This document discusses inter-DCI and co-packaged optics. It provides an overview of data center architecture and challenges in data centers including high-speed interfaces between silicon and optics. The document then discusses integrated coherent transmit-receive optical sub-assemblies and co-packaged optics as potential solutions. Co-packaged optics could provide a compact form factor with many modules close to switch ASICs and include electronics, modulators, receivers and lasers to allow for high data rates and simplified assembly at a lower cost. External and integrated laser integration approaches are also briefly outlined.

1. Inter-DCI and co-packaged optics
March, 2021
EPIC Technology Meeting on Roadmap 2021 for Co-packaged Optics

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Communication
service provider
Metro/core
distribution and hosting
Cloud interconnect
Cloud access
Synchronization
and timing
Service delivery
and assurance Enterprise
Business continuity
Disaster recovery
Internet
content provider
Cloud and OTT
services
Ensemble network management and control
ADVA’s solutions

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Data center architecture
Tier 0 Tier 0 Tier 0
…
Tier 1 Tier 1 Tier 1
…
Tier 2 Tier 2 Tier 2
…
Tier 3
Tier 3
…
Tier 1
Tier 2
Tier 3
Long-haul: 1000s of km
Metro:
<
80km
Copper cables
Active optical cables
≤2km optics
≤2km optics
Coherent optics
Challenges in DCs
• High-speed interface
between silicon and optics
• I/O power reduction
• Faceplate density
• Cost reduction
So … when do we see CPOs?
25.6T? 51.2T? 102.4T?
We see steps in this direction
for inter-DCI …

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Integrated coherent transmit-receive optical sub-assembly
• 400Gbit/s coherent module
• Solder reflow compatible (BGA)
• Includes DP-IQ modulator, DP-Co-Rx,
quad-driver, quad-TIA, MCU
• 22.5x15x3.6mm footprint
• Non-hermetic package
• No laser included (yet)
• Standardized in OIF
OIF-IC-TROSA-01.0
The IC-TROSA – a coherent CPO module

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How does it compare to the IC-TROSA?
• Compact form factor
• Need many modules close to switch ASIC
(16x8 at 51.2T)1
• Exhaustive
• Includes DSP, RF electronics,
modulator, receiver, MCU, laser
• External multi-λ laser source?
• High RF bandwidth
• BGA or LGA
• Easy cooling
• Avoiding thermal crosstalk
• Low cost
• Simplified assembly
Co-packaged optics
116x8 400G Modules DR4 or FR4 for 51.2T switch generation (3.2 Tb/s Copackaged Optics Optical Module Product Requirements Document, OIF)

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• “Monolithic” integration1
• Surface/edge coupled2
• Etched cavity3
External (FR4 implementation)
Integrated
Laser integration
1Norman, Justin C., et al. "Perspective: The future of quantum dot photonic integrated circuits." APL Photonics 3.3 (2018): 030901.
2Haglund, Erik, et al. "High-power single transverse and polarization mode VCSEL for silicon photonics integration." Optics express 27.13 (2019): 18892-18899.
3Juvert, Joan, et al. "Integration of etched facet, electrically pumped, C-band Fabry-Pérot lasers on a silicon photonic integrated circuit by transfer printing." Optics express 26.17 (2018): 21443-21454.

7. Thank you
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