from all our plants

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Mother – Daughter Road Maps

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Industrial organization
PEL PG
Industrial Director
PEL Veszprem
Activity Manager
Lean process
Methods / Tooling
Process – Indus.
SABLE
Test Development
SABLE
PEL Shenzhen
Activity Manager
Industrial Manager
Mother Plant Sable
Mother/Daughter Activity
SABLE
Process Sdt Owner
SABLE
Process integration
SABLE
High Power
& Energy Conversion
High Power
& Energy Conversion
Transfer
Serial Production
GEN2
MLB
& ESC
Medium Power
High Power
Transfer
Serial Production
Medium Power
Medium Power
ECU
EPS
S97

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Mother – Daughter Site - exchange Data Base

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Data Base sharing
KPIs review and sharing

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Share of best pratices and
deployment in all daughter sites
Formalization and management of
technical support to daughter sites
Competences transfer
plan
Data Base sharing

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Best practices sharing
Best Practices Cross fertilisation review
Poka Ypoke BMW – DC Frame EPS Packaging Scanning process
Maintenance record document

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IPROM is the procedure to manage industrialization of all production equipments
(P1, P2, P0 equipments & Capacity machines)
It describes all Process-VPS & Supply Chain activities to be lead
Simultaneous engineering Product – Process principle
IPROM goals are
Describe all steps of an industrial project.
Guide Process & Supply Chain teams towards achievement of CLEAN Milestones.
Meet Projects QCDM objectives.
IPROM is the tool box of the Industrial Team (Process & Supply Chain)

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Agenda (Day 2)
Introduction
Plant tour
SMD
Power Module
Assembly line
Debriefing

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Agenda (Day 2)
Introduction
Plant tour
SMD
Power Module
Assembly line
Conclusions & debrief

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Conclusions
We have the competencies, the industrial knowledges and the facilities in order to
go with Nexteer
Our teams are highly motivated to work with you
First 2 opportunities : We will be very happy to develop these products with Nexteer
and to start a strong collaboration
1V5 PSA
PCO BMW

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150615_Nexteer_Visit_(1).pdf June 2015 visit

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