To generate layout for CMOS Inverter
circuit and simulate it for verification.
VLSI Lab
VLSI
LABORATORY
FRONT END
DESIGN
(CAD)
BACK END
DESIGN
(CAD)
TECHNOLOGY
(TCAD)
 Proper hardware
 Proper software
 Foundry or link up with some fab lab
 Test facility
 Purpose
DESIGN STEPS
• SCHEMATIC
• LAYOUT DESIGN
• DRC
• LAYOUT Vs SCHEMATIC
• PARASITIC EXTRACTION
• POST LAYOUT SIMULTION
List of Experiments
1. To generate layout for CMOS Inverter circuit and simulate it for verification.
2. To prepare layout for given logic function and verify it with simulations.
3. Introduction to programmable devices (FPGA, CPLD), Hardware Description
Language (VHDL), and the use programming tool.
4. Implementation of basic logic gates and its testing.
5. Implementation of adder circuits and its testing.
6. Implementation of J-K and D Flip Flops and its testing.
7. Implementation 4 to 1 multiplexer and its testing.
8. Implementation of 3 to 8 decoder and its testing.
9. Implementation of sequential adder and its testing.
10. Implementation of BCD counter and its testing.
11. Simulation of CMOS Inverter using SPICE for transfer characteristic.
12. Simulation and verification of two input CMOS NOR gate using SPICE.
13. Introduction to Block Diagram Mathod
14. Design of digital Logic using block diagram.
Project
• Mini Project: VHDL/Verilog based mini project
with emphasis on design and implementation
into the group of maximum 3 students.
Design Abstraction Levels
n+
n+
S
G
D
+
DEVICE
CIRCUIT
GATE
MODULE
SYSTEM
Microwind
• Microwind is a tool for designing and
simulating circuits at layout level. The tool
features full editing facilities (copy, cut, past,
duplicate, move), various views (MOS
characteristics, 2D cross section, 3D process
viewer), and an analog simulator
Tools from Microwind
• Microwind
• DSCH
• Microwind3 Editor
• Microwind 2D viewer
• Microwind 3D viewer
• Microwind analog simulator
• Microwind tutorial on MOS devices
• View of Silicon Atoms
Getting Microwind
• Go to the website
http://www.microwind.net/document
• Download the freeware version of the
microwind
• Unzip the files in a Folder
Microwind Downloads
INTRODUCTION THE TOOL
User-friendly and intuitive
design tool for educational
use.
The student draws the
masks of the circuit layout
and performs analog
simulation
The tool displays the layout
in 2D, static 3D and
animated 3D
Editing window
One dot on the
grid is 5
lambda, or
0.175 µm
Editing icons
Access to
simulation
2D, 3D views
Simulation
properties
Layout
library
Active technology
Palette of layers
Ion current
Voltage
cursors
List of model
parameters
for BSIM4
Memory effect due to
source capacitance
Threshold voltage effect
Our Approach
1.
2.
3.
4.
MOS DEVICE
Traditional teaching : in-depth
explanation of the
potentials, fields, threshold
voltage, and eventually the
expression of the current
Ids
Our approach : step-by-step
illustration of the most
important relationships
between layout and
performance.
1. Design of the MOS
2. I/V Simulation
3. 2D view
4. Time domain analysis
Feature Size
• Chips are specified with set of masks
• Minimum dimensions of masks determine transistor
size (and hence speed, cost, and power)
• Feature size f = distance between source and drain
• Set by minimum width of polysilicon
• Feature size improves 30% every 3 years or so
• Normalize for feature size when describing design
Rules
• E.g. λ = 0.090 μm in 0.180 μm process
Layout Design Rules:
For complex processes, it becomes difficult to
understand the Complex shell structures of the
fabrication process and interpret different photo
masks.
They act as interface between the circuit designer
and the process engineer.
Editing Icons Access to
Simulation
2D 3D Views
Layout Library
Simulation Properties
Palette of Layers
Active Layers
Current Technology
Work Area
One dot on the grid is
5 lambda or 0.30 µm
Menu Command
Microwind Environment
Microwind Layout using
Verilog Code
• Design Schematic in DSCH and eport Verilog code for Circuit.
• Import Verilog file (.v) in microwind.
• This process is possible only for digital.(As digital components are possible in
Verilog)
Run on DSCH
Save File
Select Foundry
Make Verilog File
Import Verilog File
Layout
Verilog File
Select Foundry in Microwind
DSCH
to
Microwind
using
VERILOG
Design Rules
N- Well
r101 Minimum width 12λ
r102 Between wells 12 λ
r110 Minimum well Area 144 λ2
r 102
r 101
N -
Well
r201 Minimum N+ and P+ diffusion width 4λ
r 201
r 201
N -
Well
P+ Diff
N+ Diff
r202 Between two P+ and N+ diffusions 4λ
N -
Well
P+ Diff
N+ Diff
r 202
r 202
r203 Extra N-well after P+ diffusion 6λ
N -
Well
P+ Diff
N+ Diff
r 203
r 203
r204 Between N+ diffusion and n-well 6 λ
r 204
N -
Well
P+ Diff
N+ Diff
r210 Minimum diffusion area 16λ2
r 210
r 210
N -
Well
P+ Diff
N+ Diff
r301 Polysilicon Width 2λ
N -
Well
P+ Diff
N+ Diff
Polysilicon
r 301
r 301
Polysilicon
r302 Polysilicon gate on Diffusion 2λ
N -
Well
P+ Diff
N+ Diff
Polysilicon
r 302
r 302
Polysilicon
r307 Extra Polysilicon surrounding Diffusion 3λ
N -
Well
P+ Diff
N+ Diff
Polysilicon
r 307
r 307
r 307
r 307
Polysilicon
r304 Between two Polysilicon boxes 3λ
N -
Well
P+ Diff
N+ Diff
Polysilicon
Polysilicon
r 304
r 304
r307 Diffusion after Polysilicon 4λ
N -
Well
P+ Diff
N+ Diff
Polysilicon
Polysilicon
r 307
r 307
r 307
r 307
r401 Contact width 2λ
Contact
Polysilicon Contact
Metal/Polysilicon Contact
r 401
r404 Extra Poly surrounding contact 1λ
Contact
Polysilicon Contact
Metal/Polysilicon Contact
r 404 r 404
r405 Extra metal surrounding contact 1λ
Contact
Polysilicon Contact
Metal/Polysilicon Contact
r 405 r 405
N -
Well
P+ Diff
N+ Diff
Polysilicon
Polysilicon
r403 Extra diffusion surrounding contact 1λ
r 403
r 403
Metal 1
Metal 2
Metal 3
Metal 4
Metal 5
Metal 6
r 501
r 501
r501 Between two Metals 4λ
r510 Minimum Metal area 16λ2
r 510 r 510
r 510
r 510
r 510 r 510
Metal 1
Metal 2
Metal 3
Metal 4
Metal 5
Metal 6
Step 1: Select Foundary
Step 2: Select Foundary
Step 3: n+ Diffussion
Step 4: Polysilicon
Step 5: n+diff and Metal Contact
• This Completes nMOS design
• Now go for pMOS Design, and the first need is
to construct N Well
Step 6: Create N Well
Step 6: p+ Diffusion
Step 7: Polysilicon
Step 8: Contacts
Final Connections
• pMOS Completed
• Now Interconnection of pMOS and nMOS to
complete inverter
• Connect Source of pMOS to VDD and Source of
nMOS to VSS.
• Short the Drain of both pMOS and nMOS.
INVERTER: Complete Design
Check DRC
Assign Source
• Assign Signal (Clock) to Gate Terminal
• Add Visible node at Output
Inverter with Source
Run Simulation
VTC Characteristics
For Analog Circuits
(R, L and C Components)
if drain and gate is shorted then MOS will behave as a diode connected load
and it will never go to triode region and can be used as resistive load offering a
resistance equal to 1/gm.
if drain and source is shorted then MOS capacitor in which SiO2 will behave as
insulator.
Direct layout design of Analog
Circuits…
Thanks
Give Your Feedbacks at:
www.amitdegada.weebly.com/blog.html

cmos technology-micrwind layout tool-demo.ppt

  • 1.
    To generate layoutfor CMOS Inverter circuit and simulate it for verification.
  • 2.
    VLSI Lab VLSI LABORATORY FRONT END DESIGN (CAD) BACKEND DESIGN (CAD) TECHNOLOGY (TCAD)
  • 3.
     Proper hardware Proper software  Foundry or link up with some fab lab  Test facility  Purpose
  • 4.
    DESIGN STEPS • SCHEMATIC •LAYOUT DESIGN • DRC • LAYOUT Vs SCHEMATIC • PARASITIC EXTRACTION • POST LAYOUT SIMULTION
  • 5.
    List of Experiments 1.To generate layout for CMOS Inverter circuit and simulate it for verification. 2. To prepare layout for given logic function and verify it with simulations. 3. Introduction to programmable devices (FPGA, CPLD), Hardware Description Language (VHDL), and the use programming tool. 4. Implementation of basic logic gates and its testing. 5. Implementation of adder circuits and its testing. 6. Implementation of J-K and D Flip Flops and its testing. 7. Implementation 4 to 1 multiplexer and its testing. 8. Implementation of 3 to 8 decoder and its testing. 9. Implementation of sequential adder and its testing. 10. Implementation of BCD counter and its testing. 11. Simulation of CMOS Inverter using SPICE for transfer characteristic. 12. Simulation and verification of two input CMOS NOR gate using SPICE. 13. Introduction to Block Diagram Mathod 14. Design of digital Logic using block diagram.
  • 6.
    Project • Mini Project:VHDL/Verilog based mini project with emphasis on design and implementation into the group of maximum 3 students.
  • 7.
  • 8.
    Microwind • Microwind isa tool for designing and simulating circuits at layout level. The tool features full editing facilities (copy, cut, past, duplicate, move), various views (MOS characteristics, 2D cross section, 3D process viewer), and an analog simulator
  • 9.
    Tools from Microwind •Microwind • DSCH • Microwind3 Editor • Microwind 2D viewer • Microwind 3D viewer • Microwind analog simulator • Microwind tutorial on MOS devices • View of Silicon Atoms
  • 10.
    Getting Microwind • Goto the website http://www.microwind.net/document • Download the freeware version of the microwind • Unzip the files in a Folder
  • 11.
  • 12.
    INTRODUCTION THE TOOL User-friendlyand intuitive design tool for educational use. The student draws the masks of the circuit layout and performs analog simulation The tool displays the layout in 2D, static 3D and animated 3D Editing window One dot on the grid is 5 lambda, or 0.175 µm Editing icons Access to simulation 2D, 3D views Simulation properties Layout library Active technology Palette of layers Ion current Voltage cursors List of model parameters for BSIM4 Memory effect due to source capacitance Threshold voltage effect
  • 13.
    Our Approach 1. 2. 3. 4. MOS DEVICE Traditionalteaching : in-depth explanation of the potentials, fields, threshold voltage, and eventually the expression of the current Ids Our approach : step-by-step illustration of the most important relationships between layout and performance. 1. Design of the MOS 2. I/V Simulation 3. 2D view 4. Time domain analysis
  • 14.
    Feature Size • Chipsare specified with set of masks • Minimum dimensions of masks determine transistor size (and hence speed, cost, and power) • Feature size f = distance between source and drain • Set by minimum width of polysilicon • Feature size improves 30% every 3 years or so • Normalize for feature size when describing design Rules • E.g. λ = 0.090 μm in 0.180 μm process
  • 15.
    Layout Design Rules: Forcomplex processes, it becomes difficult to understand the Complex shell structures of the fabrication process and interpret different photo masks. They act as interface between the circuit designer and the process engineer.
  • 16.
    Editing Icons Accessto Simulation 2D 3D Views Layout Library Simulation Properties Palette of Layers Active Layers Current Technology Work Area One dot on the grid is 5 lambda or 0.30 µm Menu Command Microwind Environment
  • 17.
    Microwind Layout using VerilogCode • Design Schematic in DSCH and eport Verilog code for Circuit. • Import Verilog file (.v) in microwind. • This process is possible only for digital.(As digital components are possible in Verilog)
  • 18.
    Run on DSCH SaveFile Select Foundry Make Verilog File Import Verilog File Layout Verilog File Select Foundry in Microwind DSCH to Microwind using VERILOG
  • 19.
    Design Rules N- Well r101Minimum width 12λ r102 Between wells 12 λ r110 Minimum well Area 144 λ2 r 102 r 101 N - Well
  • 20.
    r201 Minimum N+and P+ diffusion width 4λ r 201 r 201 N - Well P+ Diff N+ Diff
  • 21.
    r202 Between twoP+ and N+ diffusions 4λ N - Well P+ Diff N+ Diff r 202 r 202
  • 22.
    r203 Extra N-wellafter P+ diffusion 6λ N - Well P+ Diff N+ Diff r 203 r 203
  • 23.
    r204 Between N+diffusion and n-well 6 λ r 204 N - Well P+ Diff N+ Diff
  • 24.
    r210 Minimum diffusionarea 16λ2 r 210 r 210 N - Well P+ Diff N+ Diff
  • 25.
    r301 Polysilicon Width2λ N - Well P+ Diff N+ Diff Polysilicon r 301 r 301 Polysilicon
  • 26.
    r302 Polysilicon gateon Diffusion 2λ N - Well P+ Diff N+ Diff Polysilicon r 302 r 302 Polysilicon
  • 27.
    r307 Extra Polysiliconsurrounding Diffusion 3λ N - Well P+ Diff N+ Diff Polysilicon r 307 r 307 r 307 r 307 Polysilicon
  • 28.
    r304 Between twoPolysilicon boxes 3λ N - Well P+ Diff N+ Diff Polysilicon Polysilicon r 304 r 304
  • 29.
    r307 Diffusion afterPolysilicon 4λ N - Well P+ Diff N+ Diff Polysilicon Polysilicon r 307 r 307 r 307 r 307
  • 30.
    r401 Contact width2λ Contact Polysilicon Contact Metal/Polysilicon Contact r 401
  • 31.
    r404 Extra Polysurrounding contact 1λ Contact Polysilicon Contact Metal/Polysilicon Contact r 404 r 404
  • 32.
    r405 Extra metalsurrounding contact 1λ Contact Polysilicon Contact Metal/Polysilicon Contact r 405 r 405
  • 33.
    N - Well P+ Diff N+Diff Polysilicon Polysilicon r403 Extra diffusion surrounding contact 1λ r 403 r 403
  • 34.
    Metal 1 Metal 2 Metal3 Metal 4 Metal 5 Metal 6 r 501 r 501 r501 Between two Metals 4λ
  • 35.
    r510 Minimum Metalarea 16λ2 r 510 r 510 r 510 r 510 r 510 r 510 Metal 1 Metal 2 Metal 3 Metal 4 Metal 5 Metal 6
  • 36.
  • 37.
  • 38.
    Step 3: n+Diffussion
  • 39.
  • 40.
    Step 5: n+diffand Metal Contact
  • 41.
    • This CompletesnMOS design • Now go for pMOS Design, and the first need is to construct N Well
  • 42.
  • 43.
    Step 6: p+Diffusion
  • 44.
  • 45.
  • 46.
    Final Connections • pMOSCompleted • Now Interconnection of pMOS and nMOS to complete inverter • Connect Source of pMOS to VDD and Source of nMOS to VSS. • Short the Drain of both pMOS and nMOS.
  • 47.
  • 48.
  • 49.
    Assign Source • AssignSignal (Clock) to Gate Terminal • Add Visible node at Output
  • 50.
  • 51.
  • 52.
  • 53.
    For Analog Circuits (R,L and C Components) if drain and gate is shorted then MOS will behave as a diode connected load and it will never go to triode region and can be used as resistive load offering a resistance equal to 1/gm. if drain and source is shorted then MOS capacitor in which SiO2 will behave as insulator.
  • 55.
    Direct layout designof Analog Circuits…
  • 56.
    Thanks Give Your Feedbacksat: www.amitdegada.weebly.com/blog.html

Editor's Notes

  • #2 References I am grateful for the contributions from SEMATECH, the Austin Community College, and MKS Instruments. For further reading, I especially recommend the reference from Scientific American.
  • #3 References I am grateful for the contributions from SEMATECH, the Austin Community College, and MKS Instruments. For further reading, I especially recommend the reference from Scientific American.
  • #4 References I am grateful for the contributions from SEMATECH, the Austin Community College, and MKS Instruments. For further reading, I especially recommend the reference from Scientific American.
  • #5 References I am grateful for the contributions from SEMATECH, the Austin Community College, and MKS Instruments. For further reading, I especially recommend the reference from Scientific American.
  • #6 References I am grateful for the contributions from SEMATECH, the Austin Community College, and MKS Instruments. For further reading, I especially recommend the reference from Scientific American.
  • #7 References I am grateful for the contributions from SEMATECH, the Austin Community College, and MKS Instruments. For further reading, I especially recommend the reference from Scientific American.
  • #8 References I am grateful for the contributions from SEMATECH, the Austin Community College, and MKS Instruments. For further reading, I especially recommend the reference from Scientific American.
  • #9 References I am grateful for the contributions from SEMATECH, the Austin Community College, and MKS Instruments. For further reading, I especially recommend the reference from Scientific American.
  • #10 References I am grateful for the contributions from SEMATECH, the Austin Community College, and MKS Instruments. For further reading, I especially recommend the reference from Scientific American.
  • #11 References I am grateful for the contributions from SEMATECH, the Austin Community College, and MKS Instruments. For further reading, I especially recommend the reference from Scientific American.
  • #12 References I am grateful for the contributions from SEMATECH, the Austin Community College, and MKS Instruments. For further reading, I especially recommend the reference from Scientific American.
  • #13 References I am grateful for the contributions from SEMATECH, the Austin Community College, and MKS Instruments. For further reading, I especially recommend the reference from Scientific American.
  • #38 References I am grateful for the contributions from SEMATECH, the Austin Community College, and MKS Instruments. For further reading, I especially recommend the reference from Scientific American.
  • #39 References I am grateful for the contributions from SEMATECH, the Austin Community College, and MKS Instruments. For further reading, I especially recommend the reference from Scientific American.
  • #40 References I am grateful for the contributions from SEMATECH, the Austin Community College, and MKS Instruments. For further reading, I especially recommend the reference from Scientific American.
  • #41 References I am grateful for the contributions from SEMATECH, the Austin Community College, and MKS Instruments. For further reading, I especially recommend the reference from Scientific American.
  • #42 References I am grateful for the contributions from SEMATECH, the Austin Community College, and MKS Instruments. For further reading, I especially recommend the reference from Scientific American.
  • #43 References I am grateful for the contributions from SEMATECH, the Austin Community College, and MKS Instruments. For further reading, I especially recommend the reference from Scientific American.
  • #44 References I am grateful for the contributions from SEMATECH, the Austin Community College, and MKS Instruments. For further reading, I especially recommend the reference from Scientific American.
  • #45 References I am grateful for the contributions from SEMATECH, the Austin Community College, and MKS Instruments. For further reading, I especially recommend the reference from Scientific American.
  • #46 References I am grateful for the contributions from SEMATECH, the Austin Community College, and MKS Instruments. For further reading, I especially recommend the reference from Scientific American.
  • #47 References I am grateful for the contributions from SEMATECH, the Austin Community College, and MKS Instruments. For further reading, I especially recommend the reference from Scientific American.
  • #48 References I am grateful for the contributions from SEMATECH, the Austin Community College, and MKS Instruments. For further reading, I especially recommend the reference from Scientific American.
  • #49 References I am grateful for the contributions from SEMATECH, the Austin Community College, and MKS Instruments. For further reading, I especially recommend the reference from Scientific American.
  • #50 References I am grateful for the contributions from SEMATECH, the Austin Community College, and MKS Instruments. For further reading, I especially recommend the reference from Scientific American.
  • #51 References I am grateful for the contributions from SEMATECH, the Austin Community College, and MKS Instruments. For further reading, I especially recommend the reference from Scientific American.
  • #52 References I am grateful for the contributions from SEMATECH, the Austin Community College, and MKS Instruments. For further reading, I especially recommend the reference from Scientific American.
  • #53 When Drain and gate are short mosfet is in saturation.
  • #56 References I am grateful for the contributions from SEMATECH, the Austin Community College, and MKS Instruments. For further reading, I especially recommend the reference from Scientific American.