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Tests - ResultsSample Preparation
The solder joints tested in this study were composed of a Sn-Ag-Cu
alloy of Sn-3.0Ag-0.5Cu wt.% (SAC 305). To construct these
polycrystalline specimens, Cu blocks were cut to dimensions of
11mm x 13mm x 6mm, and their broad faces were polished to 4000
grit. After the blocks are soldered they are cut into sheets. These
sheets are then polished with various slurries to produce a damage
free surface suitable for examination under a Polarized Light
Microscope (PLM) or Electron Backscatter Diffraction (EBSD) .
Abstract
The restriction of toxic leaded solders by recent policies has
made Sn-Ag-Cu alloys the prevailing replacement for solder
systems. However, the electromigration damage they must
withstand poses a major reliability issue. In order to
quantify the electromigration damage a simple and efficient
testing apparatus was built to conduct electromigration
tests under desirable conditions. Joule heating, temperature
gradients, and current crowding in the solder joints
contribute and complicate the analysis of electromigration.
Thus, this project attempted to build an electromigration
testing apparatus that provided constant temperatures and
current densities through a solder sample. Results showed
that porcelain mounts were great electrical insulators but
had a low thermal conductivity which retained heat in the
system, proving detrimental to the experiment. Glass on the
other hand proved to be an adequate base for the mount
since it did not retain heat in the system as much. We
expect future electromigration tests will utilize glass
mounts with three mechanically braced Cu heat sinks.
Acknowledgments
• J.W. Morris, Jr., Ph.D., & Xioranny Linares – Mentors
• Rhonda La Grande, Aaron Chan, & Linda Dada – Lab partners
• Cal NERDS Staff and Scholars – Support & Encouragement
• Cal NERDS & UC Leads program – Funding
Tests - Results
• Prepared samples are connected to the anode and cathode using
silver paste.
• Current applied to the system varies between 20A – 25A, in
order to achieve a current density of 11.5 kAcm-2 across the
sample.
• The sample is placed in an oven until thermal equilibrium is
sustained at about 100°C.
• Constant current is applied for 2 days.
Conclusions
• Although both the porcelain tile and glass have a low
thermal conductivity, using a glass mount proved a lot
more beneficial because it dissipates heat a lot faster
than the traditional ceramic.
• Leveled heat sinks are vital for support and help prevent
the sample from deformation.
• Mechanically bracing the system alleviates stresses on
the JB Weld epoxy and extends the apparatuses’ lifetime.
Alejandro Cota, Xioranny Linares, Rhonda La Grande, Aaron Chan, J.W. Morris, Jr., Ph. D.
Department of Materials Science and Engineering, University of California, Berkeley, CA 94720
References
Linares, Xioranny, et al. 2013. The Influence of Sn Orientation on Intermetallic
Compound Evolution in Idealized SnAgCu 305 Interconnects: An Electron
Backscatter Diffraction Study of Electromigration>. Accessed 2013 Aug 2.
Figure 2: Simple schematic of
testing a sample.
Figure 6: Current design uses a
glass base, but lacks mechanical
braces on cathode and anode.
For further information
Please contact acota@berkeley.edu or visit:
http://www.mse.berkeley.edu/groups/morris/Research.html. Alejandro Cota
is a Mechanical & Materials Science Engineering major at UC Berkeley.
Step 1: Polish
block faces,
coat with flux,
and match
together while
separated by
250μm spacers.
MAKING A TESTING APPARATUS FOR CONDUCTING
ELECTROMIGRATION TESTS
Background
Many efforts to study electromigration in the past have
proven unsuccessful due to the lack of a competent
electromigration testing apparatus. The goal of this
experiment is to build and improve a test apparatus
capable of upholding a constant temperature, and constant
current density during the length of the sample testing
period. Achieving these constant conditions allow us to
isolate and study the effects of specific electromigration
parameters, such as the effects of varying current densities.
Future Work
Figure 7: Ideal
Electromigration
testing apparatus
with a glass base.
e-
jeZDCJ SnkTSnCu
EM
SnCu
SnCu
*
,,
,

CCu,Sn : Atomic density of Cu in Sn
DCu,Sn : Diffusivity of Cu in Sn
Z* : Effective charge
e : Electron charge
ρ : Resistivity
j : Current density
k : Boltzmann Constant
T : Temperature
Electromigration Equation
 Three types of drill bits can be successfully used on glass:
tungsten carbide spear-tipped drill bits, diamond-tipped drill
bits, or diamond-coated drill bits.
 Obtain appropriate drill bit to build five testing apparatuses,
all with mechanical braces and Cu heat sinks.
 Use an Infrared Camera to evaluate the thermal gradient of the
entire apparatus including the specimen.
Step 2: The
composite block
was placed in
molten Sn-Ag-Cu
at 375°C for 30
seconds.
Step 3: Quickly
quench in ice-
water until block
cools.
Figure 4: New and modified testing
apparatus uses porcelain tile base.
Figure 5: Five
samples were
tested using the
new apparatus.
Figure 3: Glass base, cathode and
anode, missing a failed idealized
Cu||Sn||Cu interconnect due to failure
after running the sample through
the experimental procedure.
• Glass base electrically
insulates the experiment
from the oven.
• Both anode and cathode use
a Cu heat sink.
• Samples failed due to uneven
heat distribution.
• An additional Cu heat sink
must be introduced to the
system.
• JB Weld epoxy becomes
brittle causing cathode and
anode to fall off.
• A mechanical brace would
reduce stresses on JB Weld.
Step 4: Once
cooled, all blocks
were cut into
sheets roughly
500μm thick.
Figure 1: Sample preparation diagram.
• Porcelain base electrically
insulates the experiment
from the oven.
• Applied a third Cu heat sink.
• Machined a bronze-coated
sheet metal brace for both
anode and cathode.
• Samples deformed as they softened from high heat and unleveled
heat sinks.
• Extracting samples required an additional 4-6 hours compared to
glass base due to porcelain’s high heat insulation and low thermal
conductivity.
• Porcelain tiles acted as a radiant heat source and generated
unwanted thermal profiles throughout the system.
• Cu heat sinks were made level. Twice as much JB Weld epoxy aids
in heat distribution away from the sample.
• Design proved successful. Addition of mechanical brace will
further improve the design.
• Samples survived the two day experimental procedure, and have
been extracted for further analysis.

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Electromigration Poster 2

  • 1. Tests - ResultsSample Preparation The solder joints tested in this study were composed of a Sn-Ag-Cu alloy of Sn-3.0Ag-0.5Cu wt.% (SAC 305). To construct these polycrystalline specimens, Cu blocks were cut to dimensions of 11mm x 13mm x 6mm, and their broad faces were polished to 4000 grit. After the blocks are soldered they are cut into sheets. These sheets are then polished with various slurries to produce a damage free surface suitable for examination under a Polarized Light Microscope (PLM) or Electron Backscatter Diffraction (EBSD) . Abstract The restriction of toxic leaded solders by recent policies has made Sn-Ag-Cu alloys the prevailing replacement for solder systems. However, the electromigration damage they must withstand poses a major reliability issue. In order to quantify the electromigration damage a simple and efficient testing apparatus was built to conduct electromigration tests under desirable conditions. Joule heating, temperature gradients, and current crowding in the solder joints contribute and complicate the analysis of electromigration. Thus, this project attempted to build an electromigration testing apparatus that provided constant temperatures and current densities through a solder sample. Results showed that porcelain mounts were great electrical insulators but had a low thermal conductivity which retained heat in the system, proving detrimental to the experiment. Glass on the other hand proved to be an adequate base for the mount since it did not retain heat in the system as much. We expect future electromigration tests will utilize glass mounts with three mechanically braced Cu heat sinks. Acknowledgments • J.W. Morris, Jr., Ph.D., & Xioranny Linares – Mentors • Rhonda La Grande, Aaron Chan, & Linda Dada – Lab partners • Cal NERDS Staff and Scholars – Support & Encouragement • Cal NERDS & UC Leads program – Funding Tests - Results • Prepared samples are connected to the anode and cathode using silver paste. • Current applied to the system varies between 20A – 25A, in order to achieve a current density of 11.5 kAcm-2 across the sample. • The sample is placed in an oven until thermal equilibrium is sustained at about 100°C. • Constant current is applied for 2 days. Conclusions • Although both the porcelain tile and glass have a low thermal conductivity, using a glass mount proved a lot more beneficial because it dissipates heat a lot faster than the traditional ceramic. • Leveled heat sinks are vital for support and help prevent the sample from deformation. • Mechanically bracing the system alleviates stresses on the JB Weld epoxy and extends the apparatuses’ lifetime. Alejandro Cota, Xioranny Linares, Rhonda La Grande, Aaron Chan, J.W. Morris, Jr., Ph. D. Department of Materials Science and Engineering, University of California, Berkeley, CA 94720 References Linares, Xioranny, et al. 2013. The Influence of Sn Orientation on Intermetallic Compound Evolution in Idealized SnAgCu 305 Interconnects: An Electron Backscatter Diffraction Study of Electromigration>. Accessed 2013 Aug 2. Figure 2: Simple schematic of testing a sample. Figure 6: Current design uses a glass base, but lacks mechanical braces on cathode and anode. For further information Please contact acota@berkeley.edu or visit: http://www.mse.berkeley.edu/groups/morris/Research.html. Alejandro Cota is a Mechanical & Materials Science Engineering major at UC Berkeley. Step 1: Polish block faces, coat with flux, and match together while separated by 250μm spacers. MAKING A TESTING APPARATUS FOR CONDUCTING ELECTROMIGRATION TESTS Background Many efforts to study electromigration in the past have proven unsuccessful due to the lack of a competent electromigration testing apparatus. The goal of this experiment is to build and improve a test apparatus capable of upholding a constant temperature, and constant current density during the length of the sample testing period. Achieving these constant conditions allow us to isolate and study the effects of specific electromigration parameters, such as the effects of varying current densities. Future Work Figure 7: Ideal Electromigration testing apparatus with a glass base. e- jeZDCJ SnkTSnCu EM SnCu SnCu * ,, ,  CCu,Sn : Atomic density of Cu in Sn DCu,Sn : Diffusivity of Cu in Sn Z* : Effective charge e : Electron charge ρ : Resistivity j : Current density k : Boltzmann Constant T : Temperature Electromigration Equation  Three types of drill bits can be successfully used on glass: tungsten carbide spear-tipped drill bits, diamond-tipped drill bits, or diamond-coated drill bits.  Obtain appropriate drill bit to build five testing apparatuses, all with mechanical braces and Cu heat sinks.  Use an Infrared Camera to evaluate the thermal gradient of the entire apparatus including the specimen. Step 2: The composite block was placed in molten Sn-Ag-Cu at 375°C for 30 seconds. Step 3: Quickly quench in ice- water until block cools. Figure 4: New and modified testing apparatus uses porcelain tile base. Figure 5: Five samples were tested using the new apparatus. Figure 3: Glass base, cathode and anode, missing a failed idealized Cu||Sn||Cu interconnect due to failure after running the sample through the experimental procedure. • Glass base electrically insulates the experiment from the oven. • Both anode and cathode use a Cu heat sink. • Samples failed due to uneven heat distribution. • An additional Cu heat sink must be introduced to the system. • JB Weld epoxy becomes brittle causing cathode and anode to fall off. • A mechanical brace would reduce stresses on JB Weld. Step 4: Once cooled, all blocks were cut into sheets roughly 500μm thick. Figure 1: Sample preparation diagram. • Porcelain base electrically insulates the experiment from the oven. • Applied a third Cu heat sink. • Machined a bronze-coated sheet metal brace for both anode and cathode. • Samples deformed as they softened from high heat and unleveled heat sinks. • Extracting samples required an additional 4-6 hours compared to glass base due to porcelain’s high heat insulation and low thermal conductivity. • Porcelain tiles acted as a radiant heat source and generated unwanted thermal profiles throughout the system. • Cu heat sinks were made level. Twice as much JB Weld epoxy aids in heat distribution away from the sample. • Design proved successful. Addition of mechanical brace will further improve the design. • Samples survived the two day experimental procedure, and have been extracted for further analysis.