The document discusses Tyco Electronics' collaboration with academic researchers to develop new technologies. It provides examples of how Tyco has taken inventions from universities and applied them commercially through innovation. Specifically, it describes how Tyco worked with UC Berkeley to radiation crosslink self-assembled block copolymers for applications in areas like shape memory polymers and optical materials. It also discusses Tyco's collaboration with UC Davis to develop a catalytically crosslinkable and decrosslinkable polymer system using olefin metathesis, enabling recyclability. Finally, it outlines Tyco's research on graphene preparation and potential applications of graphene in areas like lightweight conductors.
White paper on ESD protection for 40nm/28nmbart_keppens
40/28nm ESD approach
On-chip ESD protection clamps for advanced 40nm and 28nm CMOS technology
Despite the rising cost for IC development, EDA tools and mask sets semiconductor design companies continue to use the most advanced CMOS technology for high performance applications because benefits like lower power dissipation, increased gate density, higher speed and lower manufacturing cost per die more than compensate the higher cost.
This return on investment however only pays off for ultra high volume applications. Due to the use of sensitive elements (such as ultra thin-oxide transistors, ultra-shallow junctions, narrow and thin metal layers), increased complexity through multiple voltage domains and the use of IP blocks from various vendors, a comprehensive ESD protection strategy becomes more important.
This white paper presents on-chip ESD protection clamps and approaches for 40/28nm CMOS that provide competitive advantage by improved yield, reduced silicon footprint and enable advanced multimedia and wireless interfaces like HDMI, USB 3.0, SATA, WiFi, GPS and Bluetooth. The solutions are validated in tens of products running in foundry and proprietary fabrication plants.
On-chip ESD protection for Silicon PhotonicsSofics
In the past, Fiber-optic communication was used only for long distance communication (50 km and beyond). Only a limited number of these high-end interface products were required worldwide. More recently, companies running large data centers (Facebook, Google, Amazon,...) like to replace the traditional cabling between server racks. The copper-based approach is considered a bottleneck for further improvements in data transfer capacity. Optical fiber can dramatically increase the bandwidth between servers and reduce complexity.
Thus, the optical interconnect suppliers now need to produce a large number of their products. To reduce the cost, they separate the optical parts (laser diodes, photo detectors) from the digital controller circuits. That allows to rely on advanced, standard CMOS technology for those controller circuits, enabling a cost-effective high-volume production. Both elements are combined within a single IC package using advanced packing techniques.
The 25-56Gbps interfaces consist of SerDes-type circuits and are integrated into advanced CMOS technology like 28nm CMOS. To create such high-speed differential I/O circuits, designers utilize the thin oxide transistors. However, those transistors are very sensitive and can be easily damaged during transient events like electrostatic discharge (ESD).
Despite the fact that the sensitive pads are not connected outside of the package, they could still receive ESD stress during assembly. Therefore, adequate protection clamps need to be inserted at the bond pads. On the other hand, for signal integrity, it is important to limit the capacitance between the interface pads and the supply lines.
Sofics has worked with several companies developing these optical interconnect interfaces. Sofics developed ESD protection with parasitic capacitance below 15fF, ten times lower than the typical low-cap ESD protection devices in TSMC 28nm CMOS.
Sgcp12 russell haggar-xsilon-for pd-fing for cir websiteJustin Hayward
The document discusses the growing Internet of Things (IoT) and the opportunities and challenges for machine-to-machine (M2M) connectivity within homes. It notes that while over 50 billion devices are expected to be connected by 2020, in-home connectivity faces obstacles like walls blocking radio signals and the need for low-cost, ubiquitous, and privacy-respecting solutions. The document reviews various in-home connectivity options and argues that no single technology can meet all needs, requiring hybrid approaches combining technologies like Zigbee, Weightless, and Hanadu's new powerline-based protocol. Compartmentalizing networks and using next-gen IPv6 profiles are also suggested to address privacy and ownership issues with multiple in
The document discusses connecting devices in the home using machine-to-machine (M2M) technology. It notes that over 50 billion devices are expected to be connected by 2020, including devices in homes for services like smart meters, appliances, assisted living, and energy management. While technologies like WiFi and powerline solutions can connect some devices, no single technology is suitable for all applications due to factors like device power usage, coverage, and privacy concerns. A new technology called Hanadu aims to provide whole-home coverage using powerlines while addressing these limitations.
Smart Grid a greenfield application for IPv6, hence the Internet. Presented at IISc, Bangalore as part of TEC and IPv6 Forum Workshop on Greenfield Applications for Transition to IPV6 in India.
Intelligent Energy is a pioneer in PEM hydrogen fuel cell technology and offers customized power solutions across various stationary and mobile applications. The document analyzes the viability of hydrogen fuel cell technology in the Indian market, citing factors like unreliable power supply, limited grid access, and incentives for renewable energy. It then outlines the advantages of hydrogen fuel cell backup power systems and identifies key vertical markets in India where these systems could provide benefits over conventional generators.
This document is a technical seminar paper submitted by M. Dona Sri on wireless communication networks. It provides an overview of the history and development of wireless technologies including early innovations like the photophone and wireless telegraphy. It discusses various wireless communication modes like radio, free-space optical, sonic and electromagnetic induction. It also covers wireless applications in different areas such as mobile phones, data communications, medical technologies and computer interface devices. Finally, it examines common modern wireless technologies and implementation standards.
White paper on ESD protection for 40nm/28nmbart_keppens
40/28nm ESD approach
On-chip ESD protection clamps for advanced 40nm and 28nm CMOS technology
Despite the rising cost for IC development, EDA tools and mask sets semiconductor design companies continue to use the most advanced CMOS technology for high performance applications because benefits like lower power dissipation, increased gate density, higher speed and lower manufacturing cost per die more than compensate the higher cost.
This return on investment however only pays off for ultra high volume applications. Due to the use of sensitive elements (such as ultra thin-oxide transistors, ultra-shallow junctions, narrow and thin metal layers), increased complexity through multiple voltage domains and the use of IP blocks from various vendors, a comprehensive ESD protection strategy becomes more important.
This white paper presents on-chip ESD protection clamps and approaches for 40/28nm CMOS that provide competitive advantage by improved yield, reduced silicon footprint and enable advanced multimedia and wireless interfaces like HDMI, USB 3.0, SATA, WiFi, GPS and Bluetooth. The solutions are validated in tens of products running in foundry and proprietary fabrication plants.
On-chip ESD protection for Silicon PhotonicsSofics
In the past, Fiber-optic communication was used only for long distance communication (50 km and beyond). Only a limited number of these high-end interface products were required worldwide. More recently, companies running large data centers (Facebook, Google, Amazon,...) like to replace the traditional cabling between server racks. The copper-based approach is considered a bottleneck for further improvements in data transfer capacity. Optical fiber can dramatically increase the bandwidth between servers and reduce complexity.
Thus, the optical interconnect suppliers now need to produce a large number of their products. To reduce the cost, they separate the optical parts (laser diodes, photo detectors) from the digital controller circuits. That allows to rely on advanced, standard CMOS technology for those controller circuits, enabling a cost-effective high-volume production. Both elements are combined within a single IC package using advanced packing techniques.
The 25-56Gbps interfaces consist of SerDes-type circuits and are integrated into advanced CMOS technology like 28nm CMOS. To create such high-speed differential I/O circuits, designers utilize the thin oxide transistors. However, those transistors are very sensitive and can be easily damaged during transient events like electrostatic discharge (ESD).
Despite the fact that the sensitive pads are not connected outside of the package, they could still receive ESD stress during assembly. Therefore, adequate protection clamps need to be inserted at the bond pads. On the other hand, for signal integrity, it is important to limit the capacitance between the interface pads and the supply lines.
Sofics has worked with several companies developing these optical interconnect interfaces. Sofics developed ESD protection with parasitic capacitance below 15fF, ten times lower than the typical low-cap ESD protection devices in TSMC 28nm CMOS.
Sgcp12 russell haggar-xsilon-for pd-fing for cir websiteJustin Hayward
The document discusses the growing Internet of Things (IoT) and the opportunities and challenges for machine-to-machine (M2M) connectivity within homes. It notes that while over 50 billion devices are expected to be connected by 2020, in-home connectivity faces obstacles like walls blocking radio signals and the need for low-cost, ubiquitous, and privacy-respecting solutions. The document reviews various in-home connectivity options and argues that no single technology can meet all needs, requiring hybrid approaches combining technologies like Zigbee, Weightless, and Hanadu's new powerline-based protocol. Compartmentalizing networks and using next-gen IPv6 profiles are also suggested to address privacy and ownership issues with multiple in
The document discusses connecting devices in the home using machine-to-machine (M2M) technology. It notes that over 50 billion devices are expected to be connected by 2020, including devices in homes for services like smart meters, appliances, assisted living, and energy management. While technologies like WiFi and powerline solutions can connect some devices, no single technology is suitable for all applications due to factors like device power usage, coverage, and privacy concerns. A new technology called Hanadu aims to provide whole-home coverage using powerlines while addressing these limitations.
Smart Grid a greenfield application for IPv6, hence the Internet. Presented at IISc, Bangalore as part of TEC and IPv6 Forum Workshop on Greenfield Applications for Transition to IPV6 in India.
Intelligent Energy is a pioneer in PEM hydrogen fuel cell technology and offers customized power solutions across various stationary and mobile applications. The document analyzes the viability of hydrogen fuel cell technology in the Indian market, citing factors like unreliable power supply, limited grid access, and incentives for renewable energy. It then outlines the advantages of hydrogen fuel cell backup power systems and identifies key vertical markets in India where these systems could provide benefits over conventional generators.
This document is a technical seminar paper submitted by M. Dona Sri on wireless communication networks. It provides an overview of the history and development of wireless technologies including early innovations like the photophone and wireless telegraphy. It discusses various wireless communication modes like radio, free-space optical, sonic and electromagnetic induction. It also covers wireless applications in different areas such as mobile phones, data communications, medical technologies and computer interface devices. Finally, it examines common modern wireless technologies and implementation standards.
This document is a presentation by Paul Steece, Vice President and General Manager of 3M's Electrical Markets Division, about reinventing the division. The key points are:
1. The Electrical Markets Division serves stable, growing end markets like electric utilities, construction, and OEMs with products like tapes, cable accessories, and insulating materials.
2. While the division was highly profitable in the past by decreasing investment, its sales growth was flat and it relied on cost cutting not growth.
3. The presentation aims to outline how the division has shifted its focus from managing for cash to prioritizing growth through increased investment in capital, M&A, and innovation.
TowerLabs: Accelerating Adoption of Green Building Technologies for CondosToronto 2030 District
Jamie James, Founder of TowerLabs @ MaRS showcases some of their research and the technology they are incubating to accelerate the uptake of cleantech in the condo sector.
Electronics 09-00331_A Novel General Purpose Combined DFVF/VCII Based Biomedi...Hoopeer Hoopeer
This document describes a novel biomedical amplifier circuit that combines a Differential Flipped Voltage Follower (DFVF) stage with a Second-Generation Voltage Conveyor (VCII) acting as a transimpedance amplifier. Simulation results using a 0.15 μm CMOS process show the circuit has an input-referred noise of 5.4 μVrms, operates from a ±0.6 V supply, and consumes only 20 μW per channel. The low complexity of the design allows for a very compact layout, enabling the integration of thousands of channels for biomedical sensing applications.
This document summarizes information about types of cables, top cable companies in India, and their financials and new developments. It discusses three main types of cables - twisted pair, coaxial, and optical fiber. It then profiles the top 6 cable companies in India, including Polycab, Sterlite Technologies, Finolex Cables, Havells India, Diamond Power Infrastructure, and KEI Industries. For each company it provides key financial metrics like net profit and growth rates, as well as information on CSR activities, new products, and market footprint.
HOW TO CHOOSE BETWEEN LTE-M AND
NB-IOT FOR GLOBAL DEPLOYMENTS. LTE-M AND NB-IOT TECHNOLOGIES - INCREASED
BATTERY LIFE, ENHANCED COVERAGE AND SIMPLIFIED
HARDWARE
Fiber Optic Cable Production. Optical Fiber Cable Manufacturing Industry
An optical fiber cable is a type of cable that has a number of optical fibers bundled together, which are normally covered in their individual protective plastic covers. Optical cables are used to transfer digital data signals in the form of light up to distances of hundreds of miles with higher throughput rates than those achievable via electrical communication cables. All optical fibers use a core of hair-like transparent silicon covered with less refractive indexed cladding to avoid light leakage to the surroundings. Due to the extreme sensitivity of the optical fiber, it is normally covered with a high-strength, lightweight protective material like Kevlar. Optical fiber cable is widely used in fiber optic communications.
See more
https://goo.gl/u8rUU2
https://goo.gl/xFZttv
Contact us:
Niir Project Consultancy Services
An ISO 9001:2015 Company
106-E, Kamla Nagar, Opp. Spark Mall,
New Delhi-110007, India.
Email: npcs.ei@gmail.com , info@entrepreneurindia.co
Tel: +91-11-23843955, 23845654, 23845886, 8800733955
Mobile: +91-9811043595
Website: www.entrepreneurindia.co , www.niir.org
Tags
Fiber Optical Cables, Fiber Optic Cable Production, Production of Fiber Optic Cable, Manufacture of Fibre Optic Cable, Fiber Optic Cable Manufacturing, How Fiber Optics are made, Fiber-Optic Cable Manufacturing Industry, Manufacturing Process of Fiber Optic Cable, Optical Fiber Cable Manufacture, Manufacturing of Fiber Optic Cables, Optical Fiber Production, Fiber Optic & Cable, Optical Fiber Manufacturing Process Pdf, Optical Fibre Manufacturing Process PPT, Fiber Optical Cables Manufacturing Plant, Fiber Optic Cable Manufacture, Fiber and Optical Cable Production Unit, Fiber Optic Cables Manufacturing Unit, Industrial Fiber Optic Cables Manufacture, Fiber Optic Cables Production Process, Fiber Optics Industry, Fiber-Optic Cable and Method of Manufacture, Industrial Fiber Optic Cables, Fiber Optic Cable Marking Process, Optical Fiber Cable Manufacturing Factory, Fiber Optic Cables, Electrical Cable, Fiber Optic Cables Uses, Project Report on Fiber-Optic Cable Manufacturing Industry, Detailed Project Report on Fiber-Optic Cable Manufacturing, Project Report on Fiber-Optic Cable Manufacturing, Pre-Investment Feasibility Study on Fiber-Optic Cable Manufacturing, Techno-Economic feasibility study on Fiber-Optic Cable Manufacturing, Feasibility report on Fiber Optic Cable Production, Free Project Profile on Fiber Optic Cable Production, Project profile on Fiber Optic Cable Production, Download free project profile on Fiber Optic Cable Production
MercaSID is a manufacturer and distributor in the Dominican Republic that was experiencing issues with its aging network. It deployed a new network solution from Juniper Networks including EX Series switches in the data center and locations, as well as WLA wireless access points and a WLC controller. This provided a highly reliable, unified wired and wireless network that improved network performance, simplified management, and supported the growing business needs of employees and partners.
li-fi: the future of wireless communicationIJMERJOURNAL
ABSTRACT: Nowadays people and their electronic devices access wireless internet. But, clogged airwaves are going to make it increasingly difficult to latch onto a reliable signal. So, Radio waves are just one part of the spectrum that can carry our data. We can use “Data through Illumination”. In this process, the data is sent through an LED source that varies in intensity faster than the human eye could follow. The future can be envisioned where the data for laptops, smart phones and all other smart applications is transmitted through the light in our living room. And security would be a snap—if you can’t see the light, you can’t access the data.
ZTE COMMUNICATIONS No.2 2016 : Optical wireless communicationsSitha Sok
ZTE COMMUNICATIONS No.2 2016
Fresh off the Press! The April issue focuses on optical wireless communications. Harald Hass, "the father of Li-Fi", and his student contributed to this special issue.
This document provides information about BMET energy telecom industry and trade PLC, a cable factory in Ethiopia. It discusses the company's history, including its establishment in 2010 and the start of production in 2013. It also describes the factory's buildings, infrastructure, machinery, production processes for different cable types, and technical specifications. In general, the document outlines the operations and capabilities of BMET as one of the largest cable manufacturers in Ethiopia.
The document discusses 5G mobile technology and its evolution from earlier generations. It provides details on:
1) How 5G will offer unprecedented call volume and data transmission speeds compared to previous technologies.
2) The network architecture of 5G, which will integrate different wireless technologies like PANs, WANs and cellular networks to provide seamless global connectivity using IPv6 addressing.
3) The mix-bandwidth data path design for 5G, which efficiently utilizes the resources of multiple overlapping wireless networks like pico-cells, micro-cells and macro-cells that cover the same area.
WiFi new generation par Guy PUJOLLE - Fevrier 2013Yves-Alain STORY
La radio cognitive, les femtocells, la nouvelle génération de WiFi Passpoint, le WiFi nouvelle génération (IEEE 802.11 ac, ad, af, ah). Recherches en Corée du Sud avec Postech et Samsung sur les capteurs médicaux en nano technologie (sécurité et virtualisation).
Instituion Of Engineers Smart Grid Seminar Jul 16 2009satyambh
The document discusses smart grids and the customer domain within smart grid ecosystems. It covers how smart meters, home area networks, energy devices, electric vehicles, and micro-grids can integrate with smart pricing programs to optimize energy usage and lower costs for utilities and customers. The goal is to shift demand away from peak times and encourage conservation through technology enabling real-time pricing programs and demand response.
This document provides an overview of emerging cellular technologies from 1G to 7G. It discusses the key features and limitations of each generation of technology, including speed increases from 2.4kbps for 1G to several Gbps for 5G. 5G is highlighted as providing high speeds, capacity, and support for multimedia applications. Challenges in implementing newer technologies like 5G include high costs and needing new infrastructure and device hardware. The document concludes that 5G may be the best next wireless system due to its security and ability to meet growing demands for wireless connectivity.
This document is a seminar report submitted by Ganesh Hegde to Visvesvaraya Technological University that discusses wireless systems and challenges in 5G networks. It provides an overview of the evolution of wireless technologies from 1G to 5G networks, describing the key features and capabilities of each generation. The report highlights that 5G networks will require significantly more advanced self-organizing capabilities to handle the immense complexity and scale compared to 3G/4G networks. It proposes a framework for empowering self-organizing networks with big data analytics and machine learning to address the challenges of deploying and managing 5G networks.
This document summarizes a proposal for wirelessly charging mobile phones using microwaves. It begins by introducing microwaves and their common uses including telecommunications and radar technology. It then outlines the proposal to add a rectenna to mobile phones to directly convert transmitted microwave energy into electricity to charge the phone battery. The rectenna would be a mesh of dipoles and diodes that absorb microwave energy from a transmitter and convert it into electric power. A sensor would also be added to detect when a call is being made so that charging only occurs during use. Potential limitations including device heating and size of rectennas are discussed. Existing inductive charging technologies are also overviewed as an alternative approach. The document concludes that wireless microwave charging could
The document describes a joint consortium between IMEC, LETI, and IHP called ePIXfab that aims to provide expertise and services for multi-project wafer runs and packaging integration. IMEC in particular has world-leading research in nano-electronics with clean rooms and facilities for CMOS scaling down to 65nm, MEMS, silicon photonics, and more. The consortium offers MPW runs on their 200mm CMOS process as well as packaging and integration services through the EU-funded ESSenTIAL support action.
Printing Flexible Electronics for Health Care ApplicationsPit Teunissen
This document discusses the development of a smart blister packaging for pharmaceuticals that can monitor when a pill is taken out. The packaging is made using printed flexible electronics on plastic substrates. Key points:
- A partner requested moving from an assembled PCB-based smart blister to a fully integrated, low-cost system printed directly onto foil using roll-to-roll processing.
- Technological challenges included simplifying and reducing the cost of the system design while maintaining functionality, as well as developing printing and assembly methods compatible with high-volume production.
- The developed smart blister uses screen printing to deposit five functional layers onto PET foil, including silver and carbon inks for electrical components and an insulating dielectric
Covis Sdn. Bhd. is a specialist company established in 2008 that provides power quality solutions and mission critical facility design. They work with various large corporations to solve power quality issues. The company utilizes various industry standards to provide full power quality coverage for customers. Covis offers a wide range of customized solutions and works with Emerson Network Power products to provide advanced power filtering technology. They have a team of qualified professionals and have experience working with many large Malaysian corporations.
This document compares the 3G and WiFi technologies for providing broadband wireless internet access. 3G refers to third generation mobile networks designed for integrated voice and data services, while WiFi refers to the 802.11 wireless Ethernet standard for wireless local area networks (LANs). Both technologies have attracted attention as candidates for dominant platforms for broadband wireless access, though they differ in industry origins and design goals. The document discusses similarities between the technologies as wireless access platforms, as well as differences in business models, spectrum policy, and stage of technical development. It concludes that both are likely to succeed, with 3G and WiFi complementing each other in network integration while WiFi also provides potential competition through lower entry costs.
A Land Rover is a vehicle used to land on other planets and requires precise control in space and on the ground. A spaceship transports people to locations like the moon quickly but the journey still takes time. Satellite dishes track the progress of spaceships in space by providing information about their location. The GATR satellite is a prototype satellite between 1.8 and 2.4 meters in size.
This document is a presentation by Paul Steece, Vice President and General Manager of 3M's Electrical Markets Division, about reinventing the division. The key points are:
1. The Electrical Markets Division serves stable, growing end markets like electric utilities, construction, and OEMs with products like tapes, cable accessories, and insulating materials.
2. While the division was highly profitable in the past by decreasing investment, its sales growth was flat and it relied on cost cutting not growth.
3. The presentation aims to outline how the division has shifted its focus from managing for cash to prioritizing growth through increased investment in capital, M&A, and innovation.
TowerLabs: Accelerating Adoption of Green Building Technologies for CondosToronto 2030 District
Jamie James, Founder of TowerLabs @ MaRS showcases some of their research and the technology they are incubating to accelerate the uptake of cleantech in the condo sector.
Electronics 09-00331_A Novel General Purpose Combined DFVF/VCII Based Biomedi...Hoopeer Hoopeer
This document describes a novel biomedical amplifier circuit that combines a Differential Flipped Voltage Follower (DFVF) stage with a Second-Generation Voltage Conveyor (VCII) acting as a transimpedance amplifier. Simulation results using a 0.15 μm CMOS process show the circuit has an input-referred noise of 5.4 μVrms, operates from a ±0.6 V supply, and consumes only 20 μW per channel. The low complexity of the design allows for a very compact layout, enabling the integration of thousands of channels for biomedical sensing applications.
This document summarizes information about types of cables, top cable companies in India, and their financials and new developments. It discusses three main types of cables - twisted pair, coaxial, and optical fiber. It then profiles the top 6 cable companies in India, including Polycab, Sterlite Technologies, Finolex Cables, Havells India, Diamond Power Infrastructure, and KEI Industries. For each company it provides key financial metrics like net profit and growth rates, as well as information on CSR activities, new products, and market footprint.
HOW TO CHOOSE BETWEEN LTE-M AND
NB-IOT FOR GLOBAL DEPLOYMENTS. LTE-M AND NB-IOT TECHNOLOGIES - INCREASED
BATTERY LIFE, ENHANCED COVERAGE AND SIMPLIFIED
HARDWARE
Fiber Optic Cable Production. Optical Fiber Cable Manufacturing Industry
An optical fiber cable is a type of cable that has a number of optical fibers bundled together, which are normally covered in their individual protective plastic covers. Optical cables are used to transfer digital data signals in the form of light up to distances of hundreds of miles with higher throughput rates than those achievable via electrical communication cables. All optical fibers use a core of hair-like transparent silicon covered with less refractive indexed cladding to avoid light leakage to the surroundings. Due to the extreme sensitivity of the optical fiber, it is normally covered with a high-strength, lightweight protective material like Kevlar. Optical fiber cable is widely used in fiber optic communications.
See more
https://goo.gl/u8rUU2
https://goo.gl/xFZttv
Contact us:
Niir Project Consultancy Services
An ISO 9001:2015 Company
106-E, Kamla Nagar, Opp. Spark Mall,
New Delhi-110007, India.
Email: npcs.ei@gmail.com , info@entrepreneurindia.co
Tel: +91-11-23843955, 23845654, 23845886, 8800733955
Mobile: +91-9811043595
Website: www.entrepreneurindia.co , www.niir.org
Tags
Fiber Optical Cables, Fiber Optic Cable Production, Production of Fiber Optic Cable, Manufacture of Fibre Optic Cable, Fiber Optic Cable Manufacturing, How Fiber Optics are made, Fiber-Optic Cable Manufacturing Industry, Manufacturing Process of Fiber Optic Cable, Optical Fiber Cable Manufacture, Manufacturing of Fiber Optic Cables, Optical Fiber Production, Fiber Optic & Cable, Optical Fiber Manufacturing Process Pdf, Optical Fibre Manufacturing Process PPT, Fiber Optical Cables Manufacturing Plant, Fiber Optic Cable Manufacture, Fiber and Optical Cable Production Unit, Fiber Optic Cables Manufacturing Unit, Industrial Fiber Optic Cables Manufacture, Fiber Optic Cables Production Process, Fiber Optics Industry, Fiber-Optic Cable and Method of Manufacture, Industrial Fiber Optic Cables, Fiber Optic Cable Marking Process, Optical Fiber Cable Manufacturing Factory, Fiber Optic Cables, Electrical Cable, Fiber Optic Cables Uses, Project Report on Fiber-Optic Cable Manufacturing Industry, Detailed Project Report on Fiber-Optic Cable Manufacturing, Project Report on Fiber-Optic Cable Manufacturing, Pre-Investment Feasibility Study on Fiber-Optic Cable Manufacturing, Techno-Economic feasibility study on Fiber-Optic Cable Manufacturing, Feasibility report on Fiber Optic Cable Production, Free Project Profile on Fiber Optic Cable Production, Project profile on Fiber Optic Cable Production, Download free project profile on Fiber Optic Cable Production
MercaSID is a manufacturer and distributor in the Dominican Republic that was experiencing issues with its aging network. It deployed a new network solution from Juniper Networks including EX Series switches in the data center and locations, as well as WLA wireless access points and a WLC controller. This provided a highly reliable, unified wired and wireless network that improved network performance, simplified management, and supported the growing business needs of employees and partners.
li-fi: the future of wireless communicationIJMERJOURNAL
ABSTRACT: Nowadays people and their electronic devices access wireless internet. But, clogged airwaves are going to make it increasingly difficult to latch onto a reliable signal. So, Radio waves are just one part of the spectrum that can carry our data. We can use “Data through Illumination”. In this process, the data is sent through an LED source that varies in intensity faster than the human eye could follow. The future can be envisioned where the data for laptops, smart phones and all other smart applications is transmitted through the light in our living room. And security would be a snap—if you can’t see the light, you can’t access the data.
ZTE COMMUNICATIONS No.2 2016 : Optical wireless communicationsSitha Sok
ZTE COMMUNICATIONS No.2 2016
Fresh off the Press! The April issue focuses on optical wireless communications. Harald Hass, "the father of Li-Fi", and his student contributed to this special issue.
This document provides information about BMET energy telecom industry and trade PLC, a cable factory in Ethiopia. It discusses the company's history, including its establishment in 2010 and the start of production in 2013. It also describes the factory's buildings, infrastructure, machinery, production processes for different cable types, and technical specifications. In general, the document outlines the operations and capabilities of BMET as one of the largest cable manufacturers in Ethiopia.
The document discusses 5G mobile technology and its evolution from earlier generations. It provides details on:
1) How 5G will offer unprecedented call volume and data transmission speeds compared to previous technologies.
2) The network architecture of 5G, which will integrate different wireless technologies like PANs, WANs and cellular networks to provide seamless global connectivity using IPv6 addressing.
3) The mix-bandwidth data path design for 5G, which efficiently utilizes the resources of multiple overlapping wireless networks like pico-cells, micro-cells and macro-cells that cover the same area.
WiFi new generation par Guy PUJOLLE - Fevrier 2013Yves-Alain STORY
La radio cognitive, les femtocells, la nouvelle génération de WiFi Passpoint, le WiFi nouvelle génération (IEEE 802.11 ac, ad, af, ah). Recherches en Corée du Sud avec Postech et Samsung sur les capteurs médicaux en nano technologie (sécurité et virtualisation).
Instituion Of Engineers Smart Grid Seminar Jul 16 2009satyambh
The document discusses smart grids and the customer domain within smart grid ecosystems. It covers how smart meters, home area networks, energy devices, electric vehicles, and micro-grids can integrate with smart pricing programs to optimize energy usage and lower costs for utilities and customers. The goal is to shift demand away from peak times and encourage conservation through technology enabling real-time pricing programs and demand response.
This document provides an overview of emerging cellular technologies from 1G to 7G. It discusses the key features and limitations of each generation of technology, including speed increases from 2.4kbps for 1G to several Gbps for 5G. 5G is highlighted as providing high speeds, capacity, and support for multimedia applications. Challenges in implementing newer technologies like 5G include high costs and needing new infrastructure and device hardware. The document concludes that 5G may be the best next wireless system due to its security and ability to meet growing demands for wireless connectivity.
This document is a seminar report submitted by Ganesh Hegde to Visvesvaraya Technological University that discusses wireless systems and challenges in 5G networks. It provides an overview of the evolution of wireless technologies from 1G to 5G networks, describing the key features and capabilities of each generation. The report highlights that 5G networks will require significantly more advanced self-organizing capabilities to handle the immense complexity and scale compared to 3G/4G networks. It proposes a framework for empowering self-organizing networks with big data analytics and machine learning to address the challenges of deploying and managing 5G networks.
This document summarizes a proposal for wirelessly charging mobile phones using microwaves. It begins by introducing microwaves and their common uses including telecommunications and radar technology. It then outlines the proposal to add a rectenna to mobile phones to directly convert transmitted microwave energy into electricity to charge the phone battery. The rectenna would be a mesh of dipoles and diodes that absorb microwave energy from a transmitter and convert it into electric power. A sensor would also be added to detect when a call is being made so that charging only occurs during use. Potential limitations including device heating and size of rectennas are discussed. Existing inductive charging technologies are also overviewed as an alternative approach. The document concludes that wireless microwave charging could
The document describes a joint consortium between IMEC, LETI, and IHP called ePIXfab that aims to provide expertise and services for multi-project wafer runs and packaging integration. IMEC in particular has world-leading research in nano-electronics with clean rooms and facilities for CMOS scaling down to 65nm, MEMS, silicon photonics, and more. The consortium offers MPW runs on their 200mm CMOS process as well as packaging and integration services through the EU-funded ESSenTIAL support action.
Printing Flexible Electronics for Health Care ApplicationsPit Teunissen
This document discusses the development of a smart blister packaging for pharmaceuticals that can monitor when a pill is taken out. The packaging is made using printed flexible electronics on plastic substrates. Key points:
- A partner requested moving from an assembled PCB-based smart blister to a fully integrated, low-cost system printed directly onto foil using roll-to-roll processing.
- Technological challenges included simplifying and reducing the cost of the system design while maintaining functionality, as well as developing printing and assembly methods compatible with high-volume production.
- The developed smart blister uses screen printing to deposit five functional layers onto PET foil, including silver and carbon inks for electrical components and an insulating dielectric
Covis Sdn. Bhd. is a specialist company established in 2008 that provides power quality solutions and mission critical facility design. They work with various large corporations to solve power quality issues. The company utilizes various industry standards to provide full power quality coverage for customers. Covis offers a wide range of customized solutions and works with Emerson Network Power products to provide advanced power filtering technology. They have a team of qualified professionals and have experience working with many large Malaysian corporations.
This document compares the 3G and WiFi technologies for providing broadband wireless internet access. 3G refers to third generation mobile networks designed for integrated voice and data services, while WiFi refers to the 802.11 wireless Ethernet standard for wireless local area networks (LANs). Both technologies have attracted attention as candidates for dominant platforms for broadband wireless access, though they differ in industry origins and design goals. The document discusses similarities between the technologies as wireless access platforms, as well as differences in business models, spectrum policy, and stage of technical development. It concludes that both are likely to succeed, with 3G and WiFi complementing each other in network integration while WiFi also provides potential competition through lower entry costs.
A Land Rover is a vehicle used to land on other planets and requires precise control in space and on the ground. A spaceship transports people to locations like the moon quickly but the journey still takes time. Satellite dishes track the progress of spaceships in space by providing information about their location. The GATR satellite is a prototype satellite between 1.8 and 2.4 meters in size.
The document discusses developing a strong Vientiane Action Plan at the First Meeting of States Parties in November 2010 to implement the Convention on Cluster Munitions. It emphasizes the need to address the needs of cluster munition survivors and ensure their inclusion in decision making. It also stresses the importance of international cooperation and ambitious, clear, and measurable victim assistance plans.
The document provides information about Handicap International's response to the 2010 Haiti earthquake and subsequent challenges. It summarizes their large-scale humanitarian aid efforts, including providing medical rehabilitation, meeting basic needs, and logistics support. Over 600 staff supported these programs. It also discusses advocacy efforts to ensure the most vulnerable groups, including people with disabilities, are protected and included in the relief work. Haiti faced additional disasters in 2010, including hurricanes, cholera outbreaks, and ongoing displacement of earthquake victims living in temporary camps.
Galaxies can contain trillions of stars. While the Milky Way is around 100,000 light years in length, some other galaxies are over 6 million light years across. Estimates put the number of stars in the Milky Way between 200 million and 400 million. Galaxies range greatly in size and brightness, and the universe contains over 10,000 galaxies, with the most distant galaxy observed over 13 billion light years away.
This document is a report from Handicap International on a survey of 1,645 landmine and explosive remnants of war survivors in 25 countries. It acknowledges the survivors who shared their experiences and volunteers who conducted interviews. The report contains individual country chapters summarizing the situation for survivors in each location, and sections on external support for victim assistance, global progress on assistance, conclusions and suggestions for improved assistance going forward.
This document provides a preliminary report on Handicap International's research into the global human impact of cluster munitions. It examines cluster munition use and casualties in several regions including Southeast Asia, Africa, Southeast Europe, the Commonwealth of Independent States, and the Greater Middle East and North Africa region. The report finds that cluster munitions cause disproportionate long-term civilian harm, with casualties predominantly young males engaged in agricultural work. It concludes that immediate and comprehensive clearance efforts are needed to reduce future civilian casualties from unexploded submunitions.
The document summarizes major developments in Western Europe during the Middle Ages, including:
1) The Catholic Church restructured and built grand cathedrals while also facing issues like priest marriage and corruption. New religious orders like the Franciscans and Dominicans emerged to emphasize education and poverty.
2) The Crusades were launched by the Pope to retake the Holy Land but ultimately failed after the 4th Crusade. Trade expanded between Europe and Asia.
3) Population growth led to developments like new farming techniques, guilds, universities, and the rise of towns and a merchant class. The Hundred Years' War between England and France helped spark nationalism.
The JTOPTICS® 100G QSFP28 AOC presents a cutting-edge solution, featuring a 4x25Gb/s active optical cable meticulously designed for applications demanding high performance, such as 100G Ethernet (100GbE) and InfiniBand FDR/EDR. Comprising QSFP28 transceivers at both ends and OM3(OM4) multi-mode fiber cables, this AOC offers four channels in each direction, providing a total bandwidth of 100Gb/s. Each channel operates at speeds up to 25Gb/s. Fully compliant with QSFP28 MSA and IEEE 802.3bm 100GBASE-SR4, as well as CAUI-4 specifications, the 100G QSFP28 AOC stands as a reliable alternative solution for 100G QSFP28 DAC (passive direct attach copper cables) and QSFP28 transceivers in high-performance computing (HPC), data center, and storage network applications.
Key Features:
4 channels full-duplex transceiver modules for efficient data transmission.
Supports a total data rate of 100Gbps, ensuring high-speed performance.
4 channels 850nm VCSEL array and 4 channels PIN photo detector array for reliable connectivity.
MMF cable with customizable length up to 70m (OM3) for versatile installations.
4x 25G NRZ electrical interface and 4x 25G NRZ optical interface for comprehensive connectivity.
Low power consumption of <3.5W, promoting energy efficiency.
Data rate up to 25.78125Gbps per channel for efficient data transmission.
Compliant with QSFP28 MSA, 100GBASE-SR4 Ethernet, and InfiniBand EDR for industry compatibility.
Operating case temperature range from 0 to 70°C, suitable for various environments.
Operates on a 3.3V power supply voltage for simplified power management.
Built-in digital diagnostic functionality for comprehensive monitoring.
RoHS compliant (lead-free), aligning with environmental standards.
The document discusses a recent attack by Naxalites in Bihar where they blew up a jeep killing 7 people including 6 police officers. While no group has claimed responsibility, it is believed to be the work of CPI(Maoist) which is the largest Naxalite group active in the area. The aim of the Naxalites is to overthrow the government through armed struggle as they do not believe in the democratic system. They have significant presence across several states in India. The growing Naxalite insurgency poses a major internal security threat to India. Tribal displacement due to development projects has contributed to the Naxalites gaining support in tribal areas.
Designing Reliable Medical Devices by Solving Common Interconnect Challenges ...NICOMATIC
What are the most common interconnect challenges that medical device manufacturers come across during the design process, including:
Connectivity: Medical devices that are not designed to securely connect to hospital networks, the Internet of Things (IoT), or mobile patient monitoring equipment now have limited product lifecycles, as they are quickly being replaced by smarter, more connected technologies.
Flexibility: As devices become smaller and more portable, flexible component designs are critical to this achievement.
Environmental Resistance: Portable medical devices are exploding in popularity, however they are far more susceptible to mechanical damage from ingress, shock, and vibration than stationary equipment.
This document discusses the challenges facing the Internet of Things (IoT) industry. It notes that IoT includes not just consumer devices but also mission critical applications in industries like healthcare, manufacturing, and energy. Key challenges include ensuring device reliability, security, low power operation, and testing for wireless connectivity, regulatory compliance, and interference. The document provides examples of how Keysight technologies help companies address these challenges and accelerate IoT development and deployment.
Optical fiber is widely used for commercial communication due to its high bandwidth capability and ability to transmit data over long distances with minimal signal loss. It has applications in telecommunications, manufacturing, oil and gas, power utilities, and transportation. Key advantages include high speeds, reliability, security, and electrical isolation. While installation costs are high, optical fiber is crucial infrastructure for industries' network and data needs.
SFP+ Active Optical Cable (AOC) is purposefully designed to facilitate single-channel, high-speed data link applications. This cable boasts a full-duplex construction, capable of transmitting data at rates up to 10Gb/s and supporting signal transmission over distances ranging from 1m to 100m. It adheres rigorously to industry-standard SFF-8431 Pluggable (SFP+) interface requirements and performance benchmarks. The 10G SFP+ Active Optical Cables (AOCs) are direct-attach fiber assemblies equipped with SFP+ connectors, offering a cost-effective solution for connecting within racks and across adjacent racks, particularly suitable for short distances. The cable length extends up to 300 meters using OM3 MMF.
Key Features:
1. SFF-8431 compliant, ensuring adherence to industry standards.
2. SFP+ form-factor connectors for a standardized and versatile interface.
3. 1x 10G NRZ electrical interface and 1x 10G NRZ optical interface for efficient data transfer.
4. Hot-pluggable electrical interface for convenient installation and removal.
5. Transmission data rate of up to 10.3Gbps, ensuring high-speed performance.
6. Utilizes an 850nm VCSEL laser and PIN photodetector for reliable signal transmission.
7. Low power consumption, measuring below 1W per end for energy efficiency.
8. Compliant with InfiniBand QDR for comprehensive compatibility.
9. Cable length extends up to 300m using OM3 MMF for versatile connectivity options.
10. All-metal housing for superior EMI performance, ensuring signal integrity.
11. Operating case temperature range from 0°C to +70°C, suitable for various environments.
12. Operates on a 3.3V power supply voltage for simplified power management.
13. RoHS-6 compliant (lead-free), adhering to environmental standards.
The role of Industrial media converters.pptxVERSITRONINC
industrial media converters, Ethernet-to-fiber conversion, rugged enclosures, IP-rated protection, reliable data transfer, 10/100TX-FX Single Fiber, PoE+ Gigabit, wide temperature range, IEEE standards, extended transmission distances, diverse industries, customer-centric approach, cost-effective solutions, seamless connectivity, challenging environments
VERSITRON's industrial media converters enable seamless Ethernet-to-fiber conversion in extreme environments. With robust enclosures and IP-rated protection, these converters ensure reliable data transfer in harsh conditions. Offering various configurations, such as the 10/100TX-FX Single Fiber and PoE+ Gigabit models, VERSITRON prioritizes customer needs with a customer-oriented approach. The devices operate in a wide temperature range, comply with IEEE standards, and find applications in diverse industries, providing cost-effective solutions for extended data transmission distances.
JTOPTICS 100G QSFP28 to 4x 25G SFP28 PCC (Passive Copper Cable), also recognized as Direct Attach Copper (DAC) or Twinax cable, delivers reliable connections between 100G Ethernet and 25G Ethernet systems. Each cable comprises four lanes, each operating at data rates of up to 25Gb/s. These passive copper cables necessitate no additional power, ensuring quality connectivity. The cables align with SFF-8402 SFP28 and SFF-8665 QSFP28 standard specifications, facilitating connectivity between system units with a QSFP28 port on one side and up to four distinct SFP28 ports on the other.
Key Features:
Hot-pluggable QSFP28 DAC cable assemblies for seamless integration.
4-channel full-duplex passive copper cable ensures reliable data transmission.
SFF-8665/SFF-8402 compliant QSFP28/SFP28 connectors adhere to industry standards.
Compliant with QSFP28 MSA and IEEE 802.3 for compatibility.
4x 25G NRZ electrical interface supports high-speed data rates.
SFF-8636 compliant I2C management interface for additional functionality.
IEEE 802.3bj 100GBASE-CR4 and IEEE 802.3by 25GBASE-CR compliant.
Data rate up to 100Gbps (4x 25Gbps) ensures high-speed connectivity.
Excellent signal integrity, low insertion loss, and low crosstalk for reliable performance.
Low power dissipation for energy efficiency.
Operating case temperature range of 0°C to +70°C for versatile environmental conditions.
Single 3.3V supply voltage simplifies power management.
RoHS compliant, ensuring adherence to environmental standards.
This document provides a linecard listing manufacturers and distributors represented by Meridian Technical Sales Inc. It lists manufacturers such as ams, AVX, Elo Touch Solutions, Ericsson Power, Honeywell Sensing and Control, Honeywell Magnetic Sensors, Microchip, and distributors that carry their products including Arrow, Avnet, Digi-Key, Mouser, and Newark/Element14.
The JTOPTICS 40G QSFP+ DAC (Direct Attach Cable) assembly provides a cost-effective solution for establishing a 40G link connectivity between devices utilizing QSFP ports. Specifically designed for high-speed interconnecting networking applications, such as data centers, high-performance computing (HPC), and storage networking, this cable is fully compliant with the QSFP+ Multi-Source Agreement (MSA) standard SFF-8436 and IEEE 802.3ba 40GBASE-CR4. The 40G QSFP+ DAC cable serves as a cost-effective, low-power consumption alternative to QSFP+ optical transceivers and QSFP+ active optical fiber (QSFP+ AOC). It is commonly deployed for short-distance connections, facilitating a 40G link between QSFP+ ports within racks and adjacent racks.
Key Features:
Hot-pluggable QSFP+ DAC cable assemblies for easy integration.
4-channel full-duplex passive copper cable ensures reliable data transmission.
SFF-8436 compliant QSFP+ connectors meet industry standards.
4x 10G NRZ electrical interface for efficient communication.
IEEE 802.3ba 40GBASE-CR4 compliant, adhering to networking standards.
Compliant with QSFP+ MSA and IEEE 802.3 for compatibility.
Data rate up to 40Gbps (4x 10Gbps) ensures high-speed connectivity.
Low power consumption of 0.02W (typ.) for energy efficiency.
Excellent signal integrity and low insertion loss for reliable performance.
Operating case temperature range of 0°C to +70°C for versatile environmental conditions.
Single 3.3V supply voltage simplifies power management.
RoHS compliant, ensuring adherence to environmental standards.
200G QSFP56 to 2xQSFP28 AOC Active optical Cable Data Sheet By JTOPTICSJayani Technologies Ltd
The JTOPTICS® 200G QSFP28-DD Breakout AOC is an innovative QSFP56 VCSEL-based (Vertical Cavity Surface-Emitting Laser) active optical splitter cable (AOC) delivering cost-effective connectivity for 200Gb/s to 2 x 100Gb/s applications in Ethernet and InfiniBand EDR environments. Compliant with both QSFP28 and QSFP-DD MSA specifications, this cable facilitates seamless integration between system units. The design incorporates a 200Gb/s QSFP-DD connector on one end and two separate 100Gb/s QSFP28 connectors on the other, making it ideal for establishing links between a switch and two servers.
Key Features:
Hot Pluggable QSFP-DD and QSFP28 MSA Compliant for versatile and standardized connectivity.
4-channel 850nm VCSEL array and PIN photo-detector array ensuring reliable data transmission.
Supports 200G to 2x 100G Ethernet Interoperability for versatile application scenarios.
8x 25G NRZ electrical interface enabling high-speed data transfer.
8x 25G NRZ optical interface facilitating efficient communication.
Data rate up to 25.78125Gbps per channel ensuring fast and reliable performance.
Compliant with QSFP-DD MSA, CMIS, and IEEE 802.3 standards for industry compatibility.
Low power dissipation for energy-efficient operations.
Max. Power Consumption of 4W for optimized power management.
Commercial or industrial case operating temperature range ensuring suitability for various environments.
MMF cable with customizable length up to 70M (OM3) & 100m (OM4) for flexible installations.
Single 3.3V power supply simplifying power management.
Built-in digital diagnostic functionality for advanced monitoring.
RoHS compliant (lead-free) aligning with environmental standards.
40G QSFP+ AOC (Active Optical Cables) breakout cables are specifically engineered for seamless interconnection between network equipment featuring QSFP+ ports and 10G SFP+ ports. Also referred to as QSFP+ splitter AOC or QSFP+ Fan-out AOC cables, these breakout cables offer four parallel bi-directional channels operating at 10.3125 Gbps each. The design involves one end equipped with a 40G QSFP+ module, and the other ends incorporate 4 10G SFP+ modules, all interconnected with fixed-length OM3/OM4 fiber cables. The QSFP+ AOC breakout cables excel in flexibility, weight, and manageability compared to QSFP+ copper breakout cables, making them ideal for installation in confined spaces and over extended distances.
Key Features:
1. Hot-pluggable QSFP+/SFP+ form factor full-duplex AOC assembly for convenient installation.
2. Utilizes a 4-channel 850nm VCSEL and PIN photo-detector for efficient data transfer.
3. Data rate up to 10.3125Gbps per channel, ensuring high-speed performance.
4. Compliant with QSFP+ MSA (SFF-8436) and SFP+ MSA (SFF-8431) for standardized usage.
5. Compliant with SFF-8432 and SFF-8472 for compatibility and performance benchmarks.
6. Compliant with IEEE 802.3ba 40GBASE-SR4 and IEEE 802.3ae 10GBASE-SR for versatile applications.
7. Compliant with InfiniBand SDR/DDR/QDR for comprehensive compatibility.
8. MMF cable with customizable length up to 100m (OM3) for versatile connectivity options.
9. 1.5W maximum power dissipation per 40G QSFP+ SR4 module for energy efficiency.
10. Operating case temperature range from 0 to 70°C, suitable for various environments.
11. Operates on a 3.3V power supply voltage for simplified power management.
12. Built-in digital diagnostic functionality for comprehensive monitoring.
13. RoHS compliant (lead-free), adhering to environmental standards.
The JTOPTICS® 800G QSFP-DD AOC (Active Optical Cable) is an 800 Gb/s parallel active optical cable designed to transmit parallel 8×100 Gb/s PAM4 signals over multi-mode fiber (MMF) cables, covering distances of up to 30m. This AOC is fully compliant with QSFP-DD MSA standards, supporting eight electrical interface lanes, each operating at a data rate of 106.25G/s, resulting in an impressive aggregate bandwidth of up to 850Gb/s. Specifically engineered for multi-mode fiber systems, it utilizes a nominal wavelength of 850nm.
Key Features:
Hot-pluggable QSFP-DD AOC assemblies for seamless integration.
8x 100G PAM4 electrical interface ensuring high-speed data transmission.
8x 100G PAM4 optical interface for reliable signal integrity.
Data rate up to 106.25Gbps per channel, providing exceptional performance.
Compliance with QSFP-DD MSA, CMIS, and IEEE 802.3 standards for interoperability.
Low power dissipation for efficient energy management.
Commercial Case Temperature range of 0°C to 70°C for versatile environmental suitability.
Single 3.3V power supply simplifying power management.
Built-in digital diagnostic functionality for real-time operating parameter access.
RoHS compliant (lead-free) adhering to environmental standards.
Max. Power Consumption of 12W for optimized power efficiency.
I2C interface with Integrated Digital Diagnostic Monitoring for advanced monitoring capabilities.
High-Speed Electrical Compliance to IEEE 802.3ck ensuring reliable connectivity.
Internet of Things - structured approach to the physical plant network - Rock...Carotek
The convergence of new technologies that securely connect plant information with enterprise systems can bring greater productivity, better utilization of assets, and improved decision-making to industrial companies. By bridging the gap between factory-level systems and enterprise systems, Rockwell Automation and Cisco can show how the connected enterprise offers ease of use, lower total cost of ownership, and improved operations.
The JTOPTICS 25G SFP28 DAC (Direct Attach Cable) features twinax copper cables, offering a cost-effective and environmentally friendly alternative to 25G optical SFP28 connections. Equipped with two fixed 25G SFP28 module heads, this cable provides a reliable solution for short-distance connections within racks and between adjacent racks in 25G data transmission scenarios. Known for its high reliability and low power consumption, it is extensively employed in data centers and various 25G Ethernet applications. The 25G SFP28 DAC cables comply with the IEEE P802.3by Ethernet standard and SFF-8402 SFP28 standard.
Key Features:
Hot-pluggable SFP28 DAC cable assembly for convenient integration.
Data rate up to 25.78125Gbps ensures high-speed data transmission.
1x 25G NRZ electrical interface for compatibility.
Compatible with SFP28 MSA, offering flexibility in usage.
Conforms to SFF-8402 and SFF-8432 standards ensuring reliable performance.
Power consumption less than 0.1W for energy-efficient operations.
Single 3.3V power supply for streamlined power management.
Low power dissipation contributes to overall efficiency.
Operating case temperature range of 0°C to +70°C for versatile environmental conditions.
RoHS-6 compliant (lead-free) and compliant with SFP28 MSA, IEEE 802.3, and InfiniBand EDR standards.
JTOPTICS 400G QSFP-DD to 4x 100G QSFP28 PCC (Passive Copper Cable), also known as Direct Attach Copper (DAC) or Twinax cable, establishes robust connections between 400G Ethernet and 100G Ethernet systems. Comprising four lanes, each operating at data rates of up to 100Gb/s (PAM4), this integrated cable solution ensures reliable transport for aggregate data rates of up to 400Gb/s. Implementing JTOPTICS 400Gb/s passive copper cables optimizes systems, significantly reducing power consumption and EMI emission, eliminating the need for Enterprise Data Center (EDC) hosts.
Key Features:
Hot-pluggable QSFP-DD form factor ensures easy installation.
Data rate up to 425Gbps supports high-speed applications.
8x 53Gb/s PAM4 modulation for efficient signal transmission.
QSFP-DD MSA, CMIS, and IEEE 802.3 compliant for standardized interoperability.
Operating case temperature of 0-70℃ accommodates various environments.
8x50G PAM4 Retimed 400GAUI-8 Electrical Interface supports specific electrical configurations.
Copper link length up to 3m offers flexibility in network design.
Supports 400G to 4x100G Ethernet Interoperability for versatile applications.
Single 3.3V supply voltage simplifies power management.
Bit Error Rate (BER) better than 1E-15 ensures data integrity.
RoHS compliant adheres to environmental standards.
Data rate up to 53.125Gbps per channel supports high-speed connectivity.
Low power dissipation contributes to energy efficiency.
Excellent signal integrity and low insertion loss ensure reliable performance.
Minimum Bend Radius 33.5mm allows for flexible cable routing.
9.000 Mitarbeiter. 49 Standorte. 4 Kontinente.
Als globales Technologie-Unternehmen ist Laird Anbieter
von innovativen Systemen, Komponenten und Lösungen.
Wir schützen elektronische Anlagen vor elektromagnetischen
Störungen und Hitze und stellen Technik für Konnektivität
bereit, z.B. im Auto.
5G mobile networks will address the massive growth in mobile data traffic and connected devices. 5G technologies include using higher frequency spectrum like mmWave bands, ultra-dense small cell networks, and new radio access technologies. This will allow 5G to provide significantly higher data rates, support a vast number of low-latency connections for devices and machines, and meet the wide-ranging service requirements. Key 5G technologies that could enable this include massive MIMO, device-to-device communication, and utilizing both licensed and unlicensed spectrum bands through technologies like LTE-U. The evolution of 5G is expected to occur in phases, building on LTE and introducing new features over spectrum bands up to 30 GHz and potentially above
1. From Invention to Innovation:
Practical Examples of Academic
Discovery Leading to Commercial
Viability
Mark W. Ellsworth
Senior Director
January 4, 2011
2. A brief history of Tyco Electronics
Radiation chemistry
applied to polymers Launch Day
Raychem July 11th
1957 1999 2007
1932 •Tyco International 2007
AMP acquires AMP, 1998 Tyco International announces
Wire crimping •Tyco International break-up plan
acquires Raychem, 1999 • Tyco International
technology
• Tyco Electronics
• Tyco Healthcare (Covidien)
A Start-Up Company with $12B in Worldwide Sales, 75 years of innovation,
and 90,000 employees in 125 countries
3. TE At A Glance:
A World Leader Enabling Smart Connectivity
Serving Large Attractive Markets
Consumer Industrial and Infrastructure
Transportation Consumer Communications Energy Industrial Aerospace Healthcare
Products Equipment & Defense
A Broad Range of Connectivity Products and Technology
Connectors Fiber Optics Touch Systems Circuit Sealing & Wireless Precision
Protection Protection Wiring
Extensive Global Resources
100
7,000 Engineers 5,000 Salespeople 125 Countries Manufacturing Sites
Close to our Customers Advising our Customers Served Serving Every Region
No competitor serves the range of industries breadth our breadth of products and resources
4. Product Capabilities for
Automotive Market
Alternative
High Speed Data
Power Systems
Networking
Sensor
Technology
Mechatronics
Inductive
Systems Relays &
Switching
Cable Assembly Modules
Terminals &
Systems
Connectors
5. Product Capabilities for
Computer & Consumer Electronics Markets
Antenna Products Sockets Coax
Active Optical Cables Fine Pitch SFP+ & QSFP
B-to-B Connectors I/O Products
6. Product Capabilities for
Energy Networks
Surge Arresters
Insulation Enhancement
Cable Accessories Insulators
New Products for Solar and Wind Energy
Power Measurement
& Control
Switching and
Protection
8. Product Capabilities for
Medical Markets
Medical Connectors Cable Assemblies Cable Assemblies
(Surgical) (Ultrasound)
Micro-miniature Coax Precision Stamping Medical Grade Tubing
9. Product Capabilities for
Touch Systems
Medical Retail Restaurant Entertainment
Office
Automation Government
Industrial
Military
Self-Service/
Informational Kiosks
10. We have a Treasure of Technology . . .
Undersea Telecommunications Energy Networks
Performance leader in fiber Large scale connectors sealed for 30
optic communications. years. High energy circuit protection.
Telecom Networks Communications
Copper and fiber connectors. High density copper
Sealed and protected for 30 years. and fiber interconnects.
$500M+ of annual
R&D investment
Transportation 14,000+ patents Touch Systems
Copper and fiber connectors. Advanced materials to
issued or pending create touch screens.
Rugged housings, sensors.
Products introduced in
last 3 years accounted
Circuit Protection
Healthcare for 36% of sales
Ultra fine cable manufacturing Advanced materials technology
and connection. Highly regulated. to create protection for commercial
& consumer devices.
Computer & Industrial Aerospace & Defense
High density copper and fiber High density metals and fiber connectors.
interconnects, high performance. High performance wire.
11. Key Market Trends
• Electronic feature growth in all industries
• Miniaturization and weight reduction
• Higher data-speed requirements
• Broadband proliferation
• Growth of wireless technologies
• Upgrade of global energy networks
• Environmental and Social responsibility
• Increasing demand for all industries in emerging markets
13. Invention and Innovation
• Invention: n an original creation
• Innovation: n an introduction of something new
14. Invention and Innovation
• Invention: n an original creation
• Innovation: n an introduction of something new
15. Invention and Innovation
• Invention: n an original creation
• Innovation: n an introduction of something new
16. Invention and Innovation
Invention: the light bulb Innovation: power distribution
• Vacuum sealed glass bulb • Power generators
• Carbon filament • Cables
• Junction boxes
17. Finding the Right Inventions
• Important criteria for inventions to be potentially useful:
– Published and/or patented
– Tested, demonstrated, and proven in several laboratories
– Potential to be applied to a number of different applications
– Commercialization interests
18. Finding the Right Inventions
• Important criteria for inventions to be useful:
– Published and/or patented
– Tested, demonstrated, and proven in several laboratories
– Potential to be applied to a number of different application
– Commercialization interests
• Other criteria that help…
– Nobel Prize winning technology
– UC Davis alums working on the innovation
19. Open Innovation
Internal
Technology Technology New
Inputs
Spin-offs Markets
Current
Markets
Technology New
External Licensing Revenues
Technology
Inputs
20. Academic – Industrial Collaborations at TE
• Connecting technologies and capabilities:
– Self-assembled block copolymers and electron beam crosslinking
• New technologies applied to existing capabilities:
– Olefin metathesis crosslinking of polymers
• Catching an early commercialization wave:
– CNT’s and graphene for light weight composite materials
• Establishing a new capability:
– Core-shell nanoparticles via atomic layer deposition
21. Radiation crosslinking of self-assembled
block copolymers
Collaboration with Prof. Nitash Balsara, University of California,
Berkeley Department of Chemical Engineering
January 4, 2011
22. Radiation crosslinking of polymers
Invention Innovation
• Discovery of polonium and • Large scale particle accelerators
radium • Crosslinking of polyethylene by GE
• Isolation, purification, researchers
concentration • Engineered commercial
• Chemical effects of radiation manufacturing by Raychem Corp.
23. How it works
How an electron beam works
Polyethylene is composed of
hydrogen atoms (red) and
HIGH VOLTAGE carbon atoms (black)
TERMINAL
ELECTRON
GUN
When the polymer chains are
BEAM TUBE exposed to the electron beam,
hydrogen atoms are dislodged,
forming reactive sites on the
polymer chains
SCAN MAGNETS
The reactive sites on
neighboring chains bond,
SCAN creating a crosslinked
WINDOW
polymer
(Ti METAL)
24. The statistics of self-assembly
A B A
• Self assembled structures calculations
and experiments:
– Ratio of A to B segments
– Length of A and B segments and
length distribution
– Molecular motion within the segments
– Strength of interaction amongst the
segments
• Experimental variables:
– Thermal treatment and history Matsen and Bates, Macromolecules, 1996, 7641-7644
– Mechanical forces
25. Collaborative research: block-copolymer
nanocomposites
Highly ordered block copolymer nanostructures are prepared by
engineers at University of California, Berkeley and the structures
are “locked” into place using Tyco Electronics’ electron beam
crosslinking capabilities.
26. Radiation crosslinking in the ordered state
Peroxide crosslinking Radiation crosslinking
After radiation crosslinking, ordered structures are
maintained above the melting point of the copolymer
33. Property Enhancement from Crosslinking
• Shape Memory Nylon 6 after lead free solder reflow (260 ºC)
– Heat Shrink Capability WITHOUT Cross-linking
• Temperature Stability
– Improved higher and lower use temps
• Chemical Resistance
Nylon 6 after lead free soldering (260 ºC)
WITH Cross-linking
34. Crosslinking is useful……..
But crosslinking renders the polymer intractable
How can we recycle these polymers?
…..by a decrosslinking reaction
36. Concept: Catalytic Crosslinking and
Decrosslinking
Catalyst Catalyst
CH2CH2 (g) – CH2CH2 (g)
Goal: Develop a catalytically Applicable to multiple polymer types
crosslinkable and decrosslinkable • Poly(ethylenes) •Fluoropolymers
system applicable to current crosslinked • Poly(esters)
materials and other materials that are •Acrylics
– Hytrel™
crosslink adverse • Rubbers
The alkene (C=C) is the key! – EPDM
38. Variable 1: Alkyl Chain Length
O O O O
n
C Monomer Polymer X-Link De-X-Link
3 No / Red → Brown N/A
4 (Gel) No / Red → Blue → Brown N/A
5
6
11
39. Variable 2: % of Olefin Content
x y
O O O O
9
x y Mn (g/mol) Ru Crosslink/gel Decrosslink
1% olefin 3 310 31,719 Yes Yes
10% olefin 38 338 42,791 Yes Yes
40. Variable 3: Polymer Backbone
Olefin Olefin Crosslin
Polymer Crosslinked Decrosslinked Polymer Decrosslinked
content content ked
5
10 % No N/A
O O 5%
1 Yes (67%) Yes
(n = 9)
n 6
10 % No N/A
O O 10 % 7
2 Yes (74%) Yes (71%)
(n = 9) 55 % Yes N/A
n
O O
20 %
3 Yes (76%) Yes
(n = 9)
n
x y
4 O O O O 50 % Yes (100%) Yes (54%)
9
41. Melt Processed Olefin modified PE-co-PAA
Catalytic Crosslinking and Electron Beaming
• Two-roll-mill
Beamed Additive (by
Sample Polymer Catalyst M-100 (psi)
(MRads) wt)
1 Modified PE 5 MRads 1% TAIC None 18
2 Modified PE 10 MRads 1% TAIC None 72
3 Modified PE None None 0.3 mol % 254
4 Modified PE None 1% TAIC 0.3 mol% 309
• Catalytic Crosslinking yields 3 x the strength of a 10 MRad beam dose
• Cat Crosslinking & TAIC yields 4 x the strength of a 10 MRad beam
dose
TAIC
42. Decrosslinking Reaction Conditions
Decrosslinking Reaction of PE using
Grubbs G1 Ru Catalysis
Crosslinked Decrosslinked
29% 71% C=C Modified PE
Decrosslinking Reaction of PE using
Ozonolysis Crosslinked Material
Crosslinked Decrosslinked
HC=O Modified PE
35% 65%
43. Designed for Recycling
Typical plastics recycling Materials designed for recycling
Properties degrade when Chemically and structurally
material is recycled created to return to the original
form upon recycling
48. Light weight conductors
• Copper • Carbon Nanotubes
– Resistivity = 17 x 10-6 ohm-cm – Resistivity = 50 x 10-6 ohm-cm
– Density = 8.9 g/cc – Density = 1.4 g/cc
CNT conductor cable could be 1/4 of the weight of the copper conductor cable
49. Light weight conductors
• Copper • Carbon Nanotubes
– Resistivity = 17 x 10-6 ohm-cm – Resistivity = 50 x 10-6 ohm-cm
– Density = 8.9 g/cc – Density = 1.4 g/cc
CNT conductor cable could be 1/4 of the weight of the copper conductor cable
50. Light weight conductors
• Copper • Carbon Nanotubes
– Resistivity = 17 x 10-6 ohm-cm – Resistivity = 50 x 10-6 ohm-cm
– Density = 8.9 g/cc – Density = 1.4 g/cc
CNT conductor cable could be 1/4 of the weight of the copper conductor cable
• Lifetime operating cost savings as
a function of weight
– Satellite = $10,000/kg
– Airplane = $1,000/kg
– Automobile = $100/kg
52. Graphene Preparation in Large Quantities
O OH
OH O
O
O
OH
HO
OH
OH OH O
Graphite Graphite Oxide (GO) Exfoliated Graphite Oxide
GO/water
tion dispersion
on ica
ras
NaNO3 + H2SO4 Ult
+ KMnO4 Graphene/
Chemical reduction
water/PSS
Th e dispersion
r mal
e xfol
i atio
Graphite Flakes n
“Dried” Graphite oxide Graphene
powder
53. Graphene Aerogels
Synthesis of Exfoliation of
Graphene Oxide Graphene Oxide
from Graphite in Water
Graphitic Oxide
GO Dispersion
57. Graphene Aerogel as Electrode Material for
Supercapacitor
4.0 1
Mass of the electrode: 1 mg
3.0
0.8
Potential (V vs. Ag/AgCl)
2.0
0.6
Current (mA)
1.0
0.4
0.0 1st
0.2
-1.0
-2.0 0
-3.0 -0.2
1 M H2SO4, 20 mV/s 1 mA
-4.0 -0.4
-0.2 0.0 0.2 0.4 0.6 0.8 0 400 800 1200 1600 2000
Potential (V vs. Ag/AgCl) Time (s)
• Specific Capacitance: 70- 150 F/g.
• Affecting factors: PVA, thermal treatment temperature,
pore size, electrolyte pore accessibility, etc.
58. CNT and Graphene research
• Light weight conductors
• Structural composites
• Field Effect Transistors
• Sensors
• Transparent Electrodes
• Thermal Substrates
• Environmental Health and Safety Issues
61. Atomic Layer Deposition (ALD)
conformal metal
oxide coating
reactant
(water)
Step 2:
reaction
byproducts
• ALD is a variation of CVD
• Literature reports dating back to
mid 1960’s
• Current commercial uses in IC and precursor
other wafer processing Step 1:
substrate
deposition
62. Multiple Cycles of ALD
• Key aspects of ALD conformal metal
oxide coating
– Two step process
– Precursor reacts with the
substrate surface reactant
– Precursor does not react (water)
Step 2:
with itself during the
reaction
deposition step
– Reactions are self-limiting byproducts
– Multiple layers achieved by
repeated cycles
• Can this be applied to precursor
particles? Step 1:
substrate
deposition
63. ALD on Particles
• First demonstrated at University
of Colorado, Boulder (George,
Weimer, Ferguson)
ALDN coating
• Conventional fluidized bed reactor (new process)
coupled to ALD precursor delivery
system
• Allows for coating a wide variety of
particles CVD coating
– Anything that can be fluidized (incumbent process)
– Coats porous and nonporous
particles
Reactants
66. Commercialization of Particle ALD
Technology
News Release
For Immediate Release – Wednesday, Feb 10, 2010
ALD NanoSolutions, Inc. and Tyco
Electronics Announce Collaboration Agreement
ALD NanoSolutions’ Particle ALD™ coating platform to
be used to develop advanced electronic materials and
applications.
67. Laser marking pigment and fading:
nanoparticle titanium dioxide
UV laser
TiO2 TiO
Heat aging
TiO2
69. Solution reaction
- -
-
NH4OH -
Create surface charges on particles by TiO2 TiO2
-
removing H from surface OH groups H2O - -
- -
OCH3
Surface charges repel particles and initiate PhSi(OCH3)3
Ti O Si + CH3OH
hydrolysis and condensation reactions of H 2O
PhTMOS on TiO2 OCH3
OH
Catalyst continues the cycle of hydrolysis and NH4OH
Ti O Si + CH3OH
condensation of PhTMOS with those grafted H 2O
O -
to the TiO2 surface
O-
PhSi(OCH3)3
Ti O Si + CH3OH
An insoluble network structure of PPSQ H2O
forms around the particle O
H3CO Si OCH3
71. Laser marking and aging results
90
80
mark contrast (%)
70
60
standard
50
pigment
40
ELMS pigment Original Mark
30
20
10
0
initial aged
Mark Aged 70 hrs. @ 260°
C
72. Applications for ALD on particles
• Pigments
• Filler compatibilization
• Particle encapsulation
• Varistors
73. Academic – Industrial Collaborations at TE
• Connecting technologies and capabilities:
– Self-assembled block copolymers and electron beam crosslinking
• New technologies applied to existing capabilities:
– Olefin metathesis crosslinking of polymers
• Catching an early commercialization wave:
– CNT’s and graphene for light weight composite materials
• Establishing a new capability:
– Core-shell nanoparticles via atomic layer deposition
74. Three Things…
• Innovation is the conversion of an invention into something practical
• Inventions and Innovations are everywhere, waiting to be discovered,
so keep asking “what can I do with this?”
• Your innovations may not finish where you thought they would, but
you can always go back to where you started.
75. Acknowledgements
Prof. Winston Ko • The Polymers, Ceramics, and
Prof. Gang-Yu Liu Technical Services Group at Tyco
Prof. Timothy Patten Electronics
and all the faculty and staff for the
invitation and arrangements – Stefanie Gravano
– Aaron Holm
• Prof. Nitash Balsara (UC Berkeley) – Jian Wang
and the Balsara Group – Len Radzilowski
– Mark Wartenberg
• Karen Buechler, Chris Gump and – Henry Cervantes
Jeff Lints at ALD Nanosolutions – Frances Peralta