EPIC has grown 58% in 18 months, today 127 members in 21 countries are part of the European Photonics Industry Consortium. The EPIC reach through LinkedIn reaches 47.764 members, EPIC videos count 3303 views in 1 year, the personal contacts network includes 4137 industry leaders and experts.
EPIC Members: www.epic-assoc.com/membership
EPIC LinkedIn Groups: www.epic-assoc.com/linkedin
EPIC Videos: http://www.youtube.com/user/CarlosLeeEPIC
Beyond all of the hype and tumult, market drivers and technological developments are converging to ensure a bright future for Si photonics.
THOUGH THE SI PHOTONICS MARKET HAS JUST KICKED OFF, VOLUME PRODUCTION IS ALREADY CLOSE
Big data is getting bigger by the second, and transporting it with existing technologies will push the limits of power consumption, density and weight. Yole Développement analysts are convinced that photons will replace electrons, and that Si photonics will be the mid-term platform to assist this transition.
Si photonics offers the advantages of silicon technology: low cost, higher integration, more embedded functionalities and higher interconnect density. It also provides two other key advantages:
1. Low power consumption: particularly when compared to copper-based solutions, which are expensive and require high electrical consumption.
2. Reliability: especially important for data centers, where a typical rack server’s lifespan is two years before replacement.
Back in 2006, VOA were the market’s first Si photonics products. Today, there are still a few Si photonics products on the market (i.e. VOA, AOC and transceivers from Luxtera, Kotura/Mellanox and Cisco/Lightwire) but big companies (i.e. Intel, HP and IBM) are close to realizing silicon photonics products. Yole Développement also sees big OEMs such as Facebook, Google and Amazon developing their own optical data center technology in partnership with chip firms (such as Facebook with Intel).
In this report Yole Développement shows that, in the short-term, silicon photonics will be the platform solution for future high-power, high-bandwidth data centers. Silicon photonics chips will be deployed in high-speed signal transmission systems, which greatly exceed copper cabling’s capabilities, i.e. for data centers and high-performance computing (HPC). As silicon photonics evolves and chips become more sophisticated, we expect the technology to be used more often in processing tasks such as interconnecting multiple cores within processor chips to boost access to shared cache and busses.
Analysts also analyzed silicon photonics’ chances of being used for telecom, consumer, medical and biosensors applications, compared with competing technologies.
More information on that report at http://www.i-micronews.com/reports/Silicon-Photonics-2014-report/1/445/
Optics and Photonics Core Market Analysis from SPIESteve Anderson
A novel approach to assessing the photonics industry involves an in-depth look at more than 3000 companies. It has yielded a unique ranking of the firms that serve the optics and photonics marketplace and their impact on the global economy.
Silicon Electronic Photonic Integrated Circuits (SiEPIC) – Research TrainingLukas Chrostowski
June 23, 2015
Webinar
Presented for the OSA, osa.peachnewmedia.com/store/seminar/seminar.php?seminar=43624
In this webinar, Lukas Chrostowski will discuss the Canada-wide NSERC CREATE research training Program – Silicon Electronic Photonic Integrated Circuits (Si-EPIC) – which has established a large community of silicon photonics researchers. This program is based in Canada and is open to international academic and industrial participants. Since 2008, we have been offering training workshops and courses. Common to all these experiences is that they all have a design–fabricate–test cycle, namely we provide participants with feedback and get their designs fabricated. We have four design workshops that are each one week long: 1) Passive silicon photonics, 2) active silicon photonics (e.g., design of 40 Gb/s travelling-wave modulators), 3) CMOS electronics for photonics, and 4) systems, integration and packaging. We also offer half-day workshops at conferences (Group IV Photonics, IEEE Photonics Conference). Finally, we have our first on-line course starting July 7, namely edX Silicon Photonics Design, Fabrication and Data Analysis. In the conference and edX course, we include automated testing so participants can get real data to analyze. Lukas will also provide examples of research innovations, including sub-wavelength grating devices, Bragg gratings, contra-directional grating-assisted couplers, and others.
What You Will Learn/Seminar Objectives
Overview of the Canada-wide NSERC CREATE research training Program – Silicon Electronic Photonic Integrated Circuits (Si-EPIC)
Overview of our online course - edX Silicon Photonics Design, Fabrication and Data Analysis
Who Should Attend:
Graduate students, postdocs and researchers interested in the field of Silicon Photonics and Photonic Integrated Circuits.
Photonic scientists working on the design and fabrication of novel silicon nanophotonic devices.
Level: The level of the webinar is intermediate. The basic concepts will be explained. However, a basic knowledge of Silicon Photonics is assumed.
Photonics market data on sensors, date centers, detectors, lighting (LED and ...Carlos Lee
Yole report abstract for EPIC 2016 International Optoelectronics Association presented by Carlos Lee, on 23 April 2016 in Zurich, Switzerland. For more information contact carlos.lee@epic-assoc.com
TOPICS: Sensors for Drones and robots, Gas sensor market and technology trends, Technology challenges for data center: the photonic case, Infrared detector market, LED modules technology and market trends, OLED for lighting, Medical imaging, Microbolometers.
Examples of Photonics Applications for DAY OF PHOTONICS 21 October 2014Carlos Lee Epic
Examples of photonics, optics, lasers, fiber, ... for more information please contact carlos.lee@epic-assoc.com or visit www.epic-assoc.com or www.day-of-photonics.org
In this slidecast, Brian Welch from Luxtera presents: Silicon Photonics for HPC Interconnects. Luxtera is the first company to overcome the complex technical obstacles involved with integrating high performance optics directly with silicon electronics on a mainstream CMOS chip, bringing direct “fiber to the chip” connectivity to market.
Beyond all of the hype and tumult, market drivers and technological developments are converging to ensure a bright future for Si photonics.
THOUGH THE SI PHOTONICS MARKET HAS JUST KICKED OFF, VOLUME PRODUCTION IS ALREADY CLOSE
Big data is getting bigger by the second, and transporting it with existing technologies will push the limits of power consumption, density and weight. Yole Développement analysts are convinced that photons will replace electrons, and that Si photonics will be the mid-term platform to assist this transition.
Si photonics offers the advantages of silicon technology: low cost, higher integration, more embedded functionalities and higher interconnect density. It also provides two other key advantages:
1. Low power consumption: particularly when compared to copper-based solutions, which are expensive and require high electrical consumption.
2. Reliability: especially important for data centers, where a typical rack server’s lifespan is two years before replacement.
Back in 2006, VOA were the market’s first Si photonics products. Today, there are still a few Si photonics products on the market (i.e. VOA, AOC and transceivers from Luxtera, Kotura/Mellanox and Cisco/Lightwire) but big companies (i.e. Intel, HP and IBM) are close to realizing silicon photonics products. Yole Développement also sees big OEMs such as Facebook, Google and Amazon developing their own optical data center technology in partnership with chip firms (such as Facebook with Intel).
In this report Yole Développement shows that, in the short-term, silicon photonics will be the platform solution for future high-power, high-bandwidth data centers. Silicon photonics chips will be deployed in high-speed signal transmission systems, which greatly exceed copper cabling’s capabilities, i.e. for data centers and high-performance computing (HPC). As silicon photonics evolves and chips become more sophisticated, we expect the technology to be used more often in processing tasks such as interconnecting multiple cores within processor chips to boost access to shared cache and busses.
Analysts also analyzed silicon photonics’ chances of being used for telecom, consumer, medical and biosensors applications, compared with competing technologies.
More information on that report at http://www.i-micronews.com/reports/Silicon-Photonics-2014-report/1/445/
Optics and Photonics Core Market Analysis from SPIESteve Anderson
A novel approach to assessing the photonics industry involves an in-depth look at more than 3000 companies. It has yielded a unique ranking of the firms that serve the optics and photonics marketplace and their impact on the global economy.
Silicon Electronic Photonic Integrated Circuits (SiEPIC) – Research TrainingLukas Chrostowski
June 23, 2015
Webinar
Presented for the OSA, osa.peachnewmedia.com/store/seminar/seminar.php?seminar=43624
In this webinar, Lukas Chrostowski will discuss the Canada-wide NSERC CREATE research training Program – Silicon Electronic Photonic Integrated Circuits (Si-EPIC) – which has established a large community of silicon photonics researchers. This program is based in Canada and is open to international academic and industrial participants. Since 2008, we have been offering training workshops and courses. Common to all these experiences is that they all have a design–fabricate–test cycle, namely we provide participants with feedback and get their designs fabricated. We have four design workshops that are each one week long: 1) Passive silicon photonics, 2) active silicon photonics (e.g., design of 40 Gb/s travelling-wave modulators), 3) CMOS electronics for photonics, and 4) systems, integration and packaging. We also offer half-day workshops at conferences (Group IV Photonics, IEEE Photonics Conference). Finally, we have our first on-line course starting July 7, namely edX Silicon Photonics Design, Fabrication and Data Analysis. In the conference and edX course, we include automated testing so participants can get real data to analyze. Lukas will also provide examples of research innovations, including sub-wavelength grating devices, Bragg gratings, contra-directional grating-assisted couplers, and others.
What You Will Learn/Seminar Objectives
Overview of the Canada-wide NSERC CREATE research training Program – Silicon Electronic Photonic Integrated Circuits (Si-EPIC)
Overview of our online course - edX Silicon Photonics Design, Fabrication and Data Analysis
Who Should Attend:
Graduate students, postdocs and researchers interested in the field of Silicon Photonics and Photonic Integrated Circuits.
Photonic scientists working on the design and fabrication of novel silicon nanophotonic devices.
Level: The level of the webinar is intermediate. The basic concepts will be explained. However, a basic knowledge of Silicon Photonics is assumed.
Photonics market data on sensors, date centers, detectors, lighting (LED and ...Carlos Lee
Yole report abstract for EPIC 2016 International Optoelectronics Association presented by Carlos Lee, on 23 April 2016 in Zurich, Switzerland. For more information contact carlos.lee@epic-assoc.com
TOPICS: Sensors for Drones and robots, Gas sensor market and technology trends, Technology challenges for data center: the photonic case, Infrared detector market, LED modules technology and market trends, OLED for lighting, Medical imaging, Microbolometers.
Examples of Photonics Applications for DAY OF PHOTONICS 21 October 2014Carlos Lee Epic
Examples of photonics, optics, lasers, fiber, ... for more information please contact carlos.lee@epic-assoc.com or visit www.epic-assoc.com or www.day-of-photonics.org
In this slidecast, Brian Welch from Luxtera presents: Silicon Photonics for HPC Interconnects. Luxtera is the first company to overcome the complex technical obstacles involved with integrating high performance optics directly with silicon electronics on a mainstream CMOS chip, bringing direct “fiber to the chip” connectivity to market.
Silicon Photonics: A Solution for Ultra High Speed Data TransferIDES Editor
Silicon photonics is the integration of integrated
optics and photonics IC technologies in silicon. Silicon
photonics has recently attracted a great deal of attention since
it offers an opportunity for low cost solutions for various
applications ranging from telecommunications to chip-chip
inter connects. Two keys to this advancement are the increased
speed of communications (now at the speed of light) and the
increased amount of data that can be transmitted at once (i.e.,
bandwidth). Silicon photonics is the study and application of
photonic systems which use silicon as an optical medium.
The silicon is usually patterned with sub-micrometer
precision, into microphotonic components. These operate in
the infrared, most commonly at the 1.55 micrometer
wavelength used by most fiber optic telecommunication
systems. The silicon typically lies on top of a layer of silica in
what (by analogy with a similar construction in
microelectronics) is known as silicon on insulator (SOI). Today
the problems associated with multi-core processors with copper
interconnect are Latency, Bandwidth, Power dissipation,
Electromagnetic interference and Signal integrity. Micro
processor designers use the integration of number of
transistors that could be squeezed onto each chip to boost
computational horsepower. That in turn caused the amount
of waste heat that had to be dissipated from each square
millimeter of silicon to go up. One problem we are facing in
this effort is that micro processors with large numbers of cores
are not yet being manufactured. Fiber optics has a reputation
as an expensive solution because of high cost of hardware and
Fabrication is done using exotic materials which are costly.
The methods used in assembly and package of these
components are also expensive. A recent break through in
silicon photonics is in the development of a laser modulator
that encodes optical data at 40 billion bits per second. Finally
reached the goal of data transmission at 40 Gbps speed,
matching the fastest devices deployed today with least cost of
processing and showing the ultimate solutions to the problems
associated with copper interconnects in multi-core processors
and expensive fiber optics.
Profitability of Optical Component Suppliers - CIOE 2012LightCounting
At the China International Optoelectronic Exhibition 2012, our LightCounting analyst team presented this market research data. It highlighted the profitability (or lack thereof) of optical component suppliers.
Technology and cost review of nine RF IPD found on the market from different suppliers: Broadcom, IPDiA, Murata, Qorvo, Skyworks and STMicroelectronics.
With integrated passive devices (IPD) accounting for almost 70 % of the PCB area in smartphones, integration is a challenge that several integrated device manufacturers (IDM) and outsourced semiconductor assembly & test (OSAT) companies have accepted in the last few years. Players active in the RF applications market include IDM companies like Qorvo, Skyworks, Murata, Broadcom, and STMicroelectronics, as well as OSATs such as STATS ChipPAC, ASE, Amkor, and TSMC.
RF Front End modules and components for cellphones 2017 - Report by Yole Deve...Yole Developpement
A dynamic market with high responsivity to technical innovation, the RF front end industry is set to grow at 14% CAGR to reach $22.7B in 2022.
A market that will more than double in six years!
The radio-frequency (RF) front end and components market for cellphones is highly dynamic. From being worth $10.1B last year, it is expected to reach $22.7B in 2022. Such high growth is definitely something that players in other semiconductor markets would envy. However, the growth is not evenly distributed.
Filters represent the biggest business in the RF front end industry, and the value of this business will more than triple from 2016 to 2022. Most of this growth will derive from additional filtering needs from new antennas as well as the need for more filtering functionality due to multiple carrier aggregation (CA).
Power amplifiers (PAs) and low noise amplifiers (LNAs), the second biggest business, will be almost flat over the same period. High-end LTE PA market growth will be balanced by a shrinking 2G/3G market. The LNA market will grow steadily, especially thanks to the addition of new antennas.
Switches, the third biggest business, will double. This market will mainly be driven by antenna switches.
Lastly, antenna tuners, a small business today with an estimated $36M market value, will expand 7.5-fold to reach $272M in 2022. This growth is mainly due to tuning being added to both the main and the diversity antennas.
For more discussion, please visit our website: http://www.i-micronews.com/reports.html
Silicon Photonics for Data Centers and Other Applications 2016 - Report by Yo...Yole Developpement
Exponential data growth in data centers will propel silicon photonics to take off into other applications, like lidar.
Big data is getting bigger by the second. Transporting this level of data around with existing technologies will soon reach power consumption, density and weight limits. Photons will continue to replace electrons throughout networks, including in the data center, in the rack and very soon on the board.
Silicon photonics is an exciting technology mixing optics, CMOS technology and advanced packaging. It combines silicon technology’s low cost, higher integration and interconnect density and higher number of embedded functionalities with lower power consumption and better reliability compared to legacy optics.
Massive R&D investments have been made in silicon photonics, but today there are still few products on the market. However, this technology has been strongly pushed by large Webcom companies such as Microsoft, Amazon and Facebook, with investments that will overtake the traditional service providers’ investments in a few years. These Webcom players are targeting $1/Gb prices and are principals for the development of cost-effective photonics technology for future generations of data centers.
Beyond communication, silicon photonics is penetrating consumer and automotive – heading to $1.1B in 2026.
More information: https://www.i-micronews.com/products/silicon-photonics-2021/
Photolithography Equipment and Materials for Advanced Packaging, MEMS and LED...Yole Developpement
Growing photolithography equipment markets in Advanced Packaging, MEMS and LEDs are attracting new players – but they have to navigate complex roadmaps.
Clear leaders and outsiders: At first glance, the projection systems industry serving the “More Moore” and the “More than Moore” markets are similar…
The semiconductor industry is very often identified by its “More Moore” players, driven by technology downscaling and cost reduction. There’s one clear leader supplying photolithography tools to the “More Moore” industry: ASML, based in The Netherlands. It’s followed by two Japanese outsiders, Nikon and Canon. Providing this market with photolithography equipment is highly complex and there are gigantic barriers to market entry. Enormous R&D investments are required as the key features to print shrink ever further. Also, the tolerances specified are very aggressive and thus equipment complexity keeps on increasing...
GaN Devices for Power Electronics: Patent InvestigationKnowmade
This report provides essential patent and market data on GaN power electronics, with in-depth analysis of key technology segments and key players:
• IP trends including time evolution and countries of filing
• Power GaN market data and forecasts
• Ranking of main patent applicants
• Joint developments and IP collaboration network of main patent applicants
• Key patents and granted patents near expiration
• Relative strength of main companies’ IP portfolios
• Matrix showing patent applicants and patented technologies
• Segmentation of patents:
- by technology levels, including epi-wafers, devices, modules and packaging,
- by technical challenges, including current collapse, E-mode and cascode,
- and by type of substrate including SiC, silicon, sapphire and bulk GaN.
• A special focus is provided on power semiconductor devices (transistors and diodes at the semiconductor level) and power components (discrete components, power modules and packaging).
• Power GaN IP profiles of 9 major companies, with key patents, technological issues, litigation, licenses, partnerships, IP strength, IP strategy and latest market news: International Rectifier (IR), Infineon, Transphorm, Fujitsu, Efficient Power Conversion (EPC), Power Integrations, GaN Systems, Panasonic and Mitsubishi Electric.
The report also provides an extensive Excel database with all patents analyzed in the report, including technology segmentation.
This Patent Investigation allows understanding the technology & market from a patent perspective. The report provides a clear link between the IP situation and market evolutions. It enables you to anticipate changes, harvest business opportunities, mitigate risks and make strategic decisions to strengthen your market position and maximize return on your IP portfolio.
GaN-on-Si Substrate Technology and Market for LED and Power ElectronicsYole Developpement
GaN-on-Si enables GaN power electronics, will LED transition as well?
GaN-ON-Si LED IS ALREADY ADOPTED BY SOME LED MANUFACTURERS, BUT COULD IT BECOME THE INDUSTRY STANDARD?
Today, GaN on Sapphire is the main stream technology for LED manufacturing. GaN-on-Si technology appeared naturally as an alternative to sapphire to reduce cost. Our cost simulation indicates that the differential in silicon substrate cost is not enough to justify the transition to GaN-on-Si technology. The main driver is the ability to manufacture in existing, depreciated CMOS fabs in 6” or 8”.
Despite potential cost benefits for LEDs, the mass adoption of GaN-on-Si technology for LED applications remains unclear. Opinions regarding the chance of success for LED-on-Si vary widely in the LED industry from unconditional enthusiasm to unjustified skepticism. Virtually all major LED makers are researching GaN-on-Si LED, but few have made it the core of their strategy and technology roadmap. Among the proponents, only Lattice Power, Plessey and Toshiba have moved to production and are offering commercial LED-on-Si.
At Yole Développement, we believe that although significant improvements have been achieved, there are still some technology hurdles (performance, yields, CMOS compatibility). We consider that if the technology hurdles are cleared, GaN-on-Si LEDs will be adopted by some LED manufacturers, but will not become the industry standard. We expect that Silicon will capture less than 5% of LED manufacturing by 2020.
GaN-ON-Si TECHNOLOGY WILL BE WIDELY ADOPTED BY POWER ELECTRONICS APPLICATIONS
The power electronics market addresses applications such as AC to DC or DC to AC conversion, which is always associated with substantial energy losses that increase with higher power and operating frequencies. Incumbent silicon based technology is reaching its limit and it is difficult to meet higher requirements. GaN based power electronics have the potential to significantly improve efficiency at both high power and frequencies while reducing device complexity and weight. Power GaN are therefore emerging as a substitution to the silicon based technology. Today, Power GaN remains at its early stage and presents only a tiny part of power electronics market.
We are quite optimistic about the adoption of GaN-on-Si technology for Power GaN devices. GaN-on-Si technology have brought to market the first GaN devices. Contrary to the LED industry, where GaN-on-Sapphire technology is main stream and presents a challenging target, GaN-on-Si will dominate the GaN based power electronics market because of its lower cost and CMOS compatibility. Although GaN based devices remain more expensive than Si based devices today, the overall cost of GaN devices for some applications are expected to be lower than Si devices three years from now, according to some manufacturers.
http://www.i-micronews.com/reports/GaN-on-Si-Substrate-Market-LED-Power-Electronics/3/424/
LiFi - Technology, Industry, and Market Trends report by Yole DéveloppementYole Developpement
LiFi: Niche or mainstream technology?
More information on : https://www.i-micronews.com/led-report/product/lifi-technology-industry-and-market-trends.html
MicroLED technology advances enable a credible cost reduction path toward high volume applications.
More info on: https://www.i-micronews.com/report/product/microled-displays-2018.html
Compare the technology and cost of 19 microphones from Knowles, Goertek, AAC Technologies, STMicroelectronics, TDK-InvenSense, TDK-Epcos, Cirrus Logic and Vesper.
Reverse Costing - Structure, process and cost report - find more here: https://www.systemplus.fr/reverse-costing-reports/consumer-mems-microphones-comparison-2020/
Report’s Key Features
• PDF with > 270 slides
• Excel file > 9,500 patents
• IP trends, including time-evolution of published patents, countries of patent filings, etc.
• Ranking of main patent assignees
• Key players’ IP position and relative strength of their patent portfolios
• Patent segmentation:
– Vertical power device (vertical transistor, vertical diode),
– Normally-off (E-mode transistor, cascode topology),
– Integration (monolithic E/D-mode, SiP/SoC, power IC),
– GaN-on-Si,
– GaN-on-Sapphire,
– Selective area p-type doping (ion implantation, p-GaN regrowth),
– Current collapse,
– Thermal management,
– Stray inductance,
– EV/HEV,
– fast charging,
– wireless charging.
• Key patent identification and details
• IP profile of 40 key players: Infineon, Panasonic, Toshiba etc.
• Excel database containing all patents analyzed in the report, including technology and application segmentations
Littelfuse and Monolith Semiconductors, in collaboration with X-Fab, have released a 1st-generation, high-reliability MOSFET with the hope of making this silicon carbide product mainstream.
The market outlook for SiC devices is promising, with a compound annual growth rate (CAGR) of 28% from 2016 – 2020. This will increase to 40% from 2020 – 2022 due to growth among automotive and industrial applications. In total, the SiC market will exceed $1B in 2022. In the energy conversion sector, SiC devices have an actual value of $250M, which will increase by around 28% in 2022. The reason for this relates to market forces pushing for loss reduction, not only for the sake of improved efficiency but also for smaller packages.
More information on that report a http://www.systemplus.fr/reverse-costing-reports/littelfuse-silicon-carbide-mosfet-lcis1mo120e0080-1200v-25a-80mohms/
Mems and sensors packaging technology and trends presentation held by Amandin...Yole Developpement
MEMS & sensors transitioning towards 3 main Hubs…
The inertial hub
Examples of MEMS companies with a «sensors integration» road (e.g., mCubewith iGyro, Spectral Engines with integrated spectrometer, Bosch with environmental combo sensors, AMS with optical combos, InvenSense with IMUs ….
Emerging semiconductor substrates are expected to grow at a 24% CAGR from 2018 – 2024.
More information on https://www.i-micronews.com/products/emerging-semiconductor-substrates-market-technology-trends-2019/
Silicon Photonics: A Solution for Ultra High Speed Data TransferIDES Editor
Silicon photonics is the integration of integrated
optics and photonics IC technologies in silicon. Silicon
photonics has recently attracted a great deal of attention since
it offers an opportunity for low cost solutions for various
applications ranging from telecommunications to chip-chip
inter connects. Two keys to this advancement are the increased
speed of communications (now at the speed of light) and the
increased amount of data that can be transmitted at once (i.e.,
bandwidth). Silicon photonics is the study and application of
photonic systems which use silicon as an optical medium.
The silicon is usually patterned with sub-micrometer
precision, into microphotonic components. These operate in
the infrared, most commonly at the 1.55 micrometer
wavelength used by most fiber optic telecommunication
systems. The silicon typically lies on top of a layer of silica in
what (by analogy with a similar construction in
microelectronics) is known as silicon on insulator (SOI). Today
the problems associated with multi-core processors with copper
interconnect are Latency, Bandwidth, Power dissipation,
Electromagnetic interference and Signal integrity. Micro
processor designers use the integration of number of
transistors that could be squeezed onto each chip to boost
computational horsepower. That in turn caused the amount
of waste heat that had to be dissipated from each square
millimeter of silicon to go up. One problem we are facing in
this effort is that micro processors with large numbers of cores
are not yet being manufactured. Fiber optics has a reputation
as an expensive solution because of high cost of hardware and
Fabrication is done using exotic materials which are costly.
The methods used in assembly and package of these
components are also expensive. A recent break through in
silicon photonics is in the development of a laser modulator
that encodes optical data at 40 billion bits per second. Finally
reached the goal of data transmission at 40 Gbps speed,
matching the fastest devices deployed today with least cost of
processing and showing the ultimate solutions to the problems
associated with copper interconnects in multi-core processors
and expensive fiber optics.
Profitability of Optical Component Suppliers - CIOE 2012LightCounting
At the China International Optoelectronic Exhibition 2012, our LightCounting analyst team presented this market research data. It highlighted the profitability (or lack thereof) of optical component suppliers.
Technology and cost review of nine RF IPD found on the market from different suppliers: Broadcom, IPDiA, Murata, Qorvo, Skyworks and STMicroelectronics.
With integrated passive devices (IPD) accounting for almost 70 % of the PCB area in smartphones, integration is a challenge that several integrated device manufacturers (IDM) and outsourced semiconductor assembly & test (OSAT) companies have accepted in the last few years. Players active in the RF applications market include IDM companies like Qorvo, Skyworks, Murata, Broadcom, and STMicroelectronics, as well as OSATs such as STATS ChipPAC, ASE, Amkor, and TSMC.
RF Front End modules and components for cellphones 2017 - Report by Yole Deve...Yole Developpement
A dynamic market with high responsivity to technical innovation, the RF front end industry is set to grow at 14% CAGR to reach $22.7B in 2022.
A market that will more than double in six years!
The radio-frequency (RF) front end and components market for cellphones is highly dynamic. From being worth $10.1B last year, it is expected to reach $22.7B in 2022. Such high growth is definitely something that players in other semiconductor markets would envy. However, the growth is not evenly distributed.
Filters represent the biggest business in the RF front end industry, and the value of this business will more than triple from 2016 to 2022. Most of this growth will derive from additional filtering needs from new antennas as well as the need for more filtering functionality due to multiple carrier aggregation (CA).
Power amplifiers (PAs) and low noise amplifiers (LNAs), the second biggest business, will be almost flat over the same period. High-end LTE PA market growth will be balanced by a shrinking 2G/3G market. The LNA market will grow steadily, especially thanks to the addition of new antennas.
Switches, the third biggest business, will double. This market will mainly be driven by antenna switches.
Lastly, antenna tuners, a small business today with an estimated $36M market value, will expand 7.5-fold to reach $272M in 2022. This growth is mainly due to tuning being added to both the main and the diversity antennas.
For more discussion, please visit our website: http://www.i-micronews.com/reports.html
Silicon Photonics for Data Centers and Other Applications 2016 - Report by Yo...Yole Developpement
Exponential data growth in data centers will propel silicon photonics to take off into other applications, like lidar.
Big data is getting bigger by the second. Transporting this level of data around with existing technologies will soon reach power consumption, density and weight limits. Photons will continue to replace electrons throughout networks, including in the data center, in the rack and very soon on the board.
Silicon photonics is an exciting technology mixing optics, CMOS technology and advanced packaging. It combines silicon technology’s low cost, higher integration and interconnect density and higher number of embedded functionalities with lower power consumption and better reliability compared to legacy optics.
Massive R&D investments have been made in silicon photonics, but today there are still few products on the market. However, this technology has been strongly pushed by large Webcom companies such as Microsoft, Amazon and Facebook, with investments that will overtake the traditional service providers’ investments in a few years. These Webcom players are targeting $1/Gb prices and are principals for the development of cost-effective photonics technology for future generations of data centers.
Beyond communication, silicon photonics is penetrating consumer and automotive – heading to $1.1B in 2026.
More information: https://www.i-micronews.com/products/silicon-photonics-2021/
Photolithography Equipment and Materials for Advanced Packaging, MEMS and LED...Yole Developpement
Growing photolithography equipment markets in Advanced Packaging, MEMS and LEDs are attracting new players – but they have to navigate complex roadmaps.
Clear leaders and outsiders: At first glance, the projection systems industry serving the “More Moore” and the “More than Moore” markets are similar…
The semiconductor industry is very often identified by its “More Moore” players, driven by technology downscaling and cost reduction. There’s one clear leader supplying photolithography tools to the “More Moore” industry: ASML, based in The Netherlands. It’s followed by two Japanese outsiders, Nikon and Canon. Providing this market with photolithography equipment is highly complex and there are gigantic barriers to market entry. Enormous R&D investments are required as the key features to print shrink ever further. Also, the tolerances specified are very aggressive and thus equipment complexity keeps on increasing...
GaN Devices for Power Electronics: Patent InvestigationKnowmade
This report provides essential patent and market data on GaN power electronics, with in-depth analysis of key technology segments and key players:
• IP trends including time evolution and countries of filing
• Power GaN market data and forecasts
• Ranking of main patent applicants
• Joint developments and IP collaboration network of main patent applicants
• Key patents and granted patents near expiration
• Relative strength of main companies’ IP portfolios
• Matrix showing patent applicants and patented technologies
• Segmentation of patents:
- by technology levels, including epi-wafers, devices, modules and packaging,
- by technical challenges, including current collapse, E-mode and cascode,
- and by type of substrate including SiC, silicon, sapphire and bulk GaN.
• A special focus is provided on power semiconductor devices (transistors and diodes at the semiconductor level) and power components (discrete components, power modules and packaging).
• Power GaN IP profiles of 9 major companies, with key patents, technological issues, litigation, licenses, partnerships, IP strength, IP strategy and latest market news: International Rectifier (IR), Infineon, Transphorm, Fujitsu, Efficient Power Conversion (EPC), Power Integrations, GaN Systems, Panasonic and Mitsubishi Electric.
The report also provides an extensive Excel database with all patents analyzed in the report, including technology segmentation.
This Patent Investigation allows understanding the technology & market from a patent perspective. The report provides a clear link between the IP situation and market evolutions. It enables you to anticipate changes, harvest business opportunities, mitigate risks and make strategic decisions to strengthen your market position and maximize return on your IP portfolio.
GaN-on-Si Substrate Technology and Market for LED and Power ElectronicsYole Developpement
GaN-on-Si enables GaN power electronics, will LED transition as well?
GaN-ON-Si LED IS ALREADY ADOPTED BY SOME LED MANUFACTURERS, BUT COULD IT BECOME THE INDUSTRY STANDARD?
Today, GaN on Sapphire is the main stream technology for LED manufacturing. GaN-on-Si technology appeared naturally as an alternative to sapphire to reduce cost. Our cost simulation indicates that the differential in silicon substrate cost is not enough to justify the transition to GaN-on-Si technology. The main driver is the ability to manufacture in existing, depreciated CMOS fabs in 6” or 8”.
Despite potential cost benefits for LEDs, the mass adoption of GaN-on-Si technology for LED applications remains unclear. Opinions regarding the chance of success for LED-on-Si vary widely in the LED industry from unconditional enthusiasm to unjustified skepticism. Virtually all major LED makers are researching GaN-on-Si LED, but few have made it the core of their strategy and technology roadmap. Among the proponents, only Lattice Power, Plessey and Toshiba have moved to production and are offering commercial LED-on-Si.
At Yole Développement, we believe that although significant improvements have been achieved, there are still some technology hurdles (performance, yields, CMOS compatibility). We consider that if the technology hurdles are cleared, GaN-on-Si LEDs will be adopted by some LED manufacturers, but will not become the industry standard. We expect that Silicon will capture less than 5% of LED manufacturing by 2020.
GaN-ON-Si TECHNOLOGY WILL BE WIDELY ADOPTED BY POWER ELECTRONICS APPLICATIONS
The power electronics market addresses applications such as AC to DC or DC to AC conversion, which is always associated with substantial energy losses that increase with higher power and operating frequencies. Incumbent silicon based technology is reaching its limit and it is difficult to meet higher requirements. GaN based power electronics have the potential to significantly improve efficiency at both high power and frequencies while reducing device complexity and weight. Power GaN are therefore emerging as a substitution to the silicon based technology. Today, Power GaN remains at its early stage and presents only a tiny part of power electronics market.
We are quite optimistic about the adoption of GaN-on-Si technology for Power GaN devices. GaN-on-Si technology have brought to market the first GaN devices. Contrary to the LED industry, where GaN-on-Sapphire technology is main stream and presents a challenging target, GaN-on-Si will dominate the GaN based power electronics market because of its lower cost and CMOS compatibility. Although GaN based devices remain more expensive than Si based devices today, the overall cost of GaN devices for some applications are expected to be lower than Si devices three years from now, according to some manufacturers.
http://www.i-micronews.com/reports/GaN-on-Si-Substrate-Market-LED-Power-Electronics/3/424/
LiFi - Technology, Industry, and Market Trends report by Yole DéveloppementYole Developpement
LiFi: Niche or mainstream technology?
More information on : https://www.i-micronews.com/led-report/product/lifi-technology-industry-and-market-trends.html
MicroLED technology advances enable a credible cost reduction path toward high volume applications.
More info on: https://www.i-micronews.com/report/product/microled-displays-2018.html
Compare the technology and cost of 19 microphones from Knowles, Goertek, AAC Technologies, STMicroelectronics, TDK-InvenSense, TDK-Epcos, Cirrus Logic and Vesper.
Reverse Costing - Structure, process and cost report - find more here: https://www.systemplus.fr/reverse-costing-reports/consumer-mems-microphones-comparison-2020/
Report’s Key Features
• PDF with > 270 slides
• Excel file > 9,500 patents
• IP trends, including time-evolution of published patents, countries of patent filings, etc.
• Ranking of main patent assignees
• Key players’ IP position and relative strength of their patent portfolios
• Patent segmentation:
– Vertical power device (vertical transistor, vertical diode),
– Normally-off (E-mode transistor, cascode topology),
– Integration (monolithic E/D-mode, SiP/SoC, power IC),
– GaN-on-Si,
– GaN-on-Sapphire,
– Selective area p-type doping (ion implantation, p-GaN regrowth),
– Current collapse,
– Thermal management,
– Stray inductance,
– EV/HEV,
– fast charging,
– wireless charging.
• Key patent identification and details
• IP profile of 40 key players: Infineon, Panasonic, Toshiba etc.
• Excel database containing all patents analyzed in the report, including technology and application segmentations
Littelfuse and Monolith Semiconductors, in collaboration with X-Fab, have released a 1st-generation, high-reliability MOSFET with the hope of making this silicon carbide product mainstream.
The market outlook for SiC devices is promising, with a compound annual growth rate (CAGR) of 28% from 2016 – 2020. This will increase to 40% from 2020 – 2022 due to growth among automotive and industrial applications. In total, the SiC market will exceed $1B in 2022. In the energy conversion sector, SiC devices have an actual value of $250M, which will increase by around 28% in 2022. The reason for this relates to market forces pushing for loss reduction, not only for the sake of improved efficiency but also for smaller packages.
More information on that report a http://www.systemplus.fr/reverse-costing-reports/littelfuse-silicon-carbide-mosfet-lcis1mo120e0080-1200v-25a-80mohms/
Mems and sensors packaging technology and trends presentation held by Amandin...Yole Developpement
MEMS & sensors transitioning towards 3 main Hubs…
The inertial hub
Examples of MEMS companies with a «sensors integration» road (e.g., mCubewith iGyro, Spectral Engines with integrated spectrometer, Bosch with environmental combo sensors, AMS with optical combos, InvenSense with IMUs ….
Emerging semiconductor substrates are expected to grow at a 24% CAGR from 2018 – 2024.
More information on https://www.i-micronews.com/products/emerging-semiconductor-substrates-market-technology-trends-2019/
EPIC - European Photonics Industry Consortium, annual report highlighting major achievements for 2013. FOREWORD of the PRESIDENT: The past year has been a year of great achievements for EPIC. We celebrated our 10 year anniversary and could not have done it in a better way than by excelling in every activity area we embarked upon. I would like to take this opportunity to commend EPIC on its achievements in being the voice of the industry, reaching out to both the industry and policy makers, continuing its work on EU funded projects and of course on the publications and industry events that the Association has organised. In addition, the year has been marked by a major growth in membership of the Association, allowing us to deliver even stronger benefits to a wider audience. I hope that once you have had a chance to glance through this outline of the work carried out by EPIC in the past year that you join me in recognising that our sector is being powerfully represented by your Industry Association at both a European and a Global level. INTRODUCTION of the DIRECTOR GENERAL:
As EPIC celebrated its 10th anniversary it was encouraging to see that our industry combines ingenuity and creativity to further technology advancement and creates applications that are addressing our world’s most critical societal challenges. EPIC’s 148 member build on the richness and diversity of the industry; through fostering openness to explore collaboration opportunities. At the various EPIC events it is evident that a strong interlink and partnership among the companies exists. The collaboration that can been seen takes a great many forms: you collaborate on EU funded project proposals, you provide input in the development of market reports, you take part in commercial trade missions- all in all you make our industry a lively and very active community! EPIC is an ever-growing community representing the Photonics sector in all its variations and it was pleasing to review not only the work that was done by our Association so that we can present this report to you but also to see that our sector’s importance is recognised in many countries around the world e.g. France’s President François Hollande visited the laser manufacturer Amplitude Systèmes and in the UK Business Secretary Vince Cable visited Rofin-Sinar and SPI. Enjoy this snapshot of the activities of EPIC in 2013.
Horizon Europe Quantum Webinar - Cluster 4 Destinations 4 and 5 | SlidesKTN
KTN Global Alliance in partnership with the Foreign, Commonwealth and Development Office (FCDO) in Germany, UK Science and Innovation Network and UK National Contact Points (NCPs) from Innovate UK as well as European NCPs focussed on pitching of project ideas and brokering partnerships for European Research and Innovation collaborations and networking.
This comics book was developped by the Labonfoil projet, a research project funded by the European Commission. I am not the author, just uploaded so that people can view this magnificent piece of science dissemination.
Horizon Europe Quantum Webinar - Cluster 4 Destinations 4 and 5 | PitchesKTN
KTN Global Alliance in partnership with the Foreign, Commonwealth and Development Office (FCDO) in Germany, UK Science and Innovation Network and UK National Contact Points (NCPs) from Innovate UK as well as European NCPs focussed on pitching of project ideas and brokering partnerships for European Research and Innovation collaborations and networking.
JMeter webinar - integration with InfluxDB and GrafanaRTTS
Watch this recorded webinar about real-time monitoring of application performance. See how to integrate Apache JMeter, the open-source leader in performance testing, with InfluxDB, the open-source time-series database, and Grafana, the open-source analytics and visualization application.
In this webinar, we will review the benefits of leveraging InfluxDB and Grafana when executing load tests and demonstrate how these tools are used to visualize performance metrics.
Length: 30 minutes
Session Overview
-------------------------------------------
During this webinar, we will cover the following topics while demonstrating the integrations of JMeter, InfluxDB and Grafana:
- What out-of-the-box solutions are available for real-time monitoring JMeter tests?
- What are the benefits of integrating InfluxDB and Grafana into the load testing stack?
- Which features are provided by Grafana?
- Demonstration of InfluxDB and Grafana using a practice web application
To view the webinar recording, go to:
https://www.rttsweb.com/jmeter-integration-webinar
Encryption in Microsoft 365 - ExpertsLive Netherlands 2024Albert Hoitingh
In this session I delve into the encryption technology used in Microsoft 365 and Microsoft Purview. Including the concepts of Customer Key and Double Key Encryption.
Securing your Kubernetes cluster_ a step-by-step guide to success !KatiaHIMEUR1
Today, after several years of existence, an extremely active community and an ultra-dynamic ecosystem, Kubernetes has established itself as the de facto standard in container orchestration. Thanks to a wide range of managed services, it has never been so easy to set up a ready-to-use Kubernetes cluster.
However, this ease of use means that the subject of security in Kubernetes is often left for later, or even neglected. This exposes companies to significant risks.
In this talk, I'll show you step-by-step how to secure your Kubernetes cluster for greater peace of mind and reliability.
UiPath Test Automation using UiPath Test Suite series, part 3DianaGray10
Welcome to UiPath Test Automation using UiPath Test Suite series part 3. In this session, we will cover desktop automation along with UI automation.
Topics covered:
UI automation Introduction,
UI automation Sample
Desktop automation flow
Pradeep Chinnala, Senior Consultant Automation Developer @WonderBotz and UiPath MVP
Deepak Rai, Automation Practice Lead, Boundaryless Group and UiPath MVP
The Art of the Pitch: WordPress Relationships and SalesLaura Byrne
Clients don’t know what they don’t know. What web solutions are right for them? How does WordPress come into the picture? How do you make sure you understand scope and timeline? What do you do if sometime changes?
All these questions and more will be explored as we talk about matching clients’ needs with what your agency offers without pulling teeth or pulling your hair out. Practical tips, and strategies for successful relationship building that leads to closing the deal.
Accelerate your Kubernetes clusters with Varnish CachingThijs Feryn
A presentation about the usage and availability of Varnish on Kubernetes. This talk explores the capabilities of Varnish caching and shows how to use the Varnish Helm chart to deploy it to Kubernetes.
This presentation was delivered at K8SUG Singapore. See https://feryn.eu/presentations/accelerate-your-kubernetes-clusters-with-varnish-caching-k8sug-singapore-28-2024 for more details.
Smart TV Buyer Insights Survey 2024 by 91mobiles.pdf91mobiles
91mobiles recently conducted a Smart TV Buyer Insights Survey in which we asked over 3,000 respondents about the TV they own, aspects they look at on a new TV, and their TV buying preferences.
Connector Corner: Automate dynamic content and events by pushing a buttonDianaGray10
Here is something new! In our next Connector Corner webinar, we will demonstrate how you can use a single workflow to:
Create a campaign using Mailchimp with merge tags/fields
Send an interactive Slack channel message (using buttons)
Have the message received by managers and peers along with a test email for review
But there’s more:
In a second workflow supporting the same use case, you’ll see:
Your campaign sent to target colleagues for approval
If the “Approve” button is clicked, a Jira/Zendesk ticket is created for the marketing design team
But—if the “Reject” button is pushed, colleagues will be alerted via Slack message
Join us to learn more about this new, human-in-the-loop capability, brought to you by Integration Service connectors.
And...
Speakers:
Akshay Agnihotri, Product Manager
Charlie Greenberg, Host
UiPath Test Automation using UiPath Test Suite series, part 4DianaGray10
Welcome to UiPath Test Automation using UiPath Test Suite series part 4. In this session, we will cover Test Manager overview along with SAP heatmap.
The UiPath Test Manager overview with SAP heatmap webinar offers a concise yet comprehensive exploration of the role of a Test Manager within SAP environments, coupled with the utilization of heatmaps for effective testing strategies.
Participants will gain insights into the responsibilities, challenges, and best practices associated with test management in SAP projects. Additionally, the webinar delves into the significance of heatmaps as a visual aid for identifying testing priorities, areas of risk, and resource allocation within SAP landscapes. Through this session, attendees can expect to enhance their understanding of test management principles while learning practical approaches to optimize testing processes in SAP environments using heatmap visualization techniques
What will you get from this session?
1. Insights into SAP testing best practices
2. Heatmap utilization for testing
3. Optimization of testing processes
4. Demo
Topics covered:
Execution from the test manager
Orchestrator execution result
Defect reporting
SAP heatmap example with demo
Speaker:
Deepak Rai, Automation Practice Lead, Boundaryless Group and UiPath MVP
Key Trends Shaping the Future of Infrastructure.pdfCheryl Hung
Keynote at DIGIT West Expo, Glasgow on 29 May 2024.
Cheryl Hung, ochery.com
Sr Director, Infrastructure Ecosystem, Arm.
The key trends across hardware, cloud and open-source; exploring how these areas are likely to mature and develop over the short and long-term, and then considering how organisations can position themselves to adapt and thrive.
Builder.ai Founder Sachin Dev Duggal's Strategic Approach to Create an Innova...Ramesh Iyer
In today's fast-changing business world, Companies that adapt and embrace new ideas often need help to keep up with the competition. However, fostering a culture of innovation takes much work. It takes vision, leadership and willingness to take risks in the right proportion. Sachin Dev Duggal, co-founder of Builder.ai, has perfected the art of this balance, creating a company culture where creativity and growth are nurtured at each stage.
Elevating Tactical DDD Patterns Through Object CalisthenicsDorra BARTAGUIZ
After immersing yourself in the blue book and its red counterpart, attending DDD-focused conferences, and applying tactical patterns, you're left with a crucial question: How do I ensure my design is effective? Tactical patterns within Domain-Driven Design (DDD) serve as guiding principles for creating clear and manageable domain models. However, achieving success with these patterns requires additional guidance. Interestingly, we've observed that a set of constraints initially designed for training purposes remarkably aligns with effective pattern implementation, offering a more ‘mechanical’ approach. Let's explore together how Object Calisthenics can elevate the design of your tactical DDD patterns, offering concrete help for those venturing into DDD for the first time!
Elevating Tactical DDD Patterns Through Object Calisthenics
EPIC – European Photonics Industry Consortium Membership Update (Feb 2014)
1. EPIC Membership
Growth Analysis
Carlos Lee
Director General
carlos.lee@epic-assoc.com
http://www.linkedin.com/in/carloslee
http://www.youtube.com/user/CarlosLeeEPIC
2. Members in 21 Countries
Estonia
COUTRY
France
Germany
United Kingdom
The Netherlands
Switzerland
Spain
Belgium
Italy
Austria
Finland
China
Ireland
Sweden
Australia
Canada
Czech Republic
Estonia
Latvia
Lithuania
Poland
Russia
MEMBERS
28
25
14
11
9
8
6
5
4
3
2
2
2
1
1
1
1
1
1
1
1
Lithuania
Czech Republic
Australia
Latvia
Canada
Poland
Russia
Sweden
China
Ireland
Finland
France
Austria
Italy
Belgium
Spain
Germany
Switzerland
The Netherlands
United Kingdom
3. EPIC has 127 members on 17 Jan 2014
58% Growth in 18 months
3S Photonics Group, ACREO Research Center, Advanced Fibre Optic Engineering, AIFOTEC Fiberoptics Gmbh, AIM Infrarot-Module
GmbH, AIXTRON SE, ALEDIA, ALPHA Route des Lasers, Alphanov, ALSI nv, ALTER Technology, AMO, Amplitude Systèmes, art
photonics, ASE Europe, ASE Optics Europe, Australian National University, Avantes, Bright Photonics, CAILabs, CALIOPA
(Huawei), CD6, CEA-LETI, Centre for Nanophotonics FOM, Centre for Physical Sciences & Technology, Chalmers University of
Technology, CIP Centre for Integrated Photonics, COBRA Research School, CSEM, DIAFIR, Dow-Corning, Edmund Optics
GmbH, Eolite Systems, ESP KTN, EXALOS, ficonTEC Services GmbH, FOTOTNIKA - LV, Fraunhofer for Solar Energy Systems
ISE, Fraunhofer Institute for Applied Optics and Engineering, Fraunhofer Institute for Laser Technology, Fraunhofer Institute for
Material and Beam Technology, Fraunhofer Institute for Reliability and Microintegration, Fraunhofer Institute for
Telecommunications, Heinrich Hertz Institute, Hamamatsu Photonics, Haute Ecole ARC , Heraeus Noblelight, Hisilicon
Technologies (Huawei), Horiba Jobin Yvon, Huawei, ICFO - Institute of Photonic Sciences, IDIL Fibres Optiques, IHP Innovations for
High Performance Microelectronics , IKO Science, Imagine Optic , IMT, Innolume, Institut d'Optique Graduate School, INTEC
Department of Information Technology, IQE, IREC - Catalonia Institute for Energy Reseach, iXFiber, KONICA MINOLTA, Laser &
Medical Devices Consulting, LayTec, LioniX BV, Luger Research, Messe Munich International, Microelectronics Institute of
Barcelona, CSIC, Multitel, Nanovation, Next Scan Technology, nlight, NOVAE , Oclaro, Onefive GmbH, OPI
Photonics, OpTecBB, Opticsvalley, Optoelectronics Research Centre Finland, Optoelectronics Research Centre UK, Phoenix
Software, Photonics Bretagne, Pie Photonics, PNO Consultants, PolyPhotonix, PopSud, Powerlase, Quantel, Quebec Photonic
Network, Robert Bosch GmbH, Rofin Sinar Laser GmbH, SAES Getters, S.p.A, SAFC Hitech, Scuola Superiore
Sant'Anna, SensUp, SMART Photonics, SOITEC, SPI Lasers UK Limited, SQS Vlaknova optika, STMicroelectronics, Süss
MicroOptics, SWISSPHOTONICS, Technical University of Berlin , Technospark Nanocenter, TEMATYS, Thorn Lighting
(Zumtobel), Time-Bandwidth Products, Inc., TNO, Tridonic GmbH & Co KG (Zumtobel), Tyndall National Institute, u2t
Photonics, Umicore EOM, University College London, University of Barcelona, University of Nottingham, University of Sheffield
, Vertilas, VI Systems GmbH, VLC Photonics, VTT, WJA Electron, Wroclaw University of Technology, XiO
Photonics, YELO, Yenista, Yole Développement, Zumtobel.
6. EPIC Network Growth
Link and Topic
http://www.linkedin.com/groups/Aerospace-Defence-65111
http://www.linkedin.com/groups/Optical-Networking-44353
http://www.linkedin.com/groups/Fiber-Laser-FaserLaser-3459529
http://www.linkedin.com/groups/Lighting-Smart-Lighting-LED-Organic-976037
http://www.linkedin.com/groups/Diode-lasers-laser-systems-3121641
http://www.linkedin.com/groups/Biophotonics-2233601
http://www.linkedin.com/groups/EPIC-European-Photonics-Industry-Consortium-2955260
http://www.linkedin.com/groups/Photonics-Research-Funding-in-Europe-4660030
http://www.linkedin.com/groups/Photonics-Jobs-in-Europe-4672908
http://www.linkedin.com/groups/Photonics-Sensors-4217955
http://www.linkedin.com/groups/Photonics-Education-Training-4606620
http://www.linkedin.com/groups/Photonics-Market-Statistics-Data-4746469
http://www.linkedin.com/groups/Key-Enabling-Technologies-KET-4705438
http://www.linkedin.com/groups/Photonics-Clusters-4551103
http://www.linkedin.com/groups/Photonics-Technology-Business-DISCUSSION-ONLY-4843482
http://www.linkedin.com/groups/Photonics-PPP-Public-Private-Partnership-4701538
TOTAL
Personal contacts
Business Cards Photonics
Business Cards Electronics
Business Public Policy & Advocacy
TOTAL
Feb-13
17821
7664
2065
2200
1939
1514
346
209
199
125
122
63
76
49
9
34401
Feb-14
22380
9775
3000
2809
2673
2555
2014
753
523
385
245
237
160
157
75
23
47764
1284
1696
1157
4137
7. Become member and join an active community
of companies driving the photonics revolution!
Membership fee
• Start-up (less than 2 years) € 500
• Company with annual revenues below € 10 millions € 2000
• Company with annual revenues over € 10 millions € 4000
• Company with annual revenues over € 100 millions € 6000
• Research organization € 2000
• University € 1000
14 Rue de la Science
1040 Brussels
Belgium
Tel: +32 473300433
carlos.lee@epic-assoc.com
17 Rue Hamelin
75016 Paris
France
Tel: +33 1 45057263
keim-paray@epic-assoc.com