JCL Inc. Is a major chip manufacturing firm that sells its products to computer manufacturers like Dell, Gateway, and others. In simplified terms, chip making at JCL Inc. Involves three basic operations: depositing, patterning, and etching. - Depositing: Using chemical vapor deposition (CVD) technology, an insulating materlal is deposited on the wafer surface, forming a thin layer of solid material on the chip. - Patterning: Photolithography projects a microscopic circult pattern on the wafer surface, which has a light-sensitive chemical Ilke the emulsion on photographic film. It is repeated many times as each layer of the chip is bult. - Etching: Etching removes selected materlal from the chip surface to create the device structures. The table below lists the required processing times and setup times at each of the steps. There is unlimited space for buffer Inventory between these steps. Assume that the unit of production is a wafer, from which Individual chips are cut at a later stage. Do not round intermediate calculations. Round your answer to 2 decimal places. a. What is the process capacity in units per hour with a batch size of 150 wafers? units per hour Do not round intermediate calculations. Round your answer to 2 decimal places. b. What is the utilization of depositing if the batch size is 150 wafers? %.

1. JCL Inc. Is a major chip manufacturing firm that sells its products to computer manufacturers
like Dell, Gateway, and others. In simplified terms, chip making at JCL Inc. Involves three basic
operations: depositing, patterning, and etching. - Depositing: Using chemical vapor deposition
(CVD) technology, an insulating materlal is deposited on the wafer surface, forming a thin layer
of solid material on the chip. - Patterning: Photolithography projects a microscopic circult pattern
on the wafer surface, which has a light-sensitive chemical Ilke the emulsion on photographic
film. It is repeated many times as each layer of the chip is bult. - Etching: Etching removes
selected materlal from the chip surface to create the device structures. The table below lists the
required processing times and setup times at each of the steps. There is unlimited space for
buffer Inventory between these steps. Assume that the unit of production is a wafer, from which
Individual chips are cut at a later stage. Do not round intermediate calculations. Round your
answer to 2 decimal places. a. What is the process capacity in units per hour with a batch size of
150 wafers? units per hour Do not round intermediate calculations. Round your answer to 2
decimal places. b. What is the utilization of depositing if the batch size is 150 wafers? %