PA 7-6 (Algo) JCL Incorporated is a major chip manufacturing... JCL Incorporated is a major
chip manufacturing firm that sells its products to computer manufacturers like Dell, Gateway,
and others. In simplified terms, chip making at JCL Incorporated involves three basic operations:
depositing, patterning, and etching. - Depositing: Using chemical vapor deposition (CVD)
technology, an insulating material is deposited on the wafer surface, forming a thin layer of solid
material on the chip. - Patterning: Photolithography projects a microscopic circuit pattern on the
wafer surface, which has a light-sensitive chemical like the emulsion on photographic film. It is
repeated many times as each layer of the chip is built. - Etching: Etching removes selected
material from the chip surface to create the device structures. The table below lists the required
processing times and setup times at each of the steps. There is unlimited space for buffer
inventory between these steps. Assume that the unit of production is a wafer, from which
individual chips are cut at a later stage. a. What is the process capacity in units per hour with a
batch size of 150 wafers? Note: Do not round intermediate calculations. Round your answer to 2
decimal places. b. What is the utilization of depositing if the batch size is 150 wafers? Note: Do
not round intermediate calculations. Round your answer to 2 decimal places..
PA 7-6 (Algo) JCL Incorporated is a major chip manufacturing... JCL I.pdf
1. PA 7-6 (Algo) JCL Incorporated is a major chip manufacturing... JCL Incorporated is a major
chip manufacturing firm that sells its products to computer manufacturers like Dell, Gateway,
and others. In simplified terms, chip making at JCL Incorporated involves three basic operations:
depositing, patterning, and etching. - Depositing: Using chemical vapor deposition (CVD)
technology, an insulating material is deposited on the wafer surface, forming a thin layer of solid
material on the chip. - Patterning: Photolithography projects a microscopic circuit pattern on the
wafer surface, which has a light-sensitive chemical like the emulsion on photographic film. It is
repeated many times as each layer of the chip is built. - Etching: Etching removes selected
material from the chip surface to create the device structures. The table below lists the required
processing times and setup times at each of the steps. There is unlimited space for buffer
inventory between these steps. Assume that the unit of production is a wafer, from which
individual chips are cut at a later stage. a. What is the process capacity in units per hour with a
batch size of 150 wafers? Note: Do not round intermediate calculations. Round your answer to 2
decimal places. b. What is the utilization of depositing if the batch size is 150 wafers? Note: Do
not round intermediate calculations. Round your answer to 2 decimal places.
