Faculty of engineering and life sciences (FELS) of Unisel arranged an industiral visit to MIMOS (Malaysian Institute of Microelectronic Systems) on 10th April 2018 with 40 students from Electrical division. The purpose of visit was to enhance the industry exposure of the pariticpants, get the practical insights into manufacturing and to get aware of the real life situations of semiconduictor manufacturing.

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INSTRUMENT AND MEASUREMENT
INDUSTRIAL VISIT REPORT
MIMOS MALAYSIA
10th
April, 2018
PREPARED BY
SAIF UR REHMAN
(4162002261)
PREPARED FOR
MADAM ARNI SABITA

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EXECUTIVE SUMMARY:
Faculty of engineering and life sciences (FELS) of Unisel arranged an
industiral visit to MIMOS (Malaysian Institute of Microelectronic
Systems) on 10th April 2018 with 40 students from Electrical division.
The purpose of visit was to enhance the industry exposure of the
pariticpants, get the practical insights into manufacturing and to get
aware of the real life situations of semiconduictor manufacturing.

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TABLE OF CONTENTS
 Company’s Background
 Introduction
 Study visit framework and mainobjectives
 Experience from MIMOS
 Conclusion

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1.Company’s background
On Semiconductor is a preffered supplier of power and signal management
products andsolutions to customers throughout the world. With best in
class service and world class supplychain, they enable their customers
to meet their design challanges successfully. Our broadportfolio of
industry leading products including power-management, analog, DSP,
mixedsignal, Advanced logic, clock management, Circuit protection
and standard component
devices provide their customers a single supplier that’s complete,
effective and efficient.
2.Introduction
Todays, the growth of semiconductor technologies are increased
critically due to achievecustomers needs, companies competitionandtoget
the most prominent companies name.Many new
technologies introduced in production such as new design patterns,
new designrules, new fabrication andothers thatare parellel intechnologies.
According to Moore’s Law,
thenumber oftransistors onachiproughly doubles every twoyears. Asaresult
the scale gets smallerand smaller. For decades, Intel has met this formidable
challenge through investments intechnology
andmanufacturing resulting intheunparalleled siliconexpertise thathasmade
Moore’s Law areality.
3. Study visit framework and main objectives
This study tour was held in the framework of the subject "Semiconductor
Manufacturing Devices. We learned onfabrication process fromfront end until
backend. Students also exposed on fabrication of MOSFETby using simulation
by Silvaco software that are currently used in certain designs and fabrication
companies these days.

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Themain objectives are:
1.To expose students inreal fabrication process.
2.To provide opportunities for students to have
better understanding infabricationprocess.
3.To introduced students on new technologies in semiconductor and Ics
fabrication.
4.To provide opportunities for students i nfuture job infield of
semiconductor’s technology.
4.Experience from MIMOS:
MIMOS (Malaysian Institute of Microelectronic Systems)
TUESDAY 10.04.2018
9.00AM-5.00PM
The company hasstarted operates inMalaysiasince1984.Thecompaniy’s
production covered in:
1.Automative
2.Computing
3.consumer
4.industrial
5.portable/ wireless
6.Medical
7.Militry/Aerospace

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8.Networking
Since their production based on customers requirement, they have to achieve
the goals ofreducing power consumption and reducing size of chips. The
company need the best ofengineers to make new developement of design
andintroduce new technologies.
Requirements in an engineering development:
1.Problems solving
2.Being creative
3.Building things
4.Making discoveries
5.Communicating withpeoples
6.Technology development
7.Helping people
Those of requirements of engineering development will produce better
development and will
meet customer’s demands.
Company’s Production And Fabrication Process
Development Flow
Before gofurther tofabrication, we have toknowonprocedure tomakingchip
or new product by followcompany’s rules.

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 CUSTOMER
 INVESTIGATION
 REQUIREMENT DEVELOPMENT
 FEASIBILITY
 COMMERCIAL AGREEMENT
 INTERACTIVE DESIGN
 PROTOTYPE
 ENSURING QUALITIFICATION
 PRODUCTION RELEASE
FRONT END
Making wafers
 Wafers produced bythiscompany is6inchdiameter. The wafer ismade
from siliconthat extract from sands (SiO2). This wafer is then sliced into
small pieces(chip) insawing process thatwill be brief innext session.

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BACK ENDPROCESS:
After thesiliconisready,itisthensenttothebackendprocess. Wenotexposed
on oxidation, photolithography and lithography process. We only briefed
onpackaging process that includes testing process.
PROCESS INVOLVED
1. Leadframes
 Packages consisting of a lead frame embedded ina vitreous paste layer
between flat ceramic top and bottom covers are more
convenient than metal/glass packagesfor some products, but give
equivalent performance.

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2. DA Adhesives (Die Attach Adhesives)
 Dieattachment using paste type epoxy is atraditional method for die-to
substratebonding. Upon epoxy dispensed, the units are cured using a
stand-alone oven.Paste dispensing and curing isrepeated for multi-thin
die stack application. In theDA film process, DA films were cut and
pressed to a bottom die. Top die was thenplaced and thermal
compressed on the DA film. The same process of attachingfilm,
pressing die, wire bonding was repeated until multiple dies were
stacked.
3. Methylenediphenyldianiline (MDA) compound:
 The MDA isuded toprotect wires inIc’s from connected each other.

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4. Wafer mounting, wafersawing:
 Wafer mounting isastep that isperformed during the die preparation
of awaferaspart oftheprocess of semiconductor fabrication.During this
step, the wafer is mounted on a plastic tape that is attached to a ring.
Wafer mounting is performedright before the wafer is cut into
separatedies.The adhesive film on which thewafer is mounted ensures
that the individual dies remain firmly in place during'dicing', as the
process of cutting the wafer iscalled.
 Wafer dicing or sawing is the process by which die are separated from
awafer of semiconductor following the processing of the wafer. The
dicing process can be accomplished by scribing and breaking, by
mechanical sawing (normally with amachine called a dicing saw) or
by laser cutting.

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5. Wire Bonding
 Wire bonding is the primary method of making interconnections
between an integrated circuit (IC) andaprinted circuit board(PCB)
during semiconductor device fabrication.
6. Molding
 The bonded chip on the lead frame is encased in a synthetic resin or
ceramic packageinthe moulding process. Each mouldismanaged witha
unique ID. The moulds are heatedup to melt the resin.In this process, the
compoundisputinIcthenwithhighpressure, thatcompoundwillmelt..

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7. ICTesting:
 The main objective in Ic Testing is to get the Ic that function as
needed with ecxat valuewithout any failure. Ic is test using testing
machine, controlled by computers. All the nodes inIc is test to read the
parameter produced. During testing process, a tray of Ics are inserted
intomachine. The machinewilldoalltesting method. Anyfailure Dieswill
be left and the successdies is collected and separated. Inking is one
method to seperate failure dies from it to be tested. This is old method
because itincreased costinusing inks.The latesttechnology inseparating
dies is done by programs inthe machine. They add wafer mapping
program or coordinating in machine todetermine thelocation of failure
dies. So, thiswill reduce costinproducion.
5. Conclusion
 Inthisindustrial visit, ihadlearn morethanwhatiecpected before. From
the first briefing byDirector, Manager and Engineers, they are very
stressed about attitude during working.Besides, theintelligent engineers
is needed in this company to ensure that company couldachieve to the
higher level across the times. I learned muchinfabrication process from
frontend until back end process. So, i hope, the knowledges about
MOSFET technologies eitherdesignation or fabrication will influence me
tojoin incontributing semiconductortechnologies.

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“Your attitude, not your aptitude will determine your altitude”