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Ramkrishna U. Pal
Contact: Phone: +91 9900042471
Email: ramkrishnapal@rediffmail.com
https://in.linkedin.com/in/ramkrishna-pal-45a59839
Overview:
16+ yrs. of experience in new product development from understanding of Customer need to
manufacturing launch using NPI design process in a global multi-cultural and multi-location environment.
Expertise in varied field of Sensor development like accelerometer,Gyroscope,6 DOF Inertial
Measurement unit, Pressure, Temperature, etc. mechanically packaged to work in harsh environment.
Active Engagement in new technology trend like IOT and sensor technology.
Profile Summary:
 12+ years of experience at Honeywell in multi-disciplinary role from design, leading projects, working
as functional leader and focus for driving business growth.
 Engineering Manager responsible for delivering NPI projects in terms of cost, schedule and on budget
following first time right design practices like simulation, design analysis, LPDS principle, etc...
 Leading a team of 50+ engineers consisting of various functions like wireless, board layout, sensors,
Electrical design and portables.
 Active engagement in IOT initiative and has developed multiple POC consisting of sensor, cloud
connectivity, and mobile app. implementing design language in mechanical packaging
 The IOT Proof of concept has been showcased at different forums like Barcelona tech Expo
 Close collaboration with external vendors like Analog Devices, Intel, Harman, Murata etc. identifying
partnership opportunity in product development
 Led a team in delivering technically challenging, complex 6 dof Inertial Measurement Unit first time in
S&C, multisensory product consisting of Gyroscope, accelerometer, inclinometer & compass
interfaced to a high speed 32 bit processor and mechanically packaged to work in high vibration,
shock for Transportation application.
 Led design team having varied experience and skill set in a global environment and delivering result
in working with global team mainly in India, USA & China
 End to End product development experience from customer need to product launch including
manufacturing line setup in NJ, China
 Has worked closely with global customer in USA, France, China, and Japan etc.at various stages like
VOC, product launch, end user application support etc…
 Provided technical consultation and product training for the launched product to Marketing,
Application Engineer in US, Europe, China & India
 Has worked in driving India growth for Sensing and Control by understanding customer requirement,
Technical Feasibility, Value Proposition, etc by closely collaborating with the Engineering GDC along
with sales & Marketing Business leaders located at Pune to drive business growth
 Experience in project execution which involves multiple stake holder including global Engineering,
sales, marketing, product management, manufacturing etc..
 Extensively used LPDS and NPI process ensuring the product designed with built in DFx process,
first time right and in a required cycle time
 Ensure first time right design by following right design practices by breaking down the complex project
into smaller modules, Risk identification and mitigation, keeping the design simple and following good
engineering practices of developing transfer function, using simulation model and other appropriate
analysis tool.
 Worked closely with marketing, product management for supporting customers on technical issues
and also creating product line Roadmap
 Building strong relationships with external and internal customers. Strong leadership, people
management & business skills.
 Been a global CER leader and review expert for NPI products which are at various stages of
development
Experience Summary:
March 2004–To Till date - Honeywell Technology Solutions Lab (Pvt) Ltd Bangalore
Designation: Engineering Manager
SBG : ACS
Band :04
Period: November , 2015 to Till Date
Band :04
Engineering Leader for ACS India Electrical COE. Leading engineering team comprising of different
functions i.e. wireless, board layout, Portables, sensors and Electrical Design.
Work Areas:
 Responsible for delivering NPI projects in terms of cost, schedule and on budget by following first time
right design practices like simulation, design analysis, LPDS principle, etc...
 Leading Electrical design team of 55+ engineers consisting of various functions like wireless, board
layout, sensors, Electrical design and portables.
 Drive creation and use of global re-useable assets including components, design and platforms
 Working upon to develop a regular MOS with all the key stakeholders for delivering programs that
meets the cost, quality and schedule requirements and feedback mechanism for escalation and project
outcome
 Coordinate with the program management function (scope, risk, schedule, communication, quality, cost,
procurement, external relations and resources), conforming to the NPI processes.
 Managing & mentoring the team
 Manage product development activities, technology leadership, budgetary planning, resource
management
 Coordinates financial aspects related to project execution (Purchase Orders, Pursuing invoices,
managing yield and efficiency, Time sheet approvals, Capex)
 Proactively addresses all common systemic issues that impact productive functioning of the teams
 Plan for knowledge development, continuous competency and capability development
 Enable project delivery and innovation by working closely with global engineering, business leaders and
external vendors (where necessary).
 Responsible for the technical solution (working with project leads, technology specialists)
 Support development and execution of STRAP, AOP, MRR for the team
 Understand Business Expectation and partnering opportunity where engineering teams can contribute
to the growth of the business.
 Uses market and customer knowledge to enable growth through innovation (POCs, PPVs) and IP
creation.
 Collaboration with external partners like Analog Devices, Murata, Harman to identify right component
and standardization
 Working with external vendors for design outsourcing opportunity enabling larger design capability
Designation: Technology Business Partner
SBG : ACS
Band :04
Period: April, 2014 to November, 2015
Responsible for India growth for Sensing and Control Portfolio of Projects. Revenue growth through NPI,
Localization and Configuration projects.
Project leader for 6 Degree of Freedom IMU sensor delivering solution and driving technology and
product roadmap
Work Areas:
 Identify growth areas in emerging region in working closely with customer and business leaders.
 Developed the technology and product roadmap for 6DOF IMU sensors to keep up the technology
development and cost differentiation.
 Active engagement in IOT initiative and has developed multiple POC consisting of sensor, cloud
connectivity and mobile app. Have developed POC like SMART Connected sensor for enabling IOT
opportunity interfacing existing Honeywell sensor. Modular and scalable building block for cross SBU use
cases, others are like Water Filter clog indicator, Sensor fusion for energy management and safety, etc...
 Use of sensor Product/Domain/Technology expertise to understand customer need, identify value
proposition followed by NPI project approval in PAC converting into a VPM project.
 Structured execution through MOS, Biweekly Engineering and Marketing review involving the project
leads, sales and marketing leader to review the E4E projects which include discussion on technical and
business risk, PAC collaboration and support required.
 Strong focus on execution, ensuring responsiveness to customers, team and management
Responsible for Conducting Technology Day with key account customer
 Developed the first of its kind heat map for S&C product mapping for India requirement in working
closely with business and strategy team. The heat map provided the key insights on existing product
offering and also help in planning the new NPI.
 The Heat map is used to provide input to the existing global product roadmap meeting the local
customer requirement thereby getting maximum ROI on the product development. The heat map has
generated two of the new product for HGR
 Created NPI Pipeline specific for India leveraging the platform products thereby reducing the
development risk and improving the cycle time
 Conducted innovation workout with theme “SENSINO” generating more than 55 ideas, shortlisting to
12 ideas followed by focused group brainstorm consisting of engineering, sales and marketing.
 Enabled S&C engineering team for more that 40+ customer visits helping the team to understand
requirement, solving customer problem and identifying differentiated offering
 Launch of two E4E project with a good opportunity size for a lead customer and also creating a
product line.
 MOS is put in place for creating a healthy NPI Pipeline and execution to drive growth
Designation: Sr. Technology specialist, Sensing & Control
SBG : ACS
Band :04
Period: October 2008 to April 2014.
Overall Responsibility of New Product development by leading a team of electronics, mechanical,
process, mechanical engineer and technology specialist. The product designed for harsh application
environment in working closely with customer and multi-location development environment with teams in
USA, India and China.
Work Areas:
 Project Management for New Product development & working for New business initiative
 End to End product development responsibility from identifying customer need to concept
development to manufacturing followed by customer support
 Led the design team by developing project delivery ownership, the team consists of Mechanical
engineer, Electrical engineer, System engineer, Technology specialist, Advanced Process engineer and
software engineer. The other cross functional team involved are ECAD, MCAD and Simulation engineer.
 Drive Critical risk management by breaking down the complex project into different smaller modules
and proactively identifying the delivery risk for each module and developing a risk management plan.
 Ensure first time right design by developing transfer function, simulation and other appropriate
analysis tool.
 Overall accountability of project delivery from Requirement to concept to manufacturing to product
launch
 Working closely with the customer, business stake holders and design team
 Ensure the NPI process is followed meeting technical and Manufacturability requirement
 Ensure product training to application engineers, product marketing and provide technical support to
customer.
 Technical support to manufacturing
 Effective resource planning based upon the project complexity, team skill and business impact
Project Name: 6 degree of Freedom Inertial Measurement Unit (IMU) and 6 dof IMU with Attitude
Heading Reference System (AHRS)
Overview: 6 dof IMU is designed to provide 6 dimensional motion sensing from a single device by sensing
Pitch, Roll and Yaw dimension. IMU consists of 3 axis Rotation rate sensors (Gyro), 3-axis
Accelerometers and 2 axis inclinometers.
It has inbuilt 32 bit processors, designed for harsh operating environment like IP67, IP69k protection,
vibration, drop. The product is also designed for wide operating voltage range meeting all electrical
requirements including EMI/EMC.
Accomplishment:
 First of its kind project in S&C with high on technical complexity having multiple sensors, with high
end processing meeting the harsh operating environment.
 Successfully launch of the 6dof IMU inclination variant
 Use of 5 phase design stage gate process. The product designed with platform and modular design
approach meeting all DFx requirement, CER, MRL, Safety, IP etc.
 First time right design with no iterations. The product designed with design margin to meet DV and PV
test requirement.
 Successful building and implementation of new End of line tester (Rate table) for manufacturing line
which is setup at Nanjing, China. The project with most complex and high investment EOL (USD 800K+)
is put in place in Nanjing.
 Platform and modular design approach for ease of configurability, support for multiple variants and to
meet future VE requirement, reduced design cycle time.
 Implemented the design ownership culture.
 Technical support to customer mapping product parametric specification to customer application need
 Working closely with customer and provide quick resolution for any product test and validation issue
with appropriate 8D report.
 Worked from Golden Valley, Minneapolis for a year to lead in setting up temporary manufacturing line
for the old variant, scoping out the specification for new EOL, evaluating the EOL supplier and building the
EOL for installation at NJ, China.
Designation: Analog and Mixed Signal electronic excellence lead
SBG : ACS
Band :03
Period: December 2007 to October 2008.
Leading a functional team of Analog and Mixed signal excellence engineering team.
Overall Responsibility for electronic design excellence and delivering the electronic design for Sensors &
Switches consisting different engineering Groups, like Speed and position sensors, Pressure sensors,
Thermal and Humidity sensors, Switches and Test and measurement sensors.
Work Areas:
 Excellence in Technical Delivery – Use of NPI process, Six sigma tools, periodic reviews, CDR
 Collaborative execution – Concurrent engineering practices , Team work with goal of product delivery
excellence
 Technology and competency Management – Training, use of right tools, groom team members for
technical excellence
 Growth and productivity focus – Focus on productivity improvement by platforms and reuse,
standardization
 State-of-the-art infrastructure – Develop design lab infrastructure to meet demands of the global
organization
 Recognition of high performance – make people better by recognizing high performers
Designation: Customer Facing Engineer (CFE) and STRAP Focal for Sensor & Switches, Bangalore
SBG : ACS
Band :03
Period: December 2007 to October 2008.

Overall responsibility for to generate new business opportunity in India. Working with local customers,
understanding the requirement and providing technical solutions after carrying out technical feasibility
study and business analysis. Also focal for developing Bangalore GDC, Domain STRAP in working
closely with key stakeholders.
Work Areas:
 Build customer relations working closely with customers and Marketing team.
 Generate NBO in working closely with customers.
 Lead the design team for concept to prototype development
 Carryout technical and business feasibility analysis in working closely with various cross functional
team.
Project overview:
1. Integrated Radiosonde module:
This is a NBO created in working closely with Indian Meteorological department (IMD). The solution is for
upper air weather observation module.
The product designed with multiple sensors namely pressure, temperature and humidity sensors . The
solutions are successfully tested at IMD test centers. The solutions are patented for its unique solutions.
2. Fuel level sensor:
This is a NBO created in working closely with telecom operator. The Fuel level sensor is proposed to
prevent fuel pilfilration at the telecom tower site. The solutions consist of pressure based fuel level
sensing technology The solutions is prototyped and has been successfully tested at customer locations.
3. CNG leak detector sensor:
This was a completely new first time solution for S&C in gas sensing application for HDV manufacturer.
The CNG leak detector consists of gas sensing device from City technology with flame arresting sinters.
The sensor is packaged for HDV application. Worked very closely with the customer to understand the
value proposition and the pain points with the existing solution. The solution arrived is for the CNG sensor
along with silicone and Sulphur poison resistant sheet. The solutions consist of packaged gas sensor with
electronic interface consisting of Analog output and gas leak warning alarm. The solution is prototyped
and has been successfully tested at customer locations.
March 2004 To December 2006 - H Technology Solutions Lab (Pvt) Ltd Bangalore
Designation: Principal Engineer
Responsible for electronic design and developing sensing concept using first principle. Overall
responsible for analog and mixed signal design, sensing concept validation and integration for automotive
application.
Work Areas:
 Analog and mixed signal design meeting stringent automotive requirement.
 Identify sensor concept using first principle and detailed theoretical analysis and transfer function
generation.
 Worked closely with customer for performance evaluation.
Other responsibility include developing project proposal for new customer requirement and carrying of
technical and business feasibility analysis.
Project Overview
Exhaust Gas Recirculation (EGR) flow sensor:
The EGR flow sensor was designed for heavy duty vehicle to control emission. The sensing principle used
is thin film anemometer based. The design consists of sensing and interfaces to ECU. It consist of 16 bit
microcontroller, signal condition circuitry, CAN interface and EMI/EMC compliant power circuitry.
1. Urea Quality sensor:
2. Air mass Flow sensor etc.
Trainings
(a) Business Partner training
(b) Certified LUMA instructor for Design Thinking workshop
(c) Conflict Management Training
(d) Strategic Marketing Program (SMP) training by VP H, Rhonda
(e) Design Thinking by LUMA Institute
(f) Essential For Supervision (EFS) training
(g) Design for Six Sigma – Phase-1 and 2- Green Belt certified
(h) Customer Facing Engineer training
(i) Business Financials training
(j) Leadership Skills Workshop
(k) Emerging trend in wireless
Awards
1. Technical achievement award
2. Leadership award
3. Patent Award -2 No.
4. Trade Secret – 1No.
5. Team excellence award – 5no
6. Partnership award (2005) – One
7. SHRISTI (Innovation paper contest) – Special prize
8. Individual Excellence Award – 1
Symposium / Conference – Speaker / Participant
1. International conference on Automotive Electronics and Intelligent Vehicle Initiative & CLIKMART 07,
August 2007, Bangalore – Speaker – Topic ‘Overview of Honeywell Sensor for Automotive’
2. Wireless Seminar, Mumbai – Participant
3. International conference on Sensor and Related Networks – SENNET -07, VIT, December 2007, -
Participant.
Other information
 2 Patents and 1 Trade Secret
Company Name: MCSoft Biotech Research Centre (R&D division of Transasia Biomedical Ltd.)
Designation: Software Engineer (R& D Dept.)
Duration: Feb 17, 2003 to Feb28, 2004
Work Areas:
1. Analog and digital circuit design for fully Automated Blood analyzer machines, which include Circuit
design, and providing PCB guidelines for single & multilayer boards.
2. Designing/Modification of Various circuits like ADC Card, Photometer Card, CPLD based motor driver
card, 16 bit micro controller based systems used in different blood analyzer.
3. Interfacing of Temperature sensors, Robocard PCB’s etc.
4. Product transfer from R&D to Production dept.
5. Optimization of the Existing products by redesigning circuits based on feedback from Production &
field.
Project Work:
1. Designing of a fully automatic Blood Analyzer
A Biomedical instrument with Robotics Control for analyzing blood samples. Designing of the Robotics
Card, and other processing card. Micro stepping logic for soft start and stop of the motor. Software is
written in C using Keil Compiler.
2. Photometer PCB
Redesign of the existing photometer PCB to eliminate the production & assembly time & thus improving
its performance. A precision OPAMP with very low bias current is used; Automatic offset voltage
adjustment using Microcontroller during initialization of the system. Layout and component placement
were done so that the board impedance is not reflected.
3 .XL120 motor driver, 4. Semi Automatic Blood analyzer, 5. LLS (Liquid level Sensor) board

Company Name: CMS Traffic system Ltd.
Designation: Field Engineer
Duration: August 2, 1999 to February 15, 2003
Work areas:
 Hardware design and Performance testing for different traffic signal indication.
 Development of Jigs & Technical Support to QA Department.
 Technical Support & Training to Production Department.
 Providing Solutions to Field Service Department on Field Specific Requirements
 Debugging of different boards used in various traffic controller.
Project Name:
1. Emergency Telephone system solutions in Mumbai – Pune Expressway
2. Pedestrian announcement system.
Education:
Bachelor of Engineering in Electronics from Mumbai University, A.C. Patil College of engineering (1994-
1999).
Passed 3 semesters in Masters in Marketing Management but not completed as moved from Mumbai to
Bangalore when joined Organization
Key Strengths:
 Customer focused
 Strong in execution
 Technical and analytical capabilities.
 Building Strong relationships with external and internal customers, and stakeholders.
 Taking ownership and accountability
 Drive for results.
 Leadership and people management skills
Date: April 5, 2016 Ramkrishna U. Pal

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Ramkrishna pal resume_april2016

  • 1. Ramkrishna U. Pal Contact: Phone: +91 9900042471 Email: ramkrishnapal@rediffmail.com https://in.linkedin.com/in/ramkrishna-pal-45a59839 Overview: 16+ yrs. of experience in new product development from understanding of Customer need to manufacturing launch using NPI design process in a global multi-cultural and multi-location environment. Expertise in varied field of Sensor development like accelerometer,Gyroscope,6 DOF Inertial Measurement unit, Pressure, Temperature, etc. mechanically packaged to work in harsh environment. Active Engagement in new technology trend like IOT and sensor technology. Profile Summary:  12+ years of experience at Honeywell in multi-disciplinary role from design, leading projects, working as functional leader and focus for driving business growth.  Engineering Manager responsible for delivering NPI projects in terms of cost, schedule and on budget following first time right design practices like simulation, design analysis, LPDS principle, etc...  Leading a team of 50+ engineers consisting of various functions like wireless, board layout, sensors, Electrical design and portables.  Active engagement in IOT initiative and has developed multiple POC consisting of sensor, cloud connectivity, and mobile app. implementing design language in mechanical packaging  The IOT Proof of concept has been showcased at different forums like Barcelona tech Expo  Close collaboration with external vendors like Analog Devices, Intel, Harman, Murata etc. identifying partnership opportunity in product development  Led a team in delivering technically challenging, complex 6 dof Inertial Measurement Unit first time in S&C, multisensory product consisting of Gyroscope, accelerometer, inclinometer & compass interfaced to a high speed 32 bit processor and mechanically packaged to work in high vibration, shock for Transportation application.  Led design team having varied experience and skill set in a global environment and delivering result in working with global team mainly in India, USA & China  End to End product development experience from customer need to product launch including manufacturing line setup in NJ, China  Has worked closely with global customer in USA, France, China, and Japan etc.at various stages like VOC, product launch, end user application support etc…  Provided technical consultation and product training for the launched product to Marketing, Application Engineer in US, Europe, China & India  Has worked in driving India growth for Sensing and Control by understanding customer requirement, Technical Feasibility, Value Proposition, etc by closely collaborating with the Engineering GDC along with sales & Marketing Business leaders located at Pune to drive business growth  Experience in project execution which involves multiple stake holder including global Engineering, sales, marketing, product management, manufacturing etc..  Extensively used LPDS and NPI process ensuring the product designed with built in DFx process, first time right and in a required cycle time  Ensure first time right design by following right design practices by breaking down the complex project into smaller modules, Risk identification and mitigation, keeping the design simple and following good engineering practices of developing transfer function, using simulation model and other appropriate analysis tool.  Worked closely with marketing, product management for supporting customers on technical issues and also creating product line Roadmap
  • 2.  Building strong relationships with external and internal customers. Strong leadership, people management & business skills.  Been a global CER leader and review expert for NPI products which are at various stages of development Experience Summary: March 2004–To Till date - Honeywell Technology Solutions Lab (Pvt) Ltd Bangalore Designation: Engineering Manager SBG : ACS Band :04 Period: November , 2015 to Till Date Band :04 Engineering Leader for ACS India Electrical COE. Leading engineering team comprising of different functions i.e. wireless, board layout, Portables, sensors and Electrical Design. Work Areas:  Responsible for delivering NPI projects in terms of cost, schedule and on budget by following first time right design practices like simulation, design analysis, LPDS principle, etc...  Leading Electrical design team of 55+ engineers consisting of various functions like wireless, board layout, sensors, Electrical design and portables.  Drive creation and use of global re-useable assets including components, design and platforms  Working upon to develop a regular MOS with all the key stakeholders for delivering programs that meets the cost, quality and schedule requirements and feedback mechanism for escalation and project outcome  Coordinate with the program management function (scope, risk, schedule, communication, quality, cost, procurement, external relations and resources), conforming to the NPI processes.  Managing & mentoring the team  Manage product development activities, technology leadership, budgetary planning, resource management  Coordinates financial aspects related to project execution (Purchase Orders, Pursuing invoices, managing yield and efficiency, Time sheet approvals, Capex)  Proactively addresses all common systemic issues that impact productive functioning of the teams  Plan for knowledge development, continuous competency and capability development  Enable project delivery and innovation by working closely with global engineering, business leaders and external vendors (where necessary).  Responsible for the technical solution (working with project leads, technology specialists)  Support development and execution of STRAP, AOP, MRR for the team  Understand Business Expectation and partnering opportunity where engineering teams can contribute to the growth of the business.  Uses market and customer knowledge to enable growth through innovation (POCs, PPVs) and IP creation.  Collaboration with external partners like Analog Devices, Murata, Harman to identify right component and standardization  Working with external vendors for design outsourcing opportunity enabling larger design capability Designation: Technology Business Partner SBG : ACS
  • 3. Band :04 Period: April, 2014 to November, 2015 Responsible for India growth for Sensing and Control Portfolio of Projects. Revenue growth through NPI, Localization and Configuration projects. Project leader for 6 Degree of Freedom IMU sensor delivering solution and driving technology and product roadmap Work Areas:  Identify growth areas in emerging region in working closely with customer and business leaders.  Developed the technology and product roadmap for 6DOF IMU sensors to keep up the technology development and cost differentiation.  Active engagement in IOT initiative and has developed multiple POC consisting of sensor, cloud connectivity and mobile app. Have developed POC like SMART Connected sensor for enabling IOT opportunity interfacing existing Honeywell sensor. Modular and scalable building block for cross SBU use cases, others are like Water Filter clog indicator, Sensor fusion for energy management and safety, etc...  Use of sensor Product/Domain/Technology expertise to understand customer need, identify value proposition followed by NPI project approval in PAC converting into a VPM project.  Structured execution through MOS, Biweekly Engineering and Marketing review involving the project leads, sales and marketing leader to review the E4E projects which include discussion on technical and business risk, PAC collaboration and support required.  Strong focus on execution, ensuring responsiveness to customers, team and management Responsible for Conducting Technology Day with key account customer  Developed the first of its kind heat map for S&C product mapping for India requirement in working closely with business and strategy team. The heat map provided the key insights on existing product offering and also help in planning the new NPI.  The Heat map is used to provide input to the existing global product roadmap meeting the local customer requirement thereby getting maximum ROI on the product development. The heat map has generated two of the new product for HGR  Created NPI Pipeline specific for India leveraging the platform products thereby reducing the development risk and improving the cycle time  Conducted innovation workout with theme “SENSINO” generating more than 55 ideas, shortlisting to 12 ideas followed by focused group brainstorm consisting of engineering, sales and marketing.  Enabled S&C engineering team for more that 40+ customer visits helping the team to understand requirement, solving customer problem and identifying differentiated offering  Launch of two E4E project with a good opportunity size for a lead customer and also creating a product line.  MOS is put in place for creating a healthy NPI Pipeline and execution to drive growth Designation: Sr. Technology specialist, Sensing & Control SBG : ACS Band :04 Period: October 2008 to April 2014. Overall Responsibility of New Product development by leading a team of electronics, mechanical, process, mechanical engineer and technology specialist. The product designed for harsh application environment in working closely with customer and multi-location development environment with teams in USA, India and China. Work Areas:  Project Management for New Product development & working for New business initiative  End to End product development responsibility from identifying customer need to concept development to manufacturing followed by customer support  Led the design team by developing project delivery ownership, the team consists of Mechanical
  • 4. engineer, Electrical engineer, System engineer, Technology specialist, Advanced Process engineer and software engineer. The other cross functional team involved are ECAD, MCAD and Simulation engineer.  Drive Critical risk management by breaking down the complex project into different smaller modules and proactively identifying the delivery risk for each module and developing a risk management plan.  Ensure first time right design by developing transfer function, simulation and other appropriate analysis tool.  Overall accountability of project delivery from Requirement to concept to manufacturing to product launch  Working closely with the customer, business stake holders and design team  Ensure the NPI process is followed meeting technical and Manufacturability requirement  Ensure product training to application engineers, product marketing and provide technical support to customer.  Technical support to manufacturing  Effective resource planning based upon the project complexity, team skill and business impact Project Name: 6 degree of Freedom Inertial Measurement Unit (IMU) and 6 dof IMU with Attitude Heading Reference System (AHRS) Overview: 6 dof IMU is designed to provide 6 dimensional motion sensing from a single device by sensing Pitch, Roll and Yaw dimension. IMU consists of 3 axis Rotation rate sensors (Gyro), 3-axis Accelerometers and 2 axis inclinometers. It has inbuilt 32 bit processors, designed for harsh operating environment like IP67, IP69k protection, vibration, drop. The product is also designed for wide operating voltage range meeting all electrical requirements including EMI/EMC. Accomplishment:  First of its kind project in S&C with high on technical complexity having multiple sensors, with high end processing meeting the harsh operating environment.  Successfully launch of the 6dof IMU inclination variant  Use of 5 phase design stage gate process. The product designed with platform and modular design approach meeting all DFx requirement, CER, MRL, Safety, IP etc.  First time right design with no iterations. The product designed with design margin to meet DV and PV test requirement.  Successful building and implementation of new End of line tester (Rate table) for manufacturing line which is setup at Nanjing, China. The project with most complex and high investment EOL (USD 800K+) is put in place in Nanjing.  Platform and modular design approach for ease of configurability, support for multiple variants and to meet future VE requirement, reduced design cycle time.  Implemented the design ownership culture.  Technical support to customer mapping product parametric specification to customer application need  Working closely with customer and provide quick resolution for any product test and validation issue with appropriate 8D report.  Worked from Golden Valley, Minneapolis for a year to lead in setting up temporary manufacturing line for the old variant, scoping out the specification for new EOL, evaluating the EOL supplier and building the EOL for installation at NJ, China. Designation: Analog and Mixed Signal electronic excellence lead SBG : ACS Band :03 Period: December 2007 to October 2008. Leading a functional team of Analog and Mixed signal excellence engineering team.
  • 5. Overall Responsibility for electronic design excellence and delivering the electronic design for Sensors & Switches consisting different engineering Groups, like Speed and position sensors, Pressure sensors, Thermal and Humidity sensors, Switches and Test and measurement sensors. Work Areas:  Excellence in Technical Delivery – Use of NPI process, Six sigma tools, periodic reviews, CDR  Collaborative execution – Concurrent engineering practices , Team work with goal of product delivery excellence  Technology and competency Management – Training, use of right tools, groom team members for technical excellence  Growth and productivity focus – Focus on productivity improvement by platforms and reuse, standardization  State-of-the-art infrastructure – Develop design lab infrastructure to meet demands of the global organization  Recognition of high performance – make people better by recognizing high performers Designation: Customer Facing Engineer (CFE) and STRAP Focal for Sensor & Switches, Bangalore SBG : ACS Band :03 Period: December 2007 to October 2008.  Overall responsibility for to generate new business opportunity in India. Working with local customers, understanding the requirement and providing technical solutions after carrying out technical feasibility study and business analysis. Also focal for developing Bangalore GDC, Domain STRAP in working closely with key stakeholders. Work Areas:  Build customer relations working closely with customers and Marketing team.  Generate NBO in working closely with customers.  Lead the design team for concept to prototype development  Carryout technical and business feasibility analysis in working closely with various cross functional team. Project overview: 1. Integrated Radiosonde module: This is a NBO created in working closely with Indian Meteorological department (IMD). The solution is for upper air weather observation module. The product designed with multiple sensors namely pressure, temperature and humidity sensors . The solutions are successfully tested at IMD test centers. The solutions are patented for its unique solutions. 2. Fuel level sensor: This is a NBO created in working closely with telecom operator. The Fuel level sensor is proposed to prevent fuel pilfilration at the telecom tower site. The solutions consist of pressure based fuel level sensing technology The solutions is prototyped and has been successfully tested at customer locations. 3. CNG leak detector sensor: This was a completely new first time solution for S&C in gas sensing application for HDV manufacturer. The CNG leak detector consists of gas sensing device from City technology with flame arresting sinters. The sensor is packaged for HDV application. Worked very closely with the customer to understand the value proposition and the pain points with the existing solution. The solution arrived is for the CNG sensor along with silicone and Sulphur poison resistant sheet. The solutions consist of packaged gas sensor with electronic interface consisting of Analog output and gas leak warning alarm. The solution is prototyped and has been successfully tested at customer locations. March 2004 To December 2006 - H Technology Solutions Lab (Pvt) Ltd Bangalore
  • 6. Designation: Principal Engineer Responsible for electronic design and developing sensing concept using first principle. Overall responsible for analog and mixed signal design, sensing concept validation and integration for automotive application. Work Areas:  Analog and mixed signal design meeting stringent automotive requirement.  Identify sensor concept using first principle and detailed theoretical analysis and transfer function generation.  Worked closely with customer for performance evaluation. Other responsibility include developing project proposal for new customer requirement and carrying of technical and business feasibility analysis. Project Overview Exhaust Gas Recirculation (EGR) flow sensor: The EGR flow sensor was designed for heavy duty vehicle to control emission. The sensing principle used is thin film anemometer based. The design consists of sensing and interfaces to ECU. It consist of 16 bit microcontroller, signal condition circuitry, CAN interface and EMI/EMC compliant power circuitry. 1. Urea Quality sensor: 2. Air mass Flow sensor etc. Trainings (a) Business Partner training (b) Certified LUMA instructor for Design Thinking workshop (c) Conflict Management Training (d) Strategic Marketing Program (SMP) training by VP H, Rhonda (e) Design Thinking by LUMA Institute (f) Essential For Supervision (EFS) training (g) Design for Six Sigma – Phase-1 and 2- Green Belt certified (h) Customer Facing Engineer training (i) Business Financials training (j) Leadership Skills Workshop (k) Emerging trend in wireless Awards 1. Technical achievement award 2. Leadership award 3. Patent Award -2 No. 4. Trade Secret – 1No. 5. Team excellence award – 5no 6. Partnership award (2005) – One 7. SHRISTI (Innovation paper contest) – Special prize 8. Individual Excellence Award – 1 Symposium / Conference – Speaker / Participant 1. International conference on Automotive Electronics and Intelligent Vehicle Initiative & CLIKMART 07, August 2007, Bangalore – Speaker – Topic ‘Overview of Honeywell Sensor for Automotive’ 2. Wireless Seminar, Mumbai – Participant
  • 7. 3. International conference on Sensor and Related Networks – SENNET -07, VIT, December 2007, - Participant. Other information  2 Patents and 1 Trade Secret Company Name: MCSoft Biotech Research Centre (R&D division of Transasia Biomedical Ltd.) Designation: Software Engineer (R& D Dept.) Duration: Feb 17, 2003 to Feb28, 2004 Work Areas: 1. Analog and digital circuit design for fully Automated Blood analyzer machines, which include Circuit design, and providing PCB guidelines for single & multilayer boards. 2. Designing/Modification of Various circuits like ADC Card, Photometer Card, CPLD based motor driver card, 16 bit micro controller based systems used in different blood analyzer. 3. Interfacing of Temperature sensors, Robocard PCB’s etc. 4. Product transfer from R&D to Production dept. 5. Optimization of the Existing products by redesigning circuits based on feedback from Production & field. Project Work: 1. Designing of a fully automatic Blood Analyzer A Biomedical instrument with Robotics Control for analyzing blood samples. Designing of the Robotics Card, and other processing card. Micro stepping logic for soft start and stop of the motor. Software is written in C using Keil Compiler. 2. Photometer PCB Redesign of the existing photometer PCB to eliminate the production & assembly time & thus improving its performance. A precision OPAMP with very low bias current is used; Automatic offset voltage adjustment using Microcontroller during initialization of the system. Layout and component placement were done so that the board impedance is not reflected. 3 .XL120 motor driver, 4. Semi Automatic Blood analyzer, 5. LLS (Liquid level Sensor) board  Company Name: CMS Traffic system Ltd. Designation: Field Engineer Duration: August 2, 1999 to February 15, 2003 Work areas:  Hardware design and Performance testing for different traffic signal indication.  Development of Jigs & Technical Support to QA Department.  Technical Support & Training to Production Department.  Providing Solutions to Field Service Department on Field Specific Requirements  Debugging of different boards used in various traffic controller. Project Name: 1. Emergency Telephone system solutions in Mumbai – Pune Expressway 2. Pedestrian announcement system. Education: Bachelor of Engineering in Electronics from Mumbai University, A.C. Patil College of engineering (1994- 1999). Passed 3 semesters in Masters in Marketing Management but not completed as moved from Mumbai to Bangalore when joined Organization
  • 8. Key Strengths:  Customer focused  Strong in execution  Technical and analytical capabilities.  Building Strong relationships with external and internal customers, and stakeholders.  Taking ownership and accountability  Drive for results.  Leadership and people management skills Date: April 5, 2016 Ramkrishna U. Pal