Electrical Interconnects
in Microfluidics
Jan Eite Bullema*
9 and 10 October 2017
10/10/2017 JEB - MF Manufacturing - Confidential 1* = WP1 leader
MFM Approach:
How do standards emerge
10/10/2017 Jan Eite Bullema - MF Manufacturing - Confidential 2
Problems
Surveys
Literature
Demonstrators
Technical Feasibility
Validation
Industry Practices
Standard
MFM Partners
Advisory Board
Technical Committees
Standardization Body
Packaging in Electronics
Packaging in electronics
• electrical power distribution,
• electrical signal distribution,
• heat dissipation / thermal management,
• physical protection,
• manufacturability / automatic processing.
10/10/2017 Jan Eite Bullema - MF Manufacturing - Confidential 3
Guidelines Electrical Interconnections
e.g. 2.54 mm pitch in box and pin headers
10/10/2017 Jan Eite Bullema - MF Manufacturing - Confidential 4
Comparison Electrical & Fluidic
Levels of Interconnect
10/10/2017 Jan Eite Bullema - MF Manufacturing - Confidential 5
Electrical Interconnections Fluidic Interconnections
Guidelines Electrical Interconnections
10/10/2017 Jan Eite Bullema - MF Manufacturing - Confidential 6
In the figure, the microbioreactor and the integrated fluidic interconnections belong
to the first level of packaging, the heating and cooling system, the optical plugs and
the demountable reaction chamber belong to the third level of packaging.
Perozziello G., Packaging of Microfluidic systems: A microfluidic Motherboard Integrating
Fluidic and Optical Interconnections, Ph. D thesis, DTU 2006
Examples Electrical Interconnections
in fluidic devices and products
10/10/2017 Jan Eite Bullema - MF Manufacturing - Confidential 7
Philips Minicare
Biocartis Instrument and Cartridge
Examples Electrical Interconnections
in fluidic devices and products
10/10/2017 Jan Eite Bullema - MF Manufacturing - Confidential 8
Biosurfit
Genalysis™ system
Imec Fluidic circuit on PCB
Matas
Examples Electrical Interconnections
in fluidic devices and products
10/10/2017 Jan Eite Bullema - MF Manufacturing - Confidential 9
Liquid metal in micro channels
Use of Fields metal (low temperature melting solder)
Examples Electrical Interconnections
in fluidic devices and products
10/10/2017 Jan Eite Bullema - MF Manufacturing - Confidential 10
Insilixa
Sensiron
Edge connector
Examples Electrical Interconnections
in fluidic devices and products
10/10/2017 Jan Eite Bullema - MF Manufacturing - Confidential 11
Qmicro: fluidic flip chip
Sensiron
Conductive tracks on foil
Generic solution: chip on channel
Examples Electrical Interconnections
in fluidic devices and products
10/10/2017 Jan Eite Bullema - MF Manufacturing - Confidential 12
MFM: electrical interconnect clamp
(box head type)
Dolomite
UT flow sensor with mini PCB
Examples Electrical Interconnections
in fluidic devices and products
10/10/2017 Jan Eite Bullema - MF Manufacturing - Confidential 13
TNO: Integrated electronics
Comparison Electrical & Fluidic
Levels of Interconnect
10/10/2017 Jan Eite Bullema - MF Manufacturing - Confidential 14
Electrical Devices Fluidic devices
First level, e.g. chip Solder, conductive
adhesive, wire bond
First level
microfluidic building
block
Gasket, O-ring
Second level, e.g.
printed circuit board
Solder, connector Second level, e.g.
fluidic circuit board
Ferrule, tube,
connector
Third level, e.g.
cabinet
connector Third level, e.g.
instrument
Ferrule, tube,
connector
Considerations for Fluidic /
Electrical Interconnections
10/10/2017 Jan Eite Bullema - MF Manufacturing - Confidential 15
Considerations for Fluidic /
Electrical Interconnections
10/10/2017 Jan Eite Bullema - MF Manufacturing - Confidential 16
Integration Considerations (PoC)
10/10/2017 Jan Eite Bullema - MF Manufacturing - Confidential 17
Technology Choice Considerations
• Power consumption
• Signal integrity: measured signals are weak amplification in
the disposable will give rise to additional cost.
• Cost
• Manufacturability: not all technologies have the same level
of matureness
• Process temperature: often the disposable contains
biomaterial and even temperatures that the electronic
industry regards as low, are too high for such materials.
• Is the connection meant to be permanent or temporary
• Is the connection also used to create a hermetic seal
10/10/2017 Jan Eite Bullema - MF Manufacturing - Confidential 18
interconnect technologies to be used
in microfluidic disposables
10/10/2017 Jan Eite Bullema - MF Manufacturing - Confidential 19
Conclusions: Guidelines for Electrical
Interconnections in Micro Fluidics
10/10/2017 Jan Eite Bullema - MF Manufacturing - Confidential 20
the current state of maturity and the large diversity in applications or technology
choices, only some high level guidelines are given
• The primary rule appears to be to avoid electrical
interconnections in a fluidic device, if possible the electrical
functions should be provided by an external instrument
• If one has to include electrical interconnections in a disposable,
solutions with springs or connectors are preferred
• It is recommended to group all electrical interconnects to a
dedicated interconnection area.
Thank You for your attention

2017 Electrical interconnects in miro fluidics

  • 1.
    Electrical Interconnects in Microfluidics JanEite Bullema* 9 and 10 October 2017 10/10/2017 JEB - MF Manufacturing - Confidential 1* = WP1 leader
  • 2.
    MFM Approach: How dostandards emerge 10/10/2017 Jan Eite Bullema - MF Manufacturing - Confidential 2 Problems Surveys Literature Demonstrators Technical Feasibility Validation Industry Practices Standard MFM Partners Advisory Board Technical Committees Standardization Body
  • 3.
    Packaging in Electronics Packagingin electronics • electrical power distribution, • electrical signal distribution, • heat dissipation / thermal management, • physical protection, • manufacturability / automatic processing. 10/10/2017 Jan Eite Bullema - MF Manufacturing - Confidential 3
  • 4.
    Guidelines Electrical Interconnections e.g.2.54 mm pitch in box and pin headers 10/10/2017 Jan Eite Bullema - MF Manufacturing - Confidential 4
  • 5.
    Comparison Electrical &Fluidic Levels of Interconnect 10/10/2017 Jan Eite Bullema - MF Manufacturing - Confidential 5 Electrical Interconnections Fluidic Interconnections
  • 6.
    Guidelines Electrical Interconnections 10/10/2017Jan Eite Bullema - MF Manufacturing - Confidential 6 In the figure, the microbioreactor and the integrated fluidic interconnections belong to the first level of packaging, the heating and cooling system, the optical plugs and the demountable reaction chamber belong to the third level of packaging. Perozziello G., Packaging of Microfluidic systems: A microfluidic Motherboard Integrating Fluidic and Optical Interconnections, Ph. D thesis, DTU 2006
  • 7.
    Examples Electrical Interconnections influidic devices and products 10/10/2017 Jan Eite Bullema - MF Manufacturing - Confidential 7 Philips Minicare Biocartis Instrument and Cartridge
  • 8.
    Examples Electrical Interconnections influidic devices and products 10/10/2017 Jan Eite Bullema - MF Manufacturing - Confidential 8 Biosurfit Genalysis™ system Imec Fluidic circuit on PCB Matas
  • 9.
    Examples Electrical Interconnections influidic devices and products 10/10/2017 Jan Eite Bullema - MF Manufacturing - Confidential 9 Liquid metal in micro channels Use of Fields metal (low temperature melting solder)
  • 10.
    Examples Electrical Interconnections influidic devices and products 10/10/2017 Jan Eite Bullema - MF Manufacturing - Confidential 10 Insilixa Sensiron Edge connector
  • 11.
    Examples Electrical Interconnections influidic devices and products 10/10/2017 Jan Eite Bullema - MF Manufacturing - Confidential 11 Qmicro: fluidic flip chip Sensiron Conductive tracks on foil Generic solution: chip on channel
  • 12.
    Examples Electrical Interconnections influidic devices and products 10/10/2017 Jan Eite Bullema - MF Manufacturing - Confidential 12 MFM: electrical interconnect clamp (box head type) Dolomite UT flow sensor with mini PCB
  • 13.
    Examples Electrical Interconnections influidic devices and products 10/10/2017 Jan Eite Bullema - MF Manufacturing - Confidential 13 TNO: Integrated electronics
  • 14.
    Comparison Electrical &Fluidic Levels of Interconnect 10/10/2017 Jan Eite Bullema - MF Manufacturing - Confidential 14 Electrical Devices Fluidic devices First level, e.g. chip Solder, conductive adhesive, wire bond First level microfluidic building block Gasket, O-ring Second level, e.g. printed circuit board Solder, connector Second level, e.g. fluidic circuit board Ferrule, tube, connector Third level, e.g. cabinet connector Third level, e.g. instrument Ferrule, tube, connector
  • 15.
    Considerations for Fluidic/ Electrical Interconnections 10/10/2017 Jan Eite Bullema - MF Manufacturing - Confidential 15
  • 16.
    Considerations for Fluidic/ Electrical Interconnections 10/10/2017 Jan Eite Bullema - MF Manufacturing - Confidential 16
  • 17.
    Integration Considerations (PoC) 10/10/2017Jan Eite Bullema - MF Manufacturing - Confidential 17
  • 18.
    Technology Choice Considerations •Power consumption • Signal integrity: measured signals are weak amplification in the disposable will give rise to additional cost. • Cost • Manufacturability: not all technologies have the same level of matureness • Process temperature: often the disposable contains biomaterial and even temperatures that the electronic industry regards as low, are too high for such materials. • Is the connection meant to be permanent or temporary • Is the connection also used to create a hermetic seal 10/10/2017 Jan Eite Bullema - MF Manufacturing - Confidential 18
  • 19.
    interconnect technologies tobe used in microfluidic disposables 10/10/2017 Jan Eite Bullema - MF Manufacturing - Confidential 19
  • 20.
    Conclusions: Guidelines forElectrical Interconnections in Micro Fluidics 10/10/2017 Jan Eite Bullema - MF Manufacturing - Confidential 20 the current state of maturity and the large diversity in applications or technology choices, only some high level guidelines are given • The primary rule appears to be to avoid electrical interconnections in a fluidic device, if possible the electrical functions should be provided by an external instrument • If one has to include electrical interconnections in a disposable, solutions with springs or connectors are preferred • It is recommended to group all electrical interconnects to a dedicated interconnection area.
  • 21.
    Thank You foryour attention

Editor's Notes

  • #3 The last few years microfluidics stopped being a niche technology, with a user base predominantly consisting of engineers. Most of the microfluidic companies now are growing and the install base of instruments based on microfluidics is growing fast. Still, the situation is far from ideal. Designs are unnecessary complicated, there is little to no reuse of build-up expertise or developed components. Similar to the early computer industry, a major reason for the low popularity is the complicated character of microfluidic devices, specifically in terms of fabrication, and thus making them inaccessible to a larger population. [1] In the ECSEL MFM project first steps have been made towards developing standards for microfluidic devices. Standards for basic design features like geometrical outlines and port locations have been proposed in white papers [2] and where adopted by ISO in an ISO IWA process. [3] One of the complications of microfluidic products is the challenge of providing electrical connections. The average microfluidic engineer lacks electronic knowledge. Furthermore, the incompatibility of microfluidics and electronics combined with space constrains, limits the technology choices.