1. _____ _ Michael(Mingyu) Yang____ _____________
Apt.204, 1351 Crab Orchard Drive myang14@ncsu.edu Tel: +1-919-744-8768
Raleigh, NC 27606, USA
Objective
Seeking a Job Opportunity in Power Electronics Application
Education
MS Electrical Engineering, North Carolina State University- Raleigh, NC Sep.2012-Dec.2014
 Coursework: Power Electronics, Analog Electronics, Electronic Packaging, System Control
Engineering, Heat Transfer, etc.
 GPA: 3.9/4.0(Major)
BS Electrical Engineering, Huazhong University of Science & Technology-Wuhan, China 2008-2012
Work Experience
Application Engineer Intern, Semtech Corporation-Morrisville, NC July.2014-December.2014
 Be involved in the development and verification of AOT buck regulator chip
 Develop mathematical model for AOT buck regulator and behavior model in Simplis
 Select feedback resistors and capacitor to optimize efficiency and stability of regulator
 Design current-mode buck converter EVB schematic and PCB layout using Cadence
Application Engineer, Semtech Corporation-Morrisville, NC January.2015-July.2015
 Lead the evaluation and development of two buck regulator products as primary
engineer. Update and communicate actively with design, test and marketing teams
during entire product development process and push to release
 Be heavily involved in hands-on bench test and lab work. Be fully capable of using lab
equipment such as oscilloscope, function generator, thermal equipment, etc.
 Develop datasheet of one buck regulator and fully verify datasheet specs to meet design
requirements
 Attend Worldwide Field Application Engineer Training as instructor. Present functions
and characteristics of chip products to FAE and instruct hands-on lab training
 Work with worldwide FAE to provide customer support and response to customer’s
requests and problems in a timely manner
Academic Experience
Master Thesis: SiC Power MOSFET and Driver Module (NSF FREEDM CENTER) Jan.2014-Dec.2014
 Perform literature research and propose an original packaging idea of SiC MOSFET and
commercial gate driver with 3D flip-chip-based technology
 Develop electrical and thermal simulations to verify the feasibility and advantage of
proposed power module
 Design, prototype and hands-on test proposed power module in clean room and lab
Project1: A Rail-to-Rail Operational Amplifier Design Nov.2013-Dec.2013
 Designed an Op-amp based on Cadence and met technical specifications, i.e. gain, gain
product, CMRR, PSRR, etc.
Project2: Three-Stage Full Bridge DC-DC Converter Design Nov.2012-Dec.2012
 Selected appropriate power switch, diode and passive components to meet the
converter’s output requirements
 Designed PID controller to achieve closed-loop control and Implemented the system
using Simulink/Plecs
Software Skills
Matlab, Altium Designer, Cadence/Orcad, Simplis/SIMetrix, Comsol, Labview, Mathcad, Excel