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Original IGBT Transistor FGA15N120ANTDTU 1200V 24A TO-3P New ON Semiconductor / Fairchild
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Original IGBT Transistor FGA15N120ANTDTU 1200V 24A TO-3P New ON Semiconductor / Fairchild
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Original IGBT Transistor FGA15N120ANTDTU 1200V 24A TO-3P New ON Semiconductor / Fairchild
1.
©2006 Fairchild Semiconductor
Corporation 1 www.fairchildsemi.com FGA15N120ANTDTU Rev. C1 FGA15N120ANTDTU—1200V,15ANPTTrenchIGBT November 2013 FGA15N120ANTDTU 1200 V, 15 A NPT Trench IGBT Features • NPT Trench Technology, Positive temperature coefficient • Low Saturation Voltage: VCE(sat), typ = 1.9 V @ IC = 15 A and TC = 25C • Low Switching Loss: Eoff, typ = 0.6 mJ @ IC = 15 A and TC = 25C • Extremely Enhanced Avalanche Capability Description Using Fairchild's proprietary trench design and advanced NPT technology, the 1200V NPT IGBT offers superior conduction and switching performances, high avalanche ruggedness and easy parallel operation. This device is well suited for the resonant or soft switching appli- cation such as induction heating, microwave oven. Absolute Maximum Ratings Thermal Characteristics G C E G C EG C E TO-3P Symbol Description Ratings Unit VCES Collector-Emitter Voltage 1200 V VGES Gate-Emitter Voltage 20 V IC Collector Current @ TC = 25C 30 A Collector Current @ TC = 100C 15 A ICM Pulsed Collector Current (Note 1) 45 A IF Diode Continuous Forward Current @ TC = 25C 30 A Diode Continuous Forward Current @ TC = 100C 15 A IFM Diode Maximum Forward Current 45 A PD Maximum Power Dissipation @ TC = 25C 186 W Maximum Power Dissipation @ TC = 100C 74 W TJ Operating Junction Temperature -55 to +150 C Tstg Storage Temperature Range -55 to +150 C TL Maximum Lead Temp. for soldering Purposes, 1/8” from case for 5 seconds 300 C Symbol Parameter Typ. Max. Unit RJC Thermal Resistance, Junction-to-Case for IGBT -- 0.67 C/W RJC Thermal Resistance, Junction-to-Case for Diode -- 2.88 C/W RJA Thermal Resistance, Junction-to-Ambient -- 40 C/W Notes: (1) Repetitive rating: Pulse width limited by max. junction temperature
2.
FGA15N120ANTDTU—1200V,15ANPTTrenchIGBT ©2006 Fairchild Semiconductor
Corporation 2 www.fairchildsemi.com FGA15N120ANTDTU Rev. C1 Package Marking and Ordering Information Electrical Characteristics of the IGBT TC = 25°C unless otherwise noted Part Number Top Mark Package Packing Method Reel Size Tape Width Quantity FGA15N120ANTDTU_F109 FGA15N120ANTDTU TO-3P Tube N/A N/A 30 Symbol Parameter Test Conditions Min. Typ. Max. Unit Off Characteristics ICES Collector Cut-Off Current VCE = VCES, VGE = 0 V -- -- 3 mA IGES G-E Leakage Current VGE = VGES, VCE = 0 V -- -- ± 250 nA On Characteristics VGE(th) G-E Threshold Voltage IC = 15 mA, VCE = VGE 4.5 6.5 8.5 V VCE(sat) Collector to Emitter Saturation Voltage IC = 15 A, VGE = 15 V -- 1.9 2.4 V IC = 15 A, VGE = 15 V, TC = 125C -- 2.2 -- V IC = 30 A, VGE = 15 V -- 2.3 -- V Dynamic Characteristics Cies Input Capacitance VCE = 30 V, VGE = 0 V, f = 1 MHz -- 2650 -- pF Coes Output Capacitance -- 143 -- pF Cres Reverse Transfer Capacitance -- 96 -- pF Switching Characteristics td(on) Turn-On Delay Time VCC = 600 V, IC = 15 A, RG = 10 , VGE = 15 V, Inductive Load, TC = 25C -- 15 -- ns tr Rise Time -- 20 -- ns td(off) Turn-Off Delay Time -- 160 -- ns tf Fall Time -- 100 180 ns Eon Turn-On Switching Loss -- 3 4.5 mJ Eoff Turn-Off Switching Loss -- 0.6 0.9 mJ Ets Total Switching Loss -- 3.6 5.4 mJ td(on) Turn-On Delay Time VCC = 600 V, IC = 15 A, RG = 10 , VGE = 15 V, Inductive Load, TC = 125C -- 15 -- ns tr Rise Time -- 20 -- ns td(off) Turn-Off Delay Time -- 170 -- ns tf Fall Time -- 150 -- ns Eon Turn-On Switching Loss -- 3.2 4.8 mJ Eoff Turn-Off Switching Loss -- 0.8 1.2 mJ Ets Total Switching Loss -- 4.0 6.0 mJ Qg Total Gate Charge VCE = 600 V, IC = 15 A, VGE = 15 V -- 120 180 nC Qge Gate-Emitter Charge -- 16 22 nC Qgc Gate-Collector Charge -- 50 65 nC
3.
FGA15N120ANTDTU—1200V,15ANPTTrenchIGBT ©2006 Fairchild Semiconductor
Corporation 3 www.fairchildsemi.com FGA15N120ANTDTU Rev. C1 Electrical Characteristics of DIODE TC = 25°C unless otherwise noted Symbol Parameter Test Conditions Min. Typ. Max. Unit VFM Diode Forward Voltage IF = 15 A TC = 25C -- 1.7 2.7 V TC = 125C -- 1.8 -- trr Diode Reverse Recovery Time IF = 15 A diF/dt = 200 A/s TC = 25C -- 210 330 ns TC = 125C -- 280 -- Irr Diode Peak Reverse Recovery Cur- rent TC = 25C -- 27 40 A TC = 125C -- 31 -- Qrr Diode Reverse Recovery Charge TC = 25C -- 2835 6600 nC TC = 125C -- 4340 --
4.
FGA15N120ANTDTU—1200V,15ANPTTrenchIGBT ©2006 Fairchild Semiconductor
Corporation 4 www.fairchildsemi.com FGA15N120ANTDTU Rev. C1 Typical Performance Characteristics Figure 1. Typical Output Characteristics Figure 2. Typical Saturation Voltage Characteristics Figure 3. Saturation Voltage vs. Case Figure 4. Saturation Voltage vs. VGE Temperature at Variant Current Level Figure 5. Saturation Voltage vs. VGE Figure 6. Capacitance Characteristics 0 2 4 6 8 10 0 50 100 150 200 TC = 25 o C 20V 17V 15V 12V VGE = 10V CollectorCurrent,IC [A] Collector-Emitter Voltage, VCE [V] 0 2 4 6 0 30 60 90 120 150 Common Emitter VGE = 15V TC = 25 o C TC = 125 o C CollectorCurrent,IC [A] Collector-Emitter Voltage, VCE [V] 25 50 75 100 125 150 1.5 2.0 2.5 3.0 Common Emitter VGE = 15V IC = 24A IC = 15A Collector-EmitterVoltage,VCE [V] Case Temperature, TC [ o C] 0 4 8 12 16 20 0 4 8 12 16 24A 15A Common Emitter TC = 25 o C IC = 7.5A Collector-EmitterVoltage,VCE [V] Gate-Emitter Voltage, VGE [V] 0.1 1 10 0 500 1000 1500 2000 2500 3000 3500 Ciss Coss Common Emitter VGE = 0V, f = 1MHz TC = 25 o C Crss Capacitance[pF] Collector-Emitter Voltage, VCE [V] 0 4 8 12 16 20 0 4 8 12 16 24A 15A Common Emitter TC = 125 o C IC = 7.5A Collector-EmitterVoltage,VCE [V] Gate-Emitter Voltage, VGE [V]
5.
FGA15N120ANTDTU—1200V,15ANPTTrenchIGBT ©2006 Fairchild Semiconductor
Corporation 5 www.fairchildsemi.com FGA15N120ANTDTU Rev. C1 Typical Performance Characteristics (Continued) Figure 7. Turn-On Characteristics vs. Gate Figure 8. Turn-Off Characteristics vs. Gate Resistance Resistance Figure 9. Switching Loss vs. Gate Resistance Figure 10. Turn-On Characteristics vs. Collector Current Figure 11. Turn-Off Characteristics vs. Figure 12. Switching Loss vs. Collector Current Collector Current 0 10 20 30 40 50 60 70 1 10 100 Common Emitter VCC = 600V, VGE = 15V IC = 15A TC = 25 o C TC = 125 o C td(on) tr SwitchingTime[ns] Gate Resistance, RG [] 0 10 20 30 40 50 60 70 10 100 1000 Common Emitter VCC = 600V, VGE = 15V IC = 15A TC = 25 o C TC = 125 o C td(off) tf SwitchingTime[ns] Gate Resistance, RG [] 0 10 20 30 40 50 60 70 1 10 Common Emitter VCC = 600V, VGE = 15V IC = 15A TC = 25 o C TC = 125 o C Eon Eoff SwitchingLoss[mJ] Gate Resistance, RG [] 10 15 20 25 30 10 100 Common Emitter VGE = 15V, RG = 10 TC = 25 o C TC = 125 o C tr td(on) SwitchingTime[ns] Collector Current, IC [A] 10 15 20 25 30 10 100 Common Emitter VGE = 15V, RG = 10 TC = 25 o C TC = 125 o C td(off) tf SwitchingTime[ns] Collector Current, IC [A] 5 10 15 20 25 30 0.1 1 10 Common Emitter VGE = 15V, RG = 10 TC = 25 o C TC = 125 o C Eon Eoff SwitchingLoss[mJ] Collector Current, IC [A]
6.
FGA15N120ANTDTU—1200V,15ANPTTrenchIGBT ©2006 Fairchild Semiconductor
Corporation 6 www.fairchildsemi.com FGA15N120ANTDTU Rev. C1 Typical Performance Characteristics (Continued) Figure 13. Gate Charge Characteristics Figure 14. SOA Characteristics Figure 15. Turn-Off SOA 0 20 40 60 80 100 120 0 3 6 9 12 15 600V 400V Common Emitter RL = 40 TC = 25 o C Vcc = 200V Gate-EmitterVoltage,VGE [V] Gate Charge, Qg [nC] 0.1 1 10 100 1000 0.01 0.1 1 10 100 50s 100s 1m s DC Operation Ic MAX (Pulsed) Ic MAX (Continuous) Single Nonrepetitive Pulse Tc = 25 o C Curves m ust be derated linearly with increase in tem perature CollectorCurrent,Ic[A] Collector - Em itter Voltage, VCE [V] 10 100 1000 1 10 100 Safe Operating Area VGE = 15V, TC = 125 o C CollectorCurrent,IC [A] Collector-Emitter Voltage, VCE [V] 1E-5 1E-4 1E-3 0.01 0.1 1 10 1E-3 0.01 0.1 1 10 0.1 0.5 0.2 0.05 0.02 0.01 single pulse ThermalResponse[Zthjc] Rectangular Pulse Duration [sec] Pdm t1 t2 Duty factor D = t1 / t2 Peak Tj = Pdm Zthjc + TC Figure 16. Transient Thermal Impedance of IGBT
7.
FGA15N120ANTDTU—1200V,15ANPTTrenchIGBT ©2006 Fairchild Semiconductor
Corporation 7 www.fairchildsemi.com FGA15N120ANTDTU Rev. C1 Typical Performance Characteristics (Continued) Figure 17. Forward Characteristics Figure 18. Reverse Recovery Current Figure 19. Stored Charge Figure 20. Reverse Recovery Time 0.1 1 10 50 0.0 0.4 0.8 1.2 1.6 2.0 2.4 TC = 125 o C TC = 25 o C TJ = 25 o C TJ = 125 o C Forward Voltage , VF [V] ForwardCurrent,IF [A] 5 10 15 20 25 0 5 10 15 20 25 30 diF/dt = 100A/s diF/dt = 200A/s ReverseRecoveryCurrnet,Irr [A] Forward Current , IF [A] 5 10 15 20 25 0 1000 2000 3000 4000 5000 6000 7000 diF/dt = 100A/s diF/dt = 200A/s StoredRecoveryCharge,Qrr [nC] Forward Current , IF [A] 5 10 15 20 25 0 100 200 300 400 diF/dt = 100A/s diF/dt = 200A/s ReverseRecoveryTime,trr [ns] Forward Current , IF [A]
8.
FGA15N120ANTDTU—1200V,15ANPTTrenchIGBT ©2006 Fairchild Semiconductor
Corporation 8 www.fairchildsemi.com FGA15N120ANTDTU Rev. C1 Mechanical Dimensions Figure 21. TO-3P 3L - 3LD, T03, PLASTIC, EIAJ SC-65 Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specif- ically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/package/packageDetails.html?id=PN_TT3P0-003
9.
FGA15N120ANTDTU—1200V,15ANPTTrenchIGBT ©2006 Fairchild Semiconductor
Corporation 9 www.fairchildsemi.com FGA15N120ANTDTU Rev. C1 TRADEMARKS The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended to be an exhaustive list of all such trademarks. *Trademarks of System General Corporation, used under license by Fairchild Semiconductor. DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used here in: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. PRODUCT STATUS DEFINITIONS Definition of Terms AccuPower™ AX-CAP®* BitSiC™ Build it Now™ CorePLUS™ CorePOWER™ CROSSVOLT™ CTL™ Current Transfer Logic™ DEUXPEED® Dual Cool™ EcoSPARK® EfficentMax™ ESBC™ Fairchild® Fairchild Semiconductor® FACT Quiet Series™ FACT® FAST® FastvCore™ FETBench™ FPS™ F-PFS™ FRFET® Global Power ResourceSM GreenBridge™ Green FPS™ Green FPS™ e-Series™ Gmax™ GTO™ IntelliMAX™ ISOPLANAR™ Marking Small Speakers Sound Louder and Better™ MegaBuck™ MICROCOUPLER™ MicroFET™ MicroPak™ MicroPak2™ MillerDrive™ MotionMax™ mWSaver® OptoHiT™ OPTOLOGIC® OPTOPLANAR® PowerTrench® PowerXS™ Programmable Active Droop™ QFET® QS™ Quiet Series™ RapidConfigure™ Saving our world, 1mW/W/kW at a time™ SignalWise™ SmartMax™ SMART START™ Solutions for Your Success™ SPM® STEALTH™ SuperFET® SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SupreMOS® SyncFET™ Sync-Lock™ ®* TinyBoost® TinyBuck® TinyCalc™ TinyLogic® TINYOPTO™ TinyPower™ TinyPWM™ TinyWire™ TranSiC™ TriFault Detect™ TRUECURRENT® * SerDes™ UHC® Ultra FRFET™ UniFET™ VCX™ VisualMax™ VoltagePlus™ XS™ ® ™ Datasheet Identification Product Status Definition Advance Information Formative / In Design Datasheet contains the design specifications for product development. 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All manufactures of semiconductor products are experiencing counterfeiting of their parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed application, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have full traceability, meet Fairchild’s quality standards for handing and storage and provide access to Fairchild’s full range of up-to-date technical and product information. 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