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Palestine Polytechnic University
Department of Mechanical Engineering
ME251: Materials Science
Course Objective:
Introduce fundamental concepts in Materials Science
Syllabus Link: http://cet.ppu.edu/depts/me/metemplate/syllabus/maher_s/
Material%20Sc%20SYLLABUS.htm
You will learn about:
• material structure
• how structure dictates properties
• how processing can change structure
This course will help you to:
• use materials properly – material selection
• realize new design opportunities with materials
Lecturer: Dr. Maher Al-Jabari

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Concept of
Material Science and Engineering
Processing
Structure Properties
level
Types

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COURSE OUTLINE AND CALENDER
TOPICS WEEKS/HOURS
Introduction to Materials Science (Chapter 1) 1st
/ 2+
Atomic Structure & Interatomic Bonding (Chapter 2) 2nd
/ 2+
The Structure of Crystalline Solids (Chapter. 3) 3rd
-5th
/ 8
Short Exam 1 5th
/ 1
Imperfections in Crystals (Chapter 4) 6th
-7th
/ 4
Diffusion (Chapter 5) -7th
/ 2
Mechanical Properties of Metals (Chapter 6) 8th
-9th
/ 6
Phase Diagrams (Chapter 9) 10th
-12th
/9
Midterm Exam 13th
/1
Phase Transformation in Metals (Chapter 10) 13th
/2
Heat treatment of metals (Chapter 11) 14th
/3
Short Exam 2 15th
/1
Introduction to other materials
(Polymers and Ceramics - as time permit)
15th
- rest
Final Exam University Schedule

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COURSE POLICIES
GRADING SYSTEM
Short Exam-1 10 %
Midterm Exam 30 %
Short Exam-2 10 %
Quizzes and Attendance 10 %
Final Exam 40 %
Students are required to attend all classes
Unexcused absence of exams is not accepted
Make-up exams are expected to be harder.

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Chapter 1 - Introduction
• What is materials science / engineering ?
• Why should we know about it?
• Materials drive our society ???????
• History
– Stone Age
– Bronze Age
– Iron Age
– Now?
• Silicon Age?
• Polymer Age?

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Introduction
Structure / Levels:
Subatomic (e.g. electron, protons)
Atomic (atoms and molecules)
Microscopic (grains: large groups)
macroscopic (by eye)
Property:
Response to a specified imposed stimulus
Kind and magnitude
Processing:
Example Heat Treatment
Applications: ?

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Example – Biomedical - Hip Implant
• Requirements
– mechanical strength
(many cycles)
– good lubricity
– biocompatibility
Femoral
Stem
Ball
Acetabular
Cup and Liner

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Other Applications
• Industry
• Metal manufacturing
• Dentists ?
• Think of Others
• In Hebron ?
• In History ?
• In Future ?

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Developments of New Types of Polymers
• Commodity plastics
Ex. Polyethylene
Polypropylene
Polystyrene
etc.
• Engineering Resins
Ex. Polycarbonate
Nylon
Polysulfone
etc.
Can polypropylene be “upgraded” to properties (and price) near
those of engineering resins?

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ex: hardness vs structure of steel
• Properties depend on structure
ex: structure vs cooling rate of steel
• Processing can change structure
Structure, Processing, & Properties
Hardness(BHN)
Cooling Rate (ºC/s)
100
200
300
400
500
600
0.01 0.1 1 10 100 1000
(d)
30 µm
(c)
4 µm
(b)
30 µm
(a)
30 µm
Just Keep in Mind
to the end !

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Types of Materials
• Metals: Metallic bonding
– Strong, ductile
– high thermal & electrical conductivity
– opaque, reflective.
• Polymers/plastics: Covalent bonding  sharing of e’s
– Soft, ductile, low strength, low density
– thermal & electrical insulators
– Optically translucent or transparent.
• Ceramics: Ionic bonding (refractory) – compounds of metallic & non-
metallic elements (oxides, carbides, nitrides, sulfides)
– Brittle, glassy, elastic
– non-conducting (insulators)
• Others:
• Composite Materials ?
• Semi-conductors ?

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1. Pick Application Determine required Properties
2. Properties Identify candidate Material(s)
3. Material Identify required Processing
Processing: changes structure and overall shape
ex: casting, vapor deposition, forming, joining,
quenching, annealing.
Properties: mechanical, electrical, thermal,
magnetic, optical, deteriorative.
Material: structure, composition.
The Materials Selection Process

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Properties
• THERMAL
• ELECTRICAL
• MAGNETIC
• OPTICAL

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THERMAL
• Space Shuttle Tiles:
- Silica fiber insulation
offers low heat conduction.
• Thermal Conductivity
of Copper:
-It decreases when you add zinc!
Composition (wt% Zinc)
ThermalConductivity
(W/m-K)
400
300
200
100
0
0 10 20 30 40

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ELECTRICAL
• Electrical Resistivity of Copper:
• Adding “impurity” atoms to Cu increases resistivity.
• Deforming Cu increases resistivity.
Adapted from Fig. 18.8, Callister 7e.
(Fig. 18.8 adapted from: J.O. Linde,
Ann Physik 5, 219 (1932); and
C.A. Wert and R.M. Thomson,
Physics of Solids, 2nd edition,
McGraw-Hill Company, New York,
1970.)
T (°C)-200 -100 0
Cu + 3.32 at%Ni
Cu + 2.16 at%Ni
deformed Cu + 1.12 at%Ni
1
2
3
4
5
6
Resistivity,ρ
(10-8
Ohm-m)
0
Cu + 1.12 at%Ni
“Pure” Cu

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MAGNETIC
• Magnetic Permeability
vs. Composition:
--Adding 3 atomic % Si
makes Fe a better
recording medium!
• Magnetic Storage:
--Recording medium
is magnetized by
recording head.
Magnetic Field
Magnetization
Fe+ 3% Si
Fe

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• Transmittance:
--Aluminum oxide may be transparent, translucent, or
opaque depending on the material structure.
single crystal
polycrystal:
low porosity
polycrystal:
high porosity
OPTICAL

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• Strength
• Fabricability
• Corrosion Resistance
• Availability
• Cost
• Appearance
Factors
Material Selection

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• Use the right material for the job.
• Understand the relation between properties,
structure, and processing.
• Recognize new design opportunities offered
by materials selection.
• Do not forget the triangle:
Course Goals:
SUMMARY
Processing
Structure Properties