The last few years microfluidics stopped being a niche technology,with a user base predominantly consisting of engineers. Most of the microfluidic companies now are growing and the install base of instruments based on microfluidics is growing fast. Still, the situation is far from ideal. Designs are unnecessary complicated, there is little to no reuse of build-up expertise or developed components. Similar to the early computerindustry,amajor reason for the low popularity is the complicated character of microfluidic devices, specifically in terms of fabrication, and thusmaking theminaccessible to a larger population.[1]I n the ECSEL MFM project first steps have been made towards developingstandards for microfluidic devices. Standards for basic design features like geometrical outlines and port locations have been proposed inwhite papers[2]and where adopted by ISO in an ISO IWA process.[3]One of the complications of microfluidic products is the challenge of providing electrical connections. The average microfluidic engineer lacks electronicpackaging knowledge. Furthermore, the incompatibility of microfluidics and electronics combined with space constrains, limits the technology choices.

1. Electrical Interconnects
in Microfluidics
Jan Eite Bullema*
9 and 10 October 2017
10/10/2017 JEB - MF Manufacturing - Confidential 1* = WP1 leader

2. MFM Approach:
How do standards emerge
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Problems
Surveys
Literature
Demonstrators
Technical Feasibility
Validation
Industry Practices
Standard
MFM Partners
Advisory Board
Technical Committees
Standardization Body

3. Packaging in Electronics
Packaging in electronics
• electrical power distribution,
• electrical signal distribution,
• heat dissipation / thermal management,
• physical protection,
• manufacturability / automatic processing.
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4. Guidelines Electrical Interconnections
e.g. 2.54 mm pitch in box and pin headers
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5. Comparison Electrical & Fluidic
Levels of Interconnect
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Electrical Interconnections Fluidic Interconnections

6. Guidelines Electrical Interconnections
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In the figure, the microbioreactor and the integrated fluidic interconnections belong
to the first level of packaging, the heating and cooling system, the optical plugs and
the demountable reaction chamber belong to the third level of packaging.
Perozziello G., Packaging of Microfluidic systems: A microfluidic Motherboard Integrating
Fluidic and Optical Interconnections, Ph. D thesis, DTU 2006

7. Examples Electrical Interconnections
in fluidic devices and products
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Philips Minicare
Biocartis Instrument and Cartridge

8. Examples Electrical Interconnections
in fluidic devices and products
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Biosurfit
Genalysis™ system
Imec Fluidic circuit on PCB
Matas

9. Examples Electrical Interconnections
in fluidic devices and products
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Liquid metal in micro channels
Use of Fields metal (low temperature melting solder)

10. Examples Electrical Interconnections
in fluidic devices and products
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Insilixa
Sensiron
Edge connector

11. Examples Electrical Interconnections
in fluidic devices and products
10/10/2017 Jan Eite Bullema - MF Manufacturing - Confidential 11
Qmicro: fluidic flip chip
Sensiron
Conductive tracks on foil
Generic solution: chip on channel

12. Examples Electrical Interconnections
in fluidic devices and products
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MFM: electrical interconnect clamp
(box head type)
Dolomite
UT flow sensor with mini PCB

13. Examples Electrical Interconnections
in fluidic devices and products
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TNO: Integrated electronics

14. Comparison Electrical & Fluidic
Levels of Interconnect
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Electrical Devices Fluidic devices
First level, e.g. chip Solder, conductive
adhesive, wire bond
First level
microfluidic building
block
Gasket, O-ring
Second level, e.g.
printed circuit board
Solder, connector Second level, e.g.
fluidic circuit board
Ferrule, tube,
connector
Third level, e.g.
cabinet
connector Third level, e.g.
instrument
Ferrule, tube,
connector

15. Considerations for Fluidic /
Electrical Interconnections
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16. Considerations for Fluidic /
Electrical Interconnections
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17. Integration Considerations (PoC)
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18. Technology Choice Considerations
• Power consumption
• Signal integrity: measured signals are weak amplification in
the disposable will give rise to additional cost.
• Cost
• Manufacturability: not all technologies have the same level
of matureness
• Process temperature: often the disposable contains
biomaterial and even temperatures that the electronic
industry regards as low, are too high for such materials.
• Is the connection meant to be permanent or temporary
• Is the connection also used to create a hermetic seal
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19. interconnect technologies to be used
in microfluidic disposables
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20. Conclusions: Guidelines for Electrical
Interconnections in Micro Fluidics
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the current state of maturity and the large diversity in applications or technology
choices, only some high level guidelines are given
• The primary rule appears to be to avoid electrical
interconnections in a fluidic device, if possible the electrical
functions should be provided by an external instrument
• If one has to include electrical interconnections in a disposable,
solutions with springs or connectors are preferred
• It is recommended to group all electrical interconnects to a
dedicated interconnection area.

21. Thank You for your attention