1. The document discusses opportunities for developing the semiconductor industry in Brazil through collaboration with South Korea, specifically in the areas of science, technology, and innovation. 2. It summarizes research conducted at the Micro Electronic Packaging Laboratory (MEPL) in Sungkyunkwan University, South Korea, including work on 3D packaging, interconnect reliability, and flexible electronics. 3. Key research findings are presented on drop test reliability of electronic packages, interface reaction of solder joints, and electromigration testing of 3D solder joints.

1. 1º FÓRUM BRASIL COREIA DO SUL EM CIÊNCIA, TECNOLOGIA E INOVAÇÃO: Oportunidades e Impactos do Desenvolvimento da Indústria de Semicondutores no Brasil 1st BRAZIL-SOUTH KOREA FORUM ON SCIENCE, TECHNOLOGY AND INNOVATION: Opportunities and impacts for the development of semiconductor industry in Brazil

2. Increased Efficiency in Electronic Packaging Hierarchy 35 ㎜ 20 ㎜ 15 ㎜ 10 ㎜ QFP TCP BGA CSP FC Package Not Exceeding 1.2x Die Area Start of Volume Production Package Efficiency ~‘91 ‘ 94~‘96 ‘ 96~‘97 ‘ 98~‘02 ‘ 03~ *TCP : TAB Carrier Package ‘ 08~ The 1st Brazil-South Korea Forum on Science, Technology, and Innovation 1 Prof. Yongil Kim, MEPL (Micro Electronic Packaging Laboratory)

4. Trend in 3 Dimensional Packages The 1st Brazil-South Korea Forum on Science, Technology, and Innovation 3 Prof. Yongil Kim, MEPL (Micro Electronic Packaging Laboratory)

5. Why stacking chips in 3D? (Yole Development, Oct. 2007) The 1st Brazil-South Korea Forum on Science, Technology, and Innovation 4 Prof. Yongil Kim, MEPL (Micro Electronic Packaging Laboratory)

6. Structure of E-BGA (Two-tier product) Solder ball Plugging paste Adhesive Side wall plating Heat sink The structure of Multi-tier E-BGA The 1st Brazil-South Korea Forum on Science, Technology, and Innovation For dissipation of generated heat by a chip and high I/O, Thermally Enhanced Multi-level BGA was introduced with a heat sink on back side of PCB. 5 Prof. Yongil Kim, MEPL (Micro Electronic Packaging Laboratory)

7. L/S=8 µm/8 µm (16 µm pitch): Pattern Thickness: 12 µm Cu Mapping SEM Subtractive -> Modified Semi-Additive Process New Type of Copper Foil for Dimension Controlled Fine Pattern The 1st Brazil-South Korea Forum on Science, Technology, and Innovation Fine Pattern for More Dense Circuit Design 6 Prof. Yongil Kim, MEPL (Micro Electronic Packaging Laboratory) Mitsui Mining and Smelting Co., Ltd. Copper Foil Sector. Advanced Materials Development Dept.

8. Sungkyunkwan University School of Advanced Materials Science & Engineering I ntroduction to M icro E lectronic P ackaging Lab. The 1st Brazil-South Korea Forum on Science, Technology, and Innovation MEPL in SKKU 7 Prof. Yongil Kim, MEPL (Micro Electronic Packaging Laboratory)

12. ③ Flip chip bonding with various material issues FC bonding with adhesives ACF in COF module Pb-free solder joints Hermetic sealing ④ Reliability evaluation of E-packages Thermal shock reliability Electromigration of solder joints Research areas at MEPL The 1st Brazil-South Korea Forum on Science, Technology, and Innovation 11 Prof. Yongil Kim, MEPL (Micro Electronic Packaging Laboratory)

13. Drop impact test & high speed shear test of E-packages ⑥ Conductive patterning with nano-ink & nano-paste RF characteristics Stretchable metal pattern ⑤ Standardization of drop & high-speed shear test method Research areas at MEPL The 1st Brazil-South Korea Forum on Science, Technology, and Innovation 12 Prof. Yongil Kim, MEPL (Micro Electronic Packaging Laboratory)

14. COF Module ⑦ Surface treatment for high reliability ⑧ Design & manufacture of test kit & module COG Module COB Module Ion migration Bondability of Pb-free solder joint Research areas at MEPL The 1st Brazil-South Korea Forum on Science, Technology, and Innovation 13 Prof. Yongil Kim, MEPL (Micro Electronic Packaging Laboratory)

15. ⑨ Development of LED Test Kits for high reliability Schematic diagrams of LED structure Without Heat Slug With Heat Slug Developed LED chip LED Chip Design LED Substrate Design Electrical Characteristic Evaluation Simulation Evaluation Research areas at MEPL The 1st Brazil-South Korea Forum on Science, Technology, and Innovation 14 Prof. Yongil Kim, MEPL (Micro Electronic Packaging Laboratory) LED package Lead Solder Substrate Cu pad

16. ⑩ Development of Stretchable Printed Circuit Board Mechanical Reliability Test Stretchable PCB Stretchable PCB Design Fabrication of Stretchable PCB Cu-Substrate Laminating DFR Laminating Lithography Developing & Etching Research areas at MEPL The 1st Brazil-South Korea Forum on Science, Technology, and Innovation 15 Prof. Yongil Kim, MEPL (Micro Electronic Packaging Laboratory)

17. The 1st Brazil-South Korea Forum on Science, Technology, and Innovation Some Research Results at MEPL Drop reliability : 0.10 ㎛ > 0.15 ㎛ > 0.05 ㎛ > 0 ㎛ Drop Test Results in ENEPIG Finished Samples 0.10 µm Pd specimen showed higher drop/shock reliability than 0.05 µm Pd specimen, about twofold, and even than 0.15 µm Pd specimen. - Cracks started from the edge to the center of the solders in all specimens. - Crack propagated along P-rich Ni/(Cu,Ni) 6 Sn 5 interfaces, through (Cu,Ni) 6 Sn 5 IMCs, or solder/(Cu,Ni) 6 Sn 5 interfaces. Crack Propagation after Drop Test (1~3) 16 Prof. Yongil Kim, MEPL (Micro Electronic Packaging Laboratory) Pd thickness ( ㎛ ) Number of drop Ni(P) (Cu,Ni) 6 Sn 5 Pd : 0.05 ㎛ Ni(P) (Cu,Ni) 6 Sn 5 (Cu,Ni) 6 Sn 5 Pd : 0.10 ㎛ Ni(P) (Cu,Ni) 6 Sn 5 (Cu,Ni) 6 Sn 5 Pd : 0.15 ㎛

18. The 1st Brazil-South Korea Forum on Science, Technology, and Innovation Some Research Results at MEPL Interface Reaction: EPMA Pd Mapping Ni EPMA Location 17 Prof. Yongil Kim, MEPL (Micro Electronic Packaging Laboratory) Ni Ni Ni Ni

19. The 1st Brazil-South Korea Forum on Science, Technology, and Innovation Some Research Results at MEPL 10 reflows 1 reflow ENIG - ENIG 1 reflow 10 reflows OSP - OSP Solder Joints of ENIG and OSP Surface Finishes Cu Cu Solder Ball Surface Treatment Sn-3.5Ag-0.7Cu IMC thickness IMC thickness 18 Prof. Yongil Kim, MEPL (Micro Electronic Packaging Laboratory) Cu Ni (Ni,Cu) 3 Sn 4 Solder Cu Ni Solder (Ni,Cu) 3 Sn 4 Cu Ni (Cu,Ni) 6 Sn 5 +(Ni,Cu) 3 Sn 4 Solder Cu Ni Solder (Cu,Ni) 6 Sn 5 +(Ni,Cu) 3 Sn 4 Cu Cu Solder Solder Cu 6 Sn 5 Cu 6 Sn 5 Cu Solder Solder Cu 6 Sn 5 Cu 6 Sn 5 Cu

20. The 1st Brazil-South Korea Forum on Science, Technology, and Innovation Some Research Results at MEPL Electro-migration Test in 3D Solder Joints 19 Prof. Yongil Kim, MEPL (Micro Electronic Packaging Laboratory) 1 st bump 2 nd bump 3 rd bump 1 st bump 3 rd bump 2 nd bump

21. Thank you very much MEPL in SKKU The 1st Brazil-South Korea Forum on Science, Technology, and Innovation 20 Prof. Yongil Kim, MEPL (Micro Electronic Packaging Laboratory)