The document describes the process and structure of a power MOSFET transistor. It involves growing an N- doped epitaxial layer on an N+ substrate to support high voltages between 1000V-500V. For lower voltages below 100V, a thinner N- layer is used. The structure also includes a P+ body region, N+ source regions, and a polysilicon gate. Key parameters that determine the transistor's current capability and on-resistance include the channel width and length, gate oxide thickness, and doping concentrations. The on-resistance is made of several parasitic resistances and increases with temperature.
28. V DS [V] I D [A] R ON V G Current capability: I D On State: R ON Output Caracteristics PMOS 10 20 30 10 20 30 0 40 0
29. V DS [V] I DS [A] T=25 o C T=125 o C Current - Temperature 5 0 10 15 0 40 80 120 T I D = f ( , ) T V T T
30. The PMOS structure contain inside parasitic Bipolar elements. The current flow vertically The current capability depends from geometric parameters (W C ) and physical ones (X ox , L C , V T ) Ron increasing with temperature