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From Technologies to Market
GaN RF
Market
Applications, players,
devices & substrates
2016 - 2022
Sample
From Technologies to Market
© 2016
Executive summary
3
REPORT OBJECTIVES
• To have an overview of the entire GaN RF market.
• Analysis of different players in different markets as well as their product range and technologies.
• Access the market from wafer suppliers to device makers and system manufacturers.
• Understand the main technologies in RF GaN markets.
• Identify the key drivers which offer opportunities for GaN development.
• Discovering the need of different RF market and the impact on the needs for GaN technologies, as
well as geographical specificities.
©2016 | www.yole.fr | GaN RF Market: Applications, Players, Technology, and Substrates 2016 – 2022 | Sample
4
REPORT METHODOLOGY
Market segmentation methodology
Market forecast methodology
©2016 | www.yole.fr | GaN RF Market: Applications, Players, Technology, and Substrates 2016 – 2022 | Sample
5
REPORT METHODOLOGY
Technology analysis methodology
Information collection
©2016 | www.yole.fr | GaN RF Market: Applications, Players, Technology, and Substrates 2016 – 2022 | Sample
6
Biographies & contacts
ABOUT THE AUTHORS
Hong LIN
Dr. Hong Lin has worked atYole Développement as a technology and market analyst since 2013. She specializes in compound
semiconductors and provides technical and economic analysis. Before joiningYole Développement,she worked as an R&D
engineer at Newstep Technologies. She was in charge of the development of cold cathodes made by PECVD for visible and UV
lamp applications based on nanotechnology. She holds a Ph.D in physics and chemistry of materials
lin@yole.fr
Zhen Zong
Zhen Zong works as an analyst for Power Electronics and Compound Semiconductors technologies atYole Développement.He
graduated from INSA Lyon with an engineering degree in material sciences, specialized in semiconductor devices and
Micro/Nano technologies.
zong@yole.fr
©2016 | www.yole.fr | GaN RF Market: Applications, Players, Technology, and Substrates 2016 – 2022 | Sample
7
TABLE OF CONTENTS (1/3)
• Acronyms……………………………………………………………………..6
• Companies Cited in this Report……………………………………………...7
• Objectives of this report………………………………………………….......8
• Executive summary………………………………………………………….10
• Revision of report GaN RF 2014…………………………………………....20
– Which scenario?
– What we got right?
– What we got wrong?
– Comparison of market forecast
• RF GaN HEMT Technology overview………………………………………25
– RF Components overview (1/2)
– RF Components overview (2/2)
– Power and Frequency regions for Different semiconductors
– GaN HEMT DEVICE Structure
– GaN / SiC / Si / GaAs: Material properties
– GaN / SiC / Si / GaAs: power transistor comparison
– ADDED values of GaN
– Avantages at the system level for PA, LNA and RF switch
– GaN MMIC description
– Top view of GaN transistor and module
– RF package type and hermeticity
– Driver for plastic package
– The steps of GaN technology development history
• GaN RF device applications overview……………………………………….39
– Applications for GaN devices in RF electronic systems
– Radio frequency band range and applications
– GaN device applications roadmap
– RF power applications as function of frequency and power
– In which applications that GaN Is already used?
– Commercially available GaN RF power products
– Comparison between commercial GaN products and total market
– GaN RF device market breakdown
– GaN RF device market size forecast
– Market overview (1/2)
– Market overview (2/2)
• Wireless infrastructures…………………………………………………………………51
– Global connections by technology
– Telecommunication market shares
– Evolution of mobile telecommunication technology(1/2)
– Evolution of mobile telecommunication technology(2/2)
– Gan opportunity in cellular market
– 4G history and definition (1/3)
– 4G history and definition (2/3)
– 4G history and definition (3/3)
– WiMAX and LTE deployment planning – Last hour of WiMAX carriers…
– WiMAX market estimation
– 4G LTE & WiMAX market estimation
– Global LTE development forecast
– LTE deployment, companies, countries mapping in 2015
– List of regions by 4G LTE penetration in 2015
– Cellular network structure
– Backhaul for Point-to-Point (PtP) and Point-to-Multipoints (PtMP)
©2016 | www.yole.fr | GaN RF Market: Applications, Players, Technology, and Substrates 2016 – 2022 | Sample
8
TABLE OF CONTENTS (2/3)
– Typical LTE base station & cell tower
– Added value of GaN for BTS power amplifier(1/3)
– Added value of GaN for BTS power amplifier(2/3)
– Added value of GaN for BTS power amplifier(3/3)
– Worldwide deployed cellular base-stations evolution
– BTS supply chain
– Estimation of total accessible market for GaN FET in Telecom
– Number of wafers to be produced for GaN FET manufacturing for
Telecom BTS Market
– Wireless infrastructure GAN RF PRODUCT SCHEME
– Conclusions
• Defense………………………………………………………………………..78
– GAN application potential in defense market
– Military RF applications & frequency bands
– GaN applications in radar systems (1/2)
– GaN applications in radar systems (2/2)
– GaN APPLICATION IN EW/IED JAMMERS
– GaN application in ELECTRICAL CONTERMEASURES
– GaN RF application in military communication
– Market drivers of GaN RF in defense applications
– Roadmap for RF transistors volumes in defense applications
– Defense GaN product scheme
– Conclusions
• CATV market………………………………………………………………….91
– CATV: the basics
– Market drivers of GaN electronics in CATV (1/3)
– Market drivers of GaN electronics in CATV (2/3)
– Market drivers of GaN electronics in CATV (3/3)
– Evolution of DOCSIS 3.1
– CATV market in terms of geography
– HFC and FTTH comparison
– CATV market evolution:
– Estimation of RF GaN devices needs per year for CATV Market
– Number of 4” equivalent wafers to be produced for GaN FET manufacturing for
CATV Market
– CATV GAN RF PRODUCT SCHEME
– Conclusions
• Satellite communication market ……………………………………………………...104
– Where do we use gan in satellite applications?
– Market drivers of the GaN RF in SATCOM
– Market drivers of GaN electronics inV-SAT
– GaN implementation inVSAT T&R UNIT
– Estimation of RF GaN devices needs per year forV-SAT Market (units)
– GaN HEMT opportunities forV-SAT
– Estimation of RF GaN devices needs per year for SATCOM Market (units)
– GaN HEMT opportunities for SATCOM
– Satellite communication GAN RF PRODUCT SCHEME
– Conclusions
©2016 | www.yole.fr | GaN RF Market: Applications, Players, Technology, and Substrates 2016 – 2022 | Sample
9
TABLE OF CONTENTS (3/3)
• Other applications……………………………………………………..…..115
– GaN applications in RF Energy
– GaN applications in LTE-U
– GaN applications in plasma lighting
– Other applications GAN PRODUCT SCHEME
– Conclusions
• GaN RF devices industrial landscape………………………………………122
– Events and history of GaN RF industry
– Major GaN RF Players and their device Frequency Range
– Major GaN RF Players and their device Frequency Range
– Main GaN RF players and their target applications
– Market Landscape
– Mapping: Players of Power RF GaN based devices in US
– Mapping: players of Power RF GaN based devices in US
– Mapping: players of Power RF GaN based devices in Europe
– Mapping: players of Power RF GaN based devices in Asia
– GaN RF Foundry technology comparison
– Mapping of GaN on Si & GaN on SiC RF epiwaferVendors
– Mapping of GaN device foundry
– Global Industrial supply-chain
– Estimation of GaN RF players market share
– Discussion between IDM and fabless in GaN industry
– Conclusions
• GaN RF substrates market……………………………………………...….139
– GaN-on-XX Epiwafer Expected Specs
– GaN-on-XX HEMT Technology comparison
– GaN on Si Epitaxy Challenges Overview
– GaN on Si HEMTs for RF applications
– GaN-on-Diamond: Double-Wafer Bonding Approach
– Why using Diamond for GaN HEMT?
– GaN-on-Diamond HEMT
– Semi insulating SiC wafer market volume (units) for GaN RF market forecast
– Epiwafer market volume (units) for GaN RF market
– Commercial available GaN on SiC device vs. GaN on Silicon devices
– GaN on silicon & GaN on SiC comparison
– GaN on silicon device design
– GaN on Si and GaN on SiC
– GaN on sic and GaN on silicon development scheme in remote future
– GaN on sic and GaN on silicon development scheme in remote future
– GaN on sic and GaN on silicon development scheme in remote future
– Summary on three development scheme further than 2020
– What is waiting ahead for GaN on SiC and GaN on silicon?
• General Conclusions…………………………………………………………………159
©2016 | www.yole.fr | GaN RF Market: Applications, Players, Technology, and Substrates 2016 – 2022 | Sample
Content of the report -
Sample
11
FORECAST GAN RF DEVICE MARKET SIZE
The total
market size
will almost
double in next
five years.
©2016 | www.yole.fr | GaN RF Market: Applications, Players, Technology, and Substrates 2016 – 2022 | Sample
12
GAN RF DEVICE MARKET BREAKDOWN
2015 - 2022 comparison by application
CAGR + 14 %
©2016 | www.yole.fr | GaN RF Market: Applications, Players, Technology, and Substrates 2016 – 2022 | Sample
2022 GaN RF devices market, breakdown by application
13
IN WHICH APPLICATIONS THAT GAN IS ALREADY USED?
GaN’s
presence in
RF market are
more
selectively in
high power
high frequency
market.
Frequency (GHz
Power (W)
1
10
>10000
100
1000
2 4 8 3216 64
1
0.1
Radars & avionics
Wireless
backhaul
CATV
SATCOM
VSAT
Base
transceiver
stations
©2016 | www.yole.fr | GaN RF Market: Applications, Players, Technology, and Substrates 2016 – 2022 | Sample
14
DIFFERENT SEGMENT OF MARKET
Different markets and drivers for
GaN development are presented and
explained.
©2016 | www.yole.fr | GaN RF Market: Applications, Players, Technology, and Substrates 2016 – 2022 | Sample
15
DIFFERENT PLAYERS AND THEIR GAN PRODUCTS
More than 600 GaN device with different power and frequency range from 17
companies have been analyzed and compared.
©2016 | www.yole.fr | GaN RF Market: Applications, Players, Technology, and Substrates 2016 – 2022 | Sample
16
GAN ON SILICON & GAN ON SIC COMPARISON
The
comparison of
GaN-on-Si and
GaN-on-SiC
has been one
of the most
concerned
questions in
GaN RF
industry.
GaN
On
SiC
GaN
On
Silicon
©2016 | www.yole.fr | GaN RF Market: Applications, Players, Technology, and Substrates 2016 – 2022 | Sample
17
GLOBAL INDUSTRIAL SUPPLY-CHAIN
Different
business
model exist in
the GaN RF
market.
S.I SiC wafers GaN HEMT epiwafers
A
F
E
C
H
O
I
K
M
X
L
Z
Y
J
W
G
Pure device foundries
V
6
7
8
11
5
4
10
9
B
D
1
2
U
T
13
14
15
16
17
18
*non-exhaustive list
12
P
Q
R
S
19
*There’s no direct supply
correspondence between
different columns!
N
Material providers Devices SystemsPA Modules
Microsemi
Fabless
design
house
3
©2016 | www.yole.fr | GaN RF Market: Applications, Players, Technology, and Substrates 2016 – 2022 | Sample
18
DISCUSSION BETWEEN IDM AND FABLESS IN GAN INDUSTRY
Who will have the last laugh?
We are still
waiting to
see which
kind of
model has
more
advantages
for GaN
business.
©2016 | www.yole.fr | GaN RF Market: Applications, Players, Technology, and Substrates 2016 – 2022 | Sample
19
EVERYYEAR,YOLE DÉVELOPPEMENT ATTENDS MAIN EVENTS. MEET WITH US AT*:
• NEPCON Japan
January 13-15, 2016 – Tokyo, Japan
• CS International
March 1-2, 2016 – Brussels, Belgium
• Image Sensors
March 15-17, 2016 – London, UK
• International Conference and Exhibition on
Device Packaging
March 15-17, 2016 – Fountain Hills, USA
• Lab-on-a-Chip European Congress
March 15-16, 2016 – Madrid, Spain
• APEC
March 20-24, 2016 – Long Beach, USA
• PCIM Europe
May 10-12, 2016 – Nuremberg, Germany
• ECTC
May 31-June 3, 2016 – LasVegas, USA
• Sensors Expo & Conf
June 21-23, 2016 – San José, USA
• SEMICON West
July 12-15, 2016 – San Francisco, USA
• LED Professional Symposium – LpS
September 20-23, 2016 – Bregenz,Austria
• SEMICON Europa
October 25-27, 2016 – Grenoble, France
• SEMICON Japan
December 14-16, 2016 – Tokyo, Japan
*Non exhaustive list
©2016 | www.yole.fr | GaN RF Market: Applications, Players, Technology, and Substrates 2016 – 2022 | Sample
20
EVEN MORE !
• Who should be interested in this report?
• GaN RF device manufacturers;
• System makers in markets like wireless infrastructure,
defense and aerospace, wired broadband (CATV, fiber optic
etc.), SATCOM, markets like RF energy or other ISM band
applications;
• Suppliers of compound semiconductor material (SiC semi-
insulating wafer, GaN epiwafer)
• Any company who wants to discover the RF GaN industry
• Companies cited
Aethercomm, Alcatel-Lucent, Ampleon, Anadigics, AT&T, Bell
laboratory, Cisco, China Mobile, China telecom, China
Unicom, Cree, Dynax, Dowa, EADS, Epigan, Ericsson, Eudyna,
Freiburg / Univ Ulm / Fraunhofer IAF, Filtronic, Freescale,
Fujitsu, Global communication semiconductors, Hittite /
Keragis, Huawei, II-VI Inc, IMEC, IMECAS Infineon, Intel, IQE,
KDDI, KT, LG Plus, Lockheed Martin, M/A-COM, Microsemi,
Mitsubishi Chemical, Mitsubishi Electric, Motorola, NEC,
Nitronex, Norstel, Nokia networks, Northrop Grumman,
NTT, NTT DOCOMO, NXP, OMMIC, Powdec, Qorvo,
Qualcomm, RFHIC, RF Lambda, RFMD, Samsung, SICC,
SiCrystal, SK Telecom, Softbank, Sprint, ST Microelectronics,
Sumitomo Electric, Enkris Semiconductor, Raytheon,
TankeBlue, Telstra, Thales, Thales III-V lab, T-mobile, Toshiba,
Triquint, UMS, Unity Wireless, Verizon, Vodafone, WIN
Semiconductors,Wolfspeed & ZTE.
©2016 | www.yole.fr | GaN RF Market: Applications, Players, Technology, and Substrates 2016 – 2022 | Sample
© 2016
Yole Développement
FromTechnologies to Market
22
MEMS &
Sensors
LED
Compound
Semi.
Imaging Photonics
MedTech
Manufacturing
Advanced Packaging
Batteries / Energy
Management
Power
Electronics
FIELDS OF EXPERTISE
Yole Développement’s 30 analysts operate in the following areas
©2016 | www.yole.fr | GaN RF Market: Applications, Players, Technology, and Substrates 2016 – 2022 | Sample
23
4 BUSINESS MODELS
o Consulting and Analysis
• Market data & research, marketing analysis
• Technology analysis
• Strategy consulting
• Reverse engineering & costing
• Patent analysis
www.yole.fr
o Reports
• Market &Technology reports
• Patent Investigation and patent infringement risk
analysis
• Teardowns & Reverse Costing Analysis
• Cost SimulationTool
www.i-Micronews.com/reports
o Financial services
• M&A (buying and selling)
• Due diligence
• Fundraising
• Maturation of companies
• IP portfolio management & optimization
www.yolefinance.com
www.bmorpho.com
o Media
• i-Micronews.com website
• @Micronews e-newsletter
• Communication & webcast services
• Events
www.i-Micronews.com
©2016 | www.yole.fr | GaN RF Market: Applications, Players, Technology, and Substrates 2016 – 2022 | Sample
24
A GROUP OF COMPANIES
Market,
technology and
strategy
consulting
www.yole.fr
M&A operations
Due diligences
www.yolefinance.com
Innovation and business maker
www.bmorpho.com
Manufacturing costs analysis
Teardown and reverse engineering
Cost simulation tools
www.systemplus.fr
IP analysis
Patent assessment
www.knowmade.fr
©2016 | www.yole.fr | GaN RF Market: Applications, Players, Technology, and Substrates 2016 – 2022 | Sample
25
OUR 2016 REPORTS PLANNING
o MEMS & SENSORS
− Gas Sensors and Combos 2016
− Status of the MEMS Industry 2016*
− Sensors for Cellphones and Tablets 2016
− Market and Technology Trends of Inkjet Printheads: Towards New Printing Opportunities
2016…
− Sensors for Biometry and Recognition 2016
− Finger Print Sensors Market and Technologies 2016
− 3D Imaging & Sensing 2016**
− Silicon Photonics 2016
− Emerging Non Volatile Memories 2016*
o IMAGING & OPTOELECTRONICS
− Status of the CMOS Image Sensor Industry 2016*
− Uncooled Infrared Imaging Technology & Market Trends 2016*
− Imaging Technologies for Automotive 2016
− Sensors for Drones & Consumer Robots 2016
− 3D Imaging & Sensing 2016**
− Silicon Photonics 2016
o MEDTECH
− BioMEMS 2016
− Point of Need Testing 2016: Application of Microfluidic Technologies
o ADVANCED PACKAGING
− FanOut WLP: Technology Trends and Business Update 2016*
− Embedded Die Packaging: Technology and Markets Trends 2016*
− 2.5D & 3D IC Business Update 2016
− Status of the Advanced Packaging Industry 2016*
− Advanced Packaging for Wearables and Mobile Applications 2016
− Advanced Packaging in Emerging Markets: China 2016
− Supply Chain Readiness for Panel Manufacturing in Packaging 2016
o MANUFACTURING
− Inspection and Metrology Technology and Applications Trends in Advanced Packaging 2016**
− Emerging Materials for Advanced Packaging 2016
− Deposition Technologies Equipment & Materials 2016
− Thinning & Dicing Equipment for Advanced Packaging, MEMS, Photovoltaics, LED, CMOS 2016
o COMPOUND SEMICONDUCTORS
− SiC Modules, Devices and Substrates for Power Electronics 2016*
− GaN Modules, Devices and Substrates for Power Electronics 2016*
− Sapphire Applications & Market 2016: from LED to Consumer Electronics*
− GaN RF Market: Applications, Players, Devices & Substrates 2016 - 2022
o LED
− Sapphire Applications and Market 2016: From LED to Consumer Electronics*
− LED Packaging 2016
− Microdisplays and MicroLEDs
− UV LED Technology, Manufacturing and Applications Trends 2016*
− OLED for Lighting 2016
− LED in Automotive Lighting 2016
o POWER ELECTRONICS
− Power Electronics in Electric and Hybrid Vehicles 2016
− Status of Power Electronics Industry 2016*
− Passive Components Technologies and Market Trends for Power Electronics 2016
− SiC Modules, Devices and Substrates for Power Electronics 2016*
− GaN Modules, Devices and Substrates for Power Electronics 2016*
− Inverter Technologies Trends & Market Expectations 2016
− Power Electronics for Renewable Energy 2016
− Thermal Management for LED and Power 2016
− RF GaN Technology and Market Analysis 2016
o BATTERY
− Market Trends and Technologies in Battery Pack and Assembly 2016
− Innovative and Emerging Technologies in Energy Storage Market 2016
**To be confirmed
Patent Analysis by Knowmade and Teardown & Reverse Costing by System Plus Consulting are available on
www.i-micronews.com
©2016 | www.yole.fr | GaN RF Market: Applications, Players, Technology, and Substrates 2016 – 2022 | Sample
26
OUR 2015 PUBLISHED REPORTS LIST
o MEMS & SENSORS
− Sensors and Data Management for Autonomous Vehicles
− Sensors for Wearable Electronics And Mobile Healthcare
− Status of the MEMS Industry
− Uncooled Infrared Imaging Technology & Market Trends
− Infrared Detector Technology & Market Trends
− High-End Gyroscopes, Accelerometers and IMUs for Defense, Aerospace & Industrial
− Emerging Non Volatile Memory (NVM) Technology & Market Trends
o IMAGING & OPTOELECTRONICS
− Camera Module Industry
− Uncooled Infrared Imaging Technology & Market Trends
− Status of the CMOS Image Sensors
− Infrared Detector Technology & Market Trends
o MEDTECH
− Sample Preparation Automation Through Emerging Microfluidic Technologies
− 2015 Microfluidic Applications in the Pharmaceutical, Life Sciences, In-Vitro Diagnostic, and
Medical Device Markets
− Sensors for Wearable Electronics And Mobile Healthcare
o COMPOUND SEMICONDUCTORS
− Sapphire Applications & Market 2015: from LED to Consumer Electronics
− SiC, GaN, and other Wide Band Gap (WBG) materials for power electronics applications
− GaN and SiC Devices for Power Electronics Applications
o LED
− LED Lighting Module Technology, Industry and Market Trends 2015
− UV LED - Technology, Manufacturing and Application Trends
− Phosphors & Quantum Dots 2015: LED Downconverters for Lighting & Displays
− Sapphire Applications & Market 2015: from LED to Consumer Electronics
o POWER ELECTRONICS
− Power Packaging Technology Trends and Market Expectations
− Energy Management for Smart Grid, Cities and Buildings: Opportunities for Battery
Electricity Storage Solutions
− Status of Chinese Power Electronics Industry
− New Technologies and Architectures for Efficient Data Center
− IGBT Market and Technology Trends
− Status of Power Electronics Industry
− SiC, GaN, and other Wide Band Gap (WBG) materials for power electronics applications
− GaN and SiC Devices for Power Electronics Applications
o ADVANCED PACKAGING
− Status of the Advanced Packaging Industry
− Supply Chain Readiness for Panel Manufacturing in Packaging
− Fan-in Wafer Level Packaging: Market and Technology Trends
− Flip Chip: Technologies and Markets Trends
− Fan-Out and Embedded Die: Technologies & Market Trends
o MANUFACTURING
− Photolithography Equipment and Materials for Advanced Packaging, MEMS and LED
Applications
− Emerging Non Volatile Memory (NVM) Technology & Market Trends
Patent Analysis by Knowmade and Teardown & Reverse Costing by System Plus Consulting are
available on www.i-micronews.com
©2016 | www.yole.fr | GaN RF Market: Applications, Players, Technology, and Substrates 2016 – 2022 | Sample
27
CONTACT INFORMATION
Follow us on
• Consulting and Specific Analysis
• North America: Steve LaFerriere, Director of Northern America Business Development
Email: laferriere@yole.fr
• Japan & Asia:Takashi Onozawa, Representative Director,Yole KK
Email: onozawa@yole.fr
• RoW: Jean-Christophe Eloy, CEO & President,Yole Développement
Email eloy@yole.fr
• Report business
• North America: Steve LaFerriere, Director of Northern America Business Development
Email: laferriere@yole.fr
• Europe: Fayçal El Khamassi, Headquarter Sales Coordination & Customer Service
Email: khamassi@yole.fr
• Japan & Asia:Takashi Onozawa, Representative Director,Yole KK.
Email: onozawa@yole.fr
• Korea: HaileyYang, Business Development Manager, Korean Office
Email: yang@yole.fr
• Taiwan: Mavis Wang, Business Development Director
Email: wang@yole.fr
• Financial services
• Jean-Christophe Eloy, CEO & President
Email: eloy@yole.fr
• General
• Email: info@yole.fr
©2016 | www.yole.fr | GaN RF Market: Applications, Players, Technology, and Substrates 2016 – 2022 | Sample

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GaN RF Market Applications, players, devices & substrates 2016 - 2022, March 2016 Report by Yole Developpement

  • 1. From Technologies to Market GaN RF Market Applications, players, devices & substrates 2016 - 2022 Sample From Technologies to Market © 2016
  • 3. 3 REPORT OBJECTIVES • To have an overview of the entire GaN RF market. • Analysis of different players in different markets as well as their product range and technologies. • Access the market from wafer suppliers to device makers and system manufacturers. • Understand the main technologies in RF GaN markets. • Identify the key drivers which offer opportunities for GaN development. • Discovering the need of different RF market and the impact on the needs for GaN technologies, as well as geographical specificities. ©2016 | www.yole.fr | GaN RF Market: Applications, Players, Technology, and Substrates 2016 – 2022 | Sample
  • 4. 4 REPORT METHODOLOGY Market segmentation methodology Market forecast methodology ©2016 | www.yole.fr | GaN RF Market: Applications, Players, Technology, and Substrates 2016 – 2022 | Sample
  • 5. 5 REPORT METHODOLOGY Technology analysis methodology Information collection ©2016 | www.yole.fr | GaN RF Market: Applications, Players, Technology, and Substrates 2016 – 2022 | Sample
  • 6. 6 Biographies & contacts ABOUT THE AUTHORS Hong LIN Dr. Hong Lin has worked atYole Développement as a technology and market analyst since 2013. She specializes in compound semiconductors and provides technical and economic analysis. Before joiningYole Développement,she worked as an R&D engineer at Newstep Technologies. She was in charge of the development of cold cathodes made by PECVD for visible and UV lamp applications based on nanotechnology. She holds a Ph.D in physics and chemistry of materials lin@yole.fr Zhen Zong Zhen Zong works as an analyst for Power Electronics and Compound Semiconductors technologies atYole Développement.He graduated from INSA Lyon with an engineering degree in material sciences, specialized in semiconductor devices and Micro/Nano technologies. zong@yole.fr ©2016 | www.yole.fr | GaN RF Market: Applications, Players, Technology, and Substrates 2016 – 2022 | Sample
  • 7. 7 TABLE OF CONTENTS (1/3) • Acronyms……………………………………………………………………..6 • Companies Cited in this Report……………………………………………...7 • Objectives of this report………………………………………………….......8 • Executive summary………………………………………………………….10 • Revision of report GaN RF 2014…………………………………………....20 – Which scenario? – What we got right? – What we got wrong? – Comparison of market forecast • RF GaN HEMT Technology overview………………………………………25 – RF Components overview (1/2) – RF Components overview (2/2) – Power and Frequency regions for Different semiconductors – GaN HEMT DEVICE Structure – GaN / SiC / Si / GaAs: Material properties – GaN / SiC / Si / GaAs: power transistor comparison – ADDED values of GaN – Avantages at the system level for PA, LNA and RF switch – GaN MMIC description – Top view of GaN transistor and module – RF package type and hermeticity – Driver for plastic package – The steps of GaN technology development history • GaN RF device applications overview……………………………………….39 – Applications for GaN devices in RF electronic systems – Radio frequency band range and applications – GaN device applications roadmap – RF power applications as function of frequency and power – In which applications that GaN Is already used? – Commercially available GaN RF power products – Comparison between commercial GaN products and total market – GaN RF device market breakdown – GaN RF device market size forecast – Market overview (1/2) – Market overview (2/2) • Wireless infrastructures…………………………………………………………………51 – Global connections by technology – Telecommunication market shares – Evolution of mobile telecommunication technology(1/2) – Evolution of mobile telecommunication technology(2/2) – Gan opportunity in cellular market – 4G history and definition (1/3) – 4G history and definition (2/3) – 4G history and definition (3/3) – WiMAX and LTE deployment planning – Last hour of WiMAX carriers… – WiMAX market estimation – 4G LTE & WiMAX market estimation – Global LTE development forecast – LTE deployment, companies, countries mapping in 2015 – List of regions by 4G LTE penetration in 2015 – Cellular network structure – Backhaul for Point-to-Point (PtP) and Point-to-Multipoints (PtMP) ©2016 | www.yole.fr | GaN RF Market: Applications, Players, Technology, and Substrates 2016 – 2022 | Sample
  • 8. 8 TABLE OF CONTENTS (2/3) – Typical LTE base station & cell tower – Added value of GaN for BTS power amplifier(1/3) – Added value of GaN for BTS power amplifier(2/3) – Added value of GaN for BTS power amplifier(3/3) – Worldwide deployed cellular base-stations evolution – BTS supply chain – Estimation of total accessible market for GaN FET in Telecom – Number of wafers to be produced for GaN FET manufacturing for Telecom BTS Market – Wireless infrastructure GAN RF PRODUCT SCHEME – Conclusions • Defense………………………………………………………………………..78 – GAN application potential in defense market – Military RF applications & frequency bands – GaN applications in radar systems (1/2) – GaN applications in radar systems (2/2) – GaN APPLICATION IN EW/IED JAMMERS – GaN application in ELECTRICAL CONTERMEASURES – GaN RF application in military communication – Market drivers of GaN RF in defense applications – Roadmap for RF transistors volumes in defense applications – Defense GaN product scheme – Conclusions • CATV market………………………………………………………………….91 – CATV: the basics – Market drivers of GaN electronics in CATV (1/3) – Market drivers of GaN electronics in CATV (2/3) – Market drivers of GaN electronics in CATV (3/3) – Evolution of DOCSIS 3.1 – CATV market in terms of geography – HFC and FTTH comparison – CATV market evolution: – Estimation of RF GaN devices needs per year for CATV Market – Number of 4” equivalent wafers to be produced for GaN FET manufacturing for CATV Market – CATV GAN RF PRODUCT SCHEME – Conclusions • Satellite communication market ……………………………………………………...104 – Where do we use gan in satellite applications? – Market drivers of the GaN RF in SATCOM – Market drivers of GaN electronics inV-SAT – GaN implementation inVSAT T&R UNIT – Estimation of RF GaN devices needs per year forV-SAT Market (units) – GaN HEMT opportunities forV-SAT – Estimation of RF GaN devices needs per year for SATCOM Market (units) – GaN HEMT opportunities for SATCOM – Satellite communication GAN RF PRODUCT SCHEME – Conclusions ©2016 | www.yole.fr | GaN RF Market: Applications, Players, Technology, and Substrates 2016 – 2022 | Sample
  • 9. 9 TABLE OF CONTENTS (3/3) • Other applications……………………………………………………..…..115 – GaN applications in RF Energy – GaN applications in LTE-U – GaN applications in plasma lighting – Other applications GAN PRODUCT SCHEME – Conclusions • GaN RF devices industrial landscape………………………………………122 – Events and history of GaN RF industry – Major GaN RF Players and their device Frequency Range – Major GaN RF Players and their device Frequency Range – Main GaN RF players and their target applications – Market Landscape – Mapping: Players of Power RF GaN based devices in US – Mapping: players of Power RF GaN based devices in US – Mapping: players of Power RF GaN based devices in Europe – Mapping: players of Power RF GaN based devices in Asia – GaN RF Foundry technology comparison – Mapping of GaN on Si & GaN on SiC RF epiwaferVendors – Mapping of GaN device foundry – Global Industrial supply-chain – Estimation of GaN RF players market share – Discussion between IDM and fabless in GaN industry – Conclusions • GaN RF substrates market……………………………………………...….139 – GaN-on-XX Epiwafer Expected Specs – GaN-on-XX HEMT Technology comparison – GaN on Si Epitaxy Challenges Overview – GaN on Si HEMTs for RF applications – GaN-on-Diamond: Double-Wafer Bonding Approach – Why using Diamond for GaN HEMT? – GaN-on-Diamond HEMT – Semi insulating SiC wafer market volume (units) for GaN RF market forecast – Epiwafer market volume (units) for GaN RF market – Commercial available GaN on SiC device vs. GaN on Silicon devices – GaN on silicon & GaN on SiC comparison – GaN on silicon device design – GaN on Si and GaN on SiC – GaN on sic and GaN on silicon development scheme in remote future – GaN on sic and GaN on silicon development scheme in remote future – GaN on sic and GaN on silicon development scheme in remote future – Summary on three development scheme further than 2020 – What is waiting ahead for GaN on SiC and GaN on silicon? • General Conclusions…………………………………………………………………159 ©2016 | www.yole.fr | GaN RF Market: Applications, Players, Technology, and Substrates 2016 – 2022 | Sample
  • 10. Content of the report - Sample
  • 11. 11 FORECAST GAN RF DEVICE MARKET SIZE The total market size will almost double in next five years. ©2016 | www.yole.fr | GaN RF Market: Applications, Players, Technology, and Substrates 2016 – 2022 | Sample
  • 12. 12 GAN RF DEVICE MARKET BREAKDOWN 2015 - 2022 comparison by application CAGR + 14 % ©2016 | www.yole.fr | GaN RF Market: Applications, Players, Technology, and Substrates 2016 – 2022 | Sample 2022 GaN RF devices market, breakdown by application
  • 13. 13 IN WHICH APPLICATIONS THAT GAN IS ALREADY USED? GaN’s presence in RF market are more selectively in high power high frequency market. Frequency (GHz Power (W) 1 10 >10000 100 1000 2 4 8 3216 64 1 0.1 Radars & avionics Wireless backhaul CATV SATCOM VSAT Base transceiver stations ©2016 | www.yole.fr | GaN RF Market: Applications, Players, Technology, and Substrates 2016 – 2022 | Sample
  • 14. 14 DIFFERENT SEGMENT OF MARKET Different markets and drivers for GaN development are presented and explained. ©2016 | www.yole.fr | GaN RF Market: Applications, Players, Technology, and Substrates 2016 – 2022 | Sample
  • 15. 15 DIFFERENT PLAYERS AND THEIR GAN PRODUCTS More than 600 GaN device with different power and frequency range from 17 companies have been analyzed and compared. ©2016 | www.yole.fr | GaN RF Market: Applications, Players, Technology, and Substrates 2016 – 2022 | Sample
  • 16. 16 GAN ON SILICON & GAN ON SIC COMPARISON The comparison of GaN-on-Si and GaN-on-SiC has been one of the most concerned questions in GaN RF industry. GaN On SiC GaN On Silicon ©2016 | www.yole.fr | GaN RF Market: Applications, Players, Technology, and Substrates 2016 – 2022 | Sample
  • 17. 17 GLOBAL INDUSTRIAL SUPPLY-CHAIN Different business model exist in the GaN RF market. S.I SiC wafers GaN HEMT epiwafers A F E C H O I K M X L Z Y J W G Pure device foundries V 6 7 8 11 5 4 10 9 B D 1 2 U T 13 14 15 16 17 18 *non-exhaustive list 12 P Q R S 19 *There’s no direct supply correspondence between different columns! N Material providers Devices SystemsPA Modules Microsemi Fabless design house 3 ©2016 | www.yole.fr | GaN RF Market: Applications, Players, Technology, and Substrates 2016 – 2022 | Sample
  • 18. 18 DISCUSSION BETWEEN IDM AND FABLESS IN GAN INDUSTRY Who will have the last laugh? We are still waiting to see which kind of model has more advantages for GaN business. ©2016 | www.yole.fr | GaN RF Market: Applications, Players, Technology, and Substrates 2016 – 2022 | Sample
  • 19. 19 EVERYYEAR,YOLE DÉVELOPPEMENT ATTENDS MAIN EVENTS. MEET WITH US AT*: • NEPCON Japan January 13-15, 2016 – Tokyo, Japan • CS International March 1-2, 2016 – Brussels, Belgium • Image Sensors March 15-17, 2016 – London, UK • International Conference and Exhibition on Device Packaging March 15-17, 2016 – Fountain Hills, USA • Lab-on-a-Chip European Congress March 15-16, 2016 – Madrid, Spain • APEC March 20-24, 2016 – Long Beach, USA • PCIM Europe May 10-12, 2016 – Nuremberg, Germany • ECTC May 31-June 3, 2016 – LasVegas, USA • Sensors Expo & Conf June 21-23, 2016 – San José, USA • SEMICON West July 12-15, 2016 – San Francisco, USA • LED Professional Symposium – LpS September 20-23, 2016 – Bregenz,Austria • SEMICON Europa October 25-27, 2016 – Grenoble, France • SEMICON Japan December 14-16, 2016 – Tokyo, Japan *Non exhaustive list ©2016 | www.yole.fr | GaN RF Market: Applications, Players, Technology, and Substrates 2016 – 2022 | Sample
  • 20. 20 EVEN MORE ! • Who should be interested in this report? • GaN RF device manufacturers; • System makers in markets like wireless infrastructure, defense and aerospace, wired broadband (CATV, fiber optic etc.), SATCOM, markets like RF energy or other ISM band applications; • Suppliers of compound semiconductor material (SiC semi- insulating wafer, GaN epiwafer) • Any company who wants to discover the RF GaN industry • Companies cited Aethercomm, Alcatel-Lucent, Ampleon, Anadigics, AT&T, Bell laboratory, Cisco, China Mobile, China telecom, China Unicom, Cree, Dynax, Dowa, EADS, Epigan, Ericsson, Eudyna, Freiburg / Univ Ulm / Fraunhofer IAF, Filtronic, Freescale, Fujitsu, Global communication semiconductors, Hittite / Keragis, Huawei, II-VI Inc, IMEC, IMECAS Infineon, Intel, IQE, KDDI, KT, LG Plus, Lockheed Martin, M/A-COM, Microsemi, Mitsubishi Chemical, Mitsubishi Electric, Motorola, NEC, Nitronex, Norstel, Nokia networks, Northrop Grumman, NTT, NTT DOCOMO, NXP, OMMIC, Powdec, Qorvo, Qualcomm, RFHIC, RF Lambda, RFMD, Samsung, SICC, SiCrystal, SK Telecom, Softbank, Sprint, ST Microelectronics, Sumitomo Electric, Enkris Semiconductor, Raytheon, TankeBlue, Telstra, Thales, Thales III-V lab, T-mobile, Toshiba, Triquint, UMS, Unity Wireless, Verizon, Vodafone, WIN Semiconductors,Wolfspeed & ZTE. ©2016 | www.yole.fr | GaN RF Market: Applications, Players, Technology, and Substrates 2016 – 2022 | Sample
  • 22. 22 MEMS & Sensors LED Compound Semi. Imaging Photonics MedTech Manufacturing Advanced Packaging Batteries / Energy Management Power Electronics FIELDS OF EXPERTISE Yole Développement’s 30 analysts operate in the following areas ©2016 | www.yole.fr | GaN RF Market: Applications, Players, Technology, and Substrates 2016 – 2022 | Sample
  • 23. 23 4 BUSINESS MODELS o Consulting and Analysis • Market data & research, marketing analysis • Technology analysis • Strategy consulting • Reverse engineering & costing • Patent analysis www.yole.fr o Reports • Market &Technology reports • Patent Investigation and patent infringement risk analysis • Teardowns & Reverse Costing Analysis • Cost SimulationTool www.i-Micronews.com/reports o Financial services • M&A (buying and selling) • Due diligence • Fundraising • Maturation of companies • IP portfolio management & optimization www.yolefinance.com www.bmorpho.com o Media • i-Micronews.com website • @Micronews e-newsletter • Communication & webcast services • Events www.i-Micronews.com ©2016 | www.yole.fr | GaN RF Market: Applications, Players, Technology, and Substrates 2016 – 2022 | Sample
  • 24. 24 A GROUP OF COMPANIES Market, technology and strategy consulting www.yole.fr M&A operations Due diligences www.yolefinance.com Innovation and business maker www.bmorpho.com Manufacturing costs analysis Teardown and reverse engineering Cost simulation tools www.systemplus.fr IP analysis Patent assessment www.knowmade.fr ©2016 | www.yole.fr | GaN RF Market: Applications, Players, Technology, and Substrates 2016 – 2022 | Sample
  • 25. 25 OUR 2016 REPORTS PLANNING o MEMS & SENSORS − Gas Sensors and Combos 2016 − Status of the MEMS Industry 2016* − Sensors for Cellphones and Tablets 2016 − Market and Technology Trends of Inkjet Printheads: Towards New Printing Opportunities 2016… − Sensors for Biometry and Recognition 2016 − Finger Print Sensors Market and Technologies 2016 − 3D Imaging & Sensing 2016** − Silicon Photonics 2016 − Emerging Non Volatile Memories 2016* o IMAGING & OPTOELECTRONICS − Status of the CMOS Image Sensor Industry 2016* − Uncooled Infrared Imaging Technology & Market Trends 2016* − Imaging Technologies for Automotive 2016 − Sensors for Drones & Consumer Robots 2016 − 3D Imaging & Sensing 2016** − Silicon Photonics 2016 o MEDTECH − BioMEMS 2016 − Point of Need Testing 2016: Application of Microfluidic Technologies o ADVANCED PACKAGING − FanOut WLP: Technology Trends and Business Update 2016* − Embedded Die Packaging: Technology and Markets Trends 2016* − 2.5D & 3D IC Business Update 2016 − Status of the Advanced Packaging Industry 2016* − Advanced Packaging for Wearables and Mobile Applications 2016 − Advanced Packaging in Emerging Markets: China 2016 − Supply Chain Readiness for Panel Manufacturing in Packaging 2016 o MANUFACTURING − Inspection and Metrology Technology and Applications Trends in Advanced Packaging 2016** − Emerging Materials for Advanced Packaging 2016 − Deposition Technologies Equipment & Materials 2016 − Thinning & Dicing Equipment for Advanced Packaging, MEMS, Photovoltaics, LED, CMOS 2016 o COMPOUND SEMICONDUCTORS − SiC Modules, Devices and Substrates for Power Electronics 2016* − GaN Modules, Devices and Substrates for Power Electronics 2016* − Sapphire Applications & Market 2016: from LED to Consumer Electronics* − GaN RF Market: Applications, Players, Devices & Substrates 2016 - 2022 o LED − Sapphire Applications and Market 2016: From LED to Consumer Electronics* − LED Packaging 2016 − Microdisplays and MicroLEDs − UV LED Technology, Manufacturing and Applications Trends 2016* − OLED for Lighting 2016 − LED in Automotive Lighting 2016 o POWER ELECTRONICS − Power Electronics in Electric and Hybrid Vehicles 2016 − Status of Power Electronics Industry 2016* − Passive Components Technologies and Market Trends for Power Electronics 2016 − SiC Modules, Devices and Substrates for Power Electronics 2016* − GaN Modules, Devices and Substrates for Power Electronics 2016* − Inverter Technologies Trends & Market Expectations 2016 − Power Electronics for Renewable Energy 2016 − Thermal Management for LED and Power 2016 − RF GaN Technology and Market Analysis 2016 o BATTERY − Market Trends and Technologies in Battery Pack and Assembly 2016 − Innovative and Emerging Technologies in Energy Storage Market 2016 **To be confirmed Patent Analysis by Knowmade and Teardown & Reverse Costing by System Plus Consulting are available on www.i-micronews.com ©2016 | www.yole.fr | GaN RF Market: Applications, Players, Technology, and Substrates 2016 – 2022 | Sample
  • 26. 26 OUR 2015 PUBLISHED REPORTS LIST o MEMS & SENSORS − Sensors and Data Management for Autonomous Vehicles − Sensors for Wearable Electronics And Mobile Healthcare − Status of the MEMS Industry − Uncooled Infrared Imaging Technology & Market Trends − Infrared Detector Technology & Market Trends − High-End Gyroscopes, Accelerometers and IMUs for Defense, Aerospace & Industrial − Emerging Non Volatile Memory (NVM) Technology & Market Trends o IMAGING & OPTOELECTRONICS − Camera Module Industry − Uncooled Infrared Imaging Technology & Market Trends − Status of the CMOS Image Sensors − Infrared Detector Technology & Market Trends o MEDTECH − Sample Preparation Automation Through Emerging Microfluidic Technologies − 2015 Microfluidic Applications in the Pharmaceutical, Life Sciences, In-Vitro Diagnostic, and Medical Device Markets − Sensors for Wearable Electronics And Mobile Healthcare o COMPOUND SEMICONDUCTORS − Sapphire Applications & Market 2015: from LED to Consumer Electronics − SiC, GaN, and other Wide Band Gap (WBG) materials for power electronics applications − GaN and SiC Devices for Power Electronics Applications o LED − LED Lighting Module Technology, Industry and Market Trends 2015 − UV LED - Technology, Manufacturing and Application Trends − Phosphors & Quantum Dots 2015: LED Downconverters for Lighting & Displays − Sapphire Applications & Market 2015: from LED to Consumer Electronics o POWER ELECTRONICS − Power Packaging Technology Trends and Market Expectations − Energy Management for Smart Grid, Cities and Buildings: Opportunities for Battery Electricity Storage Solutions − Status of Chinese Power Electronics Industry − New Technologies and Architectures for Efficient Data Center − IGBT Market and Technology Trends − Status of Power Electronics Industry − SiC, GaN, and other Wide Band Gap (WBG) materials for power electronics applications − GaN and SiC Devices for Power Electronics Applications o ADVANCED PACKAGING − Status of the Advanced Packaging Industry − Supply Chain Readiness for Panel Manufacturing in Packaging − Fan-in Wafer Level Packaging: Market and Technology Trends − Flip Chip: Technologies and Markets Trends − Fan-Out and Embedded Die: Technologies & Market Trends o MANUFACTURING − Photolithography Equipment and Materials for Advanced Packaging, MEMS and LED Applications − Emerging Non Volatile Memory (NVM) Technology & Market Trends Patent Analysis by Knowmade and Teardown & Reverse Costing by System Plus Consulting are available on www.i-micronews.com ©2016 | www.yole.fr | GaN RF Market: Applications, Players, Technology, and Substrates 2016 – 2022 | Sample
  • 27. 27 CONTACT INFORMATION Follow us on • Consulting and Specific Analysis • North America: Steve LaFerriere, Director of Northern America Business Development Email: laferriere@yole.fr • Japan & Asia:Takashi Onozawa, Representative Director,Yole KK Email: onozawa@yole.fr • RoW: Jean-Christophe Eloy, CEO & President,Yole Développement Email eloy@yole.fr • Report business • North America: Steve LaFerriere, Director of Northern America Business Development Email: laferriere@yole.fr • Europe: Fayçal El Khamassi, Headquarter Sales Coordination & Customer Service Email: khamassi@yole.fr • Japan & Asia:Takashi Onozawa, Representative Director,Yole KK. Email: onozawa@yole.fr • Korea: HaileyYang, Business Development Manager, Korean Office Email: yang@yole.fr • Taiwan: Mavis Wang, Business Development Director Email: wang@yole.fr • Financial services • Jean-Christophe Eloy, CEO & President Email: eloy@yole.fr • General • Email: info@yole.fr ©2016 | www.yole.fr | GaN RF Market: Applications, Players, Technology, and Substrates 2016 – 2022 | Sample