SUMITOMO ELECTRIC

1. R&D カタログ
表 1- 表 4
June 2015
Research & Development
Each company of the “Sumitomo Electric group” combines its unsurpassed
creativity with knowledge and experience to generate dynamics
that allows the group to contribute to society.
Osaka Works
1-1-3, Shimaya, Konohana-ku, Osaka 554-0024, Japan
Tel: +81 6 6466 5651 Fax: +81 6 6463 7229
Itami Works
1-1-1, Koyakita, Itami, Hyogo 664-0016, Japan
Tel: +81 72 772 3300 Fax: +81 72 772 2525
Yokohama Works
1, Taya-cho, Sakae-ku, Yokohama 244-8588, Japan
Tel: +81 45 853 7182 Fax: +81 45 852 0597
Transmission Devices R&D Laboratories,
Optical Communications R&D Laboratories,
New Business Frontier R&D Laboratories
(Life Science R&D Department)
Analysis Technology Research Center,
Infocommunications and Social Infrastructure Systems R&D Center
Head Office (Tokyo)
Akasaka Center Building
1-3-13, Motoakasaka, Minato-ku, Tokyo 107-8468, Japan
Tel: +81 3 6406 2600
R&D General Planning Division
5-33, Kitahama 4-chome, Chuo-ku, Osaka 541-0041, Japan
Tel: +81 6 6220 4141
http://global-sei.com/
Head Office (Osaka)
Advanced Automotive Systems R&D Center,
Energy and Electronics Materials R&D Laboratories ,
Analysis Technology Research Center, Power System R&D Center,
Infocommunications and Social Infrastructure Systems R&D Center,
R&D General Planning Division, New Business Frontier R&D Laboratories
(Water Treatment R&D Department, Agri-Science R&D Department)
Power Device Development Division
Semiconductor Technologies R&D Laboratories
Advanced Materials R&D Laboratories,
Semiconductor Technologies R&D Laboratories,
R&D General Planning Division
Advanced Automotive Systems R&D Center,
Energy and Electronics Materials R&D Laboratories,
Analysis Technology Research Center

2. 13.5
5.2
11.0
6.7
57.9
12.6
4.6
12.6
7.6
62.1
02 03
R&D カタログ
P02-03
Mid-Term Management Plan VISION 2017 and R&D Activities
Focusing on our business fields which are essential for society: the three fields of "mobility
(automotive)," "energy," and "communications (ICT)"; "environment and infrastructure" which
those three fields are integrated into; and the two new fields of "life science" and "resources,"
we aim at creating and globally providing new values covering the scope from materials to
systems and solutions through ceaseless innovation.
R&D expenses (including development expenses at production groups)
FY2012
¥94.3 bn
FY2013
¥99.5 bn
FY2014
¥105.6 bn
Active
copper/optical
cable
Optical transceiver
(40G/100G)
Home GateWay
(HGW)
Green laser diode
Aluminum WH High voltage WH for HEV/EV
Porous aluminum
“Aluminum-Celmet” Cutting tools tipped with
nano-polycrystalline diamond
“Sumidia Binderless.”
Concentrator photovoltaic
(CPV) unit
With the belief that research and development are the driving force for our company's growth, we are promoting the
implementation of our mid-term management plan "VISION 2017" that prescribes the target/direction, strategy, resource
allocation, and action program for our R&D. The proposal of new research activities and the promotion of research in the
early stages are also our main tasks for our future business. Moreover, for the acceleration of R&D and the creation of new
business fields using external operating resources, we set forward open innovations such as collaborative/contract
research with universities and laboratories, effective use of national subsidies, and collaboration with other companies.
For smooth R&D activities, we focus on overall R&D management such as total administration of R&D expenses,
assessment/analysis of research projects that have been conducted for a set period of time, and preparation of steering
groups considering the status of R&D progress. Moreover, we provide training programs to cultivate human resources,
and also work to ensure full compliance.
Infocommunications
15.2
Electronics
3.9
nicsnics
Environment
and Energy
14.2
ent
gy
Industrial Materials
and Others
7.9
Automotive
64.4
Basic research
New area
New technology
R&D General
Planning Division
R&D Organization
R&D Planning (mid-term research plan, new research proposal & business creation, open innovation)
R&D Administration/Support and Human Resources Development
Power Device
Development Div.
Semiconductor
Technologies
R&D Labs.
Advanced
Materials
R&D Labs.
Overseas
operations
Innovation Core
SEI, Inc.
China Analysis
Technology Center
ExpansionintoIntegrated
BusinessFields
N
ew
G
row
th
in
Current
Business
Fields
N
ew
G
row
th
in
Current
Business
Fields
N
ew
G
row
th
in
Current
Business
Fields
Challenging
N
ew
Business
Fields
Challenging
N
ew
Business
Fields
Challenging
N
ew
Business
Fields
Environment &
Infrastructure
Magnesium alloy
Near-infrared composition
imaging system
Optical
Communications
R&D Labs.
Transmission
Devices
R&D Labs.
Energy and
Electronics Materials
R&D Labs.
New
Business Frontier
R&D Labs.
Energy
Power System
R&D Center
Mobility
Advanced Automotive Systems
R&D Center
Communications
Infocommunications and
Social Infrastructure Systems
R&D Center
R&D General
Planning Div.
Analysis Technology
Research Center

3. R&D カタログ
P04-05
For the widespread use of vehicle information technologies such as automated driving, we are developing technolo-
gies for vehicle-to-vehicle and vehicle-to-infrastructure communications, user-friendly human machine interfaces
(HMIs) and in-vehicle network architecture.
Drawing on our material technology and analysis methods, we are working on the development of environment-
friendly products that contribute to improvement in vehicle fuel efficiency and reduction in CO2 emissions. These
products include reactors, power storage units and power supply control systems.
04 05
Environment
Safety & security
Wireless/optical communication
Communication control
Electroconductive material/
sintered alloy
Insulation material/
heat spreading material
Environment
Energy infrastructure Traffic infrastructure
Material Information and communication
Safety & security
Camera lens
Display
light source
Vehicular
communicationGateway
Power supply management
Power supply
distribution
In-vehicle
battery
charger
Power
supply
control motor
Electricity
storage
material
Magnetic
material
Telematics server
Probe information
＊2 HUD: Head-Up Display
＊3 PHEV: Plug-in Hybrid Electric Vehicle
＊1 HEMS: Home Energy Management System
Internet
In-vehicle image recognition
ITS
Power storage units Reactor Electricity storage unit
TelematicsTelematicsTelematics
HUD*2
Power supply control system
Using our material and communication technologies, we are developing innovative tech-
nologies and products that will contribute to the improvement of vehicular performance in
the future regarding the environment, safety, and security.
Advanced Automotive
Systems R&D Center
Traffic control/ITS/TelematicsSmart grid
HEMS*1
Power distribution
control
Connecting
Auxiliary for
electricity storage
Electricity storageGeneration &
driving
Auxiliary
Battery
charger
Vehicular
communication
Charge & discharge
converter
Electricity
storage unit
Low voltage
battery
High voltage
battery
Inverter
Boost converter
Motor
generator
ECUBuck
converter
Regeneration system
HEV system
EV・PHEV*3
system

4. R&D カタログ
P06-07
We have developed a micro smart-grid demonstra-
tion system and have been testing it at our Osaka
Works. Four types of renewable power generators
and a storage battery are DC-interconnected, and
natural energy and power demand fluctuations are
sophisticatedly managed, thereby ensuring stable
and efficient power supply for facilities and equip-
ment (loads).
The power generation efficiency of concentrator
photovoltaic (CPV) is about twice that of silicon
solar panels currently on the market, since CPV cells
are made from a special compound semiconductor
material. Installed at an elevated position, concentra-
tor panels provide usable space underneath them.
Expectations are high for CPV as a next-generation
photovoltaic. In the newly developed CPV (1 kW
power), panels are thinner and lighter than those of
conventional CPV.
The Power System R&D Center opened in January
2010 to promote business development in line with
technological innovations in the electric power infra-
structure sector (such as expanded use of renewable
energies and advanced electric power infrastructure
using information and communications technology).
More specifically, the laboratories promote research
and development of elemental technologies, com-
mercial products, equipment and systems that are
essential for smart grid construction.
Sumitomo Electric developed the world’s first, weak mag-
netic, high strength, textured metal substrate. A buffer
layer and an yttrium-based superconducting layer are
deposited on this substrate in sequence by sputtering and
pulsed laser deposition, respectively. This superconduct-
ing wire exhibits 3MA/cm2
or higher critical current that is
applicable for practical use.
(Left) A PV inverter converts generated DC power to AC
power. Provided with voltage control and communication
functions, it also resolves natural energy problems such
as fluctuations in output power.
(Right) POWER DEPO®
Ⅱstorage battery system
Our newly developed sEMSATM
is an energy management
system that enables energy consumers to optimize their
energy management using a variety of distributed energy
resources including renewable energies. By optimally
managing and controlling functions of power generation
and power storage facilities, sEMSATM
helps save energy
as well as electricity costs.
In a power system using power generated by renewable energy,
the storage battery plays the critical role of storing and discharg-
ing electric power in response to fluctuations in generated electric
power. Redox flow batteries are suitable for irregular, highly fluc-
tuating charge/discharge operations, enabling accurate monitor-
ing and control of stored electric power. Accordingly, they are
optimal storage batteries for smart grids designed for efficient use
of solar, wind power and other renewable energy resources. We
are focusing product development efforts on redox flow batteries
for use in smart grids on a fully commercial basis.
06 07
PV inverter and POWER DEPO®
Ⅱstorage battery system
Micro smart-grid demonstration system
Concentrator photovoltaic
Superconducting tape
Energy management system
Power System
R&D Center
Renewable energy power sources
Devices/control technology to stabilize electric power systems
Energy saving devices and electric power monitoring/control technology
Power generating facilities and devices
(solar, wind power, etc.)
Electric power system
and electric power plant NW
Next-generation power transmission/distribution network (new cables/transmission lines, DC power transmission, superconductivity)
Stabilizing devices (storage batteries, transformers, SVC, preventing isolated operation, etc.)
Automated, system operating system
Control center
Power generation Power transmission
Wind and solar power
Large load
(air conditioners,
refrigerators, etc.)
Heat pump
Water heater
Storage
batteryMonitor
Smart
meter
to supply
side Server
Transformation Distribution Consumption or
distributed power sources
SiC inverter
HEMS, DSM, DR and Home NW
Interface with electrical load products
V2G system
s
DC/DC
ココンバータ
DC/DC
Converter
DC/DC
ココンバータ
DC/DC
Converter
DC/DC
ココンバータ
Bi-Directional
Converter
DC/DC
ココンバータ
DC/DC
Converter
DC power
AC power
Information
Photovoltaic
Smart distributor Inverter
Redox flow battery
Concentrator photovoltaic
EV charging station
Superconductor electric vehicle
Small wind turbine
Display/
operation terminal
Intelligent tap
Central control server (EMS server)
Redox flow battery

5. R&D カタログ
P08-09
Our R&D Center is developing broadband communication technologies, such as optical
communications, wireless communications and their terminal equipment. In order to create
social infrastructure systems such as energy management systems and infrastructure/plant
monitoring systems, we are also working on key technologies such as sensing, communica-
tions, information management, and basic technologies such as M2M (machine to machine)
wireless communications and a service application platform for cloud computing.
We are working on the development of the Service Appli-
cation Platform to be applied to various services/systems,
such as Telematics navigation services, energy manage-
ment systems and infrastructure/plant monitoring systems.
Our Service Application Platform features various technolo-
gies such as big data processing/analysis/prediction,
security/authorization, and platform virtualization based on
our own technologies - such as cloud computing, service
gateway, sensing and wireless communications.
We are developing communication and control tech-
nologies for efficient and optimal energy consump-
tion, such as demand response technology that sup-
presses energy consumption in the event of a power
shortage, and an Home Energy Management System
(HEMS) that automatically controls energy con-
sumption of in-house appliances.
Combining Sumitomo Electric’s optical component
and system technologies, we work on the techno-
logical development of 10G-EPON*1
to achieve ultra-
fast 10 Gbps access. Through shared use of the GE-
PON*2
branched optical fiber network currently in
widespread use, 10G-EPON economically increases
the speed of access networks 10-fold.
*1 10G-EPON：10 Gigabit Ethernet Passive Optical Network
*2 GE-PON：Gigabit Ethernet Passive Optical Network
To achieve a safe and environmentally
friendly traffic society around the world, we
are developing advanced traffic control
technologies, and communication and
sensor technologies for ITS cooperative
vehicle-infrastructure systems. We are also
tackling the development of telematics that
provide vehicles with real-time traffic infor-
mation through the collection and process-
ing of probe information, including a
vehicle’s location and speed.
For high speed and large capacity commu-
nication that is required for future infra-
structure, we are developing equipment
/modules for wireless access networks
through the integration of our technologies
such as RF amplifiers, antennas, and signal
processing. Remote Radio Heads (RRHs)
and high-efficiency RF amplifier modules
have already been commercialized, and
active antennas are now under develop-
ment for next-generation communication.
With the progress and spread of IC and
wireless communications, we believe that
new services will be created as a result of
data analysis conducted through the use of
the enormous amount of sensors used to
collect various types of information. We are
working on M2M*3
wireless equipment with
low energy consumption that will play an
important role in future sensor networks,
and analytical technology that predicts
aging and detects malfunctions. Application
to infrastructure monitoring systems and
plant monitoring systems will be addressed.
08 09
High-speed optical access system
Service application platform
Energy network
Infrastructure/plant monitoring
Global ITS and telematics
Equipment and module for wireless access
Infocommunications and
Social Infrastructure
Systems R&D Center
Energy Networking
Technology
Application Service Platform Technology
M2M Wireless Device
HEMS
Platform
EV Route
Planning Service
Surveillance Service/
Information
Providing Service
Application Programming Interface
Cloud ComputingCloud ComputingCloud Computing
Parallel Distributed
Processing/
Big Data Processing
Data Analysis/
Prediction/
Optimization
Security/
Authentication
Network
Virtualization
Energy Management
Service
Speedup via 10G-EPON
Use of existing PON line
GE-PON subscriber’s terminal
Shared with
GE-PON
Video service proliferation
Multichannel broadcasting
Higher resolution
10G-EPON
center device
(shared with GE-PON)
10G-EPON
subscriber’s terminal
10G-EPON
subscriber’s terminal
Service
Gateway
Service
Gateway
Service
Gateway
Home Energy
Network
Home Energy
Network
Home Energy
Network
Facility Energy
Network
Facility Energy
Network
Facility Energy
Network
Telematics
M2M Wireless
Equipment
Infrastructure
Monitoring System
Sensors
車両接近中
車両接近中
注意！
Roadside-to-Vehicle
Communication
Inter-Vehicle Communication
（Driving Support
Information, etc.）
（Probe Information Collection by Roadside Units）
Roadside-to-Roadside
Communication
Traffic Information
Recommended
Route Provision
Vehicle Trajectory
Probe Information
Collection
（Advanced Traffic
Signal Control）
Global Telematics Server
（Probe Information/Analysis/
Processing Technologies）
ITS Cooperative
Vehicle-Infrastructure Devices
Monitoring Operation
and Deterioration
Energy-Saving
Wireless Communication
DB
Monitoring
Data
Monitoring
Data
Monitoring
Data
Data Analysis
Monitoring and Failure Detection
of Roads, Bridges,
Plant Equipment, etc.
RF amplifier module
RRH Mobile base station antenna
Active antenna
*3 M2M (Machine to Machine) refers to automated
communication between devices.

6. R&D カタログ
P10-11
The Analysis Technology Research Center supports the Sumitomo Electric Group’s manu-
facturing, product development, business development and technological foundation. The
center is active at three sites, in Osaka, Itami and Yokohama, uses advanced large research
facilities (SPring-8, Earth Simulator, etc.) outside the company, and boasts sophisticated
analysis techniques and computer aided engineering (CAE).
We work on the development of a technology to
visualize, with high spatial resolution, the distribution
of a low-concentration dopant that determines the
characteristics of functional materials and parts,
using an electron probe microanalyzer.
Our efforts are directed toward developing a
nanometer-level structural analysis technology in
order to establish an analytical technology and its
applications, principally using scanning transmission
electron microscopes and conducting crystal struc-
ture analyses.
We work on technological development such as
structural analysis of materials at the atomic scale
and in-situ reaction analysis, using synchrotron
radiation and neutrons.
Moreover, our aims include elucidation of character-
istic development mechanisms and exploration of
new materials, in which the aforementioned technol-
ogy is combined with first-principles calculation and
other simulations.
We promote the development and widespread use
of CAE analysis techniques that are useful for prod-
uct designing. Our efforts include providing training
to designers and developing simplified/automatic
analysis systems. Thus, we work on the transfer of
analysis techniques to design departments using
procedures that precisely meet designers’ needs.
Mobile phone hinges, automotive doors and robot
arms have electric wires and cables installed in their
moving parts. We work on the development of a
computer simulation technology for predicting the
service life of such wires and cables until breakage
due to twisting and bending.
Dual beam machining
and observation equipment
Three dimensional analysis
of IC inner structure
Observation of
arbitrary cross section
3D structure visualization
Elemental mapping with sub-micron resolution
Nanometer-level structural analysis
Analysis on the atomic scale using synchrotron radiation and first-principles calculation
Strategic CAE infrastructure development
For widespread use of CAE for analytical purposes
Electric wire service life prediction
10 1 1
The use of CAE is not simply intended to improve
product development efficiency. We regard it as a
key technology for attaining increased market com-
petitiveness. Our efforts are directed toward infra-
structure development to enhance the core CAE
functionality of the Sumitomo Electric Group.
*IBM, IBM System x are either registered trademarks or trademarks
of IBM Corporation in the United States, and/or other countries.
*Intel, Xeon are either registered trademarks or trademarks of Intel
Corporation in the United States, and/or other countries.
1μm
1μm
入射電子
EDX detector
Annular dark-field
detector
(HAADF)
Bright-field detector
High-angle
scattered electrons
Transmitted electron
Thin-film specimen
Incident electron
Characteristic X-ray
Scanning Transmission Electron Microscope
Probe diameter: 0.1 nm
Superconducting material
High magnification image
STEM image
JEOL JEM-2100F/Cs
[Accelerated voltage: 200 kV]
Courtesy of RIKENCourtesy of RIKENCourtesy of RIKEN
K computer
Analysis Technology
Research Center
IBM System x / x3650 M4
464 CPU Cores [10.7TFLOPS]
Intel Xenon (Sandy-Bridge)
Large Capacity Type (1Node:32Core) 691GFLOPS
SMP Type (2Node:16Core) 422GFLOPS
MPI Type (26Node:416Core) 9,651GFLOPS
Open
Turn Display
Keyboard
harness
Micro Structure
Analysis (FEM)
Conductor Shield
Insulator Jacket
0.3
mm
1. Motion Analysis (FEM) 2. Strain Calculation 3. Fatigue Analysis
Master Curve
Lite
Strain
Power cable accessories
and analysis example
0
1
2
3
4
5
6
Requiredtime(day)
Conventional method Automated system
Result processing
Computation
Mesh generation
Automated system
High-speed networksHigh-speed networksHigh-speed networks
Yokohama
General computation server
Itami
General computation serverIn-house Affiliates
Electron probe
microanalyzer
Elemental mapping of sintered aluminum nitride
High
LowCrystal
grain
Crystal grain
boundary
Impurity deposits atImpurity deposits at
grain boundariesgrain boundaries
(≦1μm)m)
Impurity deposits at
grain boundaries
(≦1μm)
SEM image
Microfocus X-ray CT system 3D observation of internal strand structure of multicore cable
Large synchrotron radiation facility (SPring-8)
Structural analysis example
(Er-doped optical fiber)
Measurement by SPring-8 X-rays
Molecular dynamics simulation
Interatomic distance (nm)
Radialdistributionfunction
Electrons revolve inElectrons revolve in
storage ring 500 m in diameter.storage ring 500 m in diameter.
Electrons revolve in
storage ring 500 m in diameter.
Courtesy:Courtesy:
Japan SynchrotronJapan Synchrotron
Radiation Research InstituteRadiation Research Institute
Courtesy:
Japan Synchrotron
Radiation Research Institute
High-intensityHigh-intensity
X-raysX-rays
High-intensity
X-rays
Analysis time reduced to one-fifth
Three-dimensional structure visualization has been
developed to observe the internal structures and tar-
geted areas of composite materials, parts, products,
as well as objects as they are.
This technology is useful for improving product qual-
ity and developing solutions to problems.

7. R&D カタログ
P12-13
In metal/organic material fields, we have not only created unique materials but also innova-
tive processes using our own technologies such as high pressure and powder metallurgy. We
promote business expansion in industrial materials and other business fields of our company
through the development of high functional materials/parts including cemented carbide cut-
ting tools, diamonds, ceramic materials, sintered ferrous alloy parts and special steel wires.
In the thin film technology field, we are
conducting R&D on the coating of hard
ceramic films on cutting tools with good
adhesion.
We have developed functional ceramic
material with unique thermal, electrical,
and optical features. Currently, large
aluminum nitride/silicon nitride sub-
strates with smooth surfaces are under
development.
We are responding to
both market and customer
needs using our array of
core technologies.
In the field of powder metallurgy-based materials, we have devel-
oped cemented carbide for cutting tools, cermets, and sintered Fe
alloy and Al alloy parts for automobiles.
More recently, our development efforts have been focused on
nano-polycrystalline diamonds that consist of crystals with dimen-
sions of several tens of nanometers and are harder than single
crystal diamonds. We have also worked on the development of
low-loss powder magnetic cores suitable for high-frequency
bands and commercial products based on these materials.
Accommodating various needs based on our core technologies
In the special steel wire field, we are working on the
development of high performance spring wires and pre-
stressed concrete (PC) strands, using our rolling, heat
treatment, and wire-making technologies. Our recent
development efforts have been focused on electrical dis-
charge machining wires used for the precise processing
of machine parts and metal molds.
Cemented carbide tool
Powder magnetic cores Nano-polycrystalline diamond
(Sold under the trade name of Sumidia Binderless)
2mm
Oil-tempered wires for valve springs
Electrical discharge machining wires
（Sold under the trade name of SumiSparkγ）
Cross section of electrical discharge machining wire
Coated endmill
Aluminum nitride substrate Silicon nitride substrate
12 13
Powder metallurgy/ultra-high pressure technologies
Melt-casting/plastic working
Thin film/sintering technologies
Advanced Materials
R&D Laboratories
High hardness &
high strength
Process innovation
Powder metallurgy
Ultra high pressure
Thin film coating
Light weight & high
corrosion resistance
Heat resistance & high
thermal conductivity
Superior magnetic
properties
Environmental burden
reduction & conserving
scarce resources
●
Cemented
carbide/cermet
●
Synthetic diamond●
Cubic boron nitride●
Magnetic materials●
Special metal wire●
Ceramics●
●
●
●
●
*Received Best 10 New Products Awards sponsored by The Nikkan Kogyo Shimbun (2013)
and Okochi Memorial Technology Prize (2014)

8. R&D カタログ
P14-15
Heat shrinkable tubeMagnetic wire for HV Flexible printed circuit
Wiring harness using aluminum wires
MgSiC heat spreader
Aluminum-Celmet Molten salt electrolyte battery
Mobile devices・PC
Flat TV
Digital Camera
HDD
Touch panel
FPC with fine circuits
5μm line width
Synthesis & application of metal nano particles
Paste composition, Printing, Circuit design
Ag nano particles Cu nano particles Chainlike Ni nano particles
SUMI-CARD™ Module for cars
Ink-jet printing
Ag nano ink Cu nano inkConductive paste
Screen-printing
50nm50nm 300nm300nm50nm 300nm
We are supporting the widespread business fields of our com-
pany through the technological development of metal/polymer
materials and wiring/connection that originated from cable
technologies. We also promote the application of our technolo-
gies to energy devices such as batteries.
For the weight reduction of wiring materials for automobiles, we are conducting the development of aluminum alloy
wires and their application to wiring harnesses in collaboration with our group companies using our technologies of
continuous casting and plastic forming.
Our electroplating technologies, originated from the coating of gold and other metals, have also produced bulk mate-
rials such as Celmet. We have recently been working on the development of new types of batteries employing the
chemical properties of our plating solutions.
Employing our composite material technologies, we are developing new materials designed to have well-balanced
properties such as thermal conductivity and expansion.
Gold plated products
Aluminum alloy wires
Our polymer technology, originating from the research
on the insulator for wire and cable and based on the key
technologies of polymerization and polymer formula-
tion, has been developing many new products for our
group, while improving flame retardant, heat resistant
and environmental properties of polymer material intro-
ducing polymer alloy and halogen free technology.
Recently, we have developed the novel high strength
molding material suitable for thin wall extrusion apply-
ing the nano-composite technology which involves
exfoliating and dispersing nano-size fillers.
To cope with high density wiring, we are developing metal nanoparticles and ink/paste containing them. We are
focusing on its application to electronic appliances.
Tech. of polymer synthesis & compounding
Business contribution
14 15
Metal & inorganic material technologies
Energy and Electronics Materials
R&D Laboratories
Metal &
Inorganic
Material
Technologies
Polymer
Material
Technologies
Wiring &
Connection
Technologies
Polymer material technologies
Wiring & connection technologies
High-strength polymer film
Microdispersion of two polymers insoluble each otherMicrodispersion of two polymers insoluble each other
→ New material with both featuresNew material with both features
Microdispersion of two polymers insoluble each other
→ New material with both features
Exfoliated nanofiller
Polymer
alloy
Polymer A
Nanocomposite
Polymer
Polymer B
Miscible to
Polymer B
Miscible to
Polymer A
Compatibilizer
Polymer alloy Nanocomposite

9. R&D カタログ
P16-17
Focusing on compound semiconductors which are the key materials for photonic devices cover-
ing ultraviolet to infrared and superior electronic devices indispensable for wireless and optical
communication as well as power electronics, we are conducting research and development on
semiconductor materials and their application technologies, as well as peripheral technologies.
Compound semiconductors are widely used for opti-
cal devices and electronic devices. In each of these
areas, we work on technological development
aiming at downstream products such as epitaxial
wafers, devices and modules, based on our material
and device technologies.
In the past, material designs depended on experi-
ment alone. However, we are now working on simu-
lation technologies that will help us expand our total
range of R&D, such as the first principle calculation
and thermal-fluid analysis technique.
We anticipate various applications, such as the cre-
ation of new materials and the development of pro-
duction process.
Compound semiconductors are widely used in various
application fields in which silicon devices cannot be used.
Sumitomo Electric has developed a variety of materials
as a pioneer in this field.
Making use of our technologies of bulk crystal growth,
epitaxial growth, simulation technique, characterization
and analysis, we are promoting research and develop-
ment on high-quality, cost-effective solutions for
application-specific needs as well as on challenges for
new materials.
Using our GaN substrate, we successfully developed pure green laser diodes following conventional blue-purple
ones. Widespread applications including displays are expected.
GaN also has excellent features as a sub-
strate material for electronic devices. To
make full use of its advantages, we have
developed vertical transistors and now are
conducting their evaluation. They are
expected to surpass conventional silicon
devices in switching speed and energy
saving.
We are conducting research on the thin film growth technology of compound semiconductor crystals. Aiming
at the application to near-infrared sensors for chemical imaging, light-emitting devices and advanced power
transistors, novel thin film crystals are being developed using our nano-structural analysis.Analysis of doped GaN
(first principle calculation)
Analysis of GaAs crystal growth
(Thermal-fluid analysis)
16 17
Sumitomo Electric’s compound semiconductors and their application
Product development and key technologies
Green semiconductor lasers
GaN-based transistor
Development of semiconductor thin films
Semiconductor Technologies
R&D Laboratories
Material design technologies
*Blu-ray is a registered trademark or trademark of Blu-ray Disc
Association in the United States, and/or other countries.
Material Photonic device
Red laser
Red / Infrared LED
(DVD, PC, automotive and
outdoor display applications)
Infrared laser/
Photo-detector
(Optical communications)
GaAs
GaN
AIN
InP
High-frequncy device
Low-noise amplifier
(Mobile phones, wireless
base station and satellite
communication systems)
High-frequency device
High-power device
(Wireless base stations,
power controllers
and electric vehicles)
Next-generation
power device
Blue-violet laser
Blue/White LED
(Blu-ray, LCD backlight, outdoor
display and lighting applications)
Ultra-violet laser/
LED
(Sterilization, cleaning and processing)
Electronic device
Photonic Device Electron Device Core Technologies
Assembly
Design
Device
Process
Characterization
Thin film growth
Equipment
Characterization
Innovative plane-direction substrate to overcome the green gap
Efficiency(%)
Wavelength (nm)
Green gap
Electrode
Substrate
Electrode Green semiconductor laser structure
GaN (0001) plane GaN (2021) plane Green semiconductor laser
On-resistance[mΩcm2
]
Breakdown voltage [V]
Target
Vgs=+1V to -3V
step -1V
AlGaN/GaN
channel
Source
electrode
Contact layer
Gate electrode
Barrier layer
Drift layerDrift layerDrift layer
GaN substrateGaN substrateGaN substrate
Drain electrode
Draincurrent[mA]
Drain voltage [V]
I-V characteristics TEM image
Device structure
Drain
current
35nm
Target
Epitaxial
Growth
Technology
Transmission Electron Microscope (TEM)
Atomic Force Microscope (AFM)
Growth technology
of multi-layers
Challenge for new materials
in undeveloped-area
Light
sensing
layers
High Al composition
AlGaN thin film
Green laser
Power device
Near-infrared
ray sensor
Electronic device
InP substrate
AlN substrate
Quantum well
structure
Simulation
Technology
Unique
Application
Technology

10. R&D カタログ
P18-19
Based on optical fiber technologies that are the foundation of broadband communication
networks, we are developing elemental technologies and products that support the creation
of high speed and large capacity optical communication networks and "fiber to the home"
(FTTH) access networks. We will study technologies in the infocommunications infrastruc-
ture field in more depth, and also challenge ourselves to develop the products of our optical
communication technologies for consumer markets, such as optical interconnection prod-
ucts. Through these activities, we will contribute to the progress of a smart network society.
Optical/electrical interconnection is not only used as wiring among information equipment incorporated into data
centers/high-performance computers, but also as internal wiring in such equipment. It is of growing importance
together with the information explosion. We are conducting integrated R&D such as active copper cables, active opti-
cal cables that comprise optical cables and connectors with built-in vertical cavity surface-emitting lasers (VCSELs)
and photo-detectors, ultra-high count multi-fiber optical connectors made through precise injection molding initially
developed for public communication products, and bend-resistant fiber cables developed for easier handling.
Ultra-low-loss optical fiber
Using pure silica core and combining our cre-
ative loss reduction technologies, we suc-
ceeded in the development of Z-PLUS Fib-
erTM 130ULL with the transmission loss of
0.149 dB/km at 1550 nm. The mass-produced
type of this fiber attains 0.154-dB/km loss.
0.10
0.15
0.20
0.25
0.30
1450 1500 1550 1600 1650
Wavelength [nm]
FiberLoss[dB/km]
標準的な光ファイバ
Z-PLUS Fiber 130 ULL
0.149dB/km
0.19dB/km
F-doped SiO2
Pure SiO2
Core
Cross sections of multi-core fibers
7 cores 8 cores 36 cores × 3 modes
7 single-core
optical fibers
Multi-core
optical fiber
Multi-core optical fiber
Single-core
optical fiber bundle
18 19
Development of optical fiber
We are conducting R&D on the innovative multi-core optical fibers (MCF) and connection technologies that can
achieve petabit optical transmission through single fiber and overcome the limits of conventional technologies.
Next generation optical fibers and connection technologies
Optical/electrical interconnection technologies
We are developing "CompovisionTM
," a chemical imaging system that reveals the compositional distribution and
slight change of measured substances in two-dimensional images in real time.
Development of CompovisonTM
Z-PLUS Fiber®
130ULL
Since the early 1970s, we have developed the
vapor-phase axial deposition (VAD) method, a
Japanese original optical fiber manufacturing
technology, and used it practically for mass pro-
duction. For the functional improvement of opti-
cal fiber, we push ahead with the development
of innovative structural design and mass produc-
tion technologies.
Multi-Core/single-core conversion connector
Visible light image
Absorbance
Optical connector for
36 single mode fibers coupled with lens
Courtesy of Nakauchi laboratory, Toyohashi University of Technology
Two-dimensional array
of near infrared sensors
Lens
SpectrometerNear infrared
light source
Scan direction
Reflection
Bend insensitive fiber for
houses and data centers
Copper cable module for
the connection of data center equipment
Active optical cable for
100 Gbit/s transmission
Active optical cable for
information equipment connection
Terminal equipmentTerminal equipmentTerminal equipment
SwitchboardSwitchboardSwitchboard
StorageStorageStorage ServerServerServer
RouterRouterRouterSwitchSwitchSwitch
Optical Communications
R&D Laboratories
Near infrared Image analysis
FatcontentConc.ofoleicacid
Conveyance
direction
Measured
object
Wavelength
CompovisionTM

11. R&D カタログ
P20-21
We are developing leading edge technologies and providing high performance products
widely used in the communication industry. For optical networks, we have developed high
performance optical devices, sub-assemblies and transceivers. We have also developed high
speed, high power electron devices such as HEMTs and MMICs for wireless communication.
Our development is based on vertical integration of creative technologies such as crystal
growth of compound semiconductors, wafer processing, assembling technique, and ad-
vanced design ability.
Through the contribution to the standardization of opti-
cal transmission specification, we are developing high
speed optical transceivers. Employing elemental tech-
nologies including high-speed analog circuit, digital
control and mechanical design as well as our accumu-
lated technologies such as optical devices, OSA and IC
design, we push forward with the miniaturization and
power saving at 100 Gbit/s transmission (25 Gbit/s
wavelength), and also exploring new technologies at
400 Gbit/s transmission (50-100 Gbit/s wavelength).
We have been developing two-dimensional infrared
imaging sensors based on the photo-detector technolo-
gies used for optical communications. These sensors
have lower noise than conventional ones and are suit-
able for microanalysis.
Applications for these sensors can also be found in sys-
tems for two-dimensional diagnosis of tissues, foods
and agricultural products as well as for gas monitoring
systems that measure toxic and environmental gases.
Toward the deployment of 10 Tbit/s-class ultra large capac-
ity transmission using wavelength division multiplexing,
digital coherent transmission technologies have recently
been the focus of attention.
Using our unique compound semiconductor technologies,
we are working on the development of important compo-
nents such as high-power and narrow linewidth tunable light
sources, multi-level modulators, and coherent receivers.

00
1110
01
Transmitted signalMulti-level modulatorTunable light source
20 21
Optical transceivers
Coherent devices
Wireless devices
Infrared imaging sensors
CFP(100G)
（145×82×14mm；32W）
QSFP28(100G)
（72×18×8.5mm；3.5W）
Miniaturizationon
We are the pioneer of gallium arsenide (GaAs) HEMT*1
and have played an important role in the development
of wireless communication. Quickly applying the tech-
nology to gallium nitride (GaN), we have greatly con-
tributed to the miniaturization and efficiency enhance-
ment of base stations for high-speed mobile communi-
cation (LTE). We are also focusing on higher frequency
and output devices for larger capacity communication
among base stations and satellites, as well as for solid
state radars. MMICs*2
, that comprise integrated HEMTs,
are also used in millimeter wave automotive radars.
Electromagnetic
analysis
Heat radiation
analysis
Transmission Devices
R&D Laboratories
Epitaxial growth technology
Wire
bonding
Hermetic
seal
YAG welding Multi-wavelength integration
10Gbit/s
Optical sub-assembly
100Gbit/s
Optical sub-assembly
100μm
10mm
inchinch2-inch
Optical
fiber
Semiconductor photodetector
Satellite
communication
Automotive radar
Wireless LAN
Cellular
base station
Wireless
infrastructure
(short haul)
Wireless infrastructure
(long haul)
Optical communication network
Metro networkMetro networkMetro network
Access and PONAccess and PONAccess and PON
Data centerData centerData center
Wafer process
Wafer
Chip
*1 HEMT：High Electron Mobility Transistor
*2 MMIC：Monolithic Microwave Integrated Circuit
Visible Near-infarared(NIR)Near-infarared(NIR)Near-infarared(NIR)
Sensor chip
Read-Out IC
Visible image(CCD)
Near infrared image
Mid-infrared camera
Mid-Mid-infrared lasernfrared laserMid-infrared laser
Mid-infrared(MIR)Mid-infrared(MIR)Mid-infrared(MIR) Far-InfraredFar-InfraredFar-Infrared
Automation of products quality inspection Toxic・VOC gas/environmental gas detection system
Sensor/camera
Si wafer
Outputpower(watt)
Frequency (GHz)
IMFET
PA
LNA
: Internal matched FET
: Power amplifier
: Low noise amplifier
SATCOM
VSAT
DBS
: Satellite communication
: Very small aperture terminal
: Direct broadcast satellite
1000
100
10
1
0.1
0.01
0.001
1 10 100
GaN HEMTs
PA MMICs
Mix / Mult /
Osc MMICs
FET
HEMT
W-CDMA,
PCS,
WiMax,
LTE,
Base Station
SATCOM, VSAT, Space,
P-to P Radio
P-to-P Radio
Automotive
radar
DBS
PA / LNA MMICs
PA MMICs
IMFETs
We are a leading company of semiconductor optical devices that
are key components in optical communication systems. The prod-
uct family covers 10Gbit/s LD, CWDM LD, DWDM electro-
absorption modulators integrated with LDs and tunable LDs, etc.
To provide these devices, we have been developing various
cutting-edge technologies such as high quality epitaxial growth
technology, sub-micron wafer process technology, and reliability
assurance technology.
Our optical sub-assemblies realize high performance, low power
consumption and compactness with the combination of our own
device technologies such as photo-detectors, light emitting
devices, ICs and design technologies such as high-speed trans-
mission lines and unique packaging. To meet the requirements of
various optical communication systems, we intend to continu-
ously supply cutting-edge products to the world.
Optical devices
Optical sub-assemblies

12. R&D カタログ
P22-23
Innovation Core SEI, Inc. (ICS)
China Analysis Technology Center
Based on the nutrient culture system we have been developing for years, we aim to
achieve a stable supply of vegetables through industrially managed production.
（Water Source））
Fertigation
Controller
Drip Fertigation
Tube
Liquid Fertilizer
Dilution Unit
Fertigation
Control Unit
Sandculture Bed
Nutrient Culture System Products (tomatoes)
Agri-Science R&D Department
Water Treatment R&D Department
The Water Treatment R&D Department has developed a chemical-free and eco-
friendly ballast water treatment system "ECOMARINETM
" composed of a filter unit with
high plankton removal performance and UV unit with low power consumption. We
promote further development for its market and move forward to obtain approvals
required to install it on ship from domestic and overseas certification bodies.
“EcomarineTM
” was demonstrated
on Asuka II of NYK Cruises Co., Ltd.
UV-based system configuration
22
23
Overseas operations
No.232 Jinfeng Road, SND, Suzhou, Jiangsu, China
TEL : +86-512-6665-3090
2355 Zanker Road, San Jose, CA 95131, U.S.A
TEL : +1-408-232-9511
ICS was established in Silicon Valley, United States, as the
first overseas base for R&D. By utilizing Silicon Valley’s
resources and environment, ICS conducts research for next
generation technologies and markets, and creates new busi-
ness for Automotive, Environment & Energy, and Infocom-
munications fields. Besides supporting the headquarters on
various R&D and business development projects, ICS has
also been supporting the globalization of R&D through
activities such as promoting open innovation and Global
Internship Program.
The China Analysis Technology Center is located in Suzhou,
east China, and provides analytical support for the produc-
tion and development of our group in China.
The China analysis technology center is located
in the Sumitomo Electric Interconnect Products (Suzhou) Ltd. (SESZ) building.
Sumitomo Electric San Jose Office Building
22
Technologies in our new business fields such as "life science" and "resources"
are being developed.
Research Advanced Driver Assistance Systems and Autonomous Driving
technologies, and participate in various pilot projects
R&D for EV and next generation energy efficient vehicle infrastructure
Study ITS innovation and trends in the future of transportation
Commercialize Redox Flow Battery and CPV, the main next generation energy business
Create new businesses through integration of Energy and ICT.
Study New Advanced Water Treatment Business using SEI core technologies
R&D of new communication technology to support evolving Cloud Society
Research new lifestyle and social system brought by the IoT
Study next generation manufacturing business lead by Industry 4.0
Automotive
Environment & Energy
Infocommunications
New Business Frontier
R&D Laboratories
“EcomarineTM
” ballast water treatment system
Ballasting
PP
De-ballasting
PP
Seawater
Treated
waterSeawater
intake
Untreated
seawater
discharge
UV unit
Pump
Filter unit
Ballast water
Ballast water tank
Pump
Filter unit
Treated
water
discharge
Sterilization by
ultraviolet irradiation
UV unit
Ballast water tank
Ballast water
①Removal of large
plankton
②Sterilization by
ultraviolet irradiation
PumpmppppppppppppPumpPumpPumpPumpPumpPumpPumpPumpPump
UV unitUV un titUV un titUV un titUV un titUV unitUV unitUV unitUV unitUV unitUV unitUV unitUV unitUV unit
Filter unitFilter unitttFilter unittFilter unittFilter unittFilter unitFilter unitFilter unitFilter unitFilter unitFilter unitFilter unitFilter unitFilter unit
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