Asian brands are rising and this trend is also visible in smart wireless devices. As suppliers of such devices shift from “Made in China” to ”Designed in China” products, achieving a competitive edge means they are looking for the best and most innovative materials, solutions and technologies. The latest innovations, however, are not necessarily available in their home markets.

1. WIRELESS ASIA - SOLUTIONS FOR SUPPLIERS OF
SMART WIRELESS DEVICES
Asian brands are rising and this trend is also visible in smart wireless
devices. As suppliers of such devices shift from “Made in China” to
”Designed in China” products, achieving a competitive edge means they
are looking for the best and most innovative materials, solutions and
technologies. The latest innovations, however, are not necessarily available
in their home markets.
Asia is the global powerhouse for wireless devices and a major hub
for wireless product R&D and manufacturing. Both the global digital
revolution and product evolution are led from Asia and the industry’s
major players all operate in China, Japan, South Korea and Taiwan.
Establishing a customer relationship with a company in one country can
open up similar business opportunities in other countries.
The development and utilization of wireless technologies in these four
countries differ. In Japan and Korea, for example, companies are seeking
the latest niche innovations that enable them to differentiate their
offerings in this highly competitive marketplace.

2. Chipset Designer &
Manufacturer
Design House
Wireless Product
Manufacturer
(ODM/OEM/
Brand owner)
Machine 2 Machine
• Efficient and multi-
tasking chipsets.
• IP licensing and
transfer of
technologies.
• open to co-operation
with international high-
technology partners .
• International appeal for
industrial design and
flexible approach for
mechanical design.
• User interface and
user experience
design.
• PCB design for new
materials and low
power consumptions.
• NFC technology based
applications such as
mobile wallets.
• Software to visualize
large amounts of data.
• Batteries and displays
with qualities such as
longer lasting and
more efficient battery.
• higher resolution
display and flexible
display.
• Hardware solutions for
high-end sensors and
receivers and remote
battery storage
• Total solutions that
enable m-payment and
m-wallet functionality in
the appliances and
devices.
• Software solutions that
enable NFC, LBS,
ERF communications,
cloud services.
www.finpro.fi/web/english-pages/opportunities-worldwide
www.finpro.fi
Finpro
Helsinki
PL 358
00181 Helsini
Address
Porkkalankatu 1
00180 Helsinki
Tel: +358 (0) 204 6951
Fax: +358 (0) 204 695 200
Email: info@finpro.fi
Anne Mäki
Consultant
anne.maki(a)finpro.fi
+358 40 415 4221
Pietro Karjalainen
Regional Sales Manager, Asia
pietro.karjalainen(a)finpro.fi
+358 40 179 5755
EXAMPLES OF BUSINESS OPPORTUNITIES IN CHINA

3. Design House
Wireless Product
Manufacturer
(ODM/OEM/
Brand owner)
Machine 2 Machine
• Software development
for example
standardized SKD of
latest OS or engines,
software platform of
specific applications,
API of web
applications.
• Hardware
development: smaller
device I/F (e.g. micro
HDMI), packaging and
mounting technology,
force feedback
components.
• OS distribution and
development platforms
such as Firefox OS,
Tizen, Ubuntu
• High-end integrated
chipsets utilizing quad-
core
• Software plug-in tools
& utilities that enable
an automatic network
configuration, which
helps ordinary end
users to hook devices
to network with ease.
• Hardware related to for
example adhoc
network control
module, cloud
applications
• Communication
modules (e.g. WiFi,
NFC, Zigbee)
• Sensor modules, high
durable batteries and
displays.
www.finpro.fi/web/english-pages/opportunities-worldwide
www.finpro.fi
Finpro
Helsinki
PL 358
00181 Helsini
Address
Porkkalankatu 1
00180 Helsinki
Tel: +358 (0) 204 6951
Fax: +358 (0) 204 695 200
Email: info@finpro.fi
Anne Mäki
Consultant
anne.maki(a)finpro.fi
+358 40 415 4221
Pietro Karjalainen
Regional Sales Manager, Asia
pietro.karjalainen(a)finpro.fi
+358 40 179 5755
EXAMPLES OF BUSINESS OPPORTUNITIES IN JAPAN

4. Chipset Designer &
Manufacturer
Design House
Wireless Product
Manufacturer
(ODM/OEM/
Brand owner)
Machine 2 Machine
• Less battery
consuming chipsets.
• Smaller footprint.
• Multi-tasking in single
chip.
• Design using new
functional materials
that are for example
more durable and
lighter.
• PCB design:
innovative design
using new materials
and consuming less
battery and leaving
smaller footprint.
• 3rd party software
providers, proven
browser optimization
performance.
• Applications related to
m-commerce and m-
payment.
• Peripheral suppliers
related to
revolutionarily
innovative lighter and
durable materials.
• Hardware: longer lasting
sensor batteries and
sensor module
with revolutionarily
innovative ASIC design
for larger data traffic.
• Software: sensor
module with
revolutionarily innovative
ASIC design,
revolutionarily innovative
data collection, analysis,
and transportation.
www.finpro.fi/web/english-pages/opportunities-worldwide
www.finpro.fi
Finpro
Helsinki
PL 358
00181 Helsini
Address
Porkkalankatu 1
00180 Helsinki
Tel: +358 (0) 204 6951
Fax: +358 (0) 204 695 200
Email: info@finpro.fi
Anne Mäki
Consultant
anne.maki(a)finpro.fi
+358 40 415 4221
Pietro Karjalainen
Regional Sales Manager, Asia
pietro.karjalainen(a)finpro.fi
+358 40 179 5755
EXAMPLES OF BUSINESS OPPORTUNITIES IN SOUTH KOREA

5. www.finpro.fi/web/english-pages/opportunities-worldwide
www.finpro.fi
Finpro
Helsinki
PL 358
00181 Helsini
Address
Porkkalankatu 1
00180 Helsinki
Tel: +358 (0) 204 6951
Fax: +358 (0) 204 695 200
Email: info@finpro.fi
Anne Mäki
Consultant
anne.maki(a)finpro.fi
+358 40 415 4221
Pietro Karjalainen
Regional Sales Manager, Asia
pietro.karjalainen(a)finpro.fi
+358 40 179 5755
EXAMPLES OF BUSINESS OPPORTUNITIES IN TAIWAN
Chipset Designer &
Manufacturer
Design House
Wireless Product
Manufacturer
(ODM/OEM/
Brand owner)
Machine 2 Machine
• Software related to
new applications for IC
design.
• Manufacturing: new
wafer material,
nanotechnology for
micro and high quality
IC production.
• New materials and
function combined.
• PCB design for
foldable design
technology.
• Case material such as
fiber glass, metal
glass, aluminum alloy.
• Wafer: material for 3D
IC, 10 nanometer.
• Third party software
providers related to
UI/UX, software for
innovative
applications, cross
platform integration,
contactless
technology, e.g. RFID
and NFC.
• Peripheral suppliers for
new material e.g.
lighter, foldable PCB.
• Chipsets: Multi-core
processor chips, AIC.
• Hardware for sensor
module for machines
and devices.
• Software for remote
control and
surveillance system of
machines.
• Wireless
communication
technology among
machines, devices and
servers.