This site survey will compose ofthe physical infrastructure of the data center, including thermal
management,power distribution,racks and cabinets,cabling,pathways,telecommunications grounding and
bonding,and labeling and administration,and evaluate them againstcurrentnetwork needs,future network
requirements,and relevantindustry standards and bestpractices.Afterwards provide a detailed reportthat
includes findings and specific recommendations for improvementand optimization.
Note: This assessmentwillbe basedonallrelevant standardsISO,IEC,EIA/TIA, BICSI, UPTIME
INSTITUTE or local codes.
1. Information Gathering
1.1. The survey should enable partner gather as much information as possible from the end-user for
discussion,analysis and review.
1.1.1. Overall data center layout and space utilization
1.1.2. Current physical infrastructure systems
1.1.3. The current objectives for the data center
1.1.4. Future requirements for the data center
1.1.5. Key physical infrastructure features and capabilities needed to supportthe current and
future goals for the data center
1.1.6. Concerns and issues regarding system performance,aesthetics,and standards
compliance
As available,Clientwill need to provide for Panduit’s review documents and drawings ofrecord for the existing
physical infrastructure layouts and deployments.
2. On-Site Evaluation
2.1. Overview
Conducta visual inspection ofthe existing physical infrastructure to evaluate:
2.1.1. Overall Layout and Space Utilization
2.1.2. Thermal Management
2.1.3. Power Distribution System
2.1.4. Cabling
2.1.5. Cable Routing Pathways
2.1.6. Racks and Cabinets
2.1.7. Telecommunications Grounding and Bonding System
2.1.8. Labeling and Administration
2.2. Overall Layout and Space Utilization
Evaluate your data center’s overall infrastructure as compared to TIA-942 standards,including:
2.2.1. Overall size and condition of the data center room and it’s suitabilityfor operations
2.2.2. Room layout
2.2.3. Capacity for expansion
2.3. Thermal Management and Cooling Systems
Gather data on various aspects ofthe data center’s thermal performance,air flow
managementpractices,and cooling systems according to ASHRAE TC 9.9 guidelines and
industrybestpractices,including:
2.3.1. The overall layout and room conditions,including hotaisle/cold aisle configuration, air
supplyand return locations,hot spots,and overall air flows to and from the air handling
units
2.3.2. Raised floor depth,under floor obstructions,perforated tile locations,sealing offloor tile
cut-outs,and the ability to reconfigure floor tiles to improve air flow
2.3.3. Drop ceiling height,overhead plenum obstructions,ceiling grate locations,and the ability
to adjustor reposition ceiling grates to improve air flow
2.3.4. The use of blanking panels,air dams,cable entry/exit sealing,hotaisle and/or cold aisle
containment,ducted exhaustsystems,and other air flow recirculation control methods
2.3.5. Location,alignment,unobstructed air flow,and proper operation of Computer Room Air
Conditioners (CRACs),Computer Room Air Handlers (CRAHs),in-row coolers,and
other cooling system equipment
2.3.6. Overall ratio of cooling capacityto IT equipmentthermal load
2.4. Power Distribution System
Inspectthe data center’s power infrastructure and evaluate it based on TIA-942 standards
and industry bestpractices.Areas assessed will include:
2.4.1. Cabinet-level power outlet availability, Power Outlet Unit(POU) capacity, IT equipment
compatibility,redundancy,alignmentwith overall data center tier level, and ability to
handle additional deployments and future growth
2.4.2. Pod or row-level power distribution methodology,accessibility,reconfiguration agility,
redundancy, alignmentwith overall facility tier level, and capacity for expansion
2.4.3. Overall data center power system topology,redundancy, tier level, and expandability
2.4.4. Stand-by power system configuration,load capacity,backup supportduration,and
capabilityfor future growth
2.5. Cabling
Inspectdata center’s copper and fiber optic cabling infrastructure and evaluate it based on industry standards
and best practices.Areas evaluated will include:
2.5.1. Slack managementand strain relief
2.5.2. Bend radius control
2.5.3. Cable management
2.5.4. Cable routing
2.5.5. Terminations
2.5.6. Cable density
2.5.7. Cable installation practices
2.5.8. Labeling ofcables per TIA-606-A standards
2.5.9. Separation of copper data cabling and power cabling
2.5.10. The organizational structure,topology, and bandwidth of your copper and fiber optic
cabling systems
2.5.11. The ability of your copper and fiber optic cabling to accommodate currentneeds
2.5.12. The ability of your copper and fiber optic cabling to supportfuture requirements,
including High Speed Data Transport(HSDT) and consolidated I/O
2.6. Cable Routing Pathways
Evaluate data center’s cabling
Pathways, based on TIA-569 standards and industrybestpractices.Areas evaluated will
include:
2.6.1. Pathway design
2.6.2. Pathway installation
2.6.3. Cable protection
2.6.4. Protection of fiber cords
2.6.5. Fill capacity
2.6.6. Pathway support
2.6.7. Waterfalls
2.6.8. Slack management
2.6.9. Bonding
3.6.10. Labeling
Note: If advised by Client,take into account local standards imposed by
authorities having jurisdiction.
2.7. Racks and Cabinets
Evaluate and recommend data center’s racks and cabinets,based on TIA-310-
C and TIA-942 standards and industrybestpractices.Areas to evaluate
include:
2.7.1. Whether cabinets and racks sufficientlysupportthe currently-installed equipment
2.7.2. The physical installation ofactive equipment
2.7.3. The risk of physical damage to equipment
2.7.4. Currentcable managementpractices and their impacton thermal management
2.7.5. Whether cabinets and racks maintain proper front-to-back air flow
2.7.6. The labeling ofcabinets,racks,equipment,patch panels,enclosures,and ports
2.7.7. Internal bonding ofyour racks and cabinets
2.7.8. The capability of your racks and cabinets to support
current needs and future requirements,such as HSDTand
consolidated I/O
2.7.9. The arrangement,configuration,and capacityof port and patching
layouts, including the logic of their arrangementand their capacity to
supportthe current port count
2.7.10. The capacity of racks and cabinets for additional equipment,
increased patching and cabling,and higher portdensities due to
growth, reconfiguration,consolidation,or upgrades
2.8. Telecommunication Grounding and Bonding
Evaluate the data center’s supplemental telecommunications
grounding and bonding network based on the TIA-607-B standard.
2.8.1. Room-level bonding practices including Mesh Common Bonding
Network (MCBN, also referred to as Mesh-BN) construction,and
connections between the MCBN and the Telecommunications
Bonding Backbone (TBB)
2.8.2. Bonding in the racks and cabinets including equipmentbonding
jumpers,rack and cabinetbonding conductors,bus bars,bonding
strips,and bonding connection methods
2.8.3. Metallic pathway bonding including the means,deployment,and
jumper connection methods
2.8.4. Electrostatic Discharge (ESD) protection wrist-straps and connections
2.9. Labeling and Administration
Evaluate the data center’s labeling,identification,and administration practices based
On the TIA-606-A standard.Specific areas reviewed include:
2.9.1. Overall room labeling
2.9.2. Rack and cabinetlabeling
2.9.3. IT equipment,patch panel,and enclosure labeling
2.9.4. Port, permanentlink,and patch cord labeling
3. Client Responsibilities
3.1. Clientto provide unlimited access to all locations in the data center where
IT equipmentis installed and used.
3.2. Clientto allow our partner to photograph data center equipment
and associated equipmentand items which are required to properly
documentthe current state of the data center. Partner agrees to
use reasonable efforts to keep such photographs confidential.
3.3. Clientto provide any necessaryinformation not available on site such as
layouts, drawings etc.
3.4. Clientdesignates a single contactperson for the purpose of the survey
and workaround

Data Center Site survey document

  • 1.
    This site surveywill compose ofthe physical infrastructure of the data center, including thermal management,power distribution,racks and cabinets,cabling,pathways,telecommunications grounding and bonding,and labeling and administration,and evaluate them againstcurrentnetwork needs,future network requirements,and relevantindustry standards and bestpractices.Afterwards provide a detailed reportthat includes findings and specific recommendations for improvementand optimization. Note: This assessmentwillbe basedonallrelevant standardsISO,IEC,EIA/TIA, BICSI, UPTIME INSTITUTE or local codes. 1. Information Gathering 1.1. The survey should enable partner gather as much information as possible from the end-user for discussion,analysis and review. 1.1.1. Overall data center layout and space utilization 1.1.2. Current physical infrastructure systems 1.1.3. The current objectives for the data center 1.1.4. Future requirements for the data center 1.1.5. Key physical infrastructure features and capabilities needed to supportthe current and future goals for the data center 1.1.6. Concerns and issues regarding system performance,aesthetics,and standards compliance As available,Clientwill need to provide for Panduit’s review documents and drawings ofrecord for the existing physical infrastructure layouts and deployments. 2. On-Site Evaluation 2.1. Overview Conducta visual inspection ofthe existing physical infrastructure to evaluate: 2.1.1. Overall Layout and Space Utilization 2.1.2. Thermal Management 2.1.3. Power Distribution System 2.1.4. Cabling 2.1.5. Cable Routing Pathways 2.1.6. Racks and Cabinets 2.1.7. Telecommunications Grounding and Bonding System 2.1.8. Labeling and Administration 2.2. Overall Layout and Space Utilization Evaluate your data center’s overall infrastructure as compared to TIA-942 standards,including: 2.2.1. Overall size and condition of the data center room and it’s suitabilityfor operations 2.2.2. Room layout 2.2.3. Capacity for expansion 2.3. Thermal Management and Cooling Systems Gather data on various aspects ofthe data center’s thermal performance,air flow managementpractices,and cooling systems according to ASHRAE TC 9.9 guidelines and
  • 2.
    industrybestpractices,including: 2.3.1. The overalllayout and room conditions,including hotaisle/cold aisle configuration, air supplyand return locations,hot spots,and overall air flows to and from the air handling units 2.3.2. Raised floor depth,under floor obstructions,perforated tile locations,sealing offloor tile cut-outs,and the ability to reconfigure floor tiles to improve air flow 2.3.3. Drop ceiling height,overhead plenum obstructions,ceiling grate locations,and the ability to adjustor reposition ceiling grates to improve air flow 2.3.4. The use of blanking panels,air dams,cable entry/exit sealing,hotaisle and/or cold aisle containment,ducted exhaustsystems,and other air flow recirculation control methods 2.3.5. Location,alignment,unobstructed air flow,and proper operation of Computer Room Air Conditioners (CRACs),Computer Room Air Handlers (CRAHs),in-row coolers,and other cooling system equipment 2.3.6. Overall ratio of cooling capacityto IT equipmentthermal load 2.4. Power Distribution System Inspectthe data center’s power infrastructure and evaluate it based on TIA-942 standards and industry bestpractices.Areas assessed will include: 2.4.1. Cabinet-level power outlet availability, Power Outlet Unit(POU) capacity, IT equipment compatibility,redundancy,alignmentwith overall data center tier level, and ability to handle additional deployments and future growth 2.4.2. Pod or row-level power distribution methodology,accessibility,reconfiguration agility, redundancy, alignmentwith overall facility tier level, and capacity for expansion 2.4.3. Overall data center power system topology,redundancy, tier level, and expandability 2.4.4. Stand-by power system configuration,load capacity,backup supportduration,and capabilityfor future growth 2.5. Cabling Inspectdata center’s copper and fiber optic cabling infrastructure and evaluate it based on industry standards and best practices.Areas evaluated will include: 2.5.1. Slack managementand strain relief 2.5.2. Bend radius control 2.5.3. Cable management 2.5.4. Cable routing 2.5.5. Terminations 2.5.6. Cable density 2.5.7. Cable installation practices 2.5.8. Labeling ofcables per TIA-606-A standards 2.5.9. Separation of copper data cabling and power cabling 2.5.10. The organizational structure,topology, and bandwidth of your copper and fiber optic cabling systems 2.5.11. The ability of your copper and fiber optic cabling to accommodate currentneeds 2.5.12. The ability of your copper and fiber optic cabling to supportfuture requirements, including High Speed Data Transport(HSDT) and consolidated I/O
  • 3.
    2.6. Cable RoutingPathways Evaluate data center’s cabling Pathways, based on TIA-569 standards and industrybestpractices.Areas evaluated will include: 2.6.1. Pathway design 2.6.2. Pathway installation 2.6.3. Cable protection 2.6.4. Protection of fiber cords 2.6.5. Fill capacity 2.6.6. Pathway support 2.6.7. Waterfalls 2.6.8. Slack management 2.6.9. Bonding 3.6.10. Labeling Note: If advised by Client,take into account local standards imposed by authorities having jurisdiction. 2.7. Racks and Cabinets Evaluate and recommend data center’s racks and cabinets,based on TIA-310- C and TIA-942 standards and industrybestpractices.Areas to evaluate include: 2.7.1. Whether cabinets and racks sufficientlysupportthe currently-installed equipment 2.7.2. The physical installation ofactive equipment 2.7.3. The risk of physical damage to equipment 2.7.4. Currentcable managementpractices and their impacton thermal management 2.7.5. Whether cabinets and racks maintain proper front-to-back air flow 2.7.6. The labeling ofcabinets,racks,equipment,patch panels,enclosures,and ports 2.7.7. Internal bonding ofyour racks and cabinets 2.7.8. The capability of your racks and cabinets to support current needs and future requirements,such as HSDTand consolidated I/O 2.7.9. The arrangement,configuration,and capacityof port and patching layouts, including the logic of their arrangementand their capacity to supportthe current port count 2.7.10. The capacity of racks and cabinets for additional equipment, increased patching and cabling,and higher portdensities due to growth, reconfiguration,consolidation,or upgrades 2.8. Telecommunication Grounding and Bonding Evaluate the data center’s supplemental telecommunications grounding and bonding network based on the TIA-607-B standard. 2.8.1. Room-level bonding practices including Mesh Common Bonding Network (MCBN, also referred to as Mesh-BN) construction,and connections between the MCBN and the Telecommunications Bonding Backbone (TBB)
  • 4.
    2.8.2. Bonding inthe racks and cabinets including equipmentbonding jumpers,rack and cabinetbonding conductors,bus bars,bonding strips,and bonding connection methods 2.8.3. Metallic pathway bonding including the means,deployment,and jumper connection methods 2.8.4. Electrostatic Discharge (ESD) protection wrist-straps and connections 2.9. Labeling and Administration Evaluate the data center’s labeling,identification,and administration practices based On the TIA-606-A standard.Specific areas reviewed include: 2.9.1. Overall room labeling 2.9.2. Rack and cabinetlabeling 2.9.3. IT equipment,patch panel,and enclosure labeling 2.9.4. Port, permanentlink,and patch cord labeling 3. Client Responsibilities 3.1. Clientto provide unlimited access to all locations in the data center where IT equipmentis installed and used. 3.2. Clientto allow our partner to photograph data center equipment and associated equipmentand items which are required to properly documentthe current state of the data center. Partner agrees to use reasonable efforts to keep such photographs confidential. 3.3. Clientto provide any necessaryinformation not available on site such as layouts, drawings etc. 3.4. Clientdesignates a single contactperson for the purpose of the survey and workaround