This device modeling report summarizes the characteristics of a 4D-22 thermistor made by Ishizuka Electronics Corporation. The report includes simulations of the thermistor's current transient behavior when subjected to a 5A signal, its thermal characteristic as temperature increases over time, and its resistance characteristic as temperature varies from 25 to 160 degrees Celsius.
This document provides a device modeling report for a programmable unijunction transistor (N13T1) manufactured by NEC. It includes the component parts, SPICE model parameters and equivalent circuit. Simulation results show the peak voltage and current characteristics meet specifications. The forward voltage at 50mA and pulse output voltage and rise time also meet given specifications.
This device modeling report summarizes the characteristics of a 4D-22 thermistor made by Ishizuka Electronics Corporation. The report includes simulations of the thermistor's current transient behavior when subjected to a 5A signal, its thermal characteristic as temperature increases over time, and its resistance characteristic as temperature varies from 25 to 160 degrees Celsius.
This document provides a device modeling report for a programmable unijunction transistor (N13T1) manufactured by NEC. It includes the component parts, SPICE model parameters and equivalent circuit. Simulation results show the peak voltage and current characteristics meet specifications. The forward voltage at 50mA and pulse output voltage and rise time also meet given specifications.
This document summarizes the specifications and performance of the N13T2 programmable unijunction transistor (PUT) made by NEC. It includes the component parameters, equivalent circuit diagram, characteristics such as peak voltage and current, forward voltage, and pulse output voltage and rise time. The performance is evaluated based on the manufacturer's specifications.
This device modeling report summarizes simulations of the 3D-22 thermistor from Ishizuka Electronics Corporation. The report includes graphs of the thermistor's current transient characteristics when subjected to a 20A pulse, its thermal characteristics as temperature increases over time, and its resistance characteristics across a range of temperatures. Evaluation circuits were used to simulate the thermistor's behavior under varying conditions.
This device modeling report summarizes simulations of the power thermistor component 3D-22 made by Ishizuka Electronics Corporation. The report includes graphs of the thermistor's current transient characteristics when subjected to alternating current, its thermal characteristics as temperature increases over time, and its resistance characteristics at different temperatures.
The document provides a device modeling report for a Toshiba TA7291P bridge driver IC. It includes:
- Component and part number details
- Circuit simulations and evaluation circuits showing the IC's operation under different input and output conditions
- Simulation results analyzing key parameters like supply current, input characteristics, saturation voltages, and diode characteristics.
The report concludes with 11 sections summarizing the IC's electrical behavior and performance based on circuit simulations, with tables comparing simulated and measured values.
The document is a device modeling report for an operational amplifier (opamp), the NJM072D manufactured by New Japan Radio. It includes the component specifications, a description of the spice model, and the results of simulations comparing the model values to the datasheet specifications for parameters such as output voltage swing, input offset voltage, slew rate, input current, gain, and common mode rejection ratio. The simulations show good agreement with errors generally less than 1% compared to the datasheet values.
This document summarizes a device modeling report for a Panasonic AN1431T shunt regulator. It describes the PSpice model parameters for the component and shows the results of circuit simulations evaluating the reference voltage, dynamic impedance, output characteristic, and reverse breakdown characteristic. The simulations demonstrate good agreement with measurements for key electrical properties of the shunt regulator.
SPICE MODEL of TPCF8A01 (Professional+BDP+SBDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCF8A01(Professional+BDP+SBDS Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCF8A01 (Professional+BDS+SBDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCF8A01 (Professional+BDS+SBDS Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 1MB08-120 (Professional Without Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 1MB08-120 (Professional Without Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of IRG4PF50W (Standard Without Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the results of device modeling simulations for an Insulated Gate Bipolar Transistor (IGBT) chip. It describes the IGBT part number and manufacturer, lists the model parameters, and shows the circuit designs and results of simulations evaluating the transfer characteristics, fall time, gate charge, and saturation characteristics of the device. Comparisons are made between the simulation results and experimental measurements.
SPICE MODEL of 1MB08D-120 (Professional+FWDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 1MB08D-120 (Professional+FWDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
This document summarizes the specifications and performance of a programmable unijunction transistor (PUT) with part number N13T1 from manufacturer NEC. It includes the component parameters, equivalent circuit diagram, peak voltage and current characteristics, forward voltage characteristics, and pulse output voltage and rise time characteristics as determined through simulation. The simulation results show the component meets or exceeds all specifications for peak voltage, forward voltage, pulse output voltage, and rise time.
This document summarizes the specifications and performance of the N13T2 programmable unijunction transistor (PUT) made by NEC. It includes the component parameters, equivalent circuit diagram, characteristics such as peak voltage and current, forward voltage, and pulse output voltage and rise time. The performance is evaluated based on the manufacturer's specifications.
This device modeling report summarizes simulations of the 3D-22 thermistor from Ishizuka Electronics Corporation. The report includes graphs of the thermistor's current transient characteristics when subjected to a 20A pulse, its thermal characteristics as temperature increases over time, and its resistance characteristics across a range of temperatures. Evaluation circuits were used to simulate the thermistor's behavior under varying conditions.
This device modeling report summarizes simulations of the power thermistor component 3D-22 made by Ishizuka Electronics Corporation. The report includes graphs of the thermistor's current transient characteristics when subjected to alternating current, its thermal characteristics as temperature increases over time, and its resistance characteristics at different temperatures.
The document provides a device modeling report for a Toshiba TA7291P bridge driver IC. It includes:
- Component and part number details
- Circuit simulations and evaluation circuits showing the IC's operation under different input and output conditions
- Simulation results analyzing key parameters like supply current, input characteristics, saturation voltages, and diode characteristics.
The report concludes with 11 sections summarizing the IC's electrical behavior and performance based on circuit simulations, with tables comparing simulated and measured values.
The document is a device modeling report for an operational amplifier (opamp), the NJM072D manufactured by New Japan Radio. It includes the component specifications, a description of the spice model, and the results of simulations comparing the model values to the datasheet specifications for parameters such as output voltage swing, input offset voltage, slew rate, input current, gain, and common mode rejection ratio. The simulations show good agreement with errors generally less than 1% compared to the datasheet values.
This document summarizes a device modeling report for a Panasonic AN1431T shunt regulator. It describes the PSpice model parameters for the component and shows the results of circuit simulations evaluating the reference voltage, dynamic impedance, output characteristic, and reverse breakdown characteristic. The simulations demonstrate good agreement with measurements for key electrical properties of the shunt regulator.
SPICE MODEL of TPCF8A01 (Professional+BDP+SBDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCF8A01(Professional+BDP+SBDS Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCF8A01 (Professional+BDS+SBDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCF8A01 (Professional+BDS+SBDS Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 1MB08-120 (Professional Without Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 1MB08-120 (Professional Without Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of IRG4PF50W (Standard Without Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the results of device modeling simulations for an Insulated Gate Bipolar Transistor (IGBT) chip. It describes the IGBT part number and manufacturer, lists the model parameters, and shows the circuit designs and results of simulations evaluating the transfer characteristics, fall time, gate charge, and saturation characteristics of the device. Comparisons are made between the simulation results and experimental measurements.
SPICE MODEL of 1MB08D-120 (Professional+FWDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 1MB08D-120 (Professional+FWDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
This document summarizes the specifications and performance of a programmable unijunction transistor (PUT) with part number N13T1 from manufacturer NEC. It includes the component parameters, equivalent circuit diagram, peak voltage and current characteristics, forward voltage characteristics, and pulse output voltage and rise time characteristics as determined through simulation. The simulation results show the component meets or exceeds all specifications for peak voltage, forward voltage, pulse output voltage, and rise time.
SPICE MODEL of 1MBC15-060 (Professional Without Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 1MBC15-060 (Professional Without Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 1MBH15D-060 (Professional+FWDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 1MBH15D-060 (Professional+FWDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 1MBH15D-060 (Professional+FWDS Model) in SPICE PARKTsuyoshi Horigome
The document provides test results and circuit simulations for an Insulated Gate Bipolar Transistor (IGBT) with part number 1MBH15D-060 from manufacturer FUJI ELECTRIC. It includes graphs and tables summarizing key characteristics such as transfer characteristics, gate charge, saturation behavior, output characteristics, and reverse recovery. Testing was conducted over various voltage and current conditions to evaluate the device performance and parameters.
SPICE MODEL of 1MBH15D-060 (Professional+FWD+SP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 1MBH15D-060(Professional+FWD+SP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 1MB08D-120 (Professional+FWDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 1MB08D-120 (Professional+FWDS Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
The document provides modeling and characterization details for a Sharp PC851 photocoupler component, including:
1) Descriptions of the diode, bipolar junction transistor, and controlled voltage/current source models used in simulations.
2) Simulation and measurement results for the input device's forward current, junction capacitance, and reverse recovery characteristics.
3) Additional simulations and measurements of the LED IV curve, transistor saturation, current transfer ratio, and switching time characteristics.
4) Tables comparing simulation and measurement results.
This document summarizes the SPICE model and characterization of a Sanyo 2SC3153 bipolar junction transistor. It includes graphs of key transistor characteristics like forward and reverse early voltage, capacitance, DC beta, saturation voltage, switching times and output characteristics from both simulation and measurement for comparison. Simulation results generally matched measurement data to within 5% error.
SPICE MODEL of 1MBH08D-120 (Professional+FWDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 1MBH08D-120 (Professional+FWDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCF8102 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCF8102 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 1MBH08D-120 (Professional+FWDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 1MBH08D-120 (Professional+FWDS Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
Update 22 models(Schottky Rectifier ) in SPICE PARK(APR2024)Tsuyoshi Horigome
This document provides an inventory update of 6,747 parts at Spice Park as of April 2024. It lists the part numbers, manufacturers, and quantities of various semiconductor components, including 1,697 Schottky rectifier diodes from 29 different manufacturers. It also includes details on passive components, batteries, mechanical parts, motors, and lamps in the inventory.
The document provides an inventory update from April 2024 of the Spice Park collection which contains 6,747 electronic components. It includes tables listing the types of semiconductor components, passive parts, batteries, mechanical parts, motors, and lamps in the collection along with their manufacturer and quantities. One of the semiconductor components, the general purpose rectifier diode, is broken down into a more detailed table with 116 entries providing part numbers, manufacturers, thermal ratings, and remarks.
Update 31 models(Diode/General ) in SPICE PARK(MAR2024)Tsuyoshi Horigome
The document provides an inventory update from March 2024 of parts in the Spice Park warehouse. It lists 6,725 total parts across various categories including semiconductors, passive parts, batteries, mechanical parts, motors, and lamps. The semiconductor section lists 652 general purpose rectifier diodes from 18 different manufacturers with quantities ranging from 2 to 145 pieces.
This document provides an inventory list of parts at Spice Park as of March 2024. It contains 3 sections - Semiconductor parts (diodes, transistors, ICs etc.), Passive parts (capacitors, resistors etc.), and Battery parts. For Semiconductor parts, it lists 36 different part types and provides the quantity of each part. It then provides further details of Diode/General Purpose Rectifiers, listing the manufacturer and quantity of 652 individual part numbers.
Update 29 models(Solar cell) in SPICE PARK(FEB2024)Tsuyoshi Horigome
The document provides an inventory update from February 2024 of Spice Park, which contains 6,694 total pieces of electronic components and parts. It lists 36 categories of semiconductor devices, 11 categories of passive parts, 10 types of batteries, 5 mechanical parts, DC motors, lamps, and power supplies. It provides the most detailed listing for solar cells, with 1,003 total pieces from 51 manufacturers listed with part numbers.
The document provides an inventory update from February 2024 of Spice Park, which contains 6,694 electronic components. It lists the components by type (e.g. semiconductor), part number, manufacturer, thermal rating, and quantity on hand. For example, it shows that there are 621 general purpose rectifier diodes from manufacturers such as Fairchild, Fuji, Intersil, Rohm, Shindengen, and Toshiba. The detailed four-page section provides further information on the first item, general purpose rectifier diodes, including 152 individual part numbers and specifications.
This document discusses circuit simulations using LTspice. It describes driving a circuit simulation by inserting a 250 ohm resistor between the output terminals. It also describes simulating a 1 channel bridge circuit where the DUT1 and DUT2 resistors are both set to 100 ohms and the input voltage is set to either 1V or 5V.
This document discusses parametric sweeps of external and internal resistance values Rg for circuit simulation in LTspice. It also references outputting a waveform similar to a report on fall time characteristics for a device modeling report with customer Samsung.
Observability Concepts EVERY Developer Should Know -- DeveloperWeek Europe.pdfPaige Cruz
Monitoring and observability aren’t traditionally found in software curriculums and many of us cobble this knowledge together from whatever vendor or ecosystem we were first introduced to and whatever is a part of your current company’s observability stack.
While the dev and ops silo continues to crumble….many organizations still relegate monitoring & observability as the purview of ops, infra and SRE teams. This is a mistake - achieving a highly observable system requires collaboration up and down the stack.
I, a former op, would like to extend an invitation to all application developers to join the observability party will share these foundational concepts to build on:
GraphSummit Singapore | The Future of Agility: Supercharging Digital Transfor...Neo4j
Leonard Jayamohan, Partner & Generative AI Lead, Deloitte
This keynote will reveal how Deloitte leverages Neo4j’s graph power for groundbreaking digital twin solutions, achieving a staggering 100x performance boost. Discover the essential role knowledge graphs play in successful generative AI implementations. Plus, get an exclusive look at an innovative Neo4j + Generative AI solution Deloitte is developing in-house.
Cosa hanno in comune un mattoncino Lego e la backdoor XZ?Speck&Tech
ABSTRACT: A prima vista, un mattoncino Lego e la backdoor XZ potrebbero avere in comune il fatto di essere entrambi blocchi di costruzione, o dipendenze di progetti creativi e software. La realtà è che un mattoncino Lego e il caso della backdoor XZ hanno molto di più di tutto ciò in comune.
Partecipate alla presentazione per immergervi in una storia di interoperabilità, standard e formati aperti, per poi discutere del ruolo importante che i contributori hanno in una comunità open source sostenibile.
BIO: Sostenitrice del software libero e dei formati standard e aperti. È stata un membro attivo dei progetti Fedora e openSUSE e ha co-fondato l'Associazione LibreItalia dove è stata coinvolta in diversi eventi, migrazioni e formazione relativi a LibreOffice. In precedenza ha lavorato a migrazioni e corsi di formazione su LibreOffice per diverse amministrazioni pubbliche e privati. Da gennaio 2020 lavora in SUSE come Software Release Engineer per Uyuni e SUSE Manager e quando non segue la sua passione per i computer e per Geeko coltiva la sua curiosità per l'astronomia (da cui deriva il suo nickname deneb_alpha).
In the rapidly evolving landscape of technologies, XML continues to play a vital role in structuring, storing, and transporting data across diverse systems. The recent advancements in artificial intelligence (AI) present new methodologies for enhancing XML development workflows, introducing efficiency, automation, and intelligent capabilities. This presentation will outline the scope and perspective of utilizing AI in XML development. The potential benefits and the possible pitfalls will be highlighted, providing a balanced view of the subject.
We will explore the capabilities of AI in understanding XML markup languages and autonomously creating structured XML content. Additionally, we will examine the capacity of AI to enrich plain text with appropriate XML markup. Practical examples and methodological guidelines will be provided to elucidate how AI can be effectively prompted to interpret and generate accurate XML markup.
Further emphasis will be placed on the role of AI in developing XSLT, or schemas such as XSD and Schematron. We will address the techniques and strategies adopted to create prompts for generating code, explaining code, or refactoring the code, and the results achieved.
The discussion will extend to how AI can be used to transform XML content. In particular, the focus will be on the use of AI XPath extension functions in XSLT, Schematron, Schematron Quick Fixes, or for XML content refactoring.
The presentation aims to deliver a comprehensive overview of AI usage in XML development, providing attendees with the necessary knowledge to make informed decisions. Whether you’re at the early stages of adopting AI or considering integrating it in advanced XML development, this presentation will cover all levels of expertise.
By highlighting the potential advantages and challenges of integrating AI with XML development tools and languages, the presentation seeks to inspire thoughtful conversation around the future of XML development. We’ll not only delve into the technical aspects of AI-powered XML development but also discuss practical implications and possible future directions.
GraphRAG for Life Science to increase LLM accuracyTomaz Bratanic
GraphRAG for life science domain, where you retriever information from biomedical knowledge graphs using LLMs to increase the accuracy and performance of generated answers
UiPath Test Automation using UiPath Test Suite series, part 5DianaGray10
Welcome to UiPath Test Automation using UiPath Test Suite series part 5. In this session, we will cover CI/CD with devops.
Topics covered:
CI/CD with in UiPath
End-to-end overview of CI/CD pipeline with Azure devops
Speaker:
Lyndsey Byblow, Test Suite Sales Engineer @ UiPath, Inc.
Unlock the Future of Search with MongoDB Atlas_ Vector Search Unleashed.pdfMalak Abu Hammad
Discover how MongoDB Atlas and vector search technology can revolutionize your application's search capabilities. This comprehensive presentation covers:
* What is Vector Search?
* Importance and benefits of vector search
* Practical use cases across various industries
* Step-by-step implementation guide
* Live demos with code snippets
* Enhancing LLM capabilities with vector search
* Best practices and optimization strategies
Perfect for developers, AI enthusiasts, and tech leaders. Learn how to leverage MongoDB Atlas to deliver highly relevant, context-aware search results, transforming your data retrieval process. Stay ahead in tech innovation and maximize the potential of your applications.
#MongoDB #VectorSearch #AI #SemanticSearch #TechInnovation #DataScience #LLM #MachineLearning #SearchTechnology
Communications Mining Series - Zero to Hero - Session 1DianaGray10
This session provides introduction to UiPath Communication Mining, importance and platform overview. You will acquire a good understand of the phases in Communication Mining as we go over the platform with you. Topics covered:
• Communication Mining Overview
• Why is it important?
• How can it help today’s business and the benefits
• Phases in Communication Mining
• Demo on Platform overview
• Q/A
Pushing the limits of ePRTC: 100ns holdover for 100 daysAdtran
At WSTS 2024, Alon Stern explored the topic of parametric holdover and explained how recent research findings can be implemented in real-world PNT networks to achieve 100 nanoseconds of accuracy for up to 100 days.
Programming Foundation Models with DSPy - Meetup SlidesZilliz
Prompting language models is hard, while programming language models is easy. In this talk, I will discuss the state-of-the-art framework DSPy for programming foundation models with its powerful optimizers and runtime constraint system.
Climate Impact of Software Testing at Nordic Testing DaysKari Kakkonen
My slides at Nordic Testing Days 6.6.2024
Climate impact / sustainability of software testing discussed on the talk. ICT and testing must carry their part of global responsibility to help with the climat warming. We can minimize the carbon footprint but we can also have a carbon handprint, a positive impact on the climate. Quality characteristics can be added with sustainability, and then measured continuously. Test environments can be used less, and in smaller scale and on demand. Test techniques can be used in optimizing or minimizing number of tests. Test automation can be used to speed up testing.
AI 101: An Introduction to the Basics and Impact of Artificial IntelligenceIndexBug
Imagine a world where machines not only perform tasks but also learn, adapt, and make decisions. This is the promise of Artificial Intelligence (AI), a technology that's not just enhancing our lives but revolutionizing entire industries.
Why You Should Replace Windows 11 with Nitrux Linux 3.5.0 for enhanced perfor...SOFTTECHHUB
The choice of an operating system plays a pivotal role in shaping our computing experience. For decades, Microsoft's Windows has dominated the market, offering a familiar and widely adopted platform for personal and professional use. However, as technological advancements continue to push the boundaries of innovation, alternative operating systems have emerged, challenging the status quo and offering users a fresh perspective on computing.
One such alternative that has garnered significant attention and acclaim is Nitrux Linux 3.5.0, a sleek, powerful, and user-friendly Linux distribution that promises to redefine the way we interact with our devices. With its focus on performance, security, and customization, Nitrux Linux presents a compelling case for those seeking to break free from the constraints of proprietary software and embrace the freedom and flexibility of open-source computing.
“An Outlook of the Ongoing and Future Relationship between Blockchain Technologies and Process-aware Information Systems.” Invited talk at the joint workshop on Blockchain for Information Systems (BC4IS) and Blockchain for Trusted Data Sharing (B4TDS), co-located with with the 36th International Conference on Advanced Information Systems Engineering (CAiSE), 3 June 2024, Limassol, Cyprus.
2. DIODE MODEL
Pspice model
Model description
Parameter
IS Saturation Current
N Emission Coefficient
RS Series Resistance
IKF High-injection Knee Current
CJO Zero-bias Junction Capacitance
M Junction Grading Coefficient
VJ Junction Potential
ISR Recombination Current Saturation Value
BV Reverse Breakdown Voltage(a positive value)
IBV Reverse Breakdown Current(a positive value)
TT Transit Time
All Rights Reserved Copyright (c) Bee Technologies Inc. 2004
3. IG-VT Characteristic
Evaluation Circuit
Rload
100
A
U1 Vak
6Vdc
G
8P4J
K
Ig
0Adc
0
Simulation result
Simulation
Comparison Table
Measurement Simulation % Error
IG (Max 10) (mA) 9.5 9.540 -0.421
VT (Max 1.5 )(V) 0.55 0.547 0.545
All Rights Reserved Copyright (c) Bee Technologies Inc. 2004
4. ITM-VTM Characteristic
Evaluation Circuit
Rload
A
24
U1 Vak
0Vdc
8P4J
G
K
Ig
10mAdc
0
Simulation result
Simulation
Comparison Table
At ITM=10A Measurement Simulation % Error
VTM(V) 1.4 1.3787 1.521
All Rights Reserved Copyright (c) Bee Technologies Inc. 2004
5. Holding Characteristic (IH)
Evaluation Circuit
Rload
A
2.265
Rg U1
G
8P4J
Vak
VOFF = 0
V1 = 0 1k FREQ = 50
K
V2 = 11 VAMPL = 24
TD = 5ms V1
TR = 1us
TF = 1us
PW = 1ms
PER = 20ms
0
Simulation result
Simulation
Comparison Table
VAK=24V,ITM=10A Measurement Simulation % Error
IH(mA) 6 6.1259 -2.098
All Rights Reserved Copyright (c) Bee Technologies Inc. 2004