1. MUHAMMAD KHIZIR AHMED
D-85, Phase-2, Navy Housing Scheme, Karsaz
Karachi, Pakistan.
Land line #: 021-34687815
Cell phone #: +92-3008933528
Email: imkhizr@yahoo.com
EXPERIENCE:
January 2015 - Present:
 Working as Design Manager at ALATANOVA PAKISTAN (PVT) LTD. (Globally
known as R&D-Altanova) www.rdaltanova.com
February 2012 – December 2014:
 Worked as Assistant Design Manager at ALATANOVA PAKISTAN (PVT) LTD.
(Globally known as R&D-Altanova) www.rdaltanova.com
June 2005 – January 2012:
 Worked as Design Engineer at ALATANOVA PAKISTAN (PVT) LTD. (Globally
known as R&D-Altanova) www.rdaltanova.com
RESPONSIBILITIES AS DESIGN MANAGER:
 Manage highly complex and target oriented design projects, meeting the latest
technology of PCB design industry following IPC standards.
 To manage and ensure timely completion of all the projects to meet customer
deadlines.
 To deal with different multi-layer analog and digital high-speed impedance-
controlled ATE boards used on different Testers (like Ultra-Flex, 93K Verigy,
T2K Advantest, Bench Test Boards and other different types of catalyst boards
etc) and characterization boards. Some of the main features of the boards are;
 High Speed Design
 High Density Designs
 Mixed Signal Design
 Power Supply/Distribution Design
 Multi Layer Board and Sequential Lamination Structures
 Controlled Impedance Layout
 Blind/Buried Via Construction
 Micro Via Construction
 Microstrip/ Stripline/ Dual Stripline/ Differential Routing
 Propagation Delay Analysis
 Split/Mixed Signal Plane Development
 BGA/Micro SMD Routing
 Library Decal/Part Design
 Analog/Gigital power and ground separation
 RFI/EMI shielding and high density
 Work directly with our other groups within a company (include purchasing,
customer support, sales and Mechanical engineering) to ensure that goals or
objectives of projects are accomplished within prescribed time frame.

2.  Manage and monitor day-to-day activity and provide directions to team
members.
 Promptly update sales and customer for any change that reflect the design time
or board cost.
 To monitor closely on working Hours spent for each project.
 To report Upper management for any project delays in designing phase and its
causes.
 Appropriate resource allocation to each project considering the nature of project.
 To overcome project delays by using multiple resources to meet the deadlines.
 To minimize design phase errors by training sessions to design team.
 To work with Assistant Managers and designers for design scheduling.
 Get ready the Gerber files, verifies the Gerber checklist filled by each designer
before releasing it to FAB.
 If there is any modification done during the Gerber then make sure to update the
design final files as well
 Create an assembly package from the files already saved on the server prior to
releasing it to assembly house.
 Update customer for any change in the deliverables because of any issue and
let them approve the rework and get their acceptance of the project after repair.
 Continuously enhancing the knowledge base to keep our company up to date
with the latest and greatest Technological advancements in the Semiconductor
industry and to compete with our competitors.
 Get DFM rules from FAB houses for designers to follow in designing layouts.
 To work and communicate directly with FAB house to encounter issues in
manufacturing and propose design modifications required to resolve the board
FAB issues.
 To work and communicate directly with Project Applications Engineers to
discuss project planning and scope.
 To maintain proper project log for each project on daily basis.
 To maintain and update designer availability on daily basis for next upcoming
projects allocations.
RESPONSIBILITIES AS DESIGN ENGINEER:
 Designing High Performance Test Board, Evaluation Boards & Probe Cards
 Designing High Performance Test Board, Evaluation Boards & Probe Cards.
 Create component symbols and footprints for the component library.
 Preparing Schematics using EDA tools like ORCAD, Concept HDL, PCAD
 PCB physical layout (parts placement, routing, trace length adjustment,
verification).
 Applying PCB electrical knowledge (high-speed design, RF and power) to meet
project requirements.
 Create complete fabrication and assembly details.
 Silkscreen labeling to identify different components, signals and other
information as per customer request.
 Designing with SMT Components including SMT Sockets, BGA Sockets, and
Micro BGA Sockets.
 Capitalizing the design in the required time and documentation including length
and delay report, BOM and capacitance of each design.
 Gerber files generation.

3. PROFESSIONAL QUALIFICATIONS:
 MSc. (ELECTRONICS) from Department of APPLIED PHYSICS University of
Karachi in the year 2005 securing first class third position.
 B.E. (Civil Engineering) from NED University Karachi securing 81%.
PERSONAL PROFILE:
 Father’s Name : Muhammad Intizamuddin
 Date of Birth : 21st OCT. 1979
 Marital Status : Married