The document provides a reverse costing analysis of the Qorvo TQF-6405 front-end module used in the Apple iPhone 6s Plus. It includes a physical analysis of the component and its packaging. The report focuses on the manufacturing cost analysis of the SMR BAW filter die. It estimates the cost of materials and manufacturing steps to determine the total cost of the MEMS wafer and die. This cost is then used to estimate the potential selling price based on the company's financial ratios.