1. What is HPC? 2. HPC Business trend 3. HP Apollo 8000 / 6000 4. HP Helion – HPC on Cloud 5. Q&A

1. © Copyright 2013 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice.
Jong-won Koh
Business Development Manager
APJ HyperScale Business Unit
HP Servers
HP Apollo Reinventing HPC to accelerate the world of tomorrow

2. © Copyright 2013 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice.
Agenda 1. What is HPC? 2. HPC Business trend 3. HP Apollo 8000 / 6000 4. HP Helion – HPC on Cloud 5. Q&A

3. © Copyright 2013 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice.
What is HPC ? High Performance Computing

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Is HPC the ‘killer app’ for innovation and competitive growth?
Why the increased need for HPC?
Need to go-to-market, faster
Increased competition
Increased globalization
Increased data volumes

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High Performance Computing is everywhere
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Geophysical Sciences
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Energy Research & Production
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Meteorological Sciences
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Government
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Academia
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Finance
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Research & Development
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Life Sciences
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Pharmaceutical
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Entertainment
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Media Production
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Visualization & Rendering
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Manufacturing
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Computer-Aided Engineering
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Electronic Design Automation
To accelerate innovation and discovery and deliver better products and services first

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“Vì Sao Đưa Anh Tới”

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So, HPC is everywhere.

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Why High Performance Computing is so important
To out-compute is to out-compete
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Firmly linked to economic competitiveness as well as scientific advances
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97% of companies that had adopted supercomputing said they could no longer compete or survive without it
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Worldwide political leaders increasingly recognize this trend
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Enables not only enterprise but also national competitiveness

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HP’s HPC Strategy

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Powering the fastest and greenest high performance computing clusters in the world
HP accelerates its leadership into the future with a reinforced focus on HPC
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#1 in the HPC market, IDC
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#1 in the TOP500 list with 182 systems
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#1 in entries on the Green500 with 195 systems

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Delivering a complete HPC solution
HP Cluster Platforms
Cloud
Servers
Storage
Accelerators
Network
Services
Power & Cooling
Management

15. © Copyright 2014 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice.
The Apollo Family

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HP Apollo family
Optimizing rack-scale computing for HPC
Accelerating performance
to speed up answers
Maximizing efficiency
for sustainability and savings
Unleashing
HPC
to enterprises of any size
4x teraflops per square foot
4x density per rack per dollar
Years to days for new innovations
Reinventing HPC today to accelerate the world of tomorrow

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HP Apollo Family
HP Apollo 8000 System
HP Apollo 6000 System

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HP Apollo 8000 System

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Challenge: National Renewable Energy Labs
Advancing research capabilities that don’t exist anywhere else in the world
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Mission: Energy Systems Integration facility (ESIF) modernizing the interplay between energy sources, infrastructure, and data
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Supercomputing cluster that raises the bar for performance, sustainability and power efficiency
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Competitive RFP for warm water cooled supercomputer, with energy recycling to heat the campus and melt the ice on the walkways
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Leading the industry by example
On a mission of sustainability

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Digester and Biogas Handling
Energy
Reuse Loop
Melt Snow on sidewalks
Heat Buildings
Bio Gas Generator Output
Evaporative Cooling Tower
Warm Water Cooled Servers
Chiller less Data Centers

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“For us, warm-water cooling was the key approach to making the efficiency targets work. As a cooling medium, liquids have about 1,000 times the efficiency of air. A juice glass full of water has the cooling capacity of a room full of air. And the pump energy needed to move that juice glass of water, to eject the heat from the system, is less than the fan energy needed to move that room full of air—much less.”
Steve Hammond, Director of the Computational Science Center

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Advancing the science of supercomputing
The New HP Apollo 8000 System
Leading teraflops per rack for accelerated results
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4X teraflops/sq. ft. than air-cooled systems
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> 250 teraflops/rack Efficient liquid cooling without the risk
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40% more FLOPS/watt and 28% less energy than air- cooled systems
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Dry-disconnect servers, intelligent Cooling Distribution Unit (iCDU) monitoring and isolation Redefining data center energy recycling
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Save up to 3,800 tons of CO2/year (790 cars)
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Recycle water to heat facility
Scientific Computing
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Research computing
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Climate modeling
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Protein analysis Manufacturing
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Product modeling
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Simulations
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Material analysis
4X teraflops/sq. ft. 40% more FLOPS/watt 3,800 tons of CO2

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Differentiated: Dry disconnect servers
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Enables maintenance of servers without breaking a water connection
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Inside the server tray, heat is transferred from components via vapor in sealed heat pipes
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Thermal bus bars on the side of the compute tray transfer heat to the water wall in the rack
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Water flows through thermal bus bar in the rack from supply-and-return pipes
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Fluid fully contained under vacuum
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Integrated controls maintain server components under optimal temperature specifications
New patented technology making a liquid-cooled system as easy to service as air-cooled
http://youtu.be/9Ih3R84Corg
Thermal bus bars
Sealed heat pipes
Sealed heat pipes
“Water Wall”

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World’s largest supercomputer dedicated to advancing renewable energy research
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$1 million in annual energy savings and cost avoidance through efficiency improvements
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Petascale (one million billion calculations/ second)
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6-fold increase in modeling and simulation capabilities
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Average PUE of 1.06 or better
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Source of heat for ESIF’s 185,000 square feet of office and lab spaces, as well as the walkways
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1MW of data center power in under 1,000 sq. ft., very energy-dense configuration

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Global impact: Reduce the carbon footprint
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Top supercomputing performance has grown 944X and the number of cores has exploded by 609X over 10 years*
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Power requirements have increased 5.5X*, while power costs per kW have spiked
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The HP Apollo family is a new approach to HPC, with cost-effective and environmentally friendly HPC solutions
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Save while reducing carbon footprint
Save 3,800 tons of CO2 per year, ~amount of CO2 produced by 790 cars
According to the Top500 supercomputing list at top500.org, CO2 based on power per rack vs. air-cooled systems.

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The best performance for your budget
HP Apollo 6000 System

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HP Confidential – NDA Required
The best performance for your budget
Leading performance per $ per watt
Get up to 4x more performance per $ per watt using 60% less rack space with up to 20 front accessible servers in 5U
Rack scale efficiency
Scale by chassis or rack with a single modular infrastructure, external power shelf dynamically allocating power to help maximize rack-level energy efficiency and easy management
Flexibility to tailor to the workload for lower TCO
Selection of compute, accelerator, storage and networking to fit workload needs while increasing cost savings
4x more performance/$/watt 60% less space $3M TCO savings
The Apollo 6000 System

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HP Confidential – NDA Required
Next generation – density, efficiency at scale
The performance you need at the price you can afford
Dell M620
2 1/2 Racks
Competitive blade servers
20% more realized performance*
60% less rack space
46% less power
$3M
HP Apollo 6000 System
1 Rack (HP ProLiant XL220a servers)
TCO savings1
* Single threaded EDA applications – Synopsys VCS data measurements
1 TCO savings over 3 years with 1,000 servers

31. © Copyright 2012 Hewlett-Packard Development Company, L.P. The information contained herein is subject to 31 change without notice.
HP Confidential – NDA Required
Challenge: Intel Electronic Design Automation (EDA)
The quest for more performance per core in ~the same power and space envelope
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39k servers and shrinking with consolidation
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1M cores by 2015, delivering 1.24M EDA MIPS
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Moving from competitive 2P blades to 1P servers in 59 data centers worldwide
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Hundreds of thousands of logic simulations/day
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Mostly single-threaded applications, massive distributed computing job, not network sensitive
As the server nodes have decreased in number, the amount of processing capacity on the EDA workloads and cores has scaled at a slight exponential curve
“The most impressive thing is that in recent years, this massive increase in compute in the EDA clusters has been accomplished while keeping the server budget flat and trying to push it down.”

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“We are seeing up to 35% performance increase in our Electronic Design Automation application workloads. We have deployed more than 20,000 of these servers, achieving better rack density and power efficiency, while delivering higher application performance to Intel silicon design engineers.”
Kim Stevenson, CIO, Intel

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HP Confidential until June 9, 2014
The New HP Apollo 6000 System
First available tray
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ProLiant XL220a Server dual-server tray
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Front serviceable
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Rear cabled solution
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Max power of ~169W per tray
Rack scale
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160 nodes per 48U rack
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5U chassis (1.0m deep rack)
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20 nodes per enclosure
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Front service, rear cabled
High performance computing
CPU
DIMMs
2x 1P
CPU
DIMMs
Rack-level shared infrastructure for efficiency and flexibility
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Highest frequency per core
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Intel E3-12xx v3 Haswell
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CPU core generation ahead
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Single-threaded applications
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Max turbo frequency of 4GHz
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Low latency: No 2P cache coherency
HP Apollo a6000 Chassis
Shared power & cooling
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Efficient pooled power shelf supports up to 6 chassis
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N, N+1, 2N redundancy configs
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12 volts DC output with max power of 15.9kW
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Advanced Power Manager

34. © Copyright 2012 Hewlett-Packard Development Company, L.P. The information contained herein is subject to 34 change without notice.
HP Confidential – NDA Required
HP Apollo a6000 Chassis
Standard 1m rack, rear cabled
5U
8.67”
Features
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1 slot and 2 slot tray support -10 single slot trays -5 double slot trays
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Mix-n-match trays
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Shared cooling
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12V DC power distribution
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5U tall infrastructure
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Up to 5700W per chassis
Serviceability
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Front serviceable trays
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Standard rear cabling
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Front serviceable hot plug drives
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Redundant, hot plug fans
5U (H) x 44.81cm (W) x 86.23cm (D)
5U (H) x 17.64 in (W) x 33.95 in (D)

35. © Copyright 2012 Hewlett-Packard Development Company, L.P. The information contained herein is subject to 35 change without notice.
HP Confidential – NDA Required
Aggregated iLO
HP APM
Power Shelf
Management Module
HP Apollo a6000 Chassis
Easy Serviceability Support
(2) Power Cages per chassis Supports up to 4 x 12V DC cables per chassis
(5) Fans
-Hot pluggable
-80mm Redundant
-Dual rotor fans
Network I/O Modules
Two 1GbE 1-port module
Two FlexibleLOM riser: supports 1GbE, 10GbE or IB
OR
HP Innovation Zone

36. © Copyright 2013 Hewlett-Packard Development Company, L.P. The information contained herein is subject to 36 change without notice.
The Apollo 6000 System
Maximizing efficiency for sustainability and savings
Saving up to $3 Million
per 1000 servers over 3 years
4x
density
per rack
per dollar
such as design automation or financial service risk analysis
35%
greater performance for EDA
Designed for single threaded HPC workloads

37. © Copyright 2014 Hewlett-Packard Development Company, L.P. The information contained herein is subject to 37 change without notice.
HP Confidential until June 9, 2014
HP Services for Apollo solutions
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Data center facilities
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Workload migration
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Big data, mobility, virtualization design, planning and implementation
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Factory Express
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Onsite installation
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HP Education
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Datacenter Care supports your environment
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Proactive Care helps prevent problems
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Foundation Care helps solve problems faster
Support
Consulting Services
Implementation
Data center planning and design services to achieve business outcomes
Ongoing support for business continuity
Services to speed startup and build capabilities with new technology
Financing
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Available globally where HP Financial Services conducts business1
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Technology refresh approach to allow for future scalability and upgrades
Flexible payment plan and terms
1Financing and service offerings available through Hewlett-Packard Financial Services Company and its subsidiaries and affiliates (collectively HPFSC) in certain countries and is subject to credit approval and execution of standard HPFSC documentation. Rates and terms are based on customer’s credit rating, offering types, services and/or equipment type and options. Not all customers may qualify. Not all services or offers are available in all countries. Other restrictions may apply. HPFSC reserves the right to change or cancel this program at any time without notice.

38. © Copyright 2014 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice.
HP Helion Self-Service HPC A Private Cloud Solution

39. © Copyright 2014 Hewlett-Packard Development Company, L.P. The information contained herein is subject to 39 change without notice.
HP Confidential until June 9, 2014
Challenges of accessing the full promise of HPC
Limited scalability
Skills shortage
Complexity
High cost

40. © Copyright 2014 Hewlett-Packard Development Company, L.P. The information contained herein is subject to 40 change without notice.
HP Confidential until June 9, 2014
Fast, easy access to scalable HPC resources for an expanded user base
HP Helion Self-Service HPC
Specialty compute
High-end compute
Applications
Data
A self-service portal simplifies access, usage, and sharing for more users
Agile private HPC cloud or managed HPC cloud based on HP Helion OpenStack®
Scalable, HPC-optimized infrastructure and management
Managed cloud
Private cloud
Public cloud

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HP Confidential until June 9, 2014
Empower your staff for increased productivity and accelerated go-to-market
Simple interface for easy access and use
Application-based resource request and job submission
Tailor the portal to each group’s needs
Integration with popular apps like ANSYS
Admins visually automate each service on agile cloud resources

42. © Copyright 2014 Hewlett-Packard Development Company, L.P. The information contained herein is subject to 42 change without notice.
HP Confidential until June 9, 2014
Usage Mgmt
ANSYS Pre and Post Processing Resources (optional ANSYS rendering jobs for low resource jobs)
ANSYS Rendering Jobs
Cluster Resources
End User Self-service HPC Portal
Workflow Engine
ESX
XenServer
VDI
Workload Manager
Bare metal
Cluster Management & Provisioning
KVM
Cluster Platform Systems (DL / SL)
Public Cloud Capacity
Common Open Source Cloud Platform
N+1 GPU, N VMs GPU, MPI Network
Optional (only when scheduling needed in HP Helion OpenStack use cases)
Selling the Complete HP Helion Self-Service HPC Solution Concept
Modular Solution Stack, tested and integrated
The OpenStack word mark and the Square O Design, together or apart, are trademarks or registered trademarks of OpenStack Foundation in the United States and other countries, and are used with the OpenStack Foundation’s permission.
App Service request & Job Submit
ANSYS Fluent
ANSYS
Workbench
A
C
B
Bare Metal

43. © Copyright 2014 Hewlett-Packard Development Company, L.P. The information contained herein is subject to 43 change without notice.
HP Confidential until June 9, 2014
Using HP Helion Self-Service HPC for driving productivity and growth
Accelerating the benefits of HPC
Go-to-market faster
Scale seamlessly
Increase staff access and usability
Reduce costs

44. © Copyright 2013 Hewlett-Packard Development Company, L.P. The information contained herein is subject to 44 change without notice.
Delivering a complete HPC solution
HP Cluster Platforms
Cloud
Servers
Storage
Accelerators
Network
Services
Power & Cooling
Management

45. © Copyright 2014 Hewlett-Packard Development Company, L.P. The information contained herein is subject to 45 change without notice.
HP Confidential until June 9, 2014
Get more Hyperscale information
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HP.COM/go/apollo
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HP.COM/go/moonshot
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HP.COM/go/scalable
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HP.COM/go/pod
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HP.COM/go/hpc
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HP.COM/go/compete
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HP.COM/go/mcs
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www.facebook.com/HPServers
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Hyperscale blog: http://h30507.www3.hp.com/t5/Hyperscale-Computing-Blog/bg- p/619
HP.com sites

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Questions ?