Ceramic PCB board is also called ceramic substrate, ceramic circuit board, ceramic copper coated plate, ceramic substrate refers to the copper foil directly bonded to alumina (Al2O3) or aluminum nitride (AlN) ceramic substrate or other ceramic substrate surface (single or double) on the special process board.

1. What is Ceramic PCB?
Ceramic PCB board is also called ceramic substrate, ceramic circuit board, ceramic
copper coated plate, ceramic substrate refers to the copper foil directly bonded to
alumina (Al2O3) or aluminum nitride (AlN) ceramic substrate or other ceramic
substrate surface (single or double) on the special process board.
The ceramic pcb can be described as an organic binder and ceramic powder that
conducts heat. The thermal conductivity at which this PCB is prepared is between 9
to 20W/m.
To explain further, ceramic PCBs are printed circuit boards, with ceramic as its base
material. This base material is highly thermally conductive like aluminum nitride,
alumina, and beryllium oxide. These are very effective in the transfer of heat from
hot spots and then dissipating this heat over the entire surface.
Asides from this, the fabrication of ceramic PCB is done with the LAM technology.
This technology is a laser quick activation metallization type. Therefore, ceramic
PCBs are highly versatile and can easily substitute the whole traditional PCBs. This
PCB will achieve this with even more enhanced performance and involving less
complicated construction.

2. 1. The difference between ceramic substrate and pcb board
Ceramic substrate is that we say ceramic circuit board, ceramic pcb and printed
circuit board have the same circuit interconnection, through hole conduction
characteristics. So what are the differences between ceramic substrate and pcb
board?
(1)The thermal conductivity of PCB board and ceramic substrate is different
Ceramic substrate is made of ceramic substrate, that is, the medium is ceramic
material, including alumina ceramic base, aluminum nitride ceramic base, silicon
nitride ceramic base, ceramic heat dissipation performance is very good, the
thermal conductivity of ceramic substrate from 25w to 230w, different ceramic
medium thermal conductivity is different. The thermal conductivity of alumina
ceramic substrate is 25w~30w, the thermal conductivity of aluminum nitride
ceramic substrate is above 170w, and the thermal conductivity of silicon nitride
ceramic substrate is 80w~90w. Then pcb board is usually the use of medium is fr4
or metal substrate, thermal conductivity is less than 3w, and the gap is too large
compared with ceramic substrate, especially the need for high heat dissipation
performance of the product field, ceramic substrate has become a very popular
medium material.
2. Ceramic substrate and pcb board insulation is different
Ceramic substrate is generally line layer - ceramic base - line layer structure, ceramic

3. substrate insulation is very good, is also determined by the ceramic material itself,
no need to add insulation layer. pcb board needs to add an insulating layer to play
a mobile insulation role, but the insulation effect is far less than ceramic substrate.
(3)The heat dissipation structure of ceramic substrate is different from that of pcb
board
The heat dissipation structure of the ceramic substrate is the structure of the circuit
layer - ceramic base - circuit board layer. Because there is no insulating layer in the
middle, the heat of the device is transferred directly from the ceramic base to the
circuit layer and the heat dissipation is out, the heat dissipation is fast and the effect
is good. pcb board is the need for heat from the medium layer - insulation layer -
line layer, separated by an insulation layer at the same time, the dielectric layer itself
of the thermal conductivity is poor, then add heat conduction adhesive, heat
conduction effect is still not improved, often can not achieve the purpose of rapid
heat dissipation device. In particular, some high-power devices need to use ceramic
substrate as a cooling substrate in the product field where the heat dissipation and
temperature change is relatively large.
(4)Ceramic substrate and pcb board application is different
Ceramic substrate and pcb board application is different, mainly the performance

4. of the two is different, ceramic substrate is used in high thermal conductivity, high
heat dissipation, high insulation, product field, such as high power LED lighting,
high power module, high-frequency communication, track power supply; Ordinary
pcb board is used in some more extensive, heat dissipation, insulation and other
requirements are not strict, used in private commercial commodities.
(5) The price of ceramic substrate is different from that of pcb board
The material and performance of ceramic substrate and pcb board are different, and
the final decision is that their prices are different. The board of ceramic substrate is
very high and the production cost is high.
Ceramic substrate has outstanding advantages, but the ceramic substrate is fragile
and has a high scrap rate, which requires a high level of production technology.
However, you can't make a circuit board with the size of more than one meter like
ordinary pcb boards. Hitech Circuits has more than 10 years of experience in the
ceramic circuit board industry, and many universities and R & D institutions are in
cooperation, welcome to inquiry.
2.Ceramic substrate and high-frequency plate difference
The material is different. The ceramic substrate is made of aluminum oxide or
aluminum nitride, and the high frequency plate is made of Rogers, Yaron, PTFE, etc.,

5. with low dielectric constant and high frequency communication speed.
Performance is different. Ceramic substrate is widely used in refrigeration and
systems, high power modules, automotive electronics and other fields. High
frequency board is mainly used in high frequency communication field, aviation,
high-end consumer electronics and so on. High-frequency communication field
involves heat dissipation requirements, usually need to be combined with the
ceramic base and high frequency plate, such as high frequency ceramic pcb.
1. Application of ceramic substrate
Ceramic substrates are used in led chips to achieve better thermal conductivity. In
addition, ceramic substrate is also used to make ceramic chips in the following
electronic devices:
◆High power semiconductor module
◆Semiconductor cooler, electronic heater; Power control circuit, power mixing
circuit
◆Intelligent power module; High frequency switching power supply, solid state relay
◆Automotive electronics, aerospace and military electronics components
◆Solar panel module; Telecommunications private exchange, receiving system;
Laser and other industrial electronics
Application of ceramic substrate in third generation semiconductor
The mainstream power devices represented by MOSFET, IGBT and transistor occupy
a place in their own frequency and power supply segments. Due to the

6. comprehensive excellent performance of IGBT, it has replaced GTR, become the
inverter, UPS, frequency converter, motor drive, high-power switching power supply,
especially now the hot electric vehicle, high-speed rail and other power electronic
devices in the mainstream devices.
Application of alumina ceramic substrate in electronic power field
In the field of power electronics, such as power switching power supply, electric
drive, etc., dielectric ceramic substrate is needed to achieve better thermal
conductivity, prevent current burn out and short circuit.
Application of alumina ceramic co-fired plate in lithium battery industry
With the recommendation of artificial intelligence and environmental protection,
the automobile industry has also launched electric cars, mainly through battery
storage. Lithium batteries made of ceramic substrate can achieve better current and
heat dissipation functions, promoting the market demand for new energy vehicles.
2. Advantages of ceramic substrate
A. The thermal expansion coefficient of ceramic substrate is close to that of silicon
chip, which can save Mo sheet of transition layer, save labor, save material and
reduce cost;
B. Reduce the welding layer, reduce the thermal resistance, reduce the cavity;
C. Under the same load flow, the wire width of copper foil 0.3mm thick is only 10%
of that of ordinary printed circuit board;
D. Excellent thermal conductivity, so that the chip packaging is very compact, so

7. that the power density is greatly increased, improve the reliability of the system and
device;
E. Ultra-thin (0.25mm) ceramic substrate can replace BeO, without environmental
toxicity problems;
F. Large load capacity, 100A current continuously through 1mm wide 0.3mm thick
copper body, temperature rise about 17℃; With 100A current continuously passing
through a 2mm wide 0.3mm thick copper body, the temperature rise is only about
5℃.
G. Low thermal resistance, 10×10mm ceramic substrate 'thermal resistance of
0.63mm thickness of ceramic substrate is 0.31K/W, 0.38mm thickness of ceramic
substrate is 0.19K/W, 0.25mm thickness of ceramic substrate is 0.14K/W.
H. High insulation and high pressure resistance to ensure personal safety and
equipment protection.
I. New packaging and assembly methods can be realized, so that the product is
highly integrated and the size is reduced.